DE102022104827A1 - Device and method for producing a bonded card with a light-transparent window - Google Patents

Abstract

The invention relates to a device (100) and a method for producing a joined card with a light-transparent window, with a film joining device (102) and with a punching device (104) which is perpendicular to the adjustment direction of its punches (112, 116) at least between one Punching position and a joining position can be adjusted, wherein in the punching position a first punch (112) and a first die (110) are positioned in relation to a card substrate (200) in such a way that they form an opening (208) when the first punch (112) is adjusted. into the card substrate (200), wherein a second punch (116) and a second die (114) are positioned opposite the window substrate (202) in such a way that they are out of the window substrate (202) during the adjustment movement of the second punch (116). punch out the window part (206) adapted to the dimensions of the opening (208) in order to insert the window part (206) into the opening (208) by the simultaneous movement of the first punch (112) together with the second punch (116), and wherein in the Joining position on the first die (110) existing area as an abutment (118) for a pressure plate (120) of the film joining device (102).

Description

The invention relates to a device and a method for producing a joined card with a light-transparent window.

From the DE 10 2014 000 133 A1 a method and a device for processing a substrate are known, in which a window opening is made in the substrate in order to then insert a filling material into the opening. Plastic cards with such windows are used, for example, as identification, value and/or security documents. In the publication cited above, the window substrate is punched out and the punched-out filling material is inserted into an opening with one and the same punch.

In the EP 3 389 963 A1 also describes a method for making a window in a layer of flexible plastic, using a double die to punch the window substrate on the one hand and the card substrate on the other hand. The window part can be inserted into the opening in the card substrate, guided by both stamps.

It is therefore the object of the present invention to provide a device and a method for producing a joined card with a light-transparent window, by means of which the window can be additionally secured in the opening.

This object is achieved by a device having the features of claim 1 and by a method having the features of claim 12. Advantageous configurations with expedient developments of the invention are specified in the dependent claims.

The device according to the invention comprises a film joining device for joining a carrier film to a single-layer or multi-layer card substrate. The device also includes a punching device, which has a die holder fixed to a punching stand, on which a first die is present, to which a first punch for punching the card substrate is assigned. There is also a second die on the die holder, which is assigned a second punch that can be moved coaxially with the first punch and has the same contour as the first punch, for punching a window substrate, with the first die being arranged at a distance from the second die in an adjustment direction of the punches. The punching device can be adjusted perpendicularly with respect to the direction of adjustment of the punches, at least between a punching position and a joining position. In the punching position, the first punch and the first die are positioned in relation to the card substrate in such a way that they make an opening in the card substrate when the first punch is adjusted, with the second punch and the second die being positioned in relation to the window substrate in such a way that they the adjustment movement of the second punch punches out a window part adapted to the dimensions of the opening from the window substrate, wherein the window part can be inserted into the opening through the simultaneous movement of the first punch together with the second punch. In the joining position, there is also an area present on the first die as an abutment for a pressure plate of the film joining device.

In this way, the punching device can therefore fulfill a dual function, namely on the one hand punching the window substrate and the card substrate and inserting the window part into the opening by the simultaneous movement of the punches. And on the other hand the formation of an abutment when joining the carrier film. In this way, there is a particularly compact device for producing a joined card with a light-transparent window.

“Joining” means the permanent connection of two or more parts to be joined, in this case in particular individual foil layers. The individual parts to be joined, in particular the foil layers, can be joined to one another by welding. Alternatively, the individual film layers can be coated with a shapeless substance, so that they are joined by gluing. The individual parts to be joined, in particular the film layers, are preferably joined together without any auxiliary material, so that the individual parts to be joined are laminated. For example, the foil layers can be hot-laminated in order to be permanently connected. Alternatively, there is the possibility that the film layers are laminated by means of pressing. Cold lamination of the film layers using an adhesive is also possible.

The “joining position” mentioned above can thus also be understood and referred to as a “welding position” or as a “laminating position”.

In order to ensure that the card substrate is not displaced during the punching process, especially if it is multi-layered, it is advantageous if the first die is assigned a hold-down device which can be adjusted coaxially with respect to the adjustment movement of the punches along the punch stand. The hold down is preferably spring-loaded; but this is not mandatory.

It has proven to be advantageous that a suction and/or blowing device is present, the nozzle of which is directed towards a space between the first die and the second die. In this way, the material punched out of the card substrate by the first punch can be blown out or sucked off, so that it does not block the trajectory for the window part punched out of the window substrate.

In order to be able to produce a particularly large number of joined cards with light-transparent windows, it has proven to be advantageous if the punching device has a further die holder fixed to a further punching stand, on which a further first die is present, which has a further first punch for punching of the card substrate, and on which there is a further, second die, to which a further, second punch that can be moved coaxially to the further first punch and has the same contour as the latter is assigned for punching the window substrate, with the further first die being positioned in an adjustment direction of the further punch under one Distance is arranged with respect to the further second die, and wherein the further punch stand and the further punches are adjustable simultaneously with the punch stand and the punches. In this way, a redundantly designed device is created.

To provide the single-layer or multi-layer card substrate, it has proven to be advantageous if there is a service station and if there is a suction gripper to position the card substrate opposite the punching device for assuming the punching position and/or the joining position. The suction pad can be designed with a positioning pin in order to ensure that the card substrate is supported in the correct position. In other words, an operationally reliable gripping of the card substrate is given by the fact that the suction gripper has at least one positioning pin which is set up to receive the pre-punched card substrate in a precise position.

In order to be able to produce a particularly large number of joined cards with light-transparent windows, it has proven to be advantageous if there is an unwinding device for unwinding the carrier film and then providing the carrier film to the film joining device. The film joining device can be a film laminating device or a film welding device.

In order to also be able to fix the carrier film in the correct position on the suction pad, it has proven to be advantageous if the unwinding device and the punching device are interposed with a punch for producing holes in the carrier film.

In order to be able to insert the carrier foil reliably into the area of the punching device and the foil joining device, it has proven to be advantageous if there is a gripper that can be adjusted perpendicularly with respect to the adjustment direction of the punching dies for gripping the carrier foil and is in turn set up to hold the carrier foil in the joining position to be positioned between the card substrate and the pressure plate of the joining device.

In order to make this positioning as true to position as possible, it has proven to be advantageous if the gripper can be adjusted parallel with respect to the adjustment direction of the punches, in particular in order to thread the perforated carrier film onto the positioning pins of the suction gripper.

Reliable separation of the carrier film can also be brought about by the punching device and the unwinding device interposing a cross-cutting device for severing the carrier film provided in web form.

The advantages, advantageous configurations and effects described in connection with the device according to the invention apply in the same way to the method according to the invention for producing a joined card with a light-transparent window. In particular, this method uses a device as described above.

• - Bereitstellung des einlagigen oder mehrlagigen Kartensubstrats an eine Stanzeinrichtung, die einen an einem Stanzständer festgelegten Matrizenhalter aufweist, an welchem eine erste Matrize vorliegt, der ein erster Stanzstempel zum Stanzen des Kartensubstrats zugeordnet ist, und an welchem eine zweite Matrize vorliegt, der ein koaxial zum ersten Stanzstempel verfahrbarer und zu diesem konturgleich gebildeter zweiter Stanzstempel zum Stanzen eines Fenstersubstrats zugeordnet ist, wobei die erste Matrize in einer Verstellrichtung der Stanzstempel unter einem Abstand bezüglich der zweiten Matrize angeordnet ist, wobei die Stanzeinrichtung senkrecht bezüglich der Verstellrichtung der Stanzstempel wenigstens zwischen einer Stanzposition und einer Fügeposition verstellbar ist,
• - Verstellen der Stanzeinrichtung in die Stanzposition, sofern diese nicht bereits eingenommen wurde,
• - Verstellen des ersten Stanzstempels und Einbringen einer Öffnung in das Kartensubstrat,
• - Verstellen des zweiten Stanzstempels und Ausstanzen eines an die Abmessungen der Öffnung angepassten Fensterteils aus dem Fenstersubstrat,
• - Beaufschlagen der dem zweiten Stanzstempel abgewandten Seite des Fensterteils durch den ersten Stanzstempel,
• - simultanes Bewegen des ersten Stanzstempels zusammen mit dem zweiten Stanzstempel und Einsetzen des Fensterteils in die Öffnung,
• - Überführen der Stanzeinrichtung in die Fügeposition, wodurch ein an der ersten Matrize vorhandener Bereich als Widerlager für eine Andruckplatte einer Folienfügeeinrichtung dient, und
• - Andrücken und Fügen einer Trägerfolie mittels der Andruckplatte der Folienfügeeinrichtung, wobei die Trägerfolie an das um das Fensterteil ergänzte Kartensubstrat gepresst wird und die erste Matrize das Widerlager beim Herstellen der gefügten Karte mit dem lichttransparenten Fenster bildet.

In particular, it includes the following - preferably consecutive - steps:

• - Provision of the single-layer or multi-layer card substrate to a punching device, which has a die holder fixed to a punching stand, on which there is a first die, to which a first punch for punching the card substrate is assigned, and on which there is a second die, which has a coaxial to the assigned to the first punch, a movable second punch with the same contour as the first punch, for punching a window substrate, the first die being arranged at a distance in relation to the second die in an adjustment direction of the punch, the punching device being perpendicular to the adjustment direction of the punch at least between a punching position and a joining position is adjustable,
• - Adjusting the punching device to the punching position if this has not already been taken,
• - Adjusting the first punch and making an opening in the card substrate,
• - Adjusting the second punch and punching out a window part adapted to the dimensions of the opening from the window substrate,
• - the side of the window part facing away from the second punch is acted upon by the first punch,
• - Simultaneously moving the first punch together with the second punch and inserting the window part into the opening,
• - Transferring the punching device into the joining position, as a result of which an area present on the first die serves as an abutment for a pressure plate of a foil joining device, and
• - Pressing and joining a carrier foil by means of the pressure plate of the foil joining device, the carrier foil being pressed against the card substrate supplemented by the window part and the first die forming the abutment when producing the joined card with the light-transparent window.

In this method, too, the punching device has a dual function, namely on the one hand for punching the substrates themselves and on the other hand providing an abutment for the pressing process of the carrier film by the joining device. The joining device can be a welding device or a laminating device.

In order to be able to carry out the method with a higher degree of automation, it has proven to be advantageous if the carrier film is provided by an unwinding device, pulled off by a gripper for joining the carrier film and positioned with respect to the card substrate.

In order to be able to position the carrier film in the correct position relative to the card substrate for the joining process, it has proven to be advantageous if the carrier film is perforated before positioning and if it is threaded onto positioning pins of a suction pad for positioning, on which the card substrate with the window part is also placed is threaded.

It has proven to be advantageous if the carrier film is part of a film web that is separated before or after joining, for which purpose a cross-cutting device can preferably be used. This ensures that there is as little waste as possible.

• 1 Eine perspektivische Ansicht auf eine Vorrichtung zum Herstellen einer gefügten Karte mit einem lichttransparenten Fenster, wobei ein Saugreifer an einem Andienplatz gegenüber einem vorgehefteten mehrlagigen Kartensubstrat (Folienstapel) platziert ist,
• 2 die Vorrichtung aus 1, bei der der Saufgreifer das Kartensubstrat gegenüber einer Stanzeinrichtung und einer Folienfügeeinrichtung positioniert hat,
• 3 die Vorrichtung aus 1, bei der die Stanzeinrichtung die Stanzposition eingenommen hat,
• 4 eine perspektivische Detailansicht der Stanzeinrichtung in der Stanzposition gemäß 3,
• 5 eine Detailseitenansicht auf die Stanzeinrichtung vor dem Stanzvorgang,
• 6 eine der 5 entsprechende Darstellung der Stanzeinrichtung, bei der das Kartensubstrat von einem Niederhalter fixiert ist, noch vor dem Stanzvorgang,
• 7 eine der 5 entsprechende Darstellung der Stanzeinrichtung, bei der der erste Stanzstempel das Kartensubstrat gestanzt hat,
• 8 eine der 5 entsprechende Darstellung der Stanzeinrichtung, bei der der erste Stanzstempel am Fenstersubstrat nahezu anliegt,
• 9 eine der 5 entsprechende Darstellung der Stanzeinrichtung, bei der der zweite Stanzstempel das Fenstersubstrats stanzt,
• 10 eine der 5 entsprechende Darstellung der Stanzeinrichtung die die fortwährende Bewegung der beiden Stanzstempel illustriert, welche das Fensterteil zwischen sich halten,
• 11 eine der 5 entsprechende Darstellung der Stanzeinrichtung, bei der die beiden Stanzstempel das Fensterteil in die in das Kartensubstrat eingebrachte Öffnung eingesetzt haben,
• 12 eine der 1 entsprechende Darstellung der Vorrichtung, bei der die Stanzeinrichtung lateral bezüglich der Verstellbewegung der Stanzstempel von dem Saugreifer entfernt positioniert ist, damit eine Trägerfolie gegenüber dem um ein Fensterteil ergänztes Kartensubstrat von einem Greifer positioniert werden kann,
• 13 eine der 5 entsprechende Darstellung, bei der die Trägerfolie unterhalb des Kartensubstrats mit Fensterteil positioniert ist,
• 14 eine der 1 entsprechende Darstellung der Vorrichtung, bei der die Andruckplatte der Folienfügeeinrichtung unterhalb der Trägerfolie platziert ist, um die Trägerfolie mit dem Kartensubstrat und dem Fensterteil in der Öffnung zu fügen,
• 15 eine Detailansicht des Fügevorgangs, bei dem die erste Matrize als Widerlager für die Andruckplatte im Bereich der Öffnung des Kartensubstrats und damit im Bereich des Fensterteils genutzt wird, wobei sich die Stanzeinrichtung in der Fügeposition befindet.

Further features, properties and advantages of the present invention are described in more detail below on the basis of embodiment variants with reference to the attached figure. All of the features described above and below are advantageous both individually and in any combination with one another. The embodiment variants described below merely represent examples which, however, do not limit the subject matter of the invention. It shows:

• 1 A perspective view of a device for producing a joined card with a light-transparent window, wherein a suction pad is placed in a third place opposite a pre-stitched multi-layer card substrate (foil stack),
• 2 the device off 1 , in which the sucking gripper has positioned the card substrate opposite a punching device and a foil joining device,
• 3 the device off 1 , in which the punching device has taken the punching position,
• 4 a detailed perspective view of the punching device in the punching position according to FIG 3 ,
• 5 a detailed side view of the punching device before the punching process,
• 6 one of the 5 corresponding representation of the punching device, in which the card substrate is fixed by a hold-down device, even before the punching process,
• 7 one of the 5 corresponding representation of the punching device, in which the first punch has punched the card substrate,
• 8th one of the 5 corresponding representation of the punching device, in which the first punching die is almost in contact with the window substrate,
• 9 one of the 5 corresponding representation of the punching device, in which the second punch punches the window substrate,
• 10 one of the 5 corresponding representation of the punching device which illustrates the continuous movement of the two punches which hold the window part between them,
• 11 one of the 5 corresponding representation of the punching device, in which the two punches the window part in the in the Kar tensubstrat introduced opening,
• 12 one of the 1 corresponding representation of the device, in which the punching device is positioned laterally with respect to the adjustment movement of the punches away from the suction gripper, so that a carrier film can be positioned by a gripper opposite the card substrate that has been supplemented by a window part,
• 13 one of the 5 corresponding representation, in which the carrier foil is positioned below the card substrate with window part,
• 14 one of the 1 Corresponding representation of the device in which the pressure plate of the foil joining device is placed below the carrier foil in order to join the carrier foil with the card substrate and the window part in the opening,
• 15 a detailed view of the joining process, in which the first die is used as an abutment for the pressure plate in the area of the opening of the card substrate and thus in the area of the window part, with the punching device being in the joining position.

The figures show a device 100 for producing a joined, in particular laminated, card with a light-transparent window. This device 100 includes a foil joining device 102 for joining by gluing, in particular laminating, or for joining by welding a carrier foil 204 to a single-layer or multi-layer card substrate 200. A punching device 104 is also present. The film joining device 102 for joining the carrier film 204 includes in particular a pressure plate 120 which can be heated in particular.

The structure of the punching device 104 of the device 100 is shown in the detailed side view 5 explained. The punching device 104 includes a punching stand 106 to which a die holder 108 is fixed. On this die holder 108 there is a first die 110 which is associated with a first punch 112 for punching the card substrate 200 . On the die holder 108 there is also a second die 114, to which a second punch 116, which can be moved coaxially to the first punch 112 and has the same contour as the latter, is assigned for punching a window substrate 202, with the first die 110 being lower in an adjustment direction of the punches 112, 116 a distance with respect to the second die 114 is arranged.

Out of 1 it follows that the punching device 104 is designed redundantly for the production of large quantities and therefore has a further die holder 128 fixed to a further punching stand 126 . On the further die holder 128 there is a further first die 130, to which a further first punch 132 for punching the card substrate 200 is assigned, and on which there is a further die 134, which is a coaxial to the further first punch 132 and is formed with the same contour another second punch 136 for punching the window substrate 202 is assigned. The other first matrix 130 is formed analogously to the two matrices 110, 114 and is thus arranged at a distance from the other second matrix 134. The two other punches 132, 136 can be adjusted in particular simultaneously with the other two punches 112, 116.

In addition, the punching device 104 can be adjusted perpendicularly with respect to the adjustment direction of the punches 112, 116, 132, 136, in particular between a punching position and a joining or laminating position. In other words, in the installed position the punching device is moved horizontally into the punching position or into the joining position. Other positions of the punching device 104 are also possible, in particular those that enable the carrier film 204 to be positioned.

In 1 shows the recording of the card substrate 200 by a suction pad 140 from a service station 138, which in the present case is realized by a mover or a transport carriage. This mover moves with the pre-attached stack of foils, and therefore with the pre-attached multi-layer card substrate 200, into a delivery position. When the mover is adjusted, the card substrate 200 is held by means of positioning pins. The suction gripper 140 can remove the card substrate 200 from these positioning pins, for which purpose it is also equipped with at least one positioning pin, for example.

When the suction gripper has picked up the card substrate 200, it positions it with respect to the punching device 104. In 2 this punching device 104 is still shown in a configuration in which it has taken up neither the punching position nor the joining position.

The punching device 104 is then moved perpendicularly with respect to the direction of adjustment of the punches 112, 116 into the punching position. Here, one of the matrices 110, 114 dips into a recess 142 of the suction gripper 140, which is particularly the case in 3 can be seen. The other matrices 130, 132 are terminally on an end face of the suction pad 140, so that an exact positioning of the punching device 104 with respect to the Suction cup 140 is implemented to perform the punching process.

In 4 This punching position can be seen in detail, whereby it can be seen that the suction gripper 140 is not only provided with a recess 142 for receiving the two matrices 110, 114, but also has an undercut 152, whereby the suction gripper 140 for part of the first Die 110 space is kept ready. The excess length of the first die 110 is therefore used by the suction gripper 140 to move the first punch 112 and to make the opening 208 in the card substrate 200 .

The actual punching and insertion process is based on the below 5 until 11 explained.

5 shows the situation in which the card substrate 200 was positioned opposite the first matrix 110 by the suction gripper 140. The punching device 104 is in the punching position. First, a hold-down device 122 is moved up to the card substrate 200 and is spring-loaded and displaceable along the punch stand 106 . The spring bearing of the hold-down device is not absolutely necessary. Its adjustment movement is therefore coaxial with respect to the adjustment movement of the punches 112, 116 along the punch stand 106.

As soon as the hold-down device 122 has 6 has assumed the configuration shown and fixes the card substrate 200 in its position, the first punch 112 is also displaced in the direction of the card substrate 200. The hold-down device 122 comprises an axial passage through which the first punch 112 can pass.

In 7 the situation is shown in which the first punch 112 has passed through the first die 110 and has introduced the opening 208 into the card substrate 200 . In 7 the first punch protrudes into the space between the first die 110 and the second die 114, a suction and/or blowing device 124 being outlined, which blows or sucks the part punched out of the card substrate 200 out of this space.

Evidence of 8th with the first punch 112 then further adjusted to the second die 114, in particular until it is in contact with the window substrate 202.

Evidence of 9 the second punch 116 is then moved in the direction of the card substrate 200, as a result of which the window substrate 202 is punched out in such a way that a window part 206 is clamped between the first punch 112 and the second punch 116. This window part 206 is adapted to the dimensions of the opening 208 in the card substrate 200. The window part 206 is then inserted into the opening 208 of the card substrate 200 by the simultaneous movement of the first punch 112 together with the second punch 116.

The simultaneous adjustment of the two punches 112, 116 is through 10 illustrated wherein the insertion of the window portion 206 into the opening 208 by 11 is illustrated.

In 12 shows the situation after the punching has been completed and the window part 206 has been inserted into the opening 208 of the card substrate 200, with the punching device 104 being moved out of the suction gripper 140 again perpendicularly with respect to the adjustment movement of the punches 112, 116. The carrier film 204 provided by the unwinding device 144 is pre-punched with a hole punch 146 for reliable positioning of the carrier film 204 relative to the other substrates in order to provide holes in the carrier film 204 that are adapted to the dimensions of the positioning pins on the suction gripper 140. A roller take-off 154 is connected downstream of the punch 146 . In order to unwind the carrier film 204 there is also a gripper 148 which is set up to position the carrier film 204 in the joining position between the card substrate 200 and the pressure plate 120 of the film joining device 102 . For this purpose, the gripper 148 can be moved perpendicularly with respect to the adjustment direction of the punches 112, 116. After the gripper 148 has been adjusted together with the end of the carrier film 204, the in 13 illustrated situation, in which the carrier film 204 is arranged underneath the card substrate 200 provided with a window part 206 .

In order to laminate the carrier film 204 to the card substrate 200, the pressure plate 120 is shown by 14 arranged under the carrier film 204 and optionally heated. The punching device 104 is then transferred to the joining position, which is shown in the detailed view 15 can also be seen more closely. The overhang on the first die 110 is used as an abutment 118 for the pressure plate 120 of the foil joining device 102 . This ensures that the window part 206 is not pressed out of the card substrate 200 during the lamination and that an adhesive bond is reliably formed both with the carrier film 204 and with the card substrate 200 . It is primarily ensured that the carrier film 204 is attached to the window part 206 . The carrier film 204 can be separated before or after the lamination, for which purpose the punching device 104 and the unwinding device 144 a cross-cutting device 150 for cutting through the carrier film 204 provided in web form is interposed. When the carrier film 204 is severed, it is reliably prevented from slipping out by the roller take-off 154 .

After the lamination, the suction gripper 140 can transfer the card substrate 200, which has been supplemented by a window part 206 and is laminated with the carrier film 204, back to the service station 138, and consequently to the mover.

The present device and the present method are characterized by their very compact design, which reliably saves the available space in large production plants for the production of card-shaped identification, valuable and/or security documents.

Reference List

100

contraption

102

foil joining device

104

punching device

106

punch stand

108

die holder

110

first matrix (to make the opening)

112

first stamp

114

second die (for punching out the window part)

116

second punch

118

abutment

120

pressure plate

122

hold-down

124

Suction and/or blowing device

126

another stamping stand

128

another matrix holder

130

another first matrix

132

another first stamp

134

another second matrix

136

another second stamp

138

Andienplatz

140

suction cups

142

Recess (to accommodate the die)

144

unwinding device

146

Perforator

148

gripper

150

cross cutting device

152

Undercut (to accommodate the overhang of the first die)

154

roll take-off

200

card substrate

202

window substrate

204

carrier film

206

window part

208

opening

QUOTES INCLUDED IN DESCRIPTION

This list of documents cited by the applicant was generated automatically and is included solely for the better information of the reader. The list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions.

Patent Literature Cited

• DE 102014000133 A1 [0002]
• EP 3389963 A1 [0003]

Claims (15)

Device (100) for producing a joined card with a light-transparent window, with a film joining device (102) for joining a carrier film (204) to a single-layer or multi-layer card substrate (200), and with a punching device (104), which has a die holder (108) fixed to a punch stand (106), on which a first die (110) is present, to which a first punch (112) for punching the card substrate (200) is assigned, and on which a second die (114 ) is present, which is assigned a second punch (116) that can be moved coaxially with the first punch (112) and has the same contour as the latter, for punching a window substrate (202), the first die (110) moving in an adjustment direction of the punch (112, 116) is spaced apart from the second die (114), wherein the punching device (104) can be adjusted perpendicularly with respect to the adjustment direction of the punches (112, 116) at least between a punching position and a joining position, wherein in the punching position the first punch (112) and the first die (110) are positioned in relation to the card substrate (200) in such a way that they make an opening (208) in the card substrate (200) during the adjustment movement of the first punch (112). , wherein the second punch (116) and the second die (114) are positioned in relation to the window substrate (202) in such a way that, during the adjustment movement of the second punch (116) out of the window substrate (202), they adapt to the dimensions of the opening (208 ) punch out an adapted window part (206) in order to insert the window part (206) into the opening (208) by the simultaneous movement of the first punch (112) together with the second punch (116), and wherein in the joining position an area present on the first die (110) is present as an abutment (118) for a pressure plate (120) of the film joining device (102). Device (100) according to claim 1 , characterized in that the first die (110) is assigned a holding-down device (122) which is coaxially adjustable with respect to the adjustment movement of the punches (112, 116) along the punching stand (106). Device (100) according to claim 1 or 2 , characterized in that a suction and/or blowing device (124) is present, which is directed with its nozzle onto a space between the first die (110) and the second die (114). Device (100) according to one of Claims 1 until 3 , characterized in that the punching device (104) has a further die holder (128) fixed to a further punching stand (126), on which a further first die (130) is present, which has a further first punch (132) for punching the card substrate ( 200) is assigned, and on which there is a further second die (134), to which a further second punch (136) for punching the window substrate (202) that can be moved coaxially to the further first punch (132) and has the same contour as this is assigned, wherein the further first die (130) is arranged at a distance in relation to the further second die (134) in an adjustment direction of the further punches (132, 136), and wherein the further punch stand (126) and the further punches (132, 136) simultaneously with the punch stand (106) and the punches (112, 116) are adjustable. Device (100) according to one of Claims 1 until 4 , characterized in that there is a service station (138) for preparing the single-layer or multi-layer card substrate (200), and that there is a suction gripper (140) to hold the card substrate (200) opposite the punching device (104) for assuming the punching position and to position the joining position. Device (100) according to claim 5 , characterized in that the suction gripper (140) has at least one positioning pin which is set up to accommodate the pre-punched card substrate (200) in a precise position. Device (100) according to one of Claims 1 until 6 , characterized in that there is an unwinding device (144) for unwinding the carrier film (204) and then providing the carrier film (204) to the film joining device (102). Device (100) according to claim 7 , characterized in that the unwinding device (144) and the punching device (104) is interposed a punch (146) for producing holes in the carrier film (204). Device (100) according to claim 7 or 8th , characterized in that there is a gripper (148), which can be adjusted perpendicularly with respect to the direction of adjustment of the punches (112, 116), for gripping the carrier film (204) and is set up to hold the carrier film (204) in the joining position between the card substrate (200) and to position the pressure plate (120). Device (100) according to claim 9 , characterized in that the gripper (148) parallel with respect to the adjustment direction of the punches (112, 116) is adjustable. Device (100) according to one of Claims 7 until 10 , characterized in that the punching device (104) and the unwinding device (144) is interposed with a cross-cutting device (150) for severing the carrier film (204) provided in web form. Method for producing a joined card with a light-transparent window, in particular by means of a device (100) according to one of Claims 1 until 11 , comprising the steps of: - providing the single-layer or multi-layer card substrate (200) to a punching device (104) which has a die holder (108) fixed to a punch stand (106), on which a first die (110) is present, which has a first Punching die (112) for punching the card substrate (200) is assigned, and on which there is a second die (114) which can be moved coaxially with the first punching die (112) and has the same contour as the second punching die (116) for punching a window substrate ( 202), the first die (110) being arranged at a distance in relation to the second die (114) in an adjustment direction of the punches (112, 116), the punching device (102) being perpendicular to the adjustment direction of the punches (112, 116) is adjustable at least between a punching position and a joining position, - adjusting the punching device (102) into the punching position if this has not already been occupied, - adjusting the first punch (112) and making an opening (208) in the card substrate (200 ), - adjusting the second punch (116) and punching out a window part (206) adapted to the dimensions of the opening (208) from the window substrate (202), - acting on the side of the window part (206) facing away from the second punch (116). the first punch (112), - simultaneous movement of the first punch (112) together with the second punch (116) and insertion of the window part (206) into the opening (208), - transfer of the punching device (104) to the joining position, whereby an area present on the first die (110) serves as an abutment (118) for a pressure plate (120) of a film joining device (102), and - pressing on and joining a carrier film (204) by means of the pressure plate (120) of the film joining device (102), wherein the carrier film (204) is pressed onto the card substrate (200) supplemented by the window part (206) and the first matrix (110) forms the abutment (118) when the joined card with the light-transparent window is produced. procedure after claim 12 , characterized in that the carrier film (204) is provided by an unwinding device (144), pulled off by a gripper (148) for joining the carrier film (204) and positioned with respect to the card substrate (200). procedure after Claim 13 , characterized in that the carrier film (204) is perforated before positioning and that it is threaded for positioning onto positioning pins of a suction gripper (140) on which the card substrate (200) with the window part (206) is also threaded. Procedure according to one of Claims 12 until 14 , characterized in that the carrier film (204) is part of a film web which is separated before or after joining.

Images