DE1237191B - Method for producing an electrical device circuit - Google Patents
Method for producing an electrical device circuitInfo
- Publication number
- DE1237191B DE1237191B DET28351A DET0028351A DE1237191B DE 1237191 B DE1237191 B DE 1237191B DE T28351 A DET28351 A DE T28351A DE T0028351 A DET0028351 A DE T0028351A DE 1237191 B DE1237191 B DE 1237191B
- Authority
- DE
- Germany
- Prior art keywords
- component carrier
- openings
- webs
- stamped part
- device circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
- H01R12/721—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures cooperating directly with the edge of the rigid printed circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R2107/00—Four or more poles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R24/00—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure
- H01R24/66—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure with pins, blades or analogous contacts and secured to apparatus or structure, e.g. to a wall
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0286—Programmable, customizable or modifiable circuits
- H05K1/029—Programmable, customizable or modifiable circuits having a programmable lay-out, i.e. adapted for choosing between a few possibilities
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/063—Lamination of preperforated insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1446—Treatment after insertion of lead into hole, e.g. bending, cutting, caulking or curing of adhesive but excluding soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Signal Processing (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Description
Verfahren zur Herstellung einer elektrischen Geräteschaltung Für die Montage von Schaltungselementen in elektrischen Geräten ist es durch die deutsche Patentschrift 952 107 bekannt, an Isolierleisten zur Herstellung von Lötanschlüssen für einzelne Schaltungselemente geeignete Metallstreifen derart zu befestigen, daß sie zwischen den Befestigungsstellen frei tragend sind und ohne Gefährdung des mechanischen Zusammenhaltes zur Verwirklichung verschiedener Schaltbilder unterbrochen werden können. Derartige Träger erfordern verhältnismäßig viel Platz.Method for producing an electrical device circuit For the assembly of circuit elements in electrical devices, it is known from German patent specification 952 107 to attach suitable metal strips to insulating strips for producing soldered connections for individual circuit elements in such a way that they are cantilevered between the fastening points and without endangering them mechanical cohesion can be interrupted to realize different circuit diagrams. Such carriers require a relatively large amount of space.
Als Träger für Schaltelemente ist ferner ein Netz aus isolierten Drähten durch die deutsche Patentschrift 1085 207 bekannt, mit denen die Schaltelemente elektrisch und mechanisch verbunden werden, wozu jedoch die Isolation einzelner Drähte an der betreffenden Stelle entfernt werden muß.A network of insulated wires is also known from German patent specification 1085 207 as a carrier for switching elements, with which the switching elements are electrically and mechanically connected, but for this purpose the insulation of individual wires must be removed at the point in question.
Durch die deutsche Patentschrift 1134 125 ist es ferner bekannt, die Schaltelemente in der von der herzu-stellenden Schaltung abhängigen Reihenfolge auf Isolierstoffbänder querliegend aufzubringen und danach elektrisch, soweit erforderlich, miteinander zu verbinden oder auf metallische Drähte querliegend aufzubringen und nicht gewünschte Verbindungen nachträglich aufzutrennen. Dieses Verfahren eignet sich nur für die Verschaltung von mit axialen Lötanschlüssen ausgerüsteten Bauelementen.From the German patent specification 1 134 125 it is also known to apply the switching elements in the sequence dependent on the circuit to be produced transversely on insulating strips and then electrically, if necessary, to connect them to one another or to apply them transversely to metallic wires and to subsequently disconnect undesired connections . This method is only suitable for interconnecting components equipped with axial soldered connections.
Auch sind durch die deutsche Auslegeschrift 1195 385 festklemmbare Kontaktstücke in Form einer Krampe zum Einsetzen in öffnungen eines elektrische Bauteile tragenden Isolierträgers bekannt, deren einer Schenkel eine Klemmöse zur Festklemmung nach Abbiegen am Anschlußende eines Bauteiles aufweist, durch den das Bauteil sowohl an dem Isolierträger mechanisch gehalten wie elektrisch mit dem Kontaktstück verbunden wird. Diese Kontaktstücke erfordern verhältnismäßig viel Platz.Also known from the German Auslegeschrift 1195 385 are clampable contact pieces in the form of a clamp for insertion into openings of an insulating support carrying electrical components, one leg of which has a clamping eyelet for clamping after bending at the connection end of a component, by means of which the component is held mechanically on the insulating support how it is electrically connected to the contact piece. These contact pieces require a relatively large amount of space.
Die Erfindung bezweckt, die Arbeitsschritte und den Platzbedarf für die Herstellung einer Geräteschaltung zu verringern. Dies erreicht die Erfindung dadurch, daß ein gitterartiges Stanzteil, dessen Stege mit Durchbrechungen zur Aufnahme von Lötanschlüssen versehen sind, auf der einen Seite eines plattenförmigen mit Durchbrechungen ausgerüsteten Bauteilträgers angeordnet wird, daß Lötanschlüsse von auf der anderen Seite des Bauteilträgers angeordneten elektrischen Bauteilen durch Durchbrechungen des Bauteilträgers und Durchbrechungen einzelner Stege hindurchgesteckt und mit den Stegen, vorzugsweise durch Löten, verbunden werden und daß das Stanzteil sodann durch Wegschneiden von umfangparallelen Randstreifen an seinem über den Umfang des Bauteilträgers vorspringenden, als Steck-& el anschlüsse verwendbaren Streifen zu einzelnen Strompfaden unterteilt wird.The invention aims, the steps and the space required for to reduce the production of a device circuit. This is what the invention achieves in that a grid-like stamped part, the webs of which have openings for receiving of solder connections are provided, on one side of a plate-shaped with Openings equipped component carrier is arranged that solder connections of electrical components arranged on the other side of the component carrier inserted through openings in the component carrier and openings in individual webs and are connected to the webs, preferably by soldering, and that the stamped part then by cutting away circumferentially parallel edge strips on its over the circumference the component carrier protruding strips that can be used as plug & el connections is divided into individual current paths.
Die Ausbildung der Geräteschaltung als Stanzteil ermöglicht eine sehr einfache und sichere Herstellung, in der Verschaltungen nicht vorkommen können. Dadurch, daß die Befestigung der Lötanschlüsse der Bauteile sogleich zur mechanischen Halterung des Stanzteiles der Schaltung an einem Bauteilträger aus Isoliermaterial dient, werden die Arbeitsgänge zum Aufbau der Geräteschaltung wesentlich vereinfacht. Die Lötanschlüsse aller Bauteile liegen auf der gleichen -Seite der gestanzten Schaltung, so daß eine Verlötung in einem Lötschwallbad ermöglicht ist.The formation of the device circuit as a stamped part enables a very simple and safe production in which interconnections cannot occur. The fact that the fastening of the soldered connections of the components immediately to the mechanical Bracket of the stamped part of the circuit on a component carrier made of insulating material is used, the operations for setting up the device circuit are significantly simplified. The solder connections of all components are on the same side of the stamped circuit, so that soldering in a solder surge bath is possible.
Mit besonderem Vorteil können einzelne, entsprechend dem jeweiligen Gerätetyp nicht benötigte Leitungszüge des mit Streifen entsprechend den bei einer Reihe von Gerätetypen benötigten Leitungszügen ausgerüsteten gitterartigen Stanzteiles durch Stanzen entfernt werden und hierdurch die Schaltung dem jeweiligen Verwendungszweck angepaßt werden.With particular advantage, individual, according to the respective Device type Unnecessary cable runs of the with strips according to the one Series of device types required cable runs equipped with a grid-like stamped part can be removed by punching and thereby the circuit to the respective purpose be adjusted.
Ein Ausführungsbeispiel der Erfindung ist in der Zeichnun- dargestellt. Es zeigt F i g. 1 eine gemäß der Erfindung ausgebildete Geräteschaltung in der Draufsicht, F i g. 2 die Seitenansicht der Geräteschaltung nach Fig. 1, F i g. 3 das gitterartige Stanzteil dieser Geräteschaltung von unten.An embodiment of the invention is shown in the drawing. It shows F i g. 1 shows a device circuit designed according to the invention in plan view, FIG. 2 shows the side view of the device circuit according to FIG. 1, FIG. 3 the grid-like stamped part of this device circuit from below.
Die in den Figuren dargestellte, Geräteschaltung für einen Fernsprechapparat besteht aus einem plattenförmigen Bauteilträger 1 aus Isoliermaterial, an dessen Unterseite ein gitterartiges Stanzteil 2 befestigt ist, welches durch Stege 3 gebildet, die benötigten Leitungsführungen aufweist. In den Stegen 3 sind Lochungen 4 zum Hindurchstecken von Anschlußdrähten der Bauelemente angebracht. Mit entsprechenden Lochungen 5 ist auch der Bauteilträger 1 ausgestattet.The device circuit shown in the figures for a telephone set consists of a plate-shaped component carrier 1 made of insulating material, on the underside of which a lattice-like stamped part 2 is attached, which is formed by webs 3 , has the required line guides. In the webs 3 perforations 4 are made for inserting connecting wires of the components. The component carrier 1 is also equipped with corresponding perforations 5.
Zur Befestigung des gitterartigen Stanzteiles 2 an der Unterseite des Bauteilträgers 1 werden von der Oberseite her die Bauteile, beispielsweise eine Induktionsspule 6, ein Federsatz 7, Widerstände 8, 9 und Kondensatoren 10, 11, durch die Lochungen 5 im Bauteilträger und die Lochungen 4 im Stanzteil 2 mit ihren Anschlußdrähten hindurchgesteckt und deren Enden abgebogen. Nach dem Tauchlötvorgang wird hierdurch das Stanzteil fest an der Unterseite des Bauteilträgers gehalten.To attach the lattice-like stamped part 2 to the underside of the component carrier 1 , the components, for example an induction coil 6, a set of springs 7, resistors 8, 9 and capacitors 10, 11, are fed through the perforations 5 in the component carrier and the perforations 4 in the Punched part 2 with its connecting wires inserted and the ends bent. After the dip soldering process, the stamped part is held firmly on the underside of the component carrier.
Nach dem Tauchlötvorgang werden an den über den Umfang des Bauteilträgers hinausragenden Teilen die vorzugsweise parallel zum Umfang verlaufenden Randstreifen 12 des Stanzteiles abgetrennt. Hierdurch wird das Stanzteil in die einzelnen Strompfade unterteilt. Die Enden 13 der Stege des Stanzteiles werden hierdurch frei und können zum Aufschieben von Steckern 16, 17, 18 verwendet werden. Die komplette Geräteschaltung kann dann an der Bodenplatte eines Fernsprechapparates befestigt werden.After the immersion soldering process, the edge strips 12 of the stamped part, which preferably run parallel to the circumference, are cut off on the parts protruding beyond the circumference of the component carrier. This divides the stamped part into the individual current paths. The ends 13 of the webs of the stamped part are thereby free and can be used to push on connectors 16, 17, 18 . The complete device circuit can then be attached to the base plate of a telephone set.
Gemäß einer Weiterbildung der Erfindung ist zur Herabsetzung der Lagerhaltung und Verminderung der Werkzeugkosten vorgesehen, daß das Stanzteil 2 für eine Reihe von Apparatetypen alle benötigten Leitungsführungen aufweist. Entsprechend dem je- weiligen Apparatetyp werden dann nicht benötigte Leitungsführungen oder nicht gewünschte Verbindungen, beispielsweise die in F i g. 3 schraffiert dargestellten Teile 14 und 15, durch Stanzen vor dem Anbringen des Stanzteiles an dem Bauteilträger entfernt oder zumindest so weit vom Stanzteil getrennt, daß sie nach dem Entfernen der Randsteifen bei der fertigen Geräteschaltung abfallen.According to a further development of the invention, in order to reduce storage and tool costs, the stamped part 2 has all the necessary line guides for a number of types of apparatus. Depending on the respective type of apparatus, lines that are not required or connections that are not desired, for example the ones shown in FIG. 3 hatched parts 14 and 15, removed by punching before attaching the punched part to the component carrier or at least so far separated from the punched part that they fall off after the removal of the edge stiffeners in the finished device circuit.
Claims (2)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DET28351A DE1237191B (en) | 1965-04-08 | 1965-04-08 | Method for producing an electrical device circuit |
| NL6601108A NL6601108A (en) | 1965-04-08 | 1966-01-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DET28351A DE1237191B (en) | 1965-04-08 | 1965-04-08 | Method for producing an electrical device circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE1237191B true DE1237191B (en) | 1967-03-23 |
Family
ID=7554108
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DET28351A Pending DE1237191B (en) | 1965-04-08 | 1965-04-08 | Method for producing an electrical device circuit |
Country Status (2)
| Country | Link |
|---|---|
| DE (1) | DE1237191B (en) |
| NL (1) | NL6601108A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2621774A1 (en) * | 1987-10-12 | 1989-04-14 | Dav | CIRCUIT BOARD FOR HIGH CURRENTS AND METHOD OF PREPARATION |
| DE19755240C1 (en) * | 1997-12-12 | 1999-07-01 | Telefunken Microelectron | Electronics housing |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE952107C (en) * | 1953-06-14 | 1956-11-08 | Neosid Pemetzrieder G M B H | Tray for the assembly of circuit elements in electrical devices in communications engineering |
| DE1085207B (en) * | 1959-08-28 | 1960-07-14 | Siemens Ag | Carrier for electrical components to be wired |
| DE1134125B (en) * | 1961-04-08 | 1962-08-02 | Telefunken Patent | Process for the production of assemblies for telecommunications and electronics |
-
1965
- 1965-04-08 DE DET28351A patent/DE1237191B/en active Pending
-
1966
- 1966-01-28 NL NL6601108A patent/NL6601108A/xx unknown
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE952107C (en) * | 1953-06-14 | 1956-11-08 | Neosid Pemetzrieder G M B H | Tray for the assembly of circuit elements in electrical devices in communications engineering |
| DE1085207B (en) * | 1959-08-28 | 1960-07-14 | Siemens Ag | Carrier for electrical components to be wired |
| DE1134125B (en) * | 1961-04-08 | 1962-08-02 | Telefunken Patent | Process for the production of assemblies for telecommunications and electronics |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2621774A1 (en) * | 1987-10-12 | 1989-04-14 | Dav | CIRCUIT BOARD FOR HIGH CURRENTS AND METHOD OF PREPARATION |
| EP0312415A1 (en) * | 1987-10-12 | 1989-04-19 | DAV, Société dite | Circuit board for high currents and process of making the same |
| DE19755240C1 (en) * | 1997-12-12 | 1999-07-01 | Telefunken Microelectron | Electronics housing |
Also Published As
| Publication number | Publication date |
|---|---|
| NL6601108A (en) | 1966-10-10 |
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