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DE10203144A1 - Electrically conducting connections between electronic components and conducting plates are formed using a laser to create conducting paths and by welding, soldering or adhesion - Google Patents

Electrically conducting connections between electronic components and conducting plates are formed using a laser to create conducting paths and by welding, soldering or adhesion

Info

Publication number
DE10203144A1
DE10203144A1 DE10203144A DE10203144A DE10203144A1 DE 10203144 A1 DE10203144 A1 DE 10203144A1 DE 10203144 A DE10203144 A DE 10203144A DE 10203144 A DE10203144 A DE 10203144A DE 10203144 A1 DE10203144 A1 DE 10203144A1
Authority
DE
Germany
Prior art keywords
circuit board
arrangement
laser
conducting
components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE10203144A
Other languages
German (de)
Inventor
Ruediger Ufermann
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to DE10203144A priority Critical patent/DE10203144A1/en
Publication of DE10203144A1 publication Critical patent/DE10203144A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H10W99/00—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder
    • H10W70/093—
    • H10W70/60—
    • H10W70/614—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H01R43/0221—Laser welding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/145—Arrangements wherein electric components are disposed between and simultaneously connected to two planar printed circuit boards, e.g. Cordwood modules
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
    • H10W72/073—
    • H10W72/9413—

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

Arrangement for producing an electrically conducting connection between electronic components (8) and flexible or rigid conducting plates comprises a laser (2), electron or ion bombardment unit, used to create electrically conducting paths (4, 6). Arrangement for producing an electrically conducting connection between electronic components (8) and flexible or rigid conducting plates comprises a laser (2), electron or ion bombardment unit, used to create electrically conducting paths (4, 6). The electronic components are in the form of discrete elements and integrated members which fit exactly in cut-outs in the rigid or flexible component sections made from non-conducting and optically transparent or non-transparent anti static plastic. The components are welded, soldered or adhered to the conducting plates and the top of the upper conducting plate and the bottom of the lower plate are coated with a non-conducting transparent plastic coating. Negative pressure is created between the components so air is sucked away.

Description

Die Erfindung betrifft eine Anordnung und ein Verfahren zur Herstellung elektrisch leitender Verbindungen zwischen flexiblen oder starren Leiterplatten und elektronischen Bauelementen nach der im Oberbegriff des Anspruchs 1 angegebenen Art. The invention relates to an arrangement and a method for producing electrically conductive Connections between flexible or rigid circuit boards and electronic components according to the specified in the preamble of claim 1 Art.

Ähnliche Anordnungen und Verfahren dieser Technologie werden bereits in verschiedenen Ausführungsformen eingesetzt. Similar arrangements and methods of this technology are already in various Embodiments used.

Ausgehend von diesem Stand der Technik liegt der Erfindung die Aufgabe zugrunde, eine Anordnung und ein Verfahren nach der im Oberbegriff des Anspruchs 1 genannten Art vorzuschlagen, mit der die vorgegebenen Aktionen erfüllt werden können. Based on this prior art, the invention has the object, a Arrangement and a method according to the type mentioned in the preamble of claim 1 to propose, with which the given actions can be fulfilled.

Erfindungsgemäß unterscheidet sich die Anordnung der Eingangs genannten Art vorrangig von bisherigen Technologien dadurch, dass auf sehr umweltfreundliche Art und Weise mittels eines Lasers in nur einem Arbeitsgang sowohl die elektrischen Leiterbahnen als auch die leitenden Verbindungen zu den elektronischen Bauelementen realisiert werden können, wodurch neben einem hohen Maß an Ökologie auch eine herausragende Ökonomie erreicht wird, da keine umweltschädigenden und teuren Stoffe mehr zum Einsatz kommen. According to the invention, the arrangement of the aforementioned type differs primarily from previous technologies in that in a very environmentally friendly way by means of a Lasers in just one operation, both the electrical conductors and the conductive Connections to the electronic components can be realized, which in addition to a high Degree of ecology also an outstanding economy is achieved, since no polluting and expensive fabrics are used more.

Gelöst wird diese Aufgabe durch die kennzeichnenden Merkmale des Anspruchs 1. Vorteilhafte Weiterbildungen der Erfindung sind durch die von diesem Anspruch abhängigen Ansprüche gekennzeichnet. This problem is solved by the characterizing features of claim 1. Advantageous developments of the invention are by the dependent of this claim claims characterized.

In folgendem wird die Erfindung anhand eines bevorzugten Ausführungsbeispiels in Verbindung mit zwei Zeichnungen beschrieben. In the following the invention with reference to a preferred embodiment in Connection described with two drawings.

Dabei zeigt: Showing:

Fig. 1 eine vereinfachte Ansicht der Leiterplatte (3) in Draufsicht. Fig. 1 is a simplified view of the circuit board ( 3 ) in plan view.

Fig. 2 eine vereinfachte Ansicht der Leiterplatten (25, 27) in Vorderansicht. Bezugszeichenliste 1 Leiterplattenanordnung
2 Laser
3 Leiterplatte
4 Leiterbahn
5 Laser
6 Leiterbahn
7 Leiterbahnquerschnitt
8 diskretes Bauelement
9 elektrische Verbindung
10 Verbindungspunkt
11 Verbindungspunkt
12 Laserkontaktierung
13 Verbindungspunkt
14 Integrierter Baustein (IC)
15 Verbindungspunkt
16 Leiterplattenunterseite (16)
17 Bauelementewanne
18 Leiterplattenstärke
19 Leiterplattenoberseite
20 diskretes Bauelement
21 Verbindungspunkt
22 Verbindungspunkt
23 Verbindungspunkt
24 Verbindungspunkt
25 untere Leiterplatte
26 integrierter Baustein (IC)
27 obere Leiterplatte
28 Beschichtung
 Fig. 2 is a simplified view of the circuit boards ( 25 , 27 ) in front view. LIST OF REFERENCES 1 circuit board assembly
2 lasers
3 circuit board
4 trace
5 lasers
6 trace
7 conductor cross section
8 discrete component
9 electrical connection
10 connection point
11 connection point
12 laser contact
13 connection point
14 integrated module (IC)
15 connection point
16 PCB underside ( 16 )
17 component tub
18 pcb thickness
19 PCB top
20 discrete component
21 connection point
22 connection point
23 connection point
24 connection point
25 lower circuit board
26 integrated module (IC)
27 upper circuit board
28 coating

Claims (11)

I. Anordnung und Verfahren zur Herstellung elektrisch leitender Verbindungen zwischen elektronischen Bauelementen und flexiblen oder starren Leiterplatten, dadurch gekennzeichnet, dass die in zunächst unbehandelten Zustand nichtleitende und optisch transparente bzw. optisch teil- oder nichttransparente und flexible oder starre und ein- oder mehrlagige Leiterplatte (3) aus Kunststoff nach Überfahren mittels des Lasers (2) durch die Intensität dessen thermischer und/oder optischer Energieeinwirkung bzw. durch Einwirkung anderer elektromagnetischer Wellen bzw. Elektronen- oder Ionenbeschuss, mehr oder weniger elektrisch leitfähige und mehr oder weniger tief darin eindringende Leiterbahnen (6, 4. . .n) mit dem Leiterbahnquerschnitten (7. . .n) hinterlässt, wobei die elektronischen Bauelemente in Form diskreter Bauelemente (8. . .n) und Integrierter Bausteine (IC) (14. . .n), die passgenau in die Mulden der starren oder flexiblen Bauelementewanne (17) aus nichtleitendem und optisch transparentem oder nichttransparentem tiefziehbarem antistatischem oder antistatisch beschichtetem Kunststoff eingebracht werden können oder auch nicht und jeweils die Verbindungspunkte (10, 13, 15, 21, 22, 23, 24. . .n) aus leitendem Kunststoff, Metall oder leitender Keramik aufweisen und plan oder erhaben gegenüber der äußeren Bauteilgehäusewandung verlaufen und an den oberen unteren oder auch seitlichen Bauelementeseiten platziert sind und durch die kurzzeitig erhöhte Energiezufuhr des Lasers (5), der mit dem Laser (2) identisch ist oder auch nicht, die Laserkontaktierungen (12. . .n) durch Schweißung, Klebung oder Lötung bewirkt, wobei auch die unten platzierten Bauelemente mit den Verbindungspunkten (21, 22, 23, 24) durch die untere Leiterplatte (25) in der zuvor beschriebenen Art und Weise elektrisch leitend und mechanisch verbunden werden können. I. Arrangement and method for producing electrically conductive connections between electronic components and flexible or rigid printed circuit boards, characterized in that the initially untreated state non-conductive and optically transparent or optically partially or non-transparent and flexible or rigid and single or multilayer printed circuit board ( 3 ) of plastic after passing through the laser ( 2 ) by the intensity of its thermal and / or optical energy or by the action of other electromagnetic waves or electron or ion bombardment, more or less electrically conductive and more or less deeply penetrating therein tracks ( 6 , 4, ..., n) with the conductor cross - sections ( 7, ..., n), wherein the electronic components are in the form of discrete components ( 8, ..., n) and integrated components ( 14 , precisely fitting into the wells of the rigid or flexible component tub ( 17 ) made of non-conductive and optically transparent or nontransparent thermoformable antistatic or antistatic coated plastic can or may not be introduced and in each case the connection points ( 10 , 13 , 15 , 21 , 22 , 23 , 24 . , .n) made of conductive plastic, metal or conductive ceramic and run flat or raised with respect to the outer component housing wall and placed on the upper lower or lateral component sides and by the briefly increased power supply of the laser ( 5 ), which with the laser ( 2 is identical or not, which causes laser contacting ( 12 .n) by welding, gluing or soldering, whereby the components placed below with the connection points ( 21 , 22 , 23 , 24 ) through the lower circuit board ( 25 ) in the manner described above can be electrically conductively and mechanically connected. 2. Anordnung und Verfahren nach Anspruch 1, dadurch gekennzeichnet, dass die Leiterplatte (3, 25, 27) transparent ist und keine elektrisch leitenden Eigenschaften besitzt, wobei die Beschichtung (28) der Schaltung entsprechende vorgegebene metallische Leiterbahnen sind und die elektronischen Bauelemente in einer bevorzugten Form von SMD-Bauelementen zum Einsatz kommen, wobei dann nur die Funktion des Lasers (5) zum Einsatz kommt. 2. Arrangement and method according to claim 1, characterized in that the circuit board ( 3 , 25 , 27 ) is transparent and has no electrically conductive properties, wherein the coating ( 28 ) of the circuit corresponding predetermined metallic interconnects and the electronic components in one preferred form of SMD components are used, in which case only the function of the laser ( 5 ) is used. 3. Anordnung und Verfahren nach einem der Ansprüche 1 bis 2, dadurch gekennzeichnet, dass die Leiterplatte (3) mit der Bauelementewanne (17) bzw. dass die obere Leiterplatte (27) und die untere Leiterplatte (25) an ihren äußeren Umgrenzungen bzw. an sich mechanisch berührenden Stellen durch den Laser (2) verschweißt bzw. hermetisch dicht umschweißt wird. 3. Arrangement and method according to one of claims 1 to 2, characterized in that the printed circuit board ( 3 ) with the component pan ( 17 ) or that the upper printed circuit board ( 27 ) and the lower printed circuit board ( 25 ) at their outer boundaries or at mechanically touching points by the laser ( 2 ) is welded or welded around hermetically sealed. 4. Anordnung und Verfahren nach einem der Ansprüche 1 bis 3, dadurch gekennzeichnet, dass die Oberseite der oberen Leiterplatte (3, 27) und die Unterseite der unteren Leiterplatte (25) mit einer nicht leitfähigen transparenten Kunststoffschicht beschichtet sind bzw. leiterplattenhomogen sind aber nicht leitfähig gemacht werden können. 4. Arrangement and method according to one of claims 1 to 3, characterized in that the upper side of the upper printed circuit board ( 3 , 27 ) and the underside of the lower printed circuit board ( 25 ) are coated with a non-conductive transparent plastic layer or are not homogeneous in the circuit board can be made conductive. 5. Anordnung und Verfahren nach einem der Ansprüche 1 bis 4, dadurch gekennzeichnet, dass die Leiterplatte (3) und/oder die Leiterplatte (25) jeweils bauteileseits mit negativem Druck durch Luftabsaugung beaufschlagt werden kann bzw. dass der negative Druck auch zwischen der Bauelementewanne (17) und der Leiterplatte (3) erzeugt werden kann. 5. Arrangement and method according to one of claims 1 to 4, characterized in that the printed circuit board ( 3 ) and / or the printed circuit board ( 25 ) each bauteileseits can be acted upon by negative pressure by air suction or that the negative pressure between the component well ( 17 ) and the circuit board ( 3 ) can be generated. 6. Anordnung und Verfahren nach einem der Ansprüche 1 bis 5, dadurch gekennzeichnet, dass der Laser (2) einen achsialkonzentrisch dazu geführten Laser zur Abstandsmessung mitführt bzw. dass auf demselben optischen Weg Infrarotstrahlung zur Temperaturmessung geleitet und ausgewertet werden kann. 6. Arrangement and method according to one of claims 1 to 5, characterized in that the laser ( 2 ) carries a axial-concentrically guided laser for distance measurement or that can be passed and evaluated on the same optical path infrared radiation for temperature measurement. 7. Anordnung und Verfahren nach einem der Ansprüche 1 bis 6, dadurch gekennzeichnet, dass die unlösbare oder lösbare Beschichtung (28) aus Kunststoff dunkelfarben ist und dieselben oder ähnliche chemisch/physikalische Eigenschaften aufweist wie die Leiterplatte (3) zuvor, wobei der Kunststoff der Leiterplatte (3) dann immer Nichtleiter ist oder auch nicht und mit der Leiterplatte (3) durch den Laser (2) verschweißt werden kann, wobei das Restmaterial davon abgezogen werden kann. 7. Arrangement and method according to one of claims 1 to 6, characterized in that the insoluble or detachable coating ( 28 ) made of plastic is dark in color and has the same or similar chemical / physical properties as the circuit board ( 3 ) before, wherein the plastic of Circuit board ( 3 ) is then always non-conductor or not and with the circuit board ( 3 ) by the laser ( 2 ) can be welded, the residual material can be deducted from it. 8. Anordnung und Verfahren nach einem der Ansprüche 1 bis 7, dadurch gekennzeichnet, dass die Gehäuseformen diskreter Bauelemente (8. . .n) und Integrierter Bausteine (IC) (14. . .n) als auch allgemein weitere elektronische Bauelemente so ausgeformt sind, dass ein unverwechselbares Einlegen in die Mulden der Bauelementewanne (17) gegeben ist. 8. Arrangement and method according to one of claims 1 to 7, characterized in that the housing forms of discrete components ( 8. .N) and integrated components (IC) ( 14. .N) and generally further electronic components are formed so in that an unmistakable insertion into the wells of the component tub ( 17 ) is provided. 9. Anordnung und Verfahren nach einem der Ansprüche 1 bis 8, dadurch gekennzeichnet, dass die Verbindungspunkte (10. . .n) mit elektrisch leitendem Klebstoff oder metallischem Lot versehen sind. 9. Arrangement and method according to one of claims 1 to 8, characterized in that the connection points ( 10. .N) are provided with electrically conductive adhesive or metallic solder. 10. Anordnung und Verfahren nach einem der Ansprüche 1 bis 9, dadurch gekennzeichnet, dass die Bauelementewanne (17) blisterähnlich im Tiefziehverfahren um die Bauelemente gezogen werden kann. 10. Arrangement and method according to one of claims 1 to 9, characterized in that the component pan ( 17 ) can be drawn blister-like in the deep drawing process to the components. 11. Anordnung und Verfahren nach einem der Ansprüche 1 bis 10, dadurch gekennzeichnet, dass die Leiterplatten (3, 25, 27) antistatisch beschichtet sein können. 11. Arrangement and method according to one of claims 1 to 10, characterized in that the circuit boards ( 3 , 25 , 27 ) may be coated antistatic.
DE10203144A 2002-01-28 2002-01-28 Electrically conducting connections between electronic components and conducting plates are formed using a laser to create conducting paths and by welding, soldering or adhesion Withdrawn DE10203144A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE10203144A DE10203144A1 (en) 2002-01-28 2002-01-28 Electrically conducting connections between electronic components and conducting plates are formed using a laser to create conducting paths and by welding, soldering or adhesion

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE10203144A DE10203144A1 (en) 2002-01-28 2002-01-28 Electrically conducting connections between electronic components and conducting plates are formed using a laser to create conducting paths and by welding, soldering or adhesion

Publications (1)

Publication Number Publication Date
DE10203144A1 true DE10203144A1 (en) 2003-07-31

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ID=7713192

Family Applications (1)

Application Number Title Priority Date Filing Date
DE10203144A Withdrawn DE10203144A1 (en) 2002-01-28 2002-01-28 Electrically conducting connections between electronic components and conducting plates are formed using a laser to create conducting paths and by welding, soldering or adhesion

Country Status (1)

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DE (1) DE10203144A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10347035A1 (en) * 2003-10-09 2005-05-12 Giesecke & Devrient Gmbh Method for generating electrically conducting structures e.g. complete circuit layout for intelligent cards, involves focusing and guiding laser radiation through substrate
DE102007014501A1 (en) * 2007-03-27 2008-10-02 Robert Bosch Gmbh Method for producing an electrically conductive track on a plastic component

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10347035A1 (en) * 2003-10-09 2005-05-12 Giesecke & Devrient Gmbh Method for generating electrically conducting structures e.g. complete circuit layout for intelligent cards, involves focusing and guiding laser radiation through substrate
DE10347035B4 (en) * 2003-10-09 2013-05-23 Giesecke & Devrient Gmbh Method and device for producing electrically conductive structures on a substrate for an electronic data carrier
DE102007014501A1 (en) * 2007-03-27 2008-10-02 Robert Bosch Gmbh Method for producing an electrically conductive track on a plastic component

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