DE112017002011A5 - Lichtemittierendes bauteil - Google Patents

Lichtemittierendes bauteil Download PDF

Info

Publication number: DE112017002011A5
Authority: DE; Germany
Prior art keywords: light; emitting component; emitting; component
Prior art date: 2016-04-14
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Pending

Application number

DE112017002011.5T

Other languages

English (en)

Inventor

Hubert Halbritter

Roland Enzmann

Andreas Wojcik

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Ams Osram International GmbH

Original Assignee

Osram Opto Semiconductors GmbH

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2016-04-14

Filing date

2017-04-12

Publication date

2019-01-24

2017-04-12 Application filed by Osram Opto Semiconductors GmbH filed Critical Osram Opto Semiconductors GmbH

2019-01-24 Publication of DE112017002011A5 publication Critical patent/DE112017002011A5/de

Status Pending legal-status Critical Current

Classifications

- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0225—Out-coupling of light
- H01S5/02255—Out-coupling of light using beam deflecting elements
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/02218—Material of the housings; Filling of the housings
- H01S5/02234—Resin-filled housings; the housings being made of resin
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/023—Mount members, e.g. sub-mount members
- H01S5/0232—Lead-frames
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/02208—Mountings; Housings characterised by the shape of the housings
- H01S5/02216—Butterfly-type, i.e. with electrode pins extending horizontally from the housings

Landscapes

Physics & Mathematics (AREA)
Condensed Matter Physics & Semiconductors (AREA)
General Physics & Mathematics (AREA)
Electromagnetism (AREA)
Optics & Photonics (AREA)
Semiconductor Lasers (AREA)

DE112017002011.5T 2016-04-14 2017-04-12 Lichtemittierendes bauteil Pending DE112017002011A5 (de)

Applications Claiming Priority (3)

Application Number	Priority Date	Filing Date	Title
DE102016106896.9		2016-04-14
DE102016106896.9A DE102016106896A1 (de)	2016-04-14	2016-04-14	Lichtemittierendes Bauteil
PCT/EP2017/058774 WO2017178525A1 (de)	2016-04-14	2017-04-12	Lichtemittierendes bauteil

Publications (1)

Publication Number	Publication Date
DE112017002011A5 true DE112017002011A5 (de)	2019-01-24

Family

ID=58537008

Family Applications (2)

Application Number	Title	Priority Date	Filing Date
DE102016106896.9A Withdrawn DE102016106896A1 (de)	2016-04-14	2016-04-14	Lichtemittierendes Bauteil
DE112017002011.5T Pending DE112017002011A5 (de)	2016-04-14	2017-04-12	Lichtemittierendes bauteil

Family Applications Before (1)

Application Number	Title	Priority Date	Filing Date
DE102016106896.9A Withdrawn DE102016106896A1 (de)	2016-04-14	2016-04-14	Lichtemittierendes Bauteil

Country Status (3)

Country	Link
US (1)	US11355897B2 (de)
DE (2)	DE102016106896A1 (de)
WO (1)	WO2017178525A1 (de)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPWO2022239653A1 (de) *	2021-05-14	2022-11-17

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DE19952712A1 (de)	1999-11-02	2001-05-10	Osram Opto Semiconductors Gmbh	Laserdiodenvorrichtung
JP4451951B2 (ja)	1999-12-20	2010-04-14	新日本製鐵株式会社	高強度ばね用鋼材
WO2002091534A1 (en) *	2001-05-08	2002-11-14	Mitsubishi Denki Kabushiki Kaisha	Wavelength monitoring apparatus
WO2003077389A1 (en) *	2002-03-08	2003-09-18	Sharp Kabushiki Kaisha	Light source apparatus and optical communication module comprising it
DE10214119A1 (de) *	2002-03-28	2003-10-23	Osram Opto Semiconductors Gmbh	Optoelektronisches Bauelement
JP2003298115A (ja)	2002-04-05	2003-10-17	Citizen Electronics Co Ltd	発光ダイオード
CN100587560C (zh) *	2003-04-01	2010-02-03	夏普株式会社	发光装置用组件、发光装置、背侧光照射装置、显示装置
JP2006032885A (ja)	2003-11-18	2006-02-02	Sharp Corp	光源装置およびそれを用いた光通信装置
JP2005252219A (ja) *	2004-02-06	2005-09-15	Toyoda Gosei Co Ltd	発光装置及び封止部材
US8033706B1 (en) *	2004-09-09	2011-10-11	Fusion Optix, Inc.	Lightguide comprising a low refractive index region
KR100665219B1 (ko) *	2005-07-14	2007-01-09	삼성전기주식회사	파장변환형 발광다이오드 패키지
US20080035942A1 (en) *	2006-08-08	2008-02-14	Lg Electronics Inc.	Light emitting device package and method for manufacturing the same
JP4783718B2 (ja) *	2006-11-27	2011-09-28	新光電気工業株式会社	照明装置
US8052308B2 (en) *	2007-04-18	2011-11-08	Seiko Epson Corporation	Light source having wavelength converter and wavelength separating member for reflecting converted light
WO2009066430A1 (ja) *	2007-11-19	2009-05-28	Panasonic Corporation	半導体発光装置および半導体発光装置の製造方法
US8337029B2 (en) *	2008-01-17	2012-12-25	Intematix Corporation	Light emitting device with phosphor wavelength conversion
DE102010034913B4 (de) *	2010-08-20	2023-03-30	OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung	Strahlung emittierendes Bauelement und Verfahren zur Herstellung des Strahlung emittierenden Bauelements
EP3716331B1 (de)	2010-12-28	2023-06-28	Nichia Corporation	Lichtemittierende vorrichtung
US8888331B2 (en) *	2011-05-09	2014-11-18	Microsoft Corporation	Low inductance light source module
JP5980577B2 (ja) *	2012-05-31	2016-08-31	シチズン電子株式会社	側面照射型ｌｅｄ発光装置及び側面照射型ｌｅｄ発光装置の製造方法
US8831054B2 (en) *	2013-01-07	2014-09-09	Emcore Corporation	Wavelength locking of a laser device
DE102013210103A1 (de) *	2013-05-29	2014-12-18	Osram Opto Semiconductors Gmbh	Optoelektronisches Bauelement
DE102014213406A1 (de)	2014-07-10	2016-01-14	Osram Opto Semiconductors Gmbh	Halbleiterlaserbauteil und Kamera
JP6354626B2 (ja) *	2015-03-09	2018-07-11	豊田合成株式会社	発光装置の製造方法
US11431146B2 (en) *	2015-03-27	2022-08-30	Jabil Inc.	Chip on submount module
CN106159071A (zh) *	2015-04-23	2016-11-23	鸿富锦精密工业（深圳）有限公司	Led封装体
DE102015108117A1 (de) *	2015-05-22	2016-11-24	Osram Opto Semiconductors Gmbh	Bauelement

2016
- 2016-04-14 DE DE102016106896.9A patent/DE102016106896A1/de not_active Withdrawn
2017
- 2017-04-12 DE DE112017002011.5T patent/DE112017002011A5/de active Pending
- 2017-04-12 US US16/092,422 patent/US11355897B2/en active Active
- 2017-04-12 WO PCT/EP2017/058774 patent/WO2017178525A1/de not_active Ceased

Also Published As

Publication number	Publication date
US11355897B2 (en)	2022-06-07
DE102016106896A1 (de)	2017-10-19
US20200119517A1 (en)	2020-04-16
WO2017178525A1 (de)	2017-10-19

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Legal Events

Date	Code	Title
2018-10-09	R012	Request for examination validly filed
2018-12-19	R083	Amendment of/additions to inventor(s)
2022-05-30	R016	Response to examination communication