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DE112004002184D2 - Klebfolie zur Implantierung von elektrischen Modulen in einen Kartenkörper - Google Patents

Klebfolie zur Implantierung von elektrischen Modulen in einen Kartenkörper

Info

Publication number
DE112004002184D2
DE112004002184D2 DE112004002184T DE112004002184T DE112004002184D2 DE 112004002184 D2 DE112004002184 D2 DE 112004002184D2 DE 112004002184 T DE112004002184 T DE 112004002184T DE 112004002184 T DE112004002184 T DE 112004002184T DE 112004002184 D2 DE112004002184 D2 DE 112004002184D2
Authority
DE
Germany
Prior art keywords
adhesive film
card body
electrical modules
implanting electrical
implanting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE112004002184T
Other languages
English (en)
Inventor
Marc Husemann
Renke Bargmann
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tesa SE
Original Assignee
Tesa SE
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tesa SE filed Critical Tesa SE
Publication of DE112004002184D2 publication Critical patent/DE112004002184D2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G06K19/07747—Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/304—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being heat-activatable, i.e. not tacky at temperatures inferior to 30°C
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2421/00—Presence of unspecified rubber

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
DE112004002184T 2003-12-23 2004-12-21 Klebfolie zur Implantierung von elektrischen Modulen in einen Kartenkörper Expired - Fee Related DE112004002184D2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10361541A DE10361541A1 (de) 2003-12-23 2003-12-23 Klebfolie zur Implantierung von elektrischen Modulen in einen Kartenkörper
PCT/EP2004/053632 WO2005063909A1 (de) 2003-12-23 2004-12-21 Klebfolie zur implantierung von elektrischen modulen in einen kartenkörper

Publications (1)

Publication Number Publication Date
DE112004002184D2 true DE112004002184D2 (de) 2006-09-14

Family

ID=34706664

Family Applications (2)

Application Number Title Priority Date Filing Date
DE10361541A Withdrawn DE10361541A1 (de) 2003-12-23 2003-12-23 Klebfolie zur Implantierung von elektrischen Modulen in einen Kartenkörper
DE112004002184T Expired - Fee Related DE112004002184D2 (de) 2003-12-23 2004-12-21 Klebfolie zur Implantierung von elektrischen Modulen in einen Kartenkörper

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE10361541A Withdrawn DE10361541A1 (de) 2003-12-23 2003-12-23 Klebfolie zur Implantierung von elektrischen Modulen in einen Kartenkörper

Country Status (4)

Country Link
EP (1) EP1699892A1 (de)
DE (2) DE10361541A1 (de)
MX (1) MXPA06007085A (de)
WO (1) WO2005063909A1 (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102005025056A1 (de) * 2005-05-30 2006-12-07 Tesa Ag Nitrilkautschuk-Blends zur Fixierung von Metallteilen auf Kunststoffen
DE102005026191A1 (de) * 2005-06-06 2006-12-07 Tesa Ag Hitze-aktivierbare Folien zur Fixierung von Metallteilen auf Kunststoffen
DE102005035905A1 (de) 2005-07-28 2007-02-01 Tesa Ag Nitrilkautschuk Blends zur Fixierung von Metallteilen auf Kunststoffen
DE102006035787A1 (de) * 2006-07-28 2008-03-13 Tesa Ag Verfahren zum Stanzen von bei Raumtemperatur nicht tackigen hitzeaktivierbaren Klebmassen
DE102006047735A1 (de) * 2006-10-06 2008-04-10 Tesa Ag Hitzeaktivierbares Klebeband insbesondere für die Verklebung von elektronischen Bauteilen und Leiterbahnen
DE102006047739A1 (de) * 2006-10-06 2008-04-17 Tesa Ag Hitzeaktivierbares Klebeband insbesondere für die Verklebung von elektronischen Bauteilen und Leiterbahnen
DE102006058935A1 (de) * 2006-12-12 2008-02-28 Tesa Ag Verbundmittelkopf-Sicherungselement
EP2079107B1 (de) 2008-01-10 2017-10-18 Gemalto AG Verfahren zum Herstellen eines kartenförmigen Datenträgers und nach diesem Verfahren hergestellter Datenträger
DE102017221039B4 (de) * 2017-11-24 2020-09-03 Tesa Se Verfahren zur Herstellung einer Haftklebemasse auf Basis von Acrylnitril-Butadien-Kautschuk

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6630238B2 (en) * 1995-02-16 2003-10-07 3M Innovative Properties Company Blended pressure-sensitive adhesives
DE19948560A1 (de) * 1999-10-08 2001-08-23 Atp Alltape Klebetechnik Gmbh Klebstoffolie zum Implantieren von elektrischen Modulen in einen Kartenkörper und Verfahren zu deren Herstellung

Also Published As

Publication number Publication date
WO2005063909A1 (de) 2005-07-14
MXPA06007085A (es) 2006-09-04
EP1699892A1 (de) 2006-09-13
DE10361541A1 (de) 2005-07-28

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