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DE1127179B - Arrangement of the grooves in at least one of the cylindrical soldering surfaces of metallic workpieces - Google Patents

Arrangement of the grooves in at least one of the cylindrical soldering surfaces of metallic workpieces

Info

Publication number
DE1127179B
DE1127179B DES64284A DES0064284A DE1127179B DE 1127179 B DE1127179 B DE 1127179B DE S64284 A DES64284 A DE S64284A DE S0064284 A DES0064284 A DE S0064284A DE 1127179 B DE1127179 B DE 1127179B
Authority
DE
Germany
Prior art keywords
grooves
arrangement
metallic workpieces
soldering surfaces
solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DES64284A
Other languages
German (de)
Inventor
Juerg Mueller
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sulzer AG
Original Assignee
Sulzer AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sulzer AG filed Critical Sulzer AG
Publication of DE1127179B publication Critical patent/DE1127179B/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/04—Tubular or hollow articles
    • B23K2101/06—Tubes

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Non-Disconnectible Joints And Screw-Threaded Joints (AREA)

Description

Anordnung der Rillen in mindestens einer der zylindrischen Lötflächen von metallischen Werkstücken Die Erfindung betrifft eine bestimmte Anordnung der Rillen in mindestens einer der zylindrischen Lötflächen von metallischen Werkstücken, deren Spaltweite durch die Kapillarwirkung des flüssigen Lotes bestimmt ist, und ihr liegt die Aufgabe zugrunde, den den bisherigen Lötverbindungen dieser Art anhaftenden Mangel der unvollständigen Benetzung der Lötflächen und der damit einhergehenden Einschlüsse von Flußmittel oder Gas, z. B. Luft, mit Sicherheit auszuschließen.Arrangement of the grooves in at least one of the cylindrical soldering surfaces of metallic workpieces The invention relates to a specific arrangement of the Grooves in at least one of the cylindrical soldering surfaces of metallic workpieces, whose gap width is determined by the capillary action of the liquid solder, and it is based on the task of the previous soldered connections of this type Lack of incomplete wetting of the soldering surfaces and the associated Inclusions of flux or gas, e.g. B. air, to be excluded with certainty.

Diese Aufgabe wird erfindungsgemäß dadurch gelöst, daß eine Mehrzahl der in sich geschlossenen Rillen in Ebenen rechtwinklig zur Zylinderachse und der Einströmrichtung des Lotes angeordnet sind.This object is achieved according to the invention in that a plurality the self-contained grooves in planes at right angles to the cylinder axis and the Direction of flow of the solder are arranged.

Bisher verteilte sich das. Lot in unbeeinflußbarer Weise über die Lötfläche, was das Entstehen von Einschlüssen von Flußmittel und Gas bewirkte. Hingegen wird bei der erfindungsgemäßen Anordnung der Rillen die Ausbreitungsgeschwindigkeit des Lots in Richtung der Lötlänge dadurch gedrosselt, daß es bei Erreichen der ersten Rille zunächst diese ausfüllt, während die Fläche davor auf Grund der großen Oberflächenspannung des. Lots gegen die Lötfläche gleichmäßig vom Lot benetzt wird. Das Flußmittel, das dagegen eine wesentlich geringere Kapillarität besitzt, wird hierdurch entweder nach der Seite oder in die Rille verdrängt, wo es Einschlüsse bilden kann. Die Rillen bilden daher hierbei Ablagerungsstätten für Einschlüsse. Nachdem die erste Rille mit Lot gefüllt ist, fließt es unter Benetzung der zweiten Fläche in die zweite Rille, füllt diese usf. Einschlüsse können hierbei also nur noch in den Rillen entstehen, was aber nicht schädlich ist, da die Zwischenflächen durch das Lot metallisch vollkommen verbunden sind.So far, the solder has been distributed over the Solder surface, causing inclusions of flux and gas. On the other hand in the arrangement of the grooves according to the invention, the velocity of propagation of the solder is throttled in the direction of the soldering length in that it is when it reaches the first Groove initially fills this, while the area in front of it due to the large surface tension The solder is evenly wetted by the solder against the soldering surface. The flux, which, on the other hand, has a much lower capillarity, becomes either displaced to the side or into the groove where it can form inclusions. The grooves therefore form deposits for inclusions. After the first groove is filled with solder, it flows into the second, wetting the second surface Groove, fill this etc. Inclusions can only arise in the grooves, but this is not harmful, since the intermediate surfaces are completely metallic due to the solder are connected.

In der Darstellung ist ein Ausführungsbeispiel gegeben, bei dem ein Werkstück 1 mit einem Werkstück 2 verlötet ist. In die Lötfläche 3 des Werkstückes 2 sind Rillen 4 eingeschnitten. Beide Werkstücke sind mit engem Schiebesatz ineinandergepaßt und haben die Spaltweite 5. Der Rillenabstand, der etwa 4- bis 5mal so lang wie -die Wandstärke 7 des Werkstückes 1 ist, ist mit 6 bezeichnet.The illustration shows an exemplary embodiment in which a workpiece 1 is soldered to a workpiece 2. Grooves 4 are cut into the soldering surface 3 of the workpiece 2. Both workpieces fit into one another with a tight sliding set and have the gap width 5. The groove spacing, which is about 4 to 5 times as long as - the wall thickness 7 of the workpiece 1, is denoted by 6.

Claims (2)

PATENTANSPRÜCHE: 1. Anordnung der Rillen in mindestens einer der zylindrischen Lötflächen von metallischen Werkstücken, deren Spaltweite durch die Kapillarwirkung des flüssigen Lots bestimmt ist, dadurch gekennzeichnet, daß eine Mehrzahl der in sich geschlossenen Rillen in Ebenen rechtwinklig zur Zylinderachse und der Einströmrichtung des Lots angeordnet sind. PATENT CLAIMS: 1. Arrangement of the grooves in at least one of the cylindrical ones Soldering surfaces of metallic workpieces, their gap width due to the capillary effect of the liquid solder is determined, characterized in that a plurality of the in closed grooves in planes at right angles to the cylinder axis and the direction of inflow of the lot are arranged. 2. Rillen nach Anspruch 1, dadurch gekennzeichnet, daß bei einer durchschnittlichen Spaltweite von 0,05 mm die Rillen einem gegenseitigen Abstand von 1 mm und eine Tiefe von 0,1 mm aufweisen. In Betracht gezogene Druckschriften: Lüder, Handbuch der Löttechnik, Verlag Technik Berlin, 1952, S. 311 bis 314; Zeitschrift Konstruktion, 7 (1955), Heft 11, S. 426.2. Grooves according to claim 1, characterized in that with an average gap width of 0.05 mm, the grooves are mutual Have a distance of 1 mm and a depth of 0.1 mm. Considered publications: Lüder, manual of soldering technology, Verlag Technik Berlin, 1952, pp. 311 to 314; magazine Construction, 7 (1955), No. 11, p. 426.
DES64284A 1959-06-25 1959-08-04 Arrangement of the grooves in at least one of the cylindrical soldering surfaces of metallic workpieces Pending DE1127179B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH1127179X 1959-06-25

Publications (1)

Publication Number Publication Date
DE1127179B true DE1127179B (en) 1962-04-05

Family

ID=4558958

Family Applications (1)

Application Number Title Priority Date Filing Date
DES64284A Pending DE1127179B (en) 1959-06-25 1959-08-04 Arrangement of the grooves in at least one of the cylindrical soldering surfaces of metallic workpieces

Country Status (1)

Country Link
DE (1) DE1127179B (en)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1194228B (en) 1961-06-13 1965-06-03 Atomic Energy Authority Uk Solder connection between a closure part and a pipe
DE1259144B (en) 1963-10-28 1968-01-18 Atomic Energy Commission Temperature-resistant connection between a metallic part and a non-metallic part
WO1981000226A1 (en) * 1979-07-12 1981-02-05 Plansee Metallwerk Method for assembling the parts making up an x-ray anode,in particular a rotating anode
US4394953A (en) 1981-03-12 1983-07-26 Schwarzkopf Development Corporation Method of joining individual parts of an X-ray anode, in particular of a rotating anode
US4409278A (en) * 1981-04-16 1983-10-11 General Electric Company Blister-free direct bonding of metals to ceramics and metals
US4413766A (en) * 1981-04-03 1983-11-08 General Electric Company Method of forming a conductor pattern including fine conductor runs on a ceramic substrate
US5727727A (en) * 1995-02-02 1998-03-17 Vlt Corporation Flowing solder in a gap
US5808358A (en) * 1994-11-10 1998-09-15 Vlt Corporation Packaging electrical circuits
US6316737B1 (en) 1999-09-09 2001-11-13 Vlt Corporation Making a connection between a component and a circuit board
US6985341B2 (en) 2001-04-24 2006-01-10 Vlt, Inc. Components having actively controlled circuit elements
US7443229B1 (en) 2001-04-24 2008-10-28 Picor Corporation Active filtering

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
None *

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1194228B (en) 1961-06-13 1965-06-03 Atomic Energy Authority Uk Solder connection between a closure part and a pipe
DE1259144B (en) 1963-10-28 1968-01-18 Atomic Energy Commission Temperature-resistant connection between a metallic part and a non-metallic part
WO1981000226A1 (en) * 1979-07-12 1981-02-05 Plansee Metallwerk Method for assembling the parts making up an x-ray anode,in particular a rotating anode
US4394953A (en) 1981-03-12 1983-07-26 Schwarzkopf Development Corporation Method of joining individual parts of an X-ray anode, in particular of a rotating anode
US4413766A (en) * 1981-04-03 1983-11-08 General Electric Company Method of forming a conductor pattern including fine conductor runs on a ceramic substrate
US4409278A (en) * 1981-04-16 1983-10-11 General Electric Company Blister-free direct bonding of metals to ceramics and metals
US5906310A (en) * 1994-11-10 1999-05-25 Vlt Corporation Packaging electrical circuits
US5808358A (en) * 1994-11-10 1998-09-15 Vlt Corporation Packaging electrical circuits
US6096981A (en) * 1994-11-10 2000-08-01 Vlt Corporation Packaging electrical circuits
US6119923A (en) * 1994-11-10 2000-09-19 Vlt Corporation Packaging electrical circuits
US6159772A (en) * 1994-11-10 2000-12-12 Vlt Corporation Packaging electrical circuits
US5727727A (en) * 1995-02-02 1998-03-17 Vlt Corporation Flowing solder in a gap
US6316737B1 (en) 1999-09-09 2001-11-13 Vlt Corporation Making a connection between a component and a circuit board
US6985341B2 (en) 2001-04-24 2006-01-10 Vlt, Inc. Components having actively controlled circuit elements
US7443229B1 (en) 2001-04-24 2008-10-28 Picor Corporation Active filtering
US7944273B1 (en) 2001-04-24 2011-05-17 Picor Corporation Active filtering

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