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DE112005000609D2 - Arrangement for cooling an electronic unit and production of such an arrangement - Google Patents

Arrangement for cooling an electronic unit and production of such an arrangement

Info

Publication number
DE112005000609D2
DE112005000609D2 DE112005000609T DE112005000609T DE112005000609D2 DE 112005000609 D2 DE112005000609 D2 DE 112005000609D2 DE 112005000609 T DE112005000609 T DE 112005000609T DE 112005000609 T DE112005000609 T DE 112005000609T DE 112005000609 D2 DE112005000609 D2 DE 112005000609D2
Authority
DE
Germany
Prior art keywords
arrangement
cooling
production
electronic unit
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
DE112005000609T
Other languages
German (de)
Inventor
Hermann Baeumel
Mustafa Elipe
Werner Graf
Gerhard Starklauf
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Aumovio Microelectronic GmbH
Original Assignee
Conti Temic Microelectronic GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Conti Temic Microelectronic GmbH filed Critical Conti Temic Microelectronic GmbH
Publication of DE112005000609D2 publication Critical patent/DE112005000609D2/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09745—Recess in conductor, e.g. in pad or in metallic substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
DE112005000609T 2004-05-05 2005-03-26 Arrangement for cooling an electronic unit and production of such an arrangement Ceased DE112005000609D2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE200410022118 DE102004022118A1 (en) 2004-05-05 2004-05-05 Arrangement for cooling an electronic unit and production of such an arrangement
PCT/DE2005/000546 WO2005109980A1 (en) 2004-05-05 2005-03-26 Arrangement for cooling an electronic unit and production of such an arrangement

Publications (1)

Publication Number Publication Date
DE112005000609D2 true DE112005000609D2 (en) 2006-11-30

Family

ID=34965871

Family Applications (2)

Application Number Title Priority Date Filing Date
DE200410022118 Withdrawn DE102004022118A1 (en) 2004-05-05 2004-05-05 Arrangement for cooling an electronic unit and production of such an arrangement
DE112005000609T Ceased DE112005000609D2 (en) 2004-05-05 2005-03-26 Arrangement for cooling an electronic unit and production of such an arrangement

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE200410022118 Withdrawn DE102004022118A1 (en) 2004-05-05 2004-05-05 Arrangement for cooling an electronic unit and production of such an arrangement

Country Status (2)

Country Link
DE (2) DE102004022118A1 (en)
WO (1) WO2005109980A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011086193A1 (en) * 2011-11-11 2013-05-16 Osram Gmbh LED module for use in vehicle light, has LED arranged at dielectric LED carrier that comprises contact section, and cooling body provided for removing heat of LED and directly connected with carrier, where cooling body has base plate
DE102012213066B3 (en) * 2012-07-25 2013-09-05 Conti Temic Microelectronic Gmbh Cooling device and method for producing a cooling device and circuit arrangement with a cooling device
DE102015015699A1 (en) 2015-12-04 2017-06-08 Abb Schweiz Ag Electronic power module
DE102017211048A1 (en) * 2017-06-29 2019-01-03 Robert Bosch Gmbh Housing and method for producing a housing
CN117020177A (en) * 2023-07-20 2023-11-10 东莞美景科技有限公司 Middle frame preparation method

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3500976A1 (en) * 1985-01-14 1986-07-17 Hans-Joachim 8500 Nürnberg Horn Heat sink for electronic components
US5447189A (en) * 1993-12-16 1995-09-05 Mcintyre; Gerald L. Method of making heat sink having elliptical pins
JPH08191120A (en) * 1995-01-10 1996-07-23 Hitachi Ltd Substrate for power semiconductor device and manufacturing method thereof
JP3635379B2 (en) * 1995-08-04 2005-04-06 同和鉱業株式会社 Metal-ceramic composite substrate
DE19732439B4 (en) * 1997-07-28 2006-01-19 Infineon Technologies Ag Power semiconductor component on heat sink
AT408153B (en) * 1998-09-02 2001-09-25 Electrovac METAL MATRIX COMPOSITE (MMC) COMPONENT
JP3812321B2 (en) * 2000-10-25 2006-08-23 株式会社豊田自動織機 Heat sink and manufacturing method thereof
US7006354B2 (en) * 2001-10-26 2006-02-28 Fujikura Ltd. Heat radiating structure for electronic device
DE10245266A1 (en) * 2002-09-27 2004-04-15 Robert Bosch Gmbh Heat sink with metallic body, used for cooling electronic components, has recess on one side containing ceramic impregnated with metal

Also Published As

Publication number Publication date
DE102004022118A1 (en) 2005-11-24
WO2005109980A1 (en) 2005-11-17

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Legal Events

Date Code Title Description
R012 Request for examination validly filed

Effective date: 20120121

R002 Refusal decision in examination/registration proceedings
R003 Refusal decision now final
R003 Refusal decision now final

Effective date: 20140902