DE112009000737A5 - Method for producing and constructing a power module - Google Patents
Method for producing and constructing a power module Download PDFInfo
- Publication number
- DE112009000737A5 DE112009000737A5 DE112009000737T DE112009000737T DE112009000737A5 DE 112009000737 A5 DE112009000737 A5 DE 112009000737A5 DE 112009000737 T DE112009000737 T DE 112009000737T DE 112009000737 T DE112009000737 T DE 112009000737T DE 112009000737 A5 DE112009000737 A5 DE 112009000737A5
- Authority
- DE
- Germany
- Prior art keywords
- constructing
- producing
- power module
- module
- power
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H10W90/00—
-
- H10W44/501—
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102008018841.7 | 2008-04-15 | ||
| DE102008018841A DE102008018841A1 (en) | 2008-04-15 | 2008-04-15 | Method for producing and constructing a power module |
| PCT/DE2009/000317 WO2009127179A1 (en) | 2008-04-15 | 2009-03-05 | Method for producing and assembly of a power module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE112009000737A5 true DE112009000737A5 (en) | 2011-01-05 |
| DE112009000737B4 DE112009000737B4 (en) | 2023-02-02 |
Family
ID=41051105
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE102008018841A Pending DE102008018841A1 (en) | 2008-04-15 | 2008-04-15 | Method for producing and constructing a power module |
| DE112009000737.6T Active DE112009000737B4 (en) | 2008-04-15 | 2009-03-05 | Structure of a three-phase inverter module |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE102008018841A Pending DE102008018841A1 (en) | 2008-04-15 | 2008-04-15 | Method for producing and constructing a power module |
Country Status (2)
| Country | Link |
|---|---|
| DE (2) | DE102008018841A1 (en) |
| WO (1) | WO2009127179A1 (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102010050315C5 (en) * | 2010-11-05 | 2014-12-04 | Danfoss Silicon Power Gmbh | Process for the production of sintered electrical assemblies and power semiconductor modules made therewith |
| DE102011076323B4 (en) * | 2011-05-24 | 2014-04-10 | Semikron Elektronik Gmbh & Co. Kg | Power electronic system with first and second subsystem |
| DE102011076324B4 (en) * | 2011-05-24 | 2014-04-10 | Semikron Elektronik Gmbh & Co. Kg | Power electronic system with connection means of first and second subsystems |
| DE102013204889A1 (en) | 2013-03-20 | 2014-09-25 | Robert Bosch Gmbh | Power module with at least one power component |
| DE102014219998B4 (en) * | 2014-10-02 | 2020-09-24 | Vitesco Technologies GmbH | Power module, power module group, power output stage and drive system with a power output stage |
| CN110246808B (en) * | 2018-03-09 | 2021-08-10 | 南京银茂微电子制造有限公司 | Power module with reduced junction temperature and method of manufacturing the same |
| CN118782576B (en) * | 2024-09-10 | 2024-12-27 | 四川富乐华半导体科技有限公司 | Ceramic copper-clad carrier plate capable of mounting chips on two sides, power supply plate and manufacturing method |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2725952B2 (en) * | 1992-06-30 | 1998-03-11 | 三菱電機株式会社 | Semiconductor power module |
| US5539254A (en) * | 1994-03-09 | 1996-07-23 | Delco Electronics Corp. | Substrate subassembly for a transistor switch module |
| US5773320A (en) * | 1995-11-13 | 1998-06-30 | Asea Brown Boveri Ag | Method for producing a power semiconductor module |
| DE19645636C1 (en) * | 1996-11-06 | 1998-03-12 | Telefunken Microelectron | Power module for operating electric motor with speed and power control |
| JPH11346480A (en) * | 1998-06-02 | 1999-12-14 | Hitachi Ltd | Inverter device |
| US20020034088A1 (en) * | 2000-09-20 | 2002-03-21 | Scott Parkhill | Leadframe-based module DC bus design to reduce module inductance |
| DE10102621B4 (en) | 2001-01-20 | 2006-05-24 | Conti Temic Microelectronic Gmbh | power module |
| WO2002082543A1 (en) | 2001-03-30 | 2002-10-17 | Hitachi, Ltd. | Semiconductor device |
| DE10141114C1 (en) * | 2001-06-08 | 2002-11-21 | Semikron Elektronik Gmbh | Circuit device has AC terminal element of circuit substrate cooled via terminal pin of base body thermally connected to heat sink |
| DE10204200A1 (en) | 2002-02-01 | 2003-08-21 | Conti Temic Microelectronic | power module |
| DE10316355C5 (en) * | 2003-04-10 | 2008-03-06 | Semikron Elektronik Gmbh & Co. Kg | Power semiconductor module with flexible external pin assignment |
| JP2006278913A (en) * | 2005-03-30 | 2006-10-12 | Toyota Motor Corp | Circuit device and manufacturing method thereof |
-
2008
- 2008-04-15 DE DE102008018841A patent/DE102008018841A1/en active Pending
-
2009
- 2009-03-05 WO PCT/DE2009/000317 patent/WO2009127179A1/en not_active Ceased
- 2009-03-05 DE DE112009000737.6T patent/DE112009000737B4/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| WO2009127179A1 (en) | 2009-10-22 |
| DE112009000737B4 (en) | 2023-02-02 |
| DE102008018841A1 (en) | 2009-10-22 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R012 | Request for examination validly filed | ||
| R079 | Amendment of ipc main class |
Free format text: PREVIOUS MAIN CLASS: H01L0025070000 Ipc: H01L0021600000 |
|
| R016 | Response to examination communication | ||
| R081 | Change of applicant/patentee |
Owner name: VITESCO TECHNOLOGIES GERMANY GMBH, DE Free format text: FORMER OWNER: CONTI TEMIC MICROELECTRONIC GMBH, 90411 NUERNBERG, DE |
|
| R081 | Change of applicant/patentee |
Owner name: SCHAEFFLER TECHNOLOGIES AG & CO. KG, DE Free format text: FORMER OWNER: VITESCO TECHNOLOGIES GERMANY GMBH, 30165 HANNOVER, DE Owner name: VITESCO TECHNOLOGIES GERMANY GMBH, DE Free format text: FORMER OWNER: VITESCO TECHNOLOGIES GERMANY GMBH, 30165 HANNOVER, DE |
|
| R084 | Declaration of willingness to licence | ||
| R016 | Response to examination communication | ||
| R018 | Grant decision by examination section/examining division | ||
| R020 | Patent grant now final | ||
| R081 | Change of applicant/patentee |
Owner name: SCHAEFFLER TECHNOLOGIES AG & CO. KG, DE Free format text: FORMER OWNER: VITESCO TECHNOLOGIES GERMANY GMBH, REGENSBURG, DE |
|
| R079 | Amendment of ipc main class |
Free format text: PREVIOUS MAIN CLASS: H01L0021600000 Ipc: H10W0070010000 |