DE10223203A1 - Electronic component module and method for its production - Google Patents

Abstract

A connection substrate for at least one electronic component has a flat substrate body, in the flat surface of which there are in each case internal contact bumps (3) for flip-chip contacting of a component and, if appropriate, external contact bumps (9) for connection to a printed circuit board by partial removal or deformation (2; 8) are arranged recessed. DOLLAR A By producing these contact bumps using the hot stamping process or by laser ablation, they can be made very small and in a narrower grid than previous chip connections.

Description

The invention relates to an electronic component module with a connection substrate and at least one electronic component and a method for its production.

A connection substrate is already included in EP 0782765 B1 a semiconductor chip, a so-called PSGA (Polymer Stud Grid Array), wherein the injection molded substrate molded polymer bumps with a solderable end surface has. The polymer bumps not only have the advantage that them in one step with the basic body itself can be molded, but they can because of their Elasticity also tensions, for example due to Thermal expansion, absorb and compensate.

In the previously known substrates with polymer bumps The latter in their distribution and arrangement to the conventional grid of other connection elements, especially the Adjusted solder balls in the so-called BGA technique. At this Technology can change the grid spacing because of the properties and the processing form of the solder balls not further reduced become. However, there is now a trend towards more Miniaturization, whereby semiconductor components with flip-chip Connections with a grid spacing of 0.2 mm and smaller own and the grid spacing of the contacts on printed circuit boards from previously 1 mm and more now to 0.5 mm and further were reduced.

The aim of the present invention is therefore a Connection substrate for at least one electronic Component, in particular a semiconductor component, to create and to specify a process for its production, which a Connection of the components in flip-chip technology with extreme allows small grid spacings and at the same time a special low height of the component and connection substrate formed module allows.

• - ein flacher Substratkörper (1; 21, 22, 23; 31; 41) besitzt auf seiner ebenen Oberseite (1a) einen Kontaktbereich mit Innenkontakten (4) für das Bauelement (7) und auf seiner Unterseite (1b) Außenkontakte (10);
• - in dem Kontaktbereich sind durch Teilabtragung (2) oder Verformung des Substratmaterials jeweils vertieft angeordnete Innenkontakt-Höcker (3) im Abstand der Anschlüsse des Bauelementes ausgebildet;
• - auf den Innenkontakt-Höckern (3) ist jeweils durch Metallisierung ein Innenkontakt (4) ausgebildet und mit einer Lotschicht versehen;
• - auf den Innenkontakten ist das Bauelement (7) in Flip- Chip-Technik kontaktiert und
• - von den Innenkontakten (4) erstrecken sich Leiterbahnen (6, 12, 13, 14, 33, 34, 43, 44) über Durchgangslöcher (5; 42) zu den Außenkontakten (10) auf der Unterseite des Substratkörpers (1; 21, 22, 23; 31; 41).

According to the invention, such a module has the following features:

• - A flat substrate body ( 1 ; 21 , 22 , 23 ; 31 ; 41 ) has on its flat top ( 1 a) a contact area with internal contacts ( 4 ) for the component ( 7 ) and on its underside ( 1 b) external contacts ( 10 );
• - In the contact area, partial recesses ( 2 ) or deformation of the substrate material form recessed internal contact bumps ( 3 ) at a distance from the connections of the component;
• - An inner contact ( 4 ) is formed on the inner contact bumps ( 3 ) by metallization and provided with a solder layer;
• - On the internal contacts, the component ( 7 ) is contacted in flip-chip technology and
• - From the inner contacts ( 4 ) extend conductor tracks ( 6 , 12 , 13 , 14 , 33 , 34 , 43 , 44 ) via through holes ( 5 ; 42 ) to the outer contacts ( 10 ) on the underside of the substrate body ( 1 ; 21 , 22 , 23 ; 31 ; 41 ).

Due to the recessed arrangement of the invention Internal contact bumps by partial ablation, annular Notches or other deformation in the otherwise flat An upper side of the substrate body is formed Particularly space-saving contacting of the component in flip Chip technology with a particularly low overall height. The summit the hump is essentially flush with the original flat surface of the substrate body; only the the soldering order forming the contact rises above this level.

In comparison with the conventional BGA technology, which is due to the proportions of the solder balls a flip chip Contacting only up to a certain minimum distance Component connections enabled and with, for example at distances of less than 200 µm only one Wire bond connection is possible, enables the invention Contacting with recessed polymer bumps a flip chip Contacting down to about 100 µm. The reason is that the solder balls in the BGA technique when melting Contacts are pressed together and thereby theirs Diameter compared to their original ball diameter magnify (about 1.3 times), while that at Invention formed on the bumps solder layer at Melting does not increase their diameter, so that Contact point does not reach a larger diameter than the connection (Pad) of the component itself.

Are preferably also on the underside of the substrate body also deepened by partial removal or deformation External contact bumps formed in the grid of PCB Connections are arranged and the external contacts of the Wear substrate. Depending on the arrangement and the Manufacturing processes of the bumps can be on the top or on the Underside of the substrate body by annular or else approximately grid-shaped notches are formed. Conceivable it is also the surface of the Substrate body with the exception of the remaining bumps remove or deform by hot stamping, so that only an edge area and, if necessary, intermediate webs in the original surface level along with the Contact bumps stop.

Depending on the course of the conductor tracks from the internal contacts the through holes or to other connections ring-shaped notches partially, especially on their Insides be metallized while another part, preferably at least parts of the outer areas of the notch, to form isolation gaps from metallization be kept free. This can be due to the sloping Walls of the notch are advantageous due to laser radiation be effected. The conductor tracks on the top and on the Bottom of the substrate body can be more preferred Design each run in groove-shaped longitudinal trenches are incorporated into the surface of the substrate body. It is advantageous that the inclined side walls these trenches are metallized to form conductor tracks, while the bottom area and the outer edges of the trenches that can be processed well with laser radiation, of which Metallization are kept free and thus insulation distances form. In this way, two can be very space-saving Conductor tracks can be housed in a trench.

The through holes can be round or rectangular Cross section either from the top surface to provided on the underside surface, or they can advantageously in the area of, for. B. annular, Notch right next to a hump or in the area of a trench guiding conductor tracks are generated. in the the latter case, it is particularly advantageous to use a rectangular one To provide through hole, two each opposite side walls are metallized, while the form insulation sections between the side walls. Thereby can have two separate traces in a rectangular Through hole are generated, each separately with the two conductor tracks of a groove-shaped trench connected can be. Such rectangular through holes can in in a simple manner, for example when hot-stamping the substrate body are generated, with inclined side walls for Generation of the insulation sections processed with a laser beam can be.

The substrate body can, for example, consist of a single one Foil are made. But it can also be an advantage to provide a base substrate on the top and / or A bump layer is laminated on the underside, the inside contact bumps in the respective bump layer or the external contact bumps are formed. In this case the cusp layers can each be made of a different material exist as the base substrate. So it is possible that Bump layer with the internal contact bumps made of one material to provide that in terms of its thermal expansion Properties of the material of the component to be applied, is preferably adapted to a semiconductor material, while a material is used for the external contact bumps which can be used in terms of its thermal expansion Properties adapted to a circuit board.

• a) In der Oberfläche eines folienförmigen Substratkörpers aus Polymer-Material werden zumindest auf einer Seite durch Teilabtragung oder Verformung der Oberfläche jeweils Innenkontakt-Höcker (3) geformt;
• b) zwischen der Oberseite und der Unterseite des Substratkörpers werden Durchgangslöcher erzeugt;
• c) durch Metallisierung der Oberseite und der Unterseite des Substratkörpers sowie der Durchgangslöcher wird eine Leiterschicht erzeugt;
• d) durch gezielte Strukturierung der Leiterschicht werden Innenkontakte auf den Innenkontakt-Höckern der Oberseite, Außenkontakte auf der Unterseite und zur Bildung elektrisch leitender Verbindungen zwischen den Innenkontakten und den Außenkontakten erzeugt;
• e) die Innenkontakte werden mit einem Lot- Material beschichtet; und
• f) auf die Innenkontakte wird das Bauelement aufgesetzt, und seine Anschlüsse werden mit den Innenkontakten verlötet.

A method according to the invention for producing a connection substrate has the following steps:

• a) Inside contact bumps ( 3 ) are formed in each case on the surface of a film-shaped substrate body made of polymer material by partial removal or deformation of the surface;
• b) through holes are produced between the top and the bottom of the substrate body;
• c) a conductor layer is produced by metallizing the top and bottom of the substrate body and the through holes;
• d) through targeted structuring of the conductor layer, internal contacts are produced on the internal contact bumps on the top, external contacts on the underside and to form electrically conductive connections between the internal contacts and the external contacts;
• e) the internal contacts are coated with a solder material; and
• f) the component is placed on the internal contacts and its connections are soldered to the internal contacts.

Preferably, in step a) also on the underside of the Substrate body by deformation or partial removal, for example, by circular notching, respectively External contact bumps are shaped, and in step c) each generated the external contacts.

In principle, it would be possible to implement the invention Connection substrate with the recessed contact bumps also in known manner by injection molding. However, since it to particularly small dimensions of the hump itself and the Pitch between the humps comes for that Production of the humps according to the invention, the production of the Through holes and possibly the production of grooves for Routing conductor tracks, preferably a hot stamping process or a structuring of the substrate body with a Laser beam into consideration. For structuring the Metallization layer for forming the conductor tracks is preferred structuring using a laser beam. It is in one case it is possible to use an etch resist layer with a Structure the laser beam and then the exposed ones Remove structures in an etching process. Another one Method especially for very thin conductor layers The metal layer can also be used directly with the Laser beam can be structured.

In the design of the connection substrate according to the invention it is possible to adapt to the connections of Semiconductor chips connection bumps with a diameter of about 50 up to 250 µm with a grid spacing of about 200 µm generate, the height of the bumps is greater than the diameter and preferably more than 1.3 times the diameter of the Solder connection can be. This results in a lot tight space a good elasticity of the individual connections. By using recessed external contact bumps the underside of the substrate body with a correspondingly smaller one Diameter of the solder joints of the external connections is also on the circuit board that holds the module, less space for who need contact themselves. So stay on the Printed circuit board, for example, between two additional connections Space available to place two or three instead of a trace To conduct conductor tracks.

The invention is described below using exemplary embodiments explained in more detail with reference to the drawing. Show it

Fig. 1 shows a section of an inventive connection substrate for an inventive module,

Fig. 2 is a schematic view showing the structure of inner contact bumps in connection with through-holes in section,

Fig. 3 is a sectional view of a module with bumps on the top and bottom of the terminal substrate,

Fig. 4 is a sectional view of a substrate with an additional bump layer on the top,

Fig. 5 is a sectional view of a substrate with additional bumps layers on the top and bottom,

Fig. 6 is a schematic detail representation of grooves with conductor tracks,

Fig. 7 is a schematic representation of a rectangular through-hole,

Fig. 8 is a schematic view of a wiring pattern on the upper side of a connecting substrate, and

Fig. 9 is a schematic representation of a wiring pattern on the bottom of a connecting substrate,

Fig. 10 is a schematic representation of a substrate having a top surface with respect to FIG. 2 modified design of the inner contact bumps,

FIG. 11 shows an embodiment of a substrate body further modified compared to FIG. 10 to show the solder application and

Fig. 12 is a schematic sectional view of a module according to the invention in a further modification.

In Fig. 1 a section of a connection according to the invention substrate is schematically shown. This connection substrate essentially consists of a substrate body 1 made of insulating material, for example LCP or another, preferably thermoplastic. In the upper side 1 a of this substrate body 1 , annular notches 2 are made , for example by means of an embossing stamp or also by removal with a laser beam. These annular notches 2 , the depth of which can be, for example, 50 to 200 μm, form internal contact bumps 3 , the grid spacings of which correspond to the contact spacings of a semiconductor component, so that flip-chip contacting is possible directly on the top of the connection substrate is. For this purpose, internal contacts in the form of a metal layer are applied to the top of the bumps 3 .

As is further shown schematically in FIG. 1, in this embodiment through holes 5 are produced between the top 1 a and the bottom 1 b of the substrate body, in which case the through holes 5 each open into a notch 2 . Via the metallization of these through holes and the outer wall of the bumps 3 , a direct conductive connection is thus produced from the inner contacts 4 via the through holes 5 to the underside 1 b of the substrate body.

Fig. 2 shows in a section the structure of Innenkontakt- bumps. 3 After the notches 2 and the through holes 5 have been produced in the substrate body 1 by hot stamping or by laser radiation, the substrate body is coated with a metallization layer, which is partially removed again in a structuring process, so that a metal layer 6 is provided on the circumference of the internal contact bumps 3 , preferably a copper layer, remains, while the outer walls of the notches 2 are freed from the metallization and thus act as insulation sections. A metallization to form the internal contacts 4 is also applied to the tip of the bumps 3 . There is also a solder layer, which is not specifically shown here. The through holes 5 have also been lined with a metal layer during the metallization process. The holes themselves can then be closed either with metal or with a plastic compound.

FIG. 3 again shows a section through a schematically illustrated connection substrate 1 , internal contact bumps 3 with internal contacts 4 for flip-chip contacting with connections 17 of a semiconductor chip 7 or another component being formed on the top. On the underside of the substrate body, external contact bumps 9 are formed in the same way by ring-shaped notches 8 , which are likewise sunk into the surface of the substrate and each carry an external contact 10 on their tip. These external contact bumps 9 are adapted in size and in their grid spacing to the connections of a printed circuit board 11 . The connection between the inner contacts 4 and the outer contacts 10 takes place via the metallized through holes 5 and a corresponding conductor track structure 12 on the underside 1 b of the substrate body. The metallization and structuring of the conductor layers on the top and the bottom of the substrate body can be carried out in one process step.

FIG. 4 shows a modification compared to FIG. 3. In this case, the substrate body consists of a base substrate 21 , on the underside of which the external contact bumps 9 are arranged as in the previous example. However, a first bump layer 22 is laminated on top of this base substrate 21 , in which the internal contact bumps 3 are shaped as in the previous examples. In this way, the bump layer 22 can be adapted even better to the properties, in particular the thermal expansion properties, of a component to be placed on top, for example the properties of a semiconductor material.

FIG. 5 shows a further modification, in which case the base substrate 21 carries not only a first bump layer 22 on the top but also a second bump layer 23 on the bottom. Thus, the bump layers 22 and 23 can be selected in different ways to match their contact partners, that is, the first bump layer 22 can be adapted to a component material and the second bump layer 23 can be adapted to the properties of a printed circuit board material. In Fig. 5, the possibility is further shown to apply conductive traces on the top and the bottom of the base substrate 21 and structure before the layers are laminated bumps 22 and 23. Thus, the through holes 5 each penetrate only the base substrate 21 and are connected on the upper side to upper-side conductor tracks 24 and on the underside to lower-side conductor tracks 25 , which in turn are connected to metallizations 6 in the notches 2 and 8 , respectively.

Can at the connection substrates according to FIGS. 1 to 4 traces on the underside or on the upper surface of a substrate body 31 may be disposed in each groove-shaped grooves 32, which are only schematically as short sections shown in Fig. 6. Such trenches can also be shaped during the production of the substrate, ie during the formation of the notches 2 by hot stamping or by laser structuring. The inclined side walls 33 and 34 are preferably metallized in these trenches 32 , while the bottom surfaces 35 and the upper edge regions 36 are not metallized and serve as insulating sections. In this way, two conductor tracks can be produced on opposite walls in a trench 32 . The production is relatively simple, since after the entire surface of the substrate body including the trench walls has been metallized, the superficial regions 36 and the bottom regions 35 parallel to the surface can easily be structured by means of a laser beam, ie can be freed from the metallization. For the sake of example only, size ratios that can be achieved with such a trench structure are given here. A trench 32 can have a width b1 of 50 μm in the bottom region 35 , while the trench spacing in the surface region can also have a width b2 of 50 μm. If one also assumes that the inclined side walls 33 and 34 each have a width b3 of 25 μm, this technique can be used to accommodate two conductor tracks over a total width of b4 = 150 μm. The depths of the trenches can also be about 50 μm in this example.

FIG. 7 also schematically shows the design of a rectangular through hole 42 narrowing on one side. A rectangular through hole 42 is formed in a substrate body 41, which is only indicated, for example by hot stamping the substrate. In this case, inclined side walls 43 , 44 , 45 and 46 are produced in that the side lengths c1 and d1 on the upper side are larger than the side lengths c2 and d2 on the underside. It should also be mentioned here that the top and bottom sides of the substrate body can also be interchanged, so that, for example, the larger hole width can optionally be provided on the chip side of the connection substrate or on the circuit board side.

After all-sided metallization of the substrate body 41 and also the through hole 42 , two opposite sides, for example sides 45 and 46, are then freed from the metallization, so that two side surfaces 43 and 44 coated with metal and insulated from one another remain. These then form two separate interconnect bushings from the top to the bottom of the substrate. Feedthroughs of this type can be provided in the substrate body where it is cheapest. Such a through hole in the region of a trench 32 according to FIG. 6 is advantageous, for example . For example, a conductor track 33 from FIG. 6 could be connected to a bushing conductor track 43 and a conductor track 34 to a bushing conductor track 44 .

Schematically possible configurations of the upper side in Figs. 8 and 9 are shown a terminal substrate (Fig. 8) and the bottom (Fig. 9). However, the schemes of Fig. 8 and Fig. 9 are not in correlation with each other, it is merely basic arrangement possibilities of the respective connecting elements of the substrate.

Thus, Fig. 8 shows a series of inner contact bumps 3 as shown in Fig. 1 to 5. These each have an internal contact 4 . From these internal contact bumps, conductor tracks 13 partially depart, which, with a corresponding design, can also be arranged in trenches like conductor tracks 33 and 34 ( FIG. 6). In each case two of these conductor tracks 13 lead to a rectangular through hole 42 according to FIG. 7 with through conductor tracks 43 and 44 .

Further internal contact bumps 3 in FIG. 8 with internal contacts 4 are each connected to round through holes 5 as in FIGS. 1 to 4. These through holes can be arranged directly next to the bumps 3 in the area of the annular notches 2 . Others in turn are connected to a remote through hole 5 via additional conductor tracks 14 .

Fig. 9 shows a possible arrangement of a circuit board connection side in the cutout. Bumps are also provided on this side, namely the external contact bumps 9 with the external contacts 10 , which are formed by annular notches 8 . In this case, too, two types of through holes are shown, namely round through holes 5 , which can be created directly in the area of an annular notch 8 , and rectangular through holes 42 , which are designed according to FIG. 7. These through holes are each connected to conductor tracks, for example conductor track pairs 33 and 34 , which are arranged in a common trench 32 according to FIG. 6. FIG. 9 shows how these two conductor tracks 33 , 34 are connected to the two conductive side walls 43 and 44 of a through hole.

In Figs. 10 to 12 schematically show further modifications of the connection substrate or of the module according to the invention are shown. FIG. 10 schematically shows a substrate body 51 , on the upper side of which internal connection bumps 53 are produced in comparison to FIG. 2 not by ring-shaped notches but by large-area removal or deformation of the areas 52 below the surface plane 55 . In this case, in addition to the inner contact bumps 53 , only edge regions 56 and an intermediate web 57 remain in the original height. The inner contact bumps 53 are then - after a previous basic metallization - provided with a solder layer 54 to form the solderable inner contacts.

Before the solder layer 54 is applied , the areas around the internal contact bumps 53 are expediently covered with a solder resist 58 ( FIG. 11) in order to ensure the necessary insulation distance between the individual bumps. This solder resist is produced and structured, for example, by spraying with subsequent laser structuring or by applying a light-sensitive layer with subsequent exposure. Known methods, such as screen printing, are suitable for applying the solder coating 54 .

FIG. 12 shows again a section of a module according to the invention, the upper side being removed or deformed on a substrate body 61 to form internal contact bumps 63 , so that only edge regions 66 remain. On these internal contact bumps 63 with their solder coating 64 , a semiconductor chip 7 is contacted via its connections 17 in a narrow grid spacing.

The underside of the substrate body 61 is largely removed in the same way to form external contact bumps 68 between the edge regions 67 . However, since the outer contact bumps 68 have a larger grid spacing than the inner contact bumps 63 in adaptation to the circuit board connections, further intermediate webs 69 can remain on the underside of the substrate body 61 , on which, for example, conductor tracks or the like can be arranged. It should be noted that the design of the depressions between the individual bumps on the top or bottom of the substrate body can be any, depending on the deformation method used. In any case, the bumps are sunk below the original surface level of the substrate body, ie below the upper surface level 65 and below the lower surface surface 70 of the substrate body.

Claims (26)

1. Electronic component module with a connection substrate and at least one electronic component ( 7 ) with the following features: - A flat substrate body ( 1 ; 21 , 22 , 23 ; 31 ; 411 ; 61 ) has on its flat top ( 1 a) a contact area with internal contacts ( 4 ) for the component ( 7 ) and on its underside ( 1 b) external contacts ( 10 ); - In the contact area, recessed internal contact bumps ( 3 ; 53 ; 63 ) are formed at a distance from the connections of the component by partial removal ( 2 ) or deformation of the substrate material; - On the inner contact bumps ( 3 ; 53 ; 63 ) an inner contact ( 4 ; 54 ; 64 ) is formed in each case by metallization and provided with a solder layer; - On the internal contacts, the component ( 7 ) is contacted in flip-chip technology and - From the inner contacts ( 4 ) extend conductor tracks ( 6 , 12 , 13 , 14 , 33 , 34 , 43 , 44 ) via through holes ( 5 ; 42 ) to the outer contacts ( 10 ) on the underside of the substrate body ( 1 ; 21 , 22 , 23 ; 31 ; 41 ). 2. Module according to claim 1, wherein on the underside of the substrate body ( 1 ; 21 , 22 , 23 ; 63 ) by partial removal ( 8 ) or deformation of the substrate material recessed external contact bumps ( 9 ; 69 ) are formed, which are at a distance from Printed circuit board connections are arranged and carry the external contacts ( 10 ) of the substrate. 3. Module according to claim 1 or 2, wherein the inner contact bumps ( 3 ) and / or the outer contact bumps ( 9 ) are each formed by annular notches ( 2 ; 8 ) in the substrate material. 4. Module according to claim 3, wherein the annular notches ( 2 ; 8 ) are metallized on their inner sides ( 6 ) and are at least partially insulated on their outer sides. 5. Module according to one of claims 1 to 4, wherein in the surface of the top and / or bottom of the substrate body ( 31 ) longitudinal trenches ( 32 ) are formed, the side walls ( 33 , 34 ) at least partially with a metal layer to form conductor tracks are provided. 6. Module according to claim 5, wherein the bottom region ( 35 ) of the trenches ( 32 ) is insulated in order to form two mutually insulated conductor tracks ( 33 , 34 ) on the side walls. 7. Module according to one of claims 3 to 6, wherein in each case through holes ( 5 ) with a round cross section in the area of a notch ( 2 ; 8 ) are arranged and metallized on their peripheral walls to form conductor tracks. 8. Module according to one of claims 1 to 6, wherein through holes ( 42 ) with a rectangular cross-section are metallized only on two opposite side walls ( 43 , 44 ) to two mutually insulated through-conductor tracks from the top to the bottom of the substrate ( 41 ) to build. 9. Module according to claims 6 and 8, wherein in each case rectangular through holes ( 43 ) are formed in the region of longitudinal trenches ( 32 ) and in each case one conductor track ( 33 , 34 ) on a side wall of the longitudinal trench ( 32 ) with a through conductor track ( 43 , 44 ) on a side wall of the through hole ( 42 ) is conductively connected. 10. Module according to one of claims 1 to 9, wherein the substrate body consists of a base substrate ( 21 ) and a bump layer ( 22 , 23 ) laminated on the top and / or on the bottom and wherein in the respective bump layer ( 22 , 23 ) the inner contact bumps ( 3 ) and the outer contact bumps ( 9 ) are formed. 11. Module according to claim 10, wherein a on the top of the base substrate ( 21 ) arranged first bump layer ( 22 ) consists of a material whose thermal expansion properties are adapted to that of a component ( 7 ) to be applied, preferably a semiconductor component are. 12. Module according to claim 10 or 11, wherein a on the underside of the base substrate ( 21 ) arranged second bump layer ( 23 ) consists of a material whose temperature behavior is adapted to that of a printed circuit board ( 11 ). 13. Module according to one of claims 10 to 12, wherein a conductor track structure ( 24 ; 25 ) is arranged below the laminated bump layer ( 22 , 23 ). 14. Module according to one of claims 1 to 13, wherein the ratio of the height of a bump ( 3 ; 9 ) to the diameter of the solder joint is greater than 1, preferably greater than 1, 3. 15. A method for producing a module according to one of claims 1 to 14 with the following steps: a) In the surface of a film-shaped substrate body ( 1 ; 21 , 22 , 23 ; 31 ; 41 ; 51 ; 61 ) made of polymer material, at least on one side, internal contact bumps ( 3 ; 53 ; 63 ) shaped; b) through holes ( 5 ; 42 ) are produced between the top and the bottom of the substrate body ( 1 ; 21 , 22 , 23 ; 31 ; 41 ; 51 ; 61 ); c) by metallizing the top and bottom of the substrate body ( 1 ; 51 ; 61 ) and the through holes ( 5 ; 42 ), a conductor layer is generated; d) through targeted structuring of the conductor layer, internal contacts ( 4 ; 54 ; 64 ) on the internal contact bumps on the upper side, external contacts ( 10 ) on the lower side and conductor tracks ( 6 , 12 , 24 , 25 , 33 , 34 , 43 , 44 ) generated to form electrically conductive connections between the inner contacts ( 4 ) and the outer contacts ( 10 ); e) the internal contacts ( 4 ; 54 ; 64 ) are coated with a solder material; and f) the component ( 7 ) is placed on the internal contacts ( 4 ) and its connections ( 17 ) are soldered to the internal contacts. 16. The method according to claim 15, wherein in step a) also formed on the underside of the substrate body by removal or deformation of the substrate material in each case recessed external contact bumps ( 9 ) and in each case the external contacts ( 10 ) generated in step c) become. 17. The method according to claim 15 or 16, wherein the inner contact bumps ( 3 ) and / or the outer contact bumps ( 9 ) are formed by approximately annular notches. 18. The method according to any one of claims 15 to 17, wherein the bumps ( 3 ; 9 ; 53 ; 63 ; 64 ) and the through holes ( 5 ; 42 ) are each produced by hot stamping. 19. The method according to any one of claims 15 to 17 ", wherein the bumps ( 2 ; 8 ) and the through holes ( 5 ; 42 ) are each produced using a laser beam. 20. The method according to any one of claims 15 to 19, the structuring of the metallization according to step c) done using a laser beam. 21. The method according to any one of claims 15 to 20,
wherein in step a) groove-like trenches ( 32 ) with oblique side walls ( 33 , 34 ) are formed in the surface of the substrate body ( 31 ), which are metallized in step c),
wherein in step d) the bottom surface of the trenches ( 35 ) and the edge region ( 36 ) on the surface of the substrate body ( 31 ) are freed from the metal layer. 22. The method according to any one of claims 15 to 20, wherein in step a) through holes ( 42 ) are produced with a tapering rectangular cross-section, wherein in step c) the side walls of the through holes are metallized and in each case two opposite side walls ( 45 , 46 ) the through holes in step d) are ready from the metal layer. 23. The method according to any one of claims 15 to 22, wherein before step e) the surface of the substrate body ( 51 ) in the areas surrounding the bumps ( 53 ) are covered with a solder resist layer ( 57 ) and wherein in step e) the solder material ( 54 ) is applied to the hump ( 53 ). 24. The method according to any one of claims 15 to 23, wherein before step a) on a base substrate ( 21 ) on the top and / or underside a bump layer ( 22 , 23 ) is laminated and in step a) the bumps ( 3 ; 9 ) in each case are generated in the cusp layer ( 22 ; 23 ). 25. The method according to claim 24, wherein before the lamination of the bump layer ( 22 ; 23 ) in each case a conductor track structure ( 24 ; 25 ) is generated on the top or the bottom of the base substrate ( 21 ). 26. The method according to claim 25, wherein the through holes ( 5 ) are produced in the base substrate ( 21 ) and a conductive connection from the through holes ( 5 ) to the inner contacts ( 4 ) or the outer contacts ( 10 ) is in each case via notches ( 2 ) is generated in the bump layer ( 22 ; 23 ).