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DE10294631D2 - Arrangement with power semiconductor components for power control of high currents and application of the arrangement - Google Patents

Arrangement with power semiconductor components for power control of high currents and application of the arrangement

Info

Publication number
DE10294631D2
DE10294631D2 DE10294631T DE10294631T DE10294631D2 DE 10294631 D2 DE10294631 D2 DE 10294631D2 DE 10294631 T DE10294631 T DE 10294631T DE 10294631 T DE10294631 T DE 10294631T DE 10294631 D2 DE10294631 D2 DE 10294631D2
Authority
DE
Germany
Prior art keywords
arrangement
power semiconductor
conductor
power
semiconductor components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE10294631T
Other languages
German (de)
Inventor
Norbert Seliger
Herbert Schwarzbauer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Corp
Original Assignee
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Corp filed Critical Siemens Corp
Priority to DE10294631T priority Critical patent/DE10294631D2/en
Application granted granted Critical
Publication of DE10294631D2 publication Critical patent/DE10294631D2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H10W90/00—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20927—Liquid coolant without phase change
    • H10W40/47—
    • H10W72/5363—
    • H10W72/5475—
    • H10W90/754—

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Power Conversion In General (AREA)
  • Inverter Devices (AREA)
  • Bipolar Transistors (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Die Bonding (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Emergency Protection Circuit Devices (AREA)

Abstract

A device with power semiconductor components controlling the power of high currents has each power semiconductor component insulated and fixed to a common cooled carrier body. Conductor bars, in addition to the power semiconductor components, are fixed to the carrier body, the conductor bars being electrically insulated and placed on top of each other, whereby each semiconductor bar has a free contact surface, and one electrical contact surface of each semiconductor component is electrically connected to a conductor bar by one or several electric conductor bridges and another electrical contact surface of the power semiconductor component is electrically connected to another bar conductor by one or several conductor bridges.
DE10294631T 2001-09-28 2002-09-10 Arrangement with power semiconductor components for power control of high currents and application of the arrangement Expired - Fee Related DE10294631D2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE10294631T DE10294631D2 (en) 2001-09-28 2002-09-10 Arrangement with power semiconductor components for power control of high currents and application of the arrangement

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
DE10147917 2001-09-28
DE10211058 2002-03-13
DE10294631T DE10294631D2 (en) 2001-09-28 2002-09-10 Arrangement with power semiconductor components for power control of high currents and application of the arrangement
PCT/DE2002/003354 WO2003032390A2 (en) 2001-09-28 2002-09-10 Device with power semiconductor components for controlling the power of high currents and use of said device

Publications (1)

Publication Number Publication Date
DE10294631D2 true DE10294631D2 (en) 2004-10-07

Family

ID=26010245

Family Applications (2)

Application Number Title Priority Date Filing Date
DE50205066T Expired - Lifetime DE50205066D1 (en) 2001-09-28 2002-09-10 ARRANGEMENT WITH POWER SEMICONDUCTOR COMPONENTS FOR POWER CONTROL OF HIGH CURRENTS AND APPLICATION OF THE ARRANGEMENT
DE10294631T Expired - Fee Related DE10294631D2 (en) 2001-09-28 2002-09-10 Arrangement with power semiconductor components for power control of high currents and application of the arrangement

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE50205066T Expired - Lifetime DE50205066D1 (en) 2001-09-28 2002-09-10 ARRANGEMENT WITH POWER SEMICONDUCTOR COMPONENTS FOR POWER CONTROL OF HIGH CURRENTS AND APPLICATION OF THE ARRANGEMENT

Country Status (9)

Country Link
US (1) US7057275B2 (en)
EP (1) EP1433204B1 (en)
JP (1) JP4423031B2 (en)
CN (1) CN100477209C (en)
AT (1) ATE311017T1 (en)
DE (2) DE50205066D1 (en)
DK (1) DK1433204T3 (en)
ES (1) ES2248609T3 (en)
WO (1) WO2003032390A2 (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004026061B4 (en) * 2004-05-25 2009-09-10 Danfoss Silicon Power Gmbh Power semiconductor module and method for cooling a power semiconductor module
US7573107B2 (en) * 2004-09-23 2009-08-11 International Rectifier Corporation Power module
JP4106061B2 (en) * 2005-04-22 2008-06-25 三菱電機株式会社 Power unit device and power conversion device
DE102005039165B4 (en) * 2005-08-17 2010-12-02 Infineon Technologies Ag Wire and strip bonded semiconductor power device and method of making the same
DE102007036048A1 (en) 2007-08-01 2009-02-05 Siemens Ag Arrangement with at least one semiconductor component, in particular a power semiconductor component for power control of high currents
CN104682673B (en) * 2013-11-29 2018-06-01 中车大连电力牵引研发中心有限公司 Light rail vehicle drag current transformer module and light rail vehicle traction convertor
EP2996144B1 (en) * 2013-12-19 2017-09-06 Fuji Electric Co., Ltd. Semiconductor module and electrically driven vehicle
DE102014107271B4 (en) * 2014-05-23 2019-11-07 Infineon Technologies Ag Semiconductor module
US9842718B1 (en) 2016-06-10 2017-12-12 Sumitomo Wiring Systems, Ltd. Fuse array for vehicle electrical system having multiple discrete circuits
FR3091141B1 (en) * 2018-12-21 2021-06-25 Valeo Siemens Eautomotive France Sas Electrical assembly of an electrical connection bar and a cooling module
US11682606B2 (en) * 2019-02-07 2023-06-20 Ford Global Technologies, Llc Semiconductor with integrated electrically conductive cooling channels
RU197562U1 (en) * 2019-12-11 2020-05-13 Валерий Валерьевич Камаев SYSTEM OF ELECTROTECHNICAL TIRES AND FIXED CONTACTS WITH A UNIVERSAL HOLDER
FR3105716B1 (en) * 2019-12-18 2022-07-01 Valeo Siemens Eautomotive France Sas ELECTRICAL EQUIPMENT COMPRISING AN ELECTRICAL CONNECTION BAR COOLED BY TWO SIDES OF A HEAT SINK

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3937045A1 (en) * 1989-11-07 1991-05-08 Abb Ixys Semiconductor Gmbh PERFORMANCE SEMICONDUCTOR MODULE
DE4005333A1 (en) 1990-02-20 1991-08-22 Rehm Schweisstechnik Gmbh ELECTRONIC CIRCUIT BREAKER
JP2725954B2 (en) 1992-07-21 1998-03-11 三菱電機株式会社 Semiconductor device and manufacturing method thereof
US5388028A (en) 1993-07-28 1995-02-07 Kaman Electromagnetics Corporation Low impedance interconnection assembly for high frequency switching power semiconductor devices and low inductance modular capacitor
DE4327895A1 (en) * 1993-08-19 1995-02-23 Abb Management Ag Power converter module
US5473190A (en) * 1993-12-14 1995-12-05 Intel Corporation Tab tape
DE4421319A1 (en) * 1994-06-17 1995-12-21 Abb Management Ag Low-inductance power semiconductor module
US5559363A (en) * 1995-06-06 1996-09-24 Martin Marietta Corporation Off-chip impedance matching utilizing a dielectric element and high density interconnect technology
US6521982B1 (en) * 2000-06-02 2003-02-18 Amkor Technology, Inc. Packaging high power integrated circuit devices
FR2802714B1 (en) * 1999-12-21 2002-03-08 Sagem ELECTRIC POWER MODULE AND METHOD FOR THE PRODUCTION THEREOF
JP2001320171A (en) * 2000-05-08 2001-11-16 Shinko Electric Ind Co Ltd Multilayer wiring board and semiconductor device
JP4044265B2 (en) * 2000-05-16 2008-02-06 三菱電機株式会社 Power module
WO2002041402A2 (en) * 2000-11-16 2002-05-23 Silicon Wireless Corporation Discrete and packaged power devices for radio frequency (rf) applications and methods of forming same
JP2002246515A (en) * 2001-02-20 2002-08-30 Mitsubishi Electric Corp Semiconductor device

Also Published As

Publication number Publication date
EP1433204A2 (en) 2004-06-30
WO2003032390A2 (en) 2003-04-17
CN1559087A (en) 2004-12-29
CN100477209C (en) 2009-04-08
JP2005505937A (en) 2005-02-24
ATE311017T1 (en) 2005-12-15
US7057275B2 (en) 2006-06-06
DE50205066D1 (en) 2005-12-29
WO2003032390A3 (en) 2004-01-29
DK1433204T3 (en) 2006-04-03
US20040256710A1 (en) 2004-12-23
ES2248609T3 (en) 2006-03-16
JP4423031B2 (en) 2010-03-03
EP1433204B1 (en) 2005-11-23

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Legal Events

Date Code Title Description
8139 Disposal/non-payment of the annual fee