DE102021203650B4 - Method for producing a cover substrate with optically active window areas, method for producing a hermetically packaged optoelectronic component and hermetically packaged optoelectronic component - Google Patents

Abstract

Method (100) for producing a molded cover substrate (20') comprising the following steps:
Providing (120) a mold substrate (10) and a cover substrate (20) which are connected to one another, wherein a surface region of the mold substrate (10) and/or the cover substrate (20) are structured to form a closed cavity (30) between the cover substrate (20) and the mold substrate (10), wherein the cover substrate (20) comprises a glass material with a lens material portion (22) which is formed as a pre-structured elevation and arranged in an aligned position to the closed cavity (30);
Tempering (130) the cover substrate (20) and the mold substrate (10) to reduce the viscosity of the glass material of the cover substrate, and providing (140) an overpressure in the closed cavity (30) relative to the surrounding atmosphere in order to cause, based on the reduced viscosity of the glass material of the cover substrate (20) and the overpressure in the closed cavity (30) relative to the surrounding atmosphere, a defined bulging of the glass material of the cover substrate (20) starting from the closed cavity (30) up to a stop surface (40-1) of a stop element (40) spaced apart from the cover substrate in order to obtain a molded cover substrate (20') with a cover element (24), wherein the defined bulging causes the formation of a lens element (26) from the lens material section (22) on the cover element; and
Removing (150) the stop element (40) and the mold substrate (10) from the molded cover substrate (20').

Description

The present invention relates to a method for producing a cover substrate for housing (= accommodating in a housing) one or a plurality of optical or optoelectronic components, wherein a cover substrate formed in the manufacturing method forms the cover substrate with the at least one cover element.

The present invention further relates to a method for producing a hermetically packaged optical or optoelectronic component, wherein the production can be carried out individually or at wafer level. The present invention further relates to a hermetically packaged optical (optoelectronic) component which is produced using this production method.

For example, a packaging concept for optoelectronic components, such as laser diodes, is provided, wherein the manufacturing process can be carried out at wafer level and/or single substrate level in order to package the optoelectronic components with a cover substrate with optically active window areas.

Blue and green laser diodes are finding ever wider applications. The use of blue laser diodes as a crucial component in reading high-density optical storage media (such as Blue Ray) is established and widespread. A wide range of other applications for high-performance blue and green laser diodes are now emerging, such as as RGB sources in mobile image and video projections. Both green and blue laser diodes should always be hermetically sealed in a housing. It is possible to encapsulate such laser diodes using a capping technology with special TO headers (e.g. TO 38) with an integrated optical window and copper heat sink.

In addition to the consumer applications mentioned above, there is also a need in the field of medical and industrial spectroscopy for hermetically encapsulated semiconductor-based light sources with particularly good heat dissipation and organic-free housing in order to guarantee the required long service lives.

The US 2015 / 0 040 368 A1 refers to a method for producing structured optical components in the form of covers with optically transparent windows for encapsulating microsystems.

The DE 10 2016 105 440 A1 refers to a method for manufacturing optical components and using functional elements.

The object underlying the present invention is therefore to provide an improved method for producing a cover substrate for encapsulating radiation-emitting components, and further to provide an improved method for producing a hermetically packaged optoelectronic component, whereby correspondingly packaged radiation-emitting components which have improved properties can be created.

The problem is solved by the subject matter of the independent claims.

Advantageous embodiments and further developments of the present application are the subject of the dependent patent claims.

The present invention is based on the discovery that a hot-viscous glass flow process can be used to produce optically active glass windows in cover elements of a glass cover (= cover substrate) for housing radiation-emitting components. These window surfaces behave like optical lenses. If the radiation emitted by the optoelectronic components, e.g. semiconductor emitters, is divergent, this radiation can be pre-collimated in at least one axis when passing through a "side" window and in two axes when passing through an "upper" window, or focused in the housing (in the opposite beam direction) when irradiated onto a light sensor, e.g. a photodiode. Depending on the requirements for the beam properties, additional lenses or other optical elements can be used if necessary, which are mounted as additional optical components either inside the sealed housing or outside on an optical bench arranged on the side or above the glass cap.

The present invention is further based on the finding that such a cover substrate (= shaped cover substrate) for an improved housed radiation-emitting component can be produced particularly advantageously at wafer level with significantly simplified expenditure, because, for example, only one (single) glass material is used. If a mold substrate is used to form cover substrates using a glass flow process, a large number of glass caps with a similarly shaped, optically active window area can be formed in a cover substrate, which can then be used to hermetically seal sensitive radiation sources. If reasons If the assembly technology requires it, these formed glass lid substrates can also be pre-separated and the lids can be used for individual encapsulation on populated carrier substrates at both the wafer and individual substrate level.

This means that the packaged, radiation-emitting and/or radiation-sensitive components can have a long service life with consistently good beam and performance quality. In particular, clouding of the outlet window and damage to the laser facets can be reduced or prevented, since the effect of water vapor and volatile organic components under the influence of the extremely intense and high-energy laser radiation can be reduced or prevented. In addition, heat dissipation from the housing can be improved. Furthermore, low manufacturing costs can be achieved.

• 1 ein Flussdiagramm des erfindungsgemäßen Herstellungsverfahrens gemäß einem Ausführungsbeispiel;
• 2-8 beispielhafte prinzipielle Ablaufdiagramme des erfindungsgemäßen Herstellungsverfahrens gemäß weiteren Ausführungsbeispielen;
• 9 ein Flussdiagramm des erfindungsgemäßen Verfahrens zur Herstellung eines hermetisch gehäusten, optischen Bauelements gemäß einem weiteren Ausführungsbeispiel;
• 10-14 beispielhafte prinzipielle Ablaufdiagramme des erfindungsgemäßen Verfahrens zur Herstellung eines hermetisch gehäusten, optischen Bauelements gemäß weiteren Ausführungsbeispielen;
• 15-20 beispielhafte Ausführungsformen für ein hermetisch gehäustes, optoelektronisches Bauelement gemäß weiteren Ausführungsbeispielen, die beispielsweise jeweils mit dem hier beschriebenen Verfahren hergestellt werden.

Preferred embodiments of the present invention are explained in more detail below with reference to the accompanying drawings. They show:

• 1 a flow chart of the manufacturing method according to the invention according to an embodiment;
• 2-8 exemplary basic flow diagrams of the manufacturing method according to the invention according to further embodiments;
• 9 a flow chart of the inventive method for producing a hermetically packaged optical component according to a further embodiment;
• 10-14 exemplary basic flow diagrams of the inventive method for producing a hermetically packaged optical component according to further embodiments;
• 15-20 exemplary embodiments for a hermetically packaged optoelectronic component according to further embodiments, which are each manufactured using the method described here, for example.

Before exemplary embodiments of the present invention are explained in more detail below with reference to the drawings, it is pointed out that identical, functionally identical or equivalent elements, objects, functional blocks and/or method steps in the different figures are provided with the same reference numerals, so that the description of these elements, objects, functional blocks and/or method steps (with the same reference numerals) shown in different exemplary embodiments is interchangeable or can be applied to one another.

In the following description, the description of an element made of a semiconductor material means that the element has a semiconductor material, i.e. is formed at least partially or completely from the semiconductor material. In the following description, the description of an element made of a glass material means that the element has a glass material, i.e. is formed at least partially or completely from the glass material.

It is understood that when an element is referred to as being "connected" or "coupled" to another element, it may be directly connected or coupled to the other element, or there may be intervening elements. Conversely, when an element is referred to as being "directly connected" or "coupled" to another element, there are no intervening elements. Other terms used to describe the relationship between elements should be interpreted in a similar manner (e.g., "between" versus "directly between," "adjacent" versus "directly adjacent," etc.).

To simplify the description of the different embodiments, the figures have a Cartesian coordinate system x, y, z, where the directions x, y, z are arranged orthogonally to one another. In the embodiments, the x-y plane corresponds to the main surface area of a carrier or substrate (= reference plane = x-y plane), where the vertical direction upwards with respect to the reference plane (x-y plane) corresponds to the "+z" direction, and where the direction vertically downwards with respect to the reference plane (x-y plane) corresponds to the "-z" direction. In the following description, the term "lateral" means a direction parallel to the x and/or y direction, i.e. parallel to the x-y plane, where the term "vertical" indicates a direction parallel to the +/- z direction.

1 shows an example of a flow chart of the manufacturing method 100 according to the invention according to an embodiment. The flow chart of 1 for example, a method 100 for producing a cover substrate for housing one or a plurality of optical or optoelectronic components, wherein the shaped cover substrate forms the cover substrate with the at least one cover element. An optoelectronic component is, for example, a radiation-emitting and/or radiation-sensitive semiconductor component, such as e.g. an optoelectronic transmitting and/or receiving component.

Since the method according to the invention for producing a cover substrate for housing one or a plurality of optical/optoelectronic components, e.g. at wafer level, uses a mold substrate comprising a semiconductor material, which is designed, for example, as a pre-processed silicon wafer, the following will also refer to a silicon mold substrate or silicon wafer. However, it should be clear that the use of silicon as a material for the mold substrate (semiconductor wafer) is only an example, whereby, depending on the area of application or production process, other suitably processable materials or semiconductor materials can also be used for the mold substrate.

Referring to the method 100 of 1 Now, in step 120, a mold substrate and a cover substrate bonded to each other are provided, wherein a surface region of the mold substrate and/or the cover substrate is structured (formed) to form at least one closed cavity between the cover substrate and the mold substrate.

According to one embodiment, the mold substrate can be designed as a semiconductor substrate (semiconductor wafer or silicon wafer) and the cover substrate as a glass substrate or glass wafer. According to one embodiment, the mold substrate and the cover substrate are hermetically connected or joined to one another, whereby this can be achieved, for example, with an anodic bonding process or another joining process. Furthermore, a surface region of the mold substrate and/or the cover substrate is provided with a recess or several recesses in order to form the closed cavity between the cover substrate and the mold substrate.

The cover substrate comprises a glass material with a lens material portion which is arranged in an aligned position or a predetermined position to the closed cavity.

The cover substrate comprises, for example, a single homogeneous material or glass material in order to form the shaped cover substrate as a lid substrate or glass cap using the following manufacturing steps.

The mold substrate is, for example, a substrate with a shape, contour or topography, such as a topographically structured substrate. The mold substrate can be designed, for example, as a semiconductor wafer (e.g. a silicon wafer), wherein the surface structuring or the topography of the mold substrate can be obtained extremely precisely by means of semiconductor processing steps (silicon processing steps), wherein such semiconductor processing processes in particular are technically extremely well mastered. Furthermore, mechanical surface processing methods, e.g. for CNC milling, can also be used to form the structure in the mold substrate. Furthermore, in addition to semiconductor materials such as Si, SiGe, other materials such as AIN, SiC, high-melting glass (e.g. Schott AF 32) can also be used for the mold substrate, which are suitable for a photolithographic or mechanical surface treatment process for forming the structure in the mold substrate and are also sufficiently temperature-stable during the tempering processes during the process for producing the cover substrate.

In a (subsequent) step 130, the cover substrate and the mold substrate are now tempered, i.e. subjected to a temperature treatment or heated (warmed) in order to reduce the viscosity of the glass material of the cover substrate. Furthermore, in a step 140, an overpressure is provided in the (at least one) closed cavity or the closed cavities relative to the surrounding atmosphere in order to cause a defined bulging, e.g. blowing out or deformation, of the glass material of the cover substrate starting from the closed cavity to a stop surface of a stop element spaced apart from the cover substrate, based on the reduced viscosity of the glass material of the cover substrate and the overpressure in the closed cavity relative to the surrounding atmosphere. The defined bulging of the glass material due to the overpressure in the closed cavity and the reduced viscosity of the glass material can also be referred to as blowing out or deformation of the glass material. By means of the defined bulging of the glass material of the cover substrate, a shaped cover substrate with (at least) one cover element (=bulging or deformation) is obtained. The resulting bulging or deformation of the shaped cover substrate (= cover substrate) is therefore referred to as the cover element.

Furthermore, a lens element is formed on the cover element by the defined bulging of the cover substrate from the lens material section on the cover substrate. Due to the aligned or predetermined position of the lens material section on the cover The lens element is positioned at a predetermined position and with a predetermined orientation on the cover element by the bulging process of the cover substrate with respect to the position of the closed cavity. The area of the cover element provided with the lens element is also referred to as an optically active window element or optically active glass window.

In a subsequent step 150, the stop element and the mold substrate are now removed from the molded cover substrate, whereby the molded cover substrate now forms the cover substrate with the at least one cover element. As the following explanations will show, the cover substrate can be used to house one or a plurality of optical or optoelectronic components.

As already mentioned above, according to one embodiment, the cover substrate comprises a single homogeneous material, e.g. a glass material, in order to form the molded cover substrate, i.e. the lid substrate or the glass cap, from a single homogeneous material. Thus, the individual lid elements are also formed in one piece (in one piece) and from a single homogeneous material, e.g. the glass material.

In this context, reference is also made to the 2-8 and the associated description, which show or implement these procedural steps.

According to one embodiment, the step 120 of providing the mold substrate and cover substrate, which are connected to one another, can now comprise the following steps (sub-steps). Thus, firstly in a step 110, the mold substrate, e.g. a silicon wafer, is provided with the structured surface area (= provided with depressions or recesses). Furthermore, the cover substrate, e.g. a glass wafer, is provided, which comprises a glass material with a lens material section.

In a step 112, the cover substrate is placed in alignment on the structured surface area of the mold substrate to place the lens material portion of the cover substrate in an aligned or predetermined position (alignment) with the structured surface area of the mold substrate.

For example, the surface area of the cover substrate that lies against the mold substrate (= opposite it) can be flat or planar (= without recesses or depressions).

In a step 114, the cover substrate is then connected or joined to the mold substrate, e.g. hermetically connected by means of anodic bonding or another joining technique, in order to form at least one closed cavity between the cover substrate and the mold substrate. The depression arranged in the mold substrate or the depressions arranged in the mold substrate then each form the at least one closed cavity between the cover substrate and the mold substrate.

According to a further embodiment, step 110 of providing the mold substrate and the cover substrate can comprise the following steps or sub-steps. For example, in a step 112-1, the mold substrate, e.g. a silicon wafer, can be provided. In a step 114-1, the cover substrate, e.g. a glass wafer, which has a structured (= provided with depressions) surface area and also a glass material with a lens material section, can be arranged or positioned in an aligned manner on the mold substrate. For example, the surface area of the mold substrate that rests against the cover substrate or is opposite it can have a flat or planar shape.

In step 114, the cover substrate is again connected or joined to the mold substrate, e.g. hermetically connected by means of anodic bonding or by means of a joining process, in order to form at least the closed cavity between the cover substrate and the mold substrate. The at least one closed cavity is thus formed, for example, by the depression(s) or structure(s) arranged in the cover substrate.

According to a further alternative embodiment, both the mold substrate and the cover substrate can have a structured surface area provided with depressions in order to jointly form the at least one closed cavity between the cover substrate and the mold substrate, and in this case, for example, when the cover substrate is arranged in an aligned manner on the mold substrate, the depressions provided in the cover substrate and the mold substrate can be brought into alignment with one another in order to then form the closed cavity(ies) between the cover substrate and the mold substrate in the step of connecting, e.g. hermetic connecting by means of anodic bonding.

According to one embodiment of the method, the cover substrate has the lens material section formed as a lens structure on a main surface area of the cover substrate facing away from the mold substrate at a position which, after the step of tempering and providing an overpressure, corresponds to a lateral side wall area of the cover element of the molded cover substrate. In this context, reference is also made, for example, to the 2-5 and the corresponding description.

According to one embodiment of the method, the cover substrate has two lens material sections formed as lens structures at positions on a main surface area of the cover substrate facing away from the mold substrate, which are formed as opposite lens structures after the step of tempering and providing an overpressure on opposite side wall areas of the cover element of the molded cover substrate. In this context, reference is also made, for example, to the 2 and the corresponding description.

According to one embodiment of the method, the cover substrate can have a recess formed in some areas (= thinning in some areas) in the first main surface area. This recess in some areas can now be provided in order to make the base area of the cover elements of the formed cover substrate (which is not curved during the blowing process) as thin as possible. In this context, reference is also made to the 2 and the corresponding description.

According to an embodiment of the method, the cover substrate has a stiffening structure which is arranged on the cover substrate on an opposite side surface of the cover substrate and (with respect to a vertical projection) opposite and centered (= centered aligned) to the lens material section. In this context, reference is also made, for example, to the 3-6 and the corresponding description.

The stiffening structures used in the method comprise, for example, a silicon material in order to form corresponding silicon stiffening structures. Alternatively, other materials can also be used that can be selectively removed or etched away from the glass material of the cover substrate. A further material property of the materials used for the stiffening structures is that the stiffening structures do not react or react through with the glass at the elevated temperatures of the tempering process, for example to prevent the materials of the cover substrate and the stiffening structures from "melting". Other materials that can be used for the stiffening structure include, for example, silicon-based material combinations such as SiGe (silicon germanium), etc.

According to an embodiment of the method, the cover substrate has a stiffening structure which is arranged on the cover substrate (as a stiffening layer over) the lens material section. In this context, reference is also made, for example, to the 4-6 and the corresponding description.

According to one embodiment, the method further comprises the following step: removing the stiffening structure after the step of tempering and providing an overpressure from the formed cover substrate. In this context, reference is also made, for example, to the 3-6 and the corresponding description.

According to an embodiment of the method, the cover substrate has two opposing stiffening structures which are arranged on the cover substrate on opposite side surfaces of the cover substrate and (with respect to a vertical projection) opposite and e.g. centered (= centered aligned) to each other at a position in order to obtain an inclined (= angled), planar side wall region of the cover element of the formed cover substrate in the step of tempering and providing an overpressure. In this context, reference is also made, for example, to the 4-5 and the corresponding description.

According to an embodiment of the method, the cover substrate can then optionally be designed such that one side wall is designed with a lens element and the opposite, inclined side wall is designed with an inner mirror coating, which acts, for example, as a deflection mirror. In this context, reference is also made, for example, to the 4 and the corresponding description.

According to an embodiment of the method, the cover substrate has a stiffening structure which is attached to the cover substrate on an opposite side surface of the cover substrate and (with respect to a vertical projection) opposite or centered (= centered aligned) to the lens material section. is arranged in order to form a defined (planar) surface area on the ceiling area of the cover element of the cover substrate vertically opposite the lens structure during the step of tempering and providing an overpressure on the ceiling area of the cover element of the cover substrate. In this context, reference is also made, for example, to the 4-6 and the corresponding description.

According to an embodiment of the method, the cover substrate has the lens material section on a main surface area of the cover substrate facing away from the mold substrate in a position to form the (eg inwardly curved) lens structure in the step of tempering and providing an overpressure on an inner ceiling wall area of the cover element. In this context, reference is also made, for example, to the 7 and the corresponding description.

According to an embodiment of the method, the cover substrate has the lens material section on a main surface area of the cover substrate facing the mold substrate in a position to form the (eg inwardly curved) lens structure in the step of tempering and providing an overpressure on an inner ceiling wall area of the cover element. In this context, reference is also made, for example, to the 8 and the corresponding description.

According to an embodiment of the method, the (hermetic) bonding of the cover substrate to the mold substrate is carried out in an atmosphere with a defined atmospheric ambient pressure in order to enclose a defined atmospheric pressure in the closed cavities. In this context, reference is also made, for example, to the 2-8 and the corresponding description.

According to one embodiment of the method, the cover substrate and/or the mold substrate are designed to form the closed cavity with a plurality of closed cavity regions between the cover substrate and the mold substrate, wherein the closed cavity regions are arranged fluidically separated from one another, or wherein gas exchange channels are further provided between the cavity regions closed from the ambient atmosphere in order to fluidically connect them to one another in order to obtain a common defined atmospheric pressure in the connected cavity regions. In this context, reference is also made, for example, to the 2-8 and the corresponding description.

According to one embodiment of the method, the step of tempering and providing an overpressure is carried out as a glass flow process in a vacuum furnace in order to obtain a defined atmospheric overpressure in the closed cavity compared to the surrounding atmosphere. In this context, reference is also made, for example, to the 2-8 and the corresponding description.

According to one embodiment, the method further comprises the following steps: cooling the stop element, the mold substrate and the molded cover substrate, and subsequently removing the mold substrate by means of an etching process, e.g. by means of a silicon or semiconductor etching process of the silicon or semiconductor material of the mold substrate. In this context, reference is also made, for example, to the 2-8 and the corresponding description.

According to one embodiment, the method further comprises the following step: Subsequent removal of the stop element by means of an etching process. In this context, reference is also made, for example, to the 2-8 and the corresponding description.

According to one embodiment of the method, the cover substrate is bulged or blown out during the step of tempering and providing an overpressure in the region of the closed cavity up to a height that is predetermined by the vertical distance of the stop surface from the cover substrate. In this context, reference is also made, for example, to the 2-8 and the corresponding description.

According to one embodiment of the method, the region of the stop surface of the stop element opposite the cavity or the cavity regions is flat and parallel to the main surface region of the cover substrate in order to form a flat cover region of the cover element during the step of tempering and providing an overpressure. In this context, reference is also made, for example, to the 2-8 and the corresponding description.

According to an embodiment of the method, when cooling the formed cover substrate in a temperature range above 650°C, eg between 650°C and 955°C or between 650°C and 750°C, an atmospheric overpressure in the closed cavities compared to the surrounding atmosphere to produce a (convex) curvature of the side wall regions (= side windows) of the cover element of the molded cover substrate outwards.

According to an embodiment of the method, the step of tempering and providing an overpressure is carried out in a vacuum oven, wherein the atmospheric overpressure in the closed cavities compared to the surrounding atmosphere is maintained by a reduced atmospheric pressure in the vacuum oven. In this context, reference is also made, for example, to the 2-8 and the corresponding description.

According to one embodiment of the method, when the molded cover substrate is cooled in a temperature range above 650°C, e.g. between 650°C and 955°C or between 650°C and 750°C, an atmospheric negative pressure is created in the closed cavities compared to the surrounding atmosphere in order to produce a (concave) curvature of the side wall regions (= side windows) of the cover element of the molded cover substrate inwards.

According to one embodiment of the method, the step of tempering and providing an overpressure is carried out in a vacuum oven, wherein the atmospheric negative pressure in the closed cavities compared to the surrounding atmosphere is maintained by an increased atmospheric pressure in the vacuum oven. In this context, reference is also made, for example, to the 2-8 and the corresponding description.

According to one embodiment of the method, the stop element (= chuck) is designed as a reusable tool and has a non-stick coating for the glass material of the cover substrate at least on the area of the stop surface opposite the cavity or on the entire stop surface. In this context, reference is also made, for example, to the 2-8 and the corresponding description.

The stop element can, for example, comprise or consist of a semiconductor material, such as silicon, and have an at least partially or completely flat (plane) stop surface opposite the cover substrate. In addition to a semiconductor material, the stop element can also comprise or consist of other materials, such as silicon carbide (SiC), graphite or aluminum nitride (AIN).

Regarding the 2 illustrated manufacturing method 100 by means of the flow chart 100-1, a further alternative embodiment of the cover substrate 20 with a partially formed recess (= partially thinned out) 20-3 in the first main surface region 20-1 of the cover substrate 20 is now shown.

This area-wise recess 20-3 can now be provided in order, for example, to make the (non-bulging) base region 24-3 of the cover elements 24 of the formed cover substrate (= cover substrate) 20' as thin as possible, that is to say, to make the base region 24-3 as thin or flat as possible at least adjacent to the lateral beam exit region 24-1 (e.g. with the lens element 26 formed thereon). This can ensure that, in a (subsequent) housing of an optical component (transmitting and/or receiving component) arranged on a component substrate, the required installation height of the optical component above the component substrate level is as low as possible. This means that the optoelectronic component (e.g. a laser emitter or a photodiode) does not need to be mounted on a submount with additional effort, e.g. in a raised position, in order to avoid a collision of the transmitting or receiving radiation of the optical component with an otherwise raised glass base.

According to this exemplary embodiment, the base region 24-3 of the cover element 24 can be designed to be (relatively) flat, at least in the direction of the lateral beam passage of the transmitting or receiving radiation of the optoelectronic component, in order to avoid having to build the optoelectronic component on an additional elevation, e.g. on a (raised) submount, on the component substrate, so that the transmitting and/or receiving radiation of the optoelectronic component 1 does not collide with the base region (glass base) 24-3 of the cover element or is disturbed by it.

For this purpose, the glass material of the cover substrate 20 is already placed on the mold substrate 10 with a thinned area 20-3 on the upper side (= on the first main surface area) 20-1, wherein this thinning 20-3 extends at least in the beam coupling direction up to the frame area of the cover element (the glass cap) 24 or, for example, up to the separation area of the cover substrate 20'.

This thinning 20-3 can also extend into the area of the window surface that still needs to be blown out 24-1, which is arranged vertically after the bulging process, for example, in order to produce a particularly thin-walled window element with a low optical effect in the beam passage area, for example. In addition, the thin-walled window element has a large beam passage area due to the flat base area 24-3, without having to blow the glass cap (the cover substrate) 20 out particularly high during the blowing out process.

2a shows, by way of example, such a cover substrate provided with thinned regions 20-3 in the step 110 of providing and further after passing through the manufacturing method 100 in the steps 160, 170, wherein the reduced thickness of the base region 24-3 of the cover substrate 20' is clearly shown.

The provision of these thinned areas 20-3 in the cover substrate is equally applicable to the different process sequences of the manufacturing method 100 shown below, wherein the thinned areas 20-3 of the cover substrate 20 are provided there in order to obtain a targeted, thin configuration of the resulting cover element 24 in the desired side wall areas and the resulting (improved) optical properties.

According to one embodiment, the method further comprises the step of applying, such as depositing, a metallization as a coherent frame structure (= a sealing frame) on connection areas at non-bulging areas (= base areas) of the formed cover substrate (= the lid substrate). In this context, reference is also made, for example, to the 2-8 and the corresponding description.

According to one embodiment of the method, an anti-reflection coating is applied or deposited on a region (ceiling region and/or side wall region) of the cover element of the formed cover substrate. In this context, for example, reference is also made to the 2-8 and the corresponding description.

In the following, some further technical explanations of the different steps of the manufacturing method 100 described above as well as the elements or structures mentioned are presented as examples. These following explanations are (unless otherwise stated) applicable to all embodiments and are to be viewed as an alternative or additional embodiment of individual method steps or individual elements or structures.

In the context of the present description, the mold substrate is provided, for example, with a topographically structured surface region (first main surface region). This means that a surface region (the first main surface region) of the mold substrate has one or more depressions. The surface region of the mold substrate can have the depressions over its entire lateral extent up to a few millimeters at or in front of the edge in order to obtain the cavities and/or gas exchange channels when the mold substrate is hermetically connected to the cover substrate. The mold substrate can therefore have a negative topography.

Furthermore, first depressions (cavity regions) in the mold substrate can be provided to form cavities or bulges for an optoelectronic (radiation-emitting or radiation-receiving) component in the cover substrate by blowing out during the glass flow process. Furthermore, adjacent second cavity regions can be designed to form a cavity for a dicing lane or to be used to expose the electrical connection pads in the housing in subsequent process steps.

According to the present description, an inversion or inverted arrangement of these functional units is also possible. For example, a cavity region or a depression according to the present description can be a surface or trench structure that is recessed to the substrate surface and that was introduced into the mold substrate by an etching process. Basic geometries for the cavity regions can depend on the required cap geometry (cover substrate geometry) and are essentially freely selectable geometrically. For example, square, rectangular, trapezoidal and linearly elongated shapes with possibly not necessarily rectangular corners as well as other shapes with linear edge sections are possible. Furthermore, circular or ellipsoidal basic shapes are also possible.

In the context of the present description, tempering (see step 130) is understood to mean a temperature treatment, for example a time-controlled, homogeneous heating or cooling, wherein this tempering step is carried out, for example, in a defined, controllable pressure environment, i.e. with defined ambient pressure conditions. According to one embodiment, the tempering step 130 can be carried out in a temperature range above 650°C, e.g. between 650°C and 955°C or between 650°C and 750°C.

A glass material within the meaning of the present description is, for example, an amorphous inorganic material whose viscosity decreases with increasing temperature (e.g. continuously).

In the illustrated manufacturing method 100, a cover substrate (molded cover substrate) is produced with one or more cover elements, wherein the cover element has a lateral and an upper side wall region, which can also act as optical window regions. These optical window regions allow a lateral to vertical beam coupling and/or coupling in to the carrier substrate. According to the present description, the window region of the cover element provided with a lens element is characterized by an influence on the beam propagation (of an incident and/or emerging optical beam), so that an additional change in direction impressed on the beam when passing through the window element moves in the range ≥ 6°.

According to the present description, window areas with a reflective mirror coating are flat and curved surfaces inclined to the base plane (the first main surface area) of the cover substrate for beam deflection and beam focusing. According to the present description, lens elements are passively imaging elements, e.g. uniaxial cylinder lenses, rotationally symmetrical converging lenses and free-form lenses.

According to the illustrated manufacturing method 100, the cover substrate, which can also be referred to as a cap or cover wafer, is manufactured with the lateral optical window surfaces made of glass, for example for a variety of housings. The lateral optical window surfaces can thus be formed, for example, vertically (= extending vertically) to the original main surface area of the cover substrate.

The method shown is essentially based on so-called glass flow techniques. In the embodiments, the glass material of the cover substrate can be Borofloat® glass or another glass such as Schott AF32, Corning Eagle XG, Hoya SD2. The coefficient of thermal expansion (CTE) of the glass materials is chosen, for example, to match the semiconductor material used, since both the production of the cover wafer (cover substrate) and the bonding of the cover wafer take place on the semiconductor material of the mold substrate, for example on a silicon substrate. Too great differences in the coefficient of thermal expansion could otherwise lead to very large thermomechanical stresses or to the destruction of the elements involved if the CTE of the glass material of the cover substrate is not adapted (e.g. within a tolerance range of less than 1%, 5% or 10%) to the CTE of the semiconductor material of the mold substrate. Adapted means, for example, that the CTE of the glass material in embodiments does not deviate from the CTE of the semiconductor material by more than 1 - 2 ppm/K. In the embodiments, the CTE of the glass material deviates from the CTE of the semiconductor material by less than 0.5 ppm/K, for example.

A possible process sequence for the production of these lid wafers with optical window surfaces is shown below using the 2-8 described. For example, areas of the lid wafer whose surfaces have a roughness of less than 50 nm are considered optical window surfaces. The surfaces of optical window surfaces can have very different geometric shapes: for example, both flat-flat and flat-convex, convex, concave, cylindrical, but other ratios can also be set. The main plane of the window surface can be inclined at an angle between 0° and 110°C relative to the lower base plane of the lid wafer, inclined rotationally symmetrically (conical) and, if necessary, shifted with a lateral offset to the center. The height of the optical window surface relative to the base plane of the lid wafer can be adjusted, for example, by the process parameters and the design.

The optical window surfaces are used for beam coupling and/or beam input for at least one radiation or light-emitting component and optionally for one or more photodetectors. For example, several optical side windows can be provided in the same cover element on different sides in order to allow lateral beam output in different directions, for example.

In the different embodiments (e.g. the process sequences shown below in 2-8 ) of the method 100, it is provided that the lid elements (= glass lids) are formed by a tempering process. The geometry achieved at the end of the process is influenced by four variables, the enclosed gas volume, the temperature profile, the pressure in the furnace, and the distance of the stop.

In a possible (simple) implementation of the process, the pressure in the furnace is constant throughout the entire time, whereby the pressure enclosed in the cavity is at least temporarily greater than the pressure in the furnace. The furnace temperature should follow a profile, with (consisting of) a heating phase, a process phase and a cooling phase. The temperature of the process phase should be above the softening temperature of the glass so that the pressure of the enclosed gas can inflate the cavity. If the pressure inside the cavity is always greater than the pressure in the furnace, the wall surface will have a convex surface. If, on the other hand, the process is carried out in such a way that the pressure in the inflated cavity approaches the furnace pressure (equilibrium state), a pressure reversal can be achieved by cooling the furnace so that the pressure in the furnace is greater than inside the cavity. This leads to a deformation of the convex surface so that a flat, almost plane wall can be achieved, at least in some areas. However, the geometry control is significantly increased by the additional stiffening elements (= stiffening structures) and stiffening layers as well as by inflating against a stop. Apart from the described effect of the temperature change, such a reversal of the pressure conditions can also be achieved by changing the, e.g. regulated, oven pressure. The stiffening elements or stiffening structures are arranged on the cover substrate as a structured stiffening layer

In the different embodiments (e.g. the process sequences shown below in 2-8 ) of the method 100, it is provided that in steps 110 and 112 the mold substrate and the cover substrate are provided and the same are anodically bonded.

According to one embodiment, the method 100 with regard to providing 110 the mold substrate may comprise the following steps: providing a semiconductor wafer with a passivation layer on a surface (= first main surface region), lithographing the passivation layer so that the resist layer is removed on the surface where the depressions and gas channels are provided, etching the passivation layer on the surface of the semiconductor wafer with regard to the lithographed regions, removing the resist layer, etching the exposed semiconductor material so that a thickness of the semiconductor wafer is reduced perpendicular to the lithographed regions of the surface in order to structure the surface region and thus provide depressions, e.g. cavities and gas channels, and completely removing the passivation layer.

This allows, for example, the mold substrate to be manufactured and provided with a suitably structured surface area. For example, the semiconductor wafer is a silicon wafer. The semiconductor wafer can be coated with an etch-resistant passivation, for example made of LP nitride (LP = low pressure) in an LP-CVD process (LP-CVD = low pressure chemical vapor deposition). Lithography is then carried out. The passivation is opened by plasma etching. The lithographed areas can be processed by plasma-assisted gas phase etching, for example anisotropic high-rate etching or isotropic wet etching, so that the surface of the semiconductor wafer is etched with respect to the lithographed areas. Finally, the passivation layer is completely removed, for example by etching it away.

According to an embodiment of the first method, the method comprises the following step in the arrangement 112 and connection 114 of the cover substrate: surface anodic bonding of the surface region of the mold substrate structured with depressions to the overlying surface region of the cover substrate. A glass wafer that is suitable as a cover substrate can, for example, comprise (consist of) Pyrex, Borofloat® 33 or similar glass materials with a low CTE. Such glass materials can be characterized by the fact that they can be used particularly well in glass flow processes.

In the following, the 2-8 exemplary process sequences or process flows for the implementation of the 1 The basic manufacturing process 100 shown in FIG. 1 is described in 2-8 the drawing plane extends parallel to the xz-plane.

All process alternatives of the method 100 described below are based on the basic concept that a cover substrate for housing one or a plurality of optical (optoelectronic) components is produced by means of a hot-viscous glass flow process, wherein the molded cover substrate forms the cover substrate with the at least one optically active cover element. The optically active cover element has, for example, a side window (= glass window) that acts as a lens element. Hermetically sealed cavities between the cover substrate and the mold substrate are used in order to bring about a defined bulging of the glass material of the cover substrate, starting from the closed cavity up to a stop surface spaced from the cover substrate, during the tempering of the cover substrate and the mold substrate by reducing the viscosity of the glass material of the cover substrate and by providing an overpressure in the closed cavity compared to the surrounding atmosphere. The molded cover cover substrate with the optically active cover element or the bulge is obtained. Since the cover substrate has a glass material with a lens material section, this forming or bulging process also causes the formation of a lens element (from the lens material section) on the cover element, ie the optically active glass window on the cover element (glass cover cover) is obtained. This cover element with the optically active glass window (lens element) can now be used to house optoelectronic components, such as radiation-emitting components.

2 now shows an exemplary flow chart 100-1 of the manufacturing method 100 according to the invention for producing a cover substrate, which can be used, for example, for housing one or a plurality of optical or optoelectronic components, wherein the produced cover substrate has the cover element with the optically active window element (lens element). The window elements can thus be formed, for example, as laterally tilted lenses (lens elements).

In step 110, first the mold substrate 10, e.g. a semiconductor or silicon wafer, is provided with the structured surface region 10-1, i.e. the mold substrate 10 is provided with at least one depression or recess 12. Furthermore, the cover substrate 20, e.g. a glass wafer, is provided. The cover substrate 20 further has at least one lens material section 22 on a first main surface region (top side) 20-1 thereof, wherein the cover substrate 20 with the lens material section 22 has a glass material.

According to a further embodiment, the lens material section 22 can also be arranged on the second main surface region 20-2 of the cover substrate 20. The following process steps are accordingly applicable to this swapped arrangement of the lens material sections 22 on the second main surface region 20-2 of the cover substrate 20.

According to one embodiment, the mold substrate 10 can be designed as a semiconductor substrate (semiconductor wafer or silicon wafer) and the cover substrate 20 as a glass substrate or glass wafer. The mold substrate 10 is, for example, a molded substrate with a shape, contour or topography, such as a topographically structured substrate. The mold substrate can, for example, be designed as a semiconductor wafer, e.g. a silicon wafer, wherein the surface structuring or the topography of the mold substrate can be obtained extremely precisely by means of semiconductor processing steps or silicon processing steps. The cover substrate 20 has, for example, a single homogeneous material or glass material in order to form the molded cover substrate 20 as a cover substrate or glass cap in one piece using the following manufacturing steps.

In a step 112, the cover substrate 20 is arranged in alignment on the structured surface region 10-1 of the mold substrate 10 in order to arrange the lens material section 22 of the cover substrate in an aligned or predetermined position (= alignment) with the structured surface region 10-1 of the mold substrate 10. For example, the second main surface region 20-2 of the cover substrate 20, which rests on the mold substrate 10, i.e. on the raised regions of the structured surface region 10-1 of the mold substrate 10, can be flat or planar and thus be designed without recesses or depressions.

If the lens material portion 22 is arranged on the second main surface region 20-2 of the cover substrate 20, in step 112 the lens material portion 22 is arranged within one of the recesses 12 of the mold substrate 10, i.e. between the raised regions of the structured surface region 10-1 of the mold substrate 10.

In a step 114, the cover substrate 20 is then connected or joined to the mold substrate 10, e.g. hermetically connected by means of anodic bonding, in order to form at least one closed cavity 30 between the cover substrate 20 and the mold substrate 10. The depression 12 arranged in the mold substrate 10 or the depressions 12 arranged in the mold substrate 10 then each form the at least one closed cavity 30 between the cover substrate 20 and the mold substrate 10.

According to an embodiment of the flow chart 100-1 of the method 100, the (hermetic) bonding 114 of the cover substrate 20 to the mold substrate 10 is performed in an atmosphere with a defined ambient atmospheric pressure in order to enclose a defined atmospheric pressure in the sealed cavities 30.

In preparation for the actual manufacturing process, a glass wafer 20 (= cover substrate) prepared with lens structures 22 (lens material sections) is provided. In the preparation In addition, during preparation, the mold substrate 10, e.g. a silicon mold substrate, is provided with one-sided cavities and channel structures 12 (= recesses or depressions). The glass wafer 20 is aligned with the mold substrate 10 and bonded, for example anodically, in a defined atmosphere in order to enclose a (defined) gas pressure in the cavities and channel structures 30. The lens structures 22 face the mold substrate 10 or away from the mold substrate 10.

According to an embodiment of the flow chart 100-1 of the method 100, the cover substrate 20 and/or the mold substrate 10 are designed to form the closed cavity 30 with a plurality of closed cavity regions 30 between the cover substrate 20 and the mold substrate 10, wherein the closed cavity regions 30 are arranged fluidically separated from one another, or wherein gas exchange channels 30-1 are further provided between the cavity regions 30 closed from the ambient atmosphere in order to fluidically connect them to one another in order to obtain a common defined atmospheric pressure in the connected cavity regions 30.

In step 120, the mold substrate 10 and the cover substrate 20, which are connected to one another, are provided, wherein the surface region 10-1 of the mold substrate 10 is structured (formed with depressions or channel structures 12) in order to form the at least one closed cavity 30 between the cover substrate 20 and the mold substrate 10. In step 120, for example, an anodically bonded glass-silicon cover substrate 10, 20 is obtained or provided.

In a (subsequent) step 130, the cover substrate 20 and the mold substrate 10 are now tempered, i.e. subjected to a temperature treatment or heated (warmed) in order to reduce the viscosity of the glass material of the cover substrate 20. Furthermore, in a step 140, an overpressure is provided in the (at least one) closed cavity or the closed cavities 30 compared to the surrounding atmosphere in order to cause a defined bulging, e.g. blowing out or deformation, of the glass material of the cover substrate 20 starting from the closed cavity 30 up to a stop surface 40-1 of a stop element 40 spaced apart from the cover substrate 20, based on the reduced viscosity of the glass material of the cover substrate 20 and the overpressure in the closed cavity 30 compared to the surrounding atmosphere. The defined bulging of the glass material of the cover substrate 20 due to the overpressure in the closed cavity 30 and the reduced viscosity of the glass material can also be referred to as blowing out or deforming the glass material. The defined bulging of the glass material of the cover substrate 20 thus produces a shaped cover substrate 20' with (at least) one cover element 24 (= bulging or deformation). The resulting bulging or deformation of the shaped cover substrate (= cover substrate) 20' is thus referred to as the cover element 24. According to one embodiment, the tempering step 130 can be carried out in a temperature range above 650°C, e.g. between 650°C and 955°C or between 650°C and 750°C.

Furthermore, a lens element 26 is formed or formed on the cover element 24 by the defined bulging of the cover substrate 20 from the lens material section 22 on the cover substrate 20. Due to the aligned or predetermined position of the lens material section 22 on the cover substrate 20 with respect to the position of the closed cavity 30, the lens element 26 is formed at a predetermined position and/or with a predetermined orientation on the cover element 24 of the cover substrate 20' by the bulging process 130, 140 of the cover substrate 20. The region of the cover element 24 provided with the lens element 26 is also referred to as an optically active window element or optically active glass window 26.

According to an embodiment of the flow chart 100-1 of the method 100, the step of tempering 130 and providing 140 an overpressure is carried out as a glass flow process in a vacuum furnace 50 in order to obtain a defined atmospheric overpressure in the closed cavity 30 compared to the surrounding atmosphere.

According to an embodiment of the flow chart 100-1 of the method 100, the cover substrate 20 is bulged or blown out in the step of tempering 130 and providing 140 an overpressure in the region of the closed cavity 30 up to a height h which is predetermined by the vertical distance of the stop surface 40-1 of the stop 40 to the first main surface region 20-1 of the cover substrate 20.

According to an embodiment of the flow chart 100-1 of the method 100, the region of the stop surface 40-1 of the stop element 40 opposite the cavity 30 or the cavity regions 30 is flat and parallel to the main surface region 20-1 of the cover substrate 20 in order to be able to provide a overpressure to form a flat ceiling area 24-2 of the cover element 24.

According to one embodiment, the stop element 40 can be designed as a reusable tool and have a non-stick coating 40-1 (as or on the stop surface 40-1) for the glass material of the cover substrate 20 at least on the region of the stop surface 40-1 opposite the cavity 30 or on the entire stop surface 40-1.

The glass flow process 130, 140 can therefore be carried out in a pressure-controlled furnace 50. The glass wafer (cover substrate) 20 is blown out in the area of the cavities 30 up to the height h, which can be determined by a stop surface 40-1 of the stop element 40. The stop 40 and thus the stop surface 40-1 is designed to be flat, for example. After the glass flow process 130, 140, the cover substrate 20' is cooled, for example, and the cover substrate 20' is removed from the furnace 50.

According to an embodiment of the flow chart 100-1 of the method 100, the cover substrate 20 has, on a main surface region 20-1 of the cover substrate 20 facing away from the mold substrate 10, the lens material section formed as a lens structure 22 at a position which, in the step of tempering 130 and providing 140 an overpressure, corresponds to a lateral side wall region 24-1 of the cover element 24 of the molded cover substrate 20'.

As exemplified in 2 As shown, the cover substrate 20 can also have two (= in pairs) lens material sections formed as lens structures 22 at positions on the main surface region 20-1 of the cover substrate 20 facing away from the mold substrate 10, which are formed as opposing lens structures 26 in the step of tempering 130 and providing 140 an overpressure on opposite side wall regions 24-1 of the cover element 24 of the molded cover substrate 20'.

According to an embodiment of the flow chart 100-1 of the method 100, in a step 142 of (defined) cooling of the molded cover substrate 20' in a temperature range above 650°C, e.g. between 650°C and 955°C or between 650°C and 750°C, an atmospheric overpressure in the closed cavities 30 relative to the surrounding atmosphere can be brought about in order to produce a (convex) curvature of the side wall regions (side windows) 24-1 of the cover element 24 of the molded cover substrate 20' outwards. According to an embodiment of the method, the step of tempering 130 and providing 140 an overpressure can be carried out in a vacuum furnace 50, wherein the atmospheric overpressure in the closed cavities 30 relative to the surrounding atmosphere is maintained by a reduced atmospheric pressure in the vacuum furnace 50.

According to a further embodiment of the flow chart 100-1 of the method 100, in the step 142 of (defined) cooling of the molded cover substrate 20' in a temperature range above 650°C, e.g. between 650°C and 955°C or between 650°C and 750°C, an atmospheric negative pressure can be brought about in the closed cavities 30 compared to the surrounding atmosphere in order to produce a (concave) curvature of the side wall regions (side windows) 24-1 of the cover element 24 of the molded cover substrate 20' inwards. According to an embodiment of the method 100-1, the step of annealing 130 and providing 140 the overpressure in the vacuum furnace 50 is carried out, wherein furthermore the atmospheric negative pressure P in the closed cavities 30 relative to the surrounding atmosphere is maintained by an increased atmospheric pressure in the vacuum furnace 50.

In a subsequent step 150, the stop element 40 and the mold substrate 10 are now removed from the molded cover substrate 20', whereby the molded cover substrate 20' now forms the lid substrate 20' with the at least one lid element 24. The lid substrate 20' can be used, for example, to house one or a plurality of optical or optoelectronic components.

According to an embodiment, the flow chart 100-1 of the method 100 may further comprise the step 142 of cooling the stop element 40, the mold substrate 10 and the molded cover substrate 20', wherein the mold substrate 10 is then subsequently removed in step 150 by means of an etching process, e.g. a silicon or semiconductor etching process of the silicon or semiconductor material of the mold substrate.

According to one embodiment, the step 150 of removing the stop element 40 is also carried out by means of an etching process, e.g. by means of a silicon or semiconductor etching process of the silicon or semiconductor material of the stop 40.

Since the cover substrate 20 according to one embodiment is a single homogeneous material, e.g. a glass material, the shaped cover substrate 20', ie the lid substrate or the glass cap, is also formed in one piece (in one piece) with the at least one lid element 24 and from a single homogeneous material, e.g. the glass material.

In step 150, for example, a glass cover substrate 20' with convex lenses 26 in the side windows 24-1 of the glass caps 24 is thus obtained after the removal of the silicon on both sides of the mold substrate 10 and the stop element 50. The lenses 26 can be formed circumferentially or segmented, whereby only one individual lens 26 can be formed.

In an (optional) subsequent step 160, the process flow 100-1 of the method 100 may further comprise applying or depositing a metallization 60 as a (continuous) frame structure or as a sealing frame on connection regions 62 on the second main surface region 20-2 on non-bulged regions (base regions) 24-3 of the cover elements 24 of the molded cover substrate (the cover substrate) 20'.

According to one embodiment, at step 160, an anti-reflective coating 64 may further be applied or deposited on an inside and/or outside region, e.g., inside and/or outside on the ceiling region 24-2 and/or sidewall region 24-1, of the lid member 24 of the molded cover substrate 20'.

In the optional step 160, a deposition of sealing frames 60 and/or optional anti-reflective coatings 64 can thus be carried out on the cover substrate 20'. This glass cover substrate 20' can then be used to hermetically seal optical structures at the wafer level, as will be explained below.

In an (optional) subsequent step 170, the process sequence 100-1 of the method 100 can further comprise separating the formed cover substrate 20' in order to obtain separated cover elements 24'. The separating 170 of the glass cover substrate 20' can be carried out, for example, by sawing or laser separation. With the separated caps 24', optical structures can be hermetically sealed at the individual substrate level or at the wafer level by individual capping, as will be explained below.

In the following, some process steps of the process flow 100-1 of the method 100 of 2 summarized again.

2 thus shows a flow chart 100-1 which uses steps 110 to 170 to illustrate a first process sequence 100-1 for producing a cover substrate 20'. After the process sequence, the cover substrate 20' resulting from the production method 100-1 has, for example, an optical side window 24-1 which is an integral component of the cover element 24 (cap) and allows lateral beam decoupling and/or beam coupling. For example, several lateral (side) side windows 24-1 (e.g. with a vertical extension) can also be provided, which are an integral component of the cover element 24 (cap) of the cover substrate 20' and allow lateral beam decoupling or beam coupling in different directions, e.g. in different directions parallel to the reference plane (xy plane). For example, a vertical (upper) side window 24-2 (e.g. with lateral extension) can also be provided, which is an integral part of the cover element 24 (cap) of the cover substrate 20' and allows a vertical beam coupling or beam coupling, e.g. perpendicular to the reference plane (xy plane).

The process flow 100-1 of 2 thus comprises, as a step 110, the provision of the mold substrate with a structured (provided with recesses) surface region, wherein the mold substrate comprises a semiconductor material, such as silicon, or consists of the semiconductor material, e.g. silicon. This is followed by the arrangement of the cover substrate on the structured surface region of the mold substrate, wherein the cover substrate is pre-structured with lenses (lens material sections). The cover substrate comprises a glass material or consists of a glass material, wherein the lenses are aligned towards the mold substrate or aligned away from the mold substrate. When the cover substrate is arranged on the mold substrate, the structured surface of the mold substrate is arranged to at least partially overlap a surface of the cover substrate and when the cover substrate is connected to the mold substrate, it is e.g. anodically bonded or hermetically joined. The structured surface of the mold substrate is connected to the surface of the cover substrate, e.g. in a gas-tight manner with a defined enclosed internal atmosphere in the recesses (cavities).

This is followed, for example, by tempering 130 of the connected substrates 10, 20 in a vacuum oven such that blowing out of the glass material of the cover substrate in the region of the recesses by the enclosed pressure in relation to the furnace pressure. The temperatures are chosen so that the viscosity of the glass material is greatly reduced and the glass material in the window area can expand in a well-controlled manner but does not melt. To support the blowing out, a pressure difference, e.g. a set one, can be present between the interior spaces or cavities arranged between the substrates and the ambient atmosphere in the furnace. An enclosed gas pressure in the interior spaces can be provided to support the blowing out of the glass material by means of a pressure difference. This allows the process to be carried out in one tempering step. The existing pressure difference between the enclosed gas pressure in the recessed interior spaces and the controlled vacuum of the furnace atmosphere supports the entire flow process.

During the glass flow process, the flow front is stopped at the stop surface 40-1 of the stop element 40 at an adjustable distance h in the vacuum furnace, wherein the stop element 40 with the stop surface 40-1 has, for example, a silicon wafer or consists of a silicon wafer. The flow process with the stop surface 40-1 at a static distance is therefore based on the reduced viscosity of the glass material of the cover substrate 20 and the overpressure in the closed cavity 30 compared to the surrounding atmosphere, wherein the bulging (blowing out / deformation) of the glass material of the cover substrate 20 is effected starting from the closed cavity 30 up to the stop surface 40-1 of the stop element 40 spaced apart from the cover substrate 20 in order to obtain the shaped cover substrate 20' with (at least) one cover element (= bulge) 24.

During the glass flow process 130, 140, the connected substrates are cooled under a reproducible temperature and pressure ramp and finally the cover substrate 20' with the mold substrate and, for example, the stop element 40 is removed from the furnace 50.

Then, the stop element 40 and the mold substrate 10 are removed 150 in order to obtain the structured cover substrate 20' obtained from the cover substrate 20 by the blow-out process. The removal 150 can mean a separation or a selective etching of the semiconductor material of the mold substrate 10 and/or the stop element 40 by means of an etching process (silicon or semiconductor etching process of the silicon or semiconductor material), e.g. in hot potassium hydroxide solution. In this way, an effective method for producing a cover substrate 20' for encapsulating radiation-emitting components is provided, since the cover substrate 20' obtained by the method 100 as described in 2-8 described schematically, comprises an optical output window 26 which is formed by means of the window component 24.

In an alternative embodiment of the method 100 for producing a cover substrate 20', the resulting cover substrate 20' has, for example, an optical side window 26, which is an integral part of the cap (the cover element) 24 and allows lateral (= side) beam extraction. For example, several optical side windows 24-1 can also be provided, which are an integral part of the cap 24 and allow lateral beam extraction in different directions, e.g. each in a different direction.

In the optional step 160, furthermore, applying (depositing) the metallization 60 as a (continuous) frame structure (a sealing frame) on connection regions 62 on the second main surface region 20-2 at the non-bulging regions (base regions) 62 of the molded cover substrate (lid substrate) 20' may be performed. In the optional step 160, furthermore, an anti-reflection coating 64 may be applied or deposited on a region (ceiling region and/or sidewall region) of the lid element 24 of the molded cover substrate 20'. In a further optional step 170, the molded cover substrate 20' may be singulated to obtain singulated lid elements 24'.

The manufacturing method 100 described above with the exemplary process flow of 2 is a very effective and simple procedure for positioning the lenses on the side areas 24-1 of the respective cover element 24.

3 now shows a further exemplary basic flow diagram 100-2 of the inventive manufacturing method 100 according to a further embodiment.

The following describes the main differences or different process steps of the flow chart 100-2 of 3 compared to flow chart 100-1 of 2 Therefore, the above description of the 1 and 2 accordingly to the following description of the embodiment of 3 be applied, whereby the following description also includes differences, such as different (= alternative and/or additional) process steps and/or elements, to the process flow 100-1 of 2 and the resulting technical effects are described.

In step 110, first the mold substrate 10, e.g. a semiconductor or silicon wafer, is provided with the structured surface region 10-1, ie the mold substrate 10 is provided with at least one depression or recess 12. Furthermore, the cover substrate 20, e.g. a glass wafer, is provided. The cover substrate 20 further has at least one lens material section 22 on a first main surface region 20-1 thereof, wherein the cover substrate 20 with the lens material section 22 has a glass material.

According to one embodiment, the cover substrate 20 has a stiffening structure 28 on one side, which is arranged on the cover substrate 22 on an opposite side surface 20-2 of the cover substrate and (with respect to a vertical projection), e.g. opposite and centered (= centered aligned) to the lens material section 22 on the cover substrate 20.

According to a further (alternative) embodiment, the lens material section 22 can also be arranged on the second main surface area 20-2 of the cover substrate 20 and the (one-sided) stiffening structure 28 on the first main surface area (side surface) 20-1 of the cover substrate and (with respect to a vertical projection) opposite and centered (= centered alignment) to the lens material section 22 on the cover substrate 20. The following process steps are accordingly applicable to this swapped arrangement of the lens material sections 22 and the stiffening structure(s) 28 on the cover substrate 20.

In a step 112, the cover substrate 20 is arranged in alignment on the structured surface region 10-1 of the mold substrate 10 in order to arrange the lens material portion 22 of the cover substrate in an aligned or predetermined position (= alignment) with the structured surface region 10-1 of the mold substrate 10. For example, the stiffening structure 28 can be arranged on the second main surface region 20-2 of the cover substrate 20 within one of the recesses 12 of the mold substrate 10, i.e. between the raised regions of the structured surface region 10-1 of the mold substrate 10.

In a step 114, the cover substrate 20 is then connected to the mold substrate 10, e.g. hermetically connected by means of anodic bonding (e.g. in a defined atmosphere) in order to form at least one closed cavity 30 between the cover substrate 20 and the mold substrate 10. In this case, the depression 12 arranged in the mold substrate 10 or the depressions 12 arranged in the mold substrate 10 then each form the at least one closed cavity 30 between the cover substrate 20 and the mold substrate 10. According to an embodiment of the flow chart 100-2 of the method 100, the (hermetic) bonding 114 of the cover substrate 20 to the mold substrate 10 is carried out in an atmosphere with a defined atmospheric ambient pressure in order to enclose a defined atmospheric pressure in the closed cavities 30. The lens structures 22 therefore face towards the mold substrate 10 or away from the mold substrate 10.

In step 120, the mold substrate 10 and the cover substrate 20, which are connected to one another, are provided, wherein the surface region 10-1 of the mold substrate 10 is structured, i.e. is formed with the depressions and/or channel structures 12. The cover substrate 20 further has at least one lens material section 22 on a first main surface region 20-1 thereof, wherein the cover substrate 20 with the lens material section 22 has a glass material, and wherein an associated stiffening structure 28 is arranged on the cover substrate 20.

In preparation for the actual manufacturing process, a glass wafer 20 (= cover substrate) prepared with lens structures 22 (lens material sections) is provided, which has one or a plurality of stiffening structures 28 on the back. The stiffening structure has a semiconductor material, such as silicon, or consists of the semiconductor material, e.g. silicon. The size and geometric arrangement of the stiffening structure(s) 28 allows the lens angle to be defined very precisely in relation to the distance h of the stop surface 40-1 of the stop element 40.

In preparation, the mold substrate 10, e.g. a silicon mold substrate, is also provided with one-sided cavities and channel structures 12 (= recesses or depressions). The glass wafer 20 is aligned with the mold substrate 10 and bonded, for example anodically, in a defined atmosphere in order to enclose a (defined) gas pressure in the cavities and channel structures 30. The lens structures 22 face the mold substrate 10 or away from the mold substrate 10.

In the (subsequent) step 130, the cover substrate 20 and the mold substrate 10 are now tempered, ie subjected to a temperature treatment subjected to or heated (warmed) in order to reduce the viscosity of the glass material of the cover substrate 20. Furthermore, in a step 140, an overpressure is provided in the (at least one) closed cavity or the closed cavities 30 compared to the surrounding atmosphere in order to bring about a defined bulging, e.g. blowing out or deformation, of the glass material of the cover substrate 20. The defined bulging of the glass material of the cover substrate 20 thus produces a shaped cover substrate 20' with (at least) one cover element 24 (= bulging or deformation).

Furthermore, a lens element 26 is formed or formed on the cover element 24 by the defined bulging of the cover substrate 20 from the lens material section 22 on the cover substrate 20. Due to the aligned or predetermined position of the lens material section 22 on the cover substrate 20 with respect to the position of the closed cavity 30, the lens element 26 is formed at a predetermined position and/or with a predetermined orientation on the cover element 24 of the cover substrate 20' by the bulging process 130, 140 of the cover substrate 20.

According to an embodiment of the flow chart 100-2 of the method 100, the step of tempering 130 and providing 140 an overpressure is carried out as a glass flow process in a vacuum furnace 50 in order to obtain a defined atmospheric overpressure in the closed cavity 30 compared to the surrounding atmosphere.

According to an embodiment of the flow chart 100-2 of the method 100, the cover substrate 20 is bulged or blown out in the step of tempering 130 and providing 140 an overpressure in the region of the closed cavity 30 up to a height h which is predetermined by the vertical distance of the stop surface 40-1 of the stop 40 to the first main surface region 20-1 of the cover substrate 20.

According to an embodiment of the flow chart 100-2 of the method 100, the region of the stop surface 40-1 of the stop element 40 opposite the cavity 30 or the cavity regions 30 is flat and parallel to the main surface region 20-1 of the cover substrate 20 in order to form a flat cover region 24-2 of the cover element 24 in the step of tempering 130 and providing 140 an overpressure.

The glass flow process 130, 140 can therefore be carried out in a pressure-controlled furnace 50. The glass wafer (cover substrate) 20 is blown out in the area of the cavities 30 up to the height h, which can be determined by a stop surface 40-1 of the stop element 40. The stop 40 and thus the stop surface 40-1 is designed to be flat, for example. After the glass flow process 130, 140, the cover substrate 20' is cooled, for example, and the cover substrate 20' is removed from the furnace 50.

According to an embodiment of the flow chart 100-2 of the method 100, the cover substrate 20 has, on a main surface region 20-1 of the cover substrate 20 facing away from the mold substrate 10, the lens material section formed as a lens structure 22 at a position which, in the step of tempering 130 and providing 140 an overpressure, corresponds to a lateral side wall region 24-1 of the cover element 24 of the molded cover substrate 20'.

According to an embodiment of the flow chart 100-2 of the method 100, in a step 142 of cooling the molded cover substrate 20' in a temperature range above 650°C, e.g. between 650°C and 955°C or between 650°C and 750°C, an atmospheric overpressure or also a negative pressure can be brought about in the closed cavities 30 compared to the surrounding atmosphere in order to produce a curvature of the side wall regions (side windows) 24-1 of the cover element 24 of the molded cover substrate 20' outwards (convex) or inwards (concave).

In a subsequent step 150, the stop element 40 and the mold substrate 10 are now removed from the molded cover substrate 20', whereby the molded cover substrate 20' now forms the lid substrate 20' with the at least one lid element 24. The lid substrate 20' can be used, for example, to house one or a plurality of optical or optoelectronic components.

According to an embodiment, the flowchart 100-2 of the method 100 may further comprise the step 142 of cooling the stop element 40, the mold substrate 10 and the molded cover substrate 20', wherein the mold substrate 10 is then subsequently removed in step 150 by means of an etching process, e.g. a silicon or semiconductor etching process of the silicon or semiconductor material of the mold substrate.

According to one embodiment, the method further comprises a step 152 of removing ens of the stiffening structure 28 after the step 130, 140 of annealing and providing an overpressure from the molded cover substrate 20'. The removal of the stiffening structure 28 can also be carried out by means of an etching process, eg together with the etching process of the mold substrate 10, eg by means of a silicon or semiconductor etching process of the silicon or semiconductor material.

Since the cover substrate 20 according to one embodiment comprises a single homogeneous material, e.g. a glass material, the molded cover substrate 20', i.e. the cover substrate or the glass cap, is also formed in one piece with the at least one cover element 24 and from a single homogeneous material, e.g. the glass material. In step 150, for example, a glass cover substrate 20' with convex lenses 26 in the side windows 24-1 of the glass caps 24 is thus obtained after the silicon of the mold substrate 10 and the stop element 50 have been removed on both sides. The lenses 26 can be formed circumferentially or segmented, whereby only one individual lens 26 can be formed.

In an (optional) subsequent step 160, the process flow 100-2 of the method 100 may further comprise applying or depositing a metallization 60 as a (continuous) frame structure or as a sealing frame on connection regions 62 on the second main surface region 20-2 at non-bulged regions (base regions) 24-3 of the cover elements 24 of the molded cover substrate (the cover substrate) 20'.

According to one embodiment, at step 160, an anti-reflective coating 64 may further be applied or deposited on an inside and/or outside region, e.g., inside and/or outside on the ceiling region 24-2 and/or sidewall region 24-1, of the lid member 24 of the molded cover substrate 20'.

In an (optional) subsequent step 170, the process flow 100-2 of the method 100 may further comprise singulating the formed cover substrate 20' to obtain singulated cover elements 24'.

In the following, some process steps of the process flow 100-2 of the method 100 of 3 summarized again. 3 thus shows a flow chart 100-2 which illustrates a further process sequence 100-2 for producing the cover substrate 20' using steps 110 to 170.

First, in step 110, a mold substrate 10 having a surface region 10-1 structured with depressions 12 is provided, wherein the mold substrate 10 comprises, for example, silicon or consists of silicon. This is followed by step 112 of arranging a cover substrate 20 pre-structured with lenses (lens material structures) 22 on the top side 20-1 and stiffening structures 28 on the bottom side 20-2 on the surface region 10-1 of the mold substrate 10 pre-structured with depressions 12, wherein the cover substrate 20 comprises (or consists of) a glass material and the stiffening structures silicon, and wherein the lenses 22 face away from the mold substrate 10 and the stiffening structures 28 face towards the mold substrate 10 (or in an inverted arrangement), and lenses and stiffening structures are arranged centered relative to one another or (deliberately) de-centered in a defined manner (in order to slant the resulting lens elements 26).

In the step 114 of connecting the cover substrate 20 to the mold substrate 10, the structured surface 10-1 of the mold substrate 10 is connected to the surface 20-2 of the cover substrate 20 in a gas-tight manner with a defined enclosed internal atmosphere in the recesses 12 to provide the interconnected substrates 10, 20 (step 120). In the step 130 of annealing the interconnected substrates 10, 20 in a vacuum furnace 50, the glass material of the cover substrate 20 is blown out with respect to the recesses 12 of the mold substrate 10 by the enclosed pressure in relation to the furnace pressure. The flow front stops at the stop surface 40-1 of the stop element 40 at the adjustable distance h in the vacuum furnace 50, wherein the stop element 40 with the stop surface 40-1 has a silicon wafer or consists of a silicon wafer. Finally, the connected substrates 10, 20 are cooled under a defined or reproducible temperature and pressure ramp and then removed from the furnace. In step 152, the stop surface 40-1 and the mold substrate 10 are removed from the molded cover substrate 20' in order to obtain the structured cover substrate 20' obtained from the cover substrate 20 by the blow-out process.

In this context, it should be noted that the rear stiffening of the cover substrate 20 with the stiffening element 28 tilts a plano-convex lens 26 into an angle (lens positioning). The lens 26 can, however, lose some of its roundness because glass flows away from the preformed lens (= lens structure material) when it is inflated. If the rear stiffening 28 is also arranged in a further plan area, a window area 26 is created with flat inner wall 26-1, which can also be metallized to form a deflecting mirror, for example. The technology of the stiffening elements 28 can be used to create hinge functions (during the blow-out process), which can, for example, influence the shape of the side walls of the cover element (= cap) during the blow-out process.

4 now shows a further exemplary basic flow chart 100-3 of the inventive manufacturing method 100 according to a further embodiment. In the following, essential differences or different method steps of the flow chart 100-3 of 4 compared to flow charts 100-1, 100-2 of 2 and 3 Therefore, the above description of the 1 - 3 accordingly to the following description of the embodiment of 4 applied, whereby the following description also describes differences, such as different (= alternative and/or additional) process steps and/or elements, to the previous process sequences and the resulting technical effects.

In step 110, first the mold substrate 10, e.g. a semiconductor or silicon wafer, is provided with the structured surface region 10-1, i.e. the mold substrate 10 is provided with at least one depression or recess 12. Furthermore, the cover substrate 20, e.g. a glass wafer, is provided. The cover substrate 20 further has at least one lens material section 22 on a first main surface region 20-1 thereof, wherein the cover substrate 20 with the lens material section 22 has a glass material.

According to one embodiment, the cover substrate 20 has a stiffening structure 28 which is arranged on the cover substrate 22 on an opposite side surface 20-2 of the cover substrate and (with respect to a vertical projection) opposite and, for example, centered (= centeredly aligned) to the lens material section 22 on the cover substrate 20. Furthermore, the cover substrate 20 has a further stiffening structure 29 which is arranged on the cover substrate 20 as a structured stiffening layer on or above the lens material section 22, i.e. covering the lens material section 22. The further stiffening structure 29 covers the lens material section 22 at least partially or completely. Thus, a double-sided stiffening structure is provided over the lens material portion 22 as well as on an opposite side surface 20-2 of the cover substrate to maintain the lens shape during the glass flow process (steps 130, 140).

According to a further (alternative) embodiment, the lens material section 22 (with the further stiffening structure 29) can also be arranged on the second main surface area 20-2 of the cover substrate 20 and the stiffening structure 28 on the first main surface area (side surface) 20-1 of the cover substrate and (with respect to a vertical projection) opposite and centered (= centered aligned) to the lens material section 22 on the cover substrate 20. The following process steps are accordingly applicable to this swapped arrangement of the lens material sections 22 and the stiffening structure(s) 28 on the cover substrate 20.

According to one embodiment, the cover substrate 20 further comprises further (e.g. two) opposing stiffening structures 28-1, 28-2, which are arranged locally on the cover substrate 20 on opposite side surfaces 20-1, 20-2 of the cover substrate 20 and (with respect to a vertical projection) opposite (and centered/aligned) to each other at a position. The further pair of opposing stiffening structures 28-1, 28-2 is now provided in order to obtain an inclined (angled), planar side wall region 24-1 of the cover element 24 of the molded cover substrate 20' in the (later) step of tempering 130 and providing 140 an overpressure.

Thus, on the surface regions 20-1, 20-2 of the cover substrate 20, the lens material sections (= lens structures) 22 as well as further regions are locally coated or covered with the stiffening structures 28, 28-1, 28-2, 29 (= structured stiffening layers).

In step 112, the cover substrate 20 is arranged in alignment on the structured surface region 10-1 of the mold substrate 10 in order to arrange the lens material section 22 of the cover substrate in an aligned or predetermined position (= alignment) with the structured surface region 10-1 of the mold substrate 10. For example, the stiffening structure 28 and the further stiffening structure 28-2 can be arranged on the second main surface region 20-2 of the cover substrate 20 within one of the recesses 12 of the mold substrate 10, i.e. between the raised regions of the structured surface region 10-1 of the mold substrate 10.

In a step 114, the cover substrate 20 is then connected to the mold substrate 10, e.g. hermetically connected by means of anodic bonding (e.g. in a defined atmosphere) in order to form at least one closed cavity 30 between the cover substrate 20 and the mold substrate 10. In this case, the depression 12 arranged in the mold substrate 10 or the depressions 12 arranged in the mold substrate 10 then each form the at least one closed cavity 30 between the cover substrate 20 and the mold substrate 10. According to an embodiment of the flow chart 100-3 of the method 100, the (hermetic) bonding 114 of the cover substrate 20 to the mold substrate 10 is carried out in an atmosphere with a defined atmospheric ambient pressure in order to enclose a defined atmospheric pressure in the closed cavities 30. The lens structures 22 therefore face towards the mold substrate 10 or away from the mold substrate 10.

In step 120, the mold substrate 10 and the cover substrate 20, which are connected to one another, are provided, wherein the surface region 10-1 of the mold substrate 10 is structured (formed with depressions or channel structures 12). The cover substrate 20 further has at least one lens material section 22 on a first main surface region 20-1 thereof, wherein the cover substrate 20 with the lens material section 22 has a glass material, and wherein associated stiffening structures 28, 29 and 28-1, 28-2 are arranged on the cover substrate 20.

In preparation for the actual manufacturing process, a glass wafer 20 (= cover substrate) prepared with lens structures 22 (lens material sections) is provided, which has one or a plurality of stiffening structures 28, 28-2 on the back (on the back 20-2) and the stiffening structures 28-1, 29 on the front (on the front 20-1). The stiffening structures have a semiconductor material, such as silicon, or consist of the semiconductor material, e.g. silicon. The size and geometric arrangement of the stiffening structure(s) 28, 28-1, 28-2 and 29 allow the lens angle to be defined very precisely in relation to the distance h of the stop surface 40-1 of the stop element 40. Furthermore, the double-sided, opposing arrangement of the stiffening structures 28, 29 over the lens material section 22 and on an opposite side surface 20-2 of the cover substrate allows the desired lens shape of the lens structure 22 to be obtained or maintained during the glass flow process (steps 130, 140).

In preparation, the mold substrate 10, e.g. a silicon mold substrate, is also provided with one-sided cavities and channel structures 12 (= recesses or depressions). The glass wafer 20 is aligned with the mold substrate 10 and bonded, for example anodically, in a defined atmosphere in order to enclose a (defined) gas pressure in the cavities and channel structures 30. The lens structures 22 face the mold substrate 10 or away from the mold substrate 10.

In the (subsequent) step 130, the cover substrate 20 and the mold substrate 10 are now tempered, i.e. subjected to a temperature treatment or heated (warmed) in order to reduce the viscosity of the glass material of the cover substrate 20. Furthermore, in a step 140, an overpressure is provided in the (at least one) closed cavity or the closed cavities 30 compared to the surrounding atmosphere in order to cause a defined bulging, e.g. blowing out or deformation, of the glass material of the cover substrate 20. The defined bulging of the glass material of the cover substrate 20 thus produces a molded cover substrate 20' with (at least) one cover element 24 (= bulging or deformation).

Furthermore, a lens element 26 is formed or formed on the cover element 24 by the defined bulging of the cover substrate 20 from the lens material section 22 on the cover substrate 20. Due to the aligned or predetermined position of the lens material section 22 on the cover substrate 20 with respect to the position of the closed cavity 30, the lens element 26 is formed at a predetermined position and/or with a predetermined orientation on the cover element 24 of the cover substrate 20' by the bulging process 130, 140 of the cover substrate 20.

Due to the aligned or predetermined position of the further pair of opposing stiffening structures 28-1, 28-2, the step of tempering 130 and providing 140 an overpressure now results in an inclined (angled), planar side wall region 24-1 of the cover element 24 of the formed cover substrate 20'. Due to the size and geometric arrangement of the further stiffening structures 28-, 28-2, both the inclination or the angle of incidence as well as the length of the inclined side wall region 24-1 of the cover element 24 (e.g. based on the distance h of the stop surface 40-1 of the stop element 40) can be defined very precisely. Furthermore, the double-sided, opposing arrangement of the stiffening structures 28, 29 above the lens material material portion 22 and on an opposite side surface 20-2 of the cover substrate, the desired lens shape of the lens structure 22 can be obtained in the glass flow process (steps 130,140).

According to an embodiment of the flow chart 100-3 of the method 100, the step of tempering 130 and providing 140 an overpressure is carried out as a glass flow process in a vacuum furnace 50 in order to obtain a defined atmospheric overpressure in the closed cavity 30 compared to the surrounding atmosphere. According to an embodiment of the flow chart 100-3 of the method 100, the cover substrate 20 is bulged or blown out in the step of tempering 130 and providing 140 an overpressure in the region of the closed cavity 30 up to a height h which is predetermined by the vertical distance of the stop surface 40-1 of the stop 40 to the first main surface region 20-1 of the cover substrate 20.

According to an embodiment of the flow chart 100-3 of the method 100, the region of the stop surface 40-1 of the stop element 40 opposite the cavity 30 or the cavity regions 30 is flat and parallel to the main surface region 20-1 of the cover substrate 20 in order to form a flat cover region 24-2 of the cover element 24 in the step of tempering 130 and providing 140 an overpressure.

The glass flow process 130, 140 can therefore be carried out in a pressure-controlled furnace 50. The glass wafer (cover substrate) 20 is blown out in the area of the cavities 30 up to the height h, which can be determined by a stop surface 40-1 of the stop element 40. The stop 40 and thus the stop surface 40-1 is designed to be flat, for example. After the glass flow process 130, 140, the cover substrate 20' is cooled, for example, and the cover substrate 20' is removed from the furnace 50.

According to an embodiment of the flow chart 100-3 of the method 100, the cover substrate 20 has, on a main surface region 20-1 of the cover substrate 20 facing away from the mold substrate 10, the lens material section formed as a lens structure 22 at a position which, in the step of tempering 130 and providing 140 an overpressure, corresponds to a lateral side wall region 24-1 of the cover element 24 of the molded cover substrate 20'.

According to an embodiment of the flow chart 100-3 of the method 100, in a step 142 of cooling the molded cover substrate 20' in a temperature range above 650°C, e.g. between 650°C and 955°C or between 650°C and 750°C, an atmospheric overpressure or alternatively an atmospheric underpressure can be brought about in the closed cavities 30 compared to the surrounding atmosphere in order to produce a curvature of the side wall regions (side windows) 24-1 of the cover element 24 of the molded cover substrate 20' outwards (convex) or alternatively inwards (concave).

In a subsequent step 150, the stop element 40 and the mold substrate 10 are now removed from the molded cover substrate 20', whereby the molded cover substrate 20' now forms the lid substrate 20' with the at least one lid element 24. The lid substrate 20' can be used, for example, to house one or a plurality of optical or optoelectronic components.

According to an embodiment, the flowchart 100-3 of the method 100 may further comprise the step 142 of cooling the stop element 40, the mold substrate 10 and the molded cover substrate 20', wherein the mold substrate 10 is then subsequently removed in step 150 by means of an etching process, e.g. a silicon or semiconductor etching process of the silicon or semiconductor material of the mold substrate.

According to one embodiment, the method further comprises a step 152 of removing the stiffening structures 28, 28-1, 28-2, 29 from the molded cover substrate 20' after the step 130, 140 of annealing and providing an overpressure. The removal of the stiffening structures 28, 28-1, 28-2 and 29 can also be carried out by means of an etching process, e.g. together with the etching process of the mold substrate 10, e.g. by means of a silicon or semiconductor etching process of the silicon or semiconductor material.

Since the cover substrate 20 according to an embodiment comprises a single homogeneous material, e.g. a glass material, the shaped cover substrate 20', ie the cover substrate or the glass cap, is also formed in one piece with the at least one cover element 24 and from a single homogeneous material, e.g. the glass material. In step 150, for example, a glass cover substrate 20' with convex lenses 26 in a side window 24-1 of the cover element (= the glass cap) 24 and an inclined side window 24-1 of the cover element 24 of the shaped cover substrate 20', e.g. on (lateral) opposite sides of the cover element 24, after the removal of the silicon from both sides of the mold substrate 10 and the stop element 50.

In an (optional) subsequent step 160, the process flow 100-3 of the method 100 may further comprise applying or depositing a metallization 60 as a (continuous) frame structure or as a sealing frame on connection regions 62 on non-bulged regions (base regions) 24-3 of the cover elements 24 (on the second main surface region 20-2) of the molded cover substrate (the cover substrate) 20'.

According to one embodiment, at step 160, an anti-reflective coating 64 may further be applied or deposited on an inside and/or outside region, e.g., inside and/or outside on the ceiling region 24-2 and/or sidewall region 24-1, of the lid member 24 of the molded cover substrate 20'.

According to an embodiment of the method, the cover substrate 20' can then optionally be designed such that a side wall 24-1 is formed with a lens element and the opposite, inclined side wall 24-1 is formed with an inner mirror coating 65, which acts, for example, as a deflecting mirror.

In an (optional) subsequent step 170, the process flow 100-3 of the method 100 may further comprise singulating the formed cover substrate 20' to obtain singulated cover elements 24'.

In the following, some process steps of process flow 100-3 of method 100 of 4 summarized again. 4 thus shows a flow chart 100-3 which illustrates a further process sequence 100-3 for producing the cover substrate 20' using steps 110 to 170.

First, in step 110, a mold substrate 10 having a surface region 10-1 structured with depressions 12 is provided, wherein the mold substrate 10 comprises, for example, silicon or consists of silicon. This is followed by step 112 of arranging a cover substrate 20 with a structured stiffening layer 28-1, 29 on the top side 20-1 preformed with lenses (lens material structures) 22 and structured stiffening structures 28, 28-2 on the bottom side 20-2 of the cover substrate 20 on the surface area 10-1 of the mold substrate 10 prestructured with depressions 12, wherein the cover substrate 20 comprises (or consists of) a glass material and the stiffening structures or stiffening layers 28, 28-1, 28-2, 29 comprise (or consist of) silicon and the covered lenses and flat surfaces face away from the mold substrate 10 or towards the mold substrate 10 and wherein stiffening layers or stiffening structures 28-1, 28-2 and 28, 29 (opposite each other in pairs).

In the step 114 of bonding the cover substrate 20 to the mold substrate 10, the structured surface 10-1 of the mold substrate 10 is bonded to the surface 20-2 of the cover substrate 20 in a gas-tight manner with a defined enclosed internal atmosphere in the recesses 12 to provide the bonded substrates 10, 20 (step 120). In the step 130 of annealing the bonded substrates 10, 20 in a vacuum furnace 50, the glass material of the cover substrate 20 is blown out with respect to the recesses 12 of the mold substrate 10 by the enclosed pressure in relation to the furnace pressure. The flow front stops at the stop surface 40-1 of the stop element 40 at the adjustable distance h in the vacuum furnace 50, wherein the stop element 40 with the stop surface 40-1 has a silicon wafer or consists of a silicon wafer. The adjustable distance h in the vacuum furnace is fixed and remains unchanged during the blowing and cooling process. Finally, the connected substrates 10, 20 are cooled under a defined or reproducible temperature and pressure ramp and then removed from the furnace. In step 152, the stop surface 40-1 and the mold substrate 10 are removed from the molded cover substrate 20' in order to obtain the structured cover substrate 20' obtained from the cover substrate 20 by the blowing process.

In this context, it should be noted that this mechanism allows several flat side walls 24-1 with a defined tilt angle to be produced in a cover element (= housing) 24 and can also be combined with lens elements 26. By covering the lens (the lens material structure) 22 on both sides with the opposing stiffening structures 28, 29, the original lens shape is better preserved and lenses with a higher refractive index and a shorter focus distance can be produced. The tilting mechanism against a stop 40 can also be used to set up the window surfaces 24-1 vertically, thereby achieving a very high reproducibility of the angle of attack. The covering of both sides with stiffening structures and stiffening layers 28-1, 28-2 leads to a flat-flat window surface 24-1 without significant Thickness variation over approximately 90% of the window surface protected in this way. The tilting mechanism also supports multiple lens arrangements, which can be arranged next to each other and, to a limited extent, on top of each other and tilted to a defined angle. This can be referred to as lens or mirror surface arrangement.

5 now shows a further exemplary basic flow chart 100-4 of the inventive manufacturing method 100 according to a further embodiment. In the following, essential differences or different method steps of the flow chart 100-4 of 5 compared to the flow charts 100-1 - 100-3 of 2 - 4 Therefore, the above description of the 1 - 4 accordingly to the following description of the embodiment of 5 applied, whereby the following description also describes differences, such as different (= alternative and/or additional) process steps and/or elements, to the previous process sequences and the resulting technical effects.

In step 110, first the mold substrate 10, e.g. a semiconductor or silicon wafer, is provided with the structured surface region 10-1, i.e. the mold substrate 10 is provided with at least one depression or recess 12. Furthermore, the cover substrate 20, e.g. a glass wafer, is provided. The cover substrate 20 further has at least one pre-structured lens material section 22 on a second main surface region 20-2 thereof, wherein the cover substrate 20 with the lens material section 22 has a glass material. The cover substrate 20 has a stiffening structure 29, which is arranged on the cover substrate 20 as a structured stiffening layer on or above the lens material section 22, i.e. covering the lens material section 22. The further stiffening structure 29 covers the lens material section 22 at least partially or completely.

According to one embodiment, the cover substrate 20 has a stiffening structure 28 arranged on the cover substrate 22 on an opposite side surface 20-1 of the cover substrate 20 and (with respect to a vertical projection) opposite and centered (= centered aligned) to the lens material portion 22 on the cover substrate 20. Thus, a double-sided stiffening structure is provided over the lens material portion 22 and on an opposite side surface 20-2 of the cover substrate for maintaining the lens shape during the glass flow process (steps 130, 140).

The stiffening structure 28 arranged opposite the lens structure 22 is now, for example, relatively thick in order to serve as a tilt stop during the glass flow process (steps 130, 140). The (particularly) thick stiffening structure 28 can prevent the lens structure 22 from tipping over during the glass flow process (steps 130, 140) and the installation angle of the lens elements 26, e.g. of lens elements 26 in the range of 90° relative to the mold substrate 10, can thus be produced in a particularly reproducible manner.

According to one embodiment, the cover substrate 20 further comprises a further stiffening structure 28-1 on a second main surface region 20-2 of the cover substrate 20. According to a further optional embodiment, further stiffening structures 28-1, 28-2 lying opposite one another in pairs can also be arranged locally on the cover substrate 20 on opposite side surfaces 20-1, 20-2 of the cover substrate 20 and (with respect to a vertical projection) opposite one another (and e.g. centered/aligned).

In a step 112, the cover substrate 20 is arranged in alignment on the structured surface region 10-1 of the mold substrate 10 in order to arrange the lens material section 22 of the cover substrate in an aligned or predetermined position (= alignment) with the structured surface region 10-1 of the mold substrate 10. For example, the lens structure 22 with the stiffening structure 29 and the further stiffening structure 28-1 can be arranged on the second main surface region 20-2 of the cover substrate 20 within one of the recesses 12 of the mold substrate 10, i.e. between the raised regions of the structured surface region 10-1 of the mold substrate 10.

In a step 114, the cover substrate 20 is then connected to the mold substrate 10, e.g. hermetically connected by means of anodic bonding (e.g. in a defined atmosphere) in order to form at least one closed cavity 30 between the cover substrate 20 and the mold substrate 10. In this case, the depression 12 arranged in the mold substrate 10 or the depressions 12 arranged in the mold substrate 10 then each form the at least one closed cavity 30 between the cover substrate 20 and the mold substrate 10. According to an embodiment of the flow chart 100-4 of the method 100, the (hermetic) connection 114 of the cover substrate 20 to the mold substrate 10 is carried out in an atmosphere with a defined atmospheric ambient pressure in order to enclose a defined atmospheric pressure in the closed cavities 30.

In step 120, the mold substrate 10 and the cover substrate 20, which are connected to one another, are provided, wherein the surface region 10-1 of the mold substrate 10 is structured (formed with depressions or channel structures 12). The cover substrate 20 further comprises (at least) one lens material section 22 on the second main surface region 20-2 thereof, wherein the cover substrate 20 with the lens material section 22 comprises a glass material, and wherein an associated stiffening structure 28 is arranged on the cover substrate 20.

In preparation for the actual manufacturing process, a glass wafer 20 (= cover substrate) prepared with pre-structured lenses (lens structures or lens material sections) 22 is provided, which has a plurality of stiffening structures 28, 28-1, 29, with thick silicon stiffening structures 28 on the wafer side opposite the pre-structured lenses 22. Furthermore, the lens structures and optionally other areas of the glass wafer (cover substrate) 20 can be locally coated with a stiffening layer on the top side of the glass wafer 20. The stiffening structures have a semiconductor material, such as silicon, or consist of the semiconductor material, e.g. silicon. The size and geometric arrangement of the stiffening structure 28 allows the lens angle (e.g. 90°) to be set very precisely. Furthermore, the double-sided, opposing arrangement of the stiffening structures 28, 29 over the lens material section 22 and on an opposite side surface 20-2 of the cover substrate allows the desired lens shape of the lens structure 22 to be obtained or maintained during the glass flow process (steps 130, 140).

In preparation, the mold substrate 10, e.g. a silicon mold substrate, is also provided with one-sided cavities and channel structures 12 (= recesses or depressions). The glass wafer 20 is aligned with the mold substrate 10 and bonded, for example anodically, in a defined atmosphere in order to enclose a (defined) gas pressure in the cavities and channel structures 30. The lens structures 22 face the mold substrate 10 or away from the mold substrate 10.

In the (subsequent) step 130, the cover substrate 20 and the mold substrate 10 are now tempered, i.e. subjected to a temperature treatment or heated (warmed) in order to reduce the viscosity of the glass material of the cover substrate 20. Furthermore, in a step 140, an overpressure is provided in the (at least one) closed cavity or the closed cavities 30 compared to the surrounding atmosphere in order to cause a defined bulging, e.g. blowing out or deformation, of the glass material of the cover substrate 20. The defined bulging of the glass material of the cover substrate 20 thus produces a molded cover substrate 20' with (at least) one cover element 24 (= bulging or deformation).

Furthermore, a lens element 26 is formed or formed on the cover element 24 by the defined bulging of the cover substrate 20 from the lens material section 22 on the cover substrate 20. Due to the aligned or predetermined position of the lens material section 22 on the cover substrate 20 with respect to the position of the closed cavity 30, the lens element 26 is formed at a predetermined position and/or with a predetermined orientation on the cover element 24 of the cover substrate 20' by the bulging process 130, 140 of the cover substrate 20.

Due to the aligned or predetermined position and the relatively large thickness of the stiffening structure 28, which is opposite the lens structure 22 and the stiffening structure 29 arranged thereon on the cover substrate 20, the step of tempering 130 and providing 140 of an overpressure now causes the thick stiffening structure 28 to serve as a tilt stop during the glass flow process. The (particularly) thick stiffening structure 28 can prevent the lens structure 22 from tipping over during the glass flow process (steps 130, 140) and the setting angle of the lenses or lens elements 26 can thus be produced in a particularly reproducible manner in a range of 90° relative to the mold substrate 10. The setting angle of the lens element 26 is thus determined in terms of process technology by placing the lateral edge of the thick stiffening structures 28 on. According to one embodiment, the tempering step 130 can be carried out in a temperature range above 650°C, e.g. between 650°C and 955°C or between 650°C and 750°C. Furthermore, the double-sided, opposing arrangement of the stiffening structures 28, 29 above the lens material section 22 and on an opposite side surface 20-2 of the cover substrate can achieve the desired lens shape of the lens structure 22 in the glass flow process (steps 130, 140).

According to an embodiment of the flow chart 100-4 of the method 100, the step of tempering 130 and providing 140 an overpressure is carried out as a glass flow process in a vacuum furnace 50 in order to obtain a defined atmospheric overpressure in the closed cavity 30 compared to the surrounding atmosphere.

According to an embodiment of the flow chart 100-4 of the method 100, the cover substrate 20 is bulged or blown out in the step of tempering 130 and providing 140 an overpressure in the region of the closed cavity 30 up to a height h which is predetermined by the vertical distance of the stop surface 40-1 of the stop 40 to the first main surface region 20-1 of the cover substrate 20.

According to an embodiment of the flow chart 100-4 of the method 100, the region of the stop surface 40-1 of the stop element 40 opposite the cavity 30 or the cavity regions 30 is flat and parallel to the main surface region 20-1 of the cover substrate 20 in order to form a flat cover region 24-2 of the cover element 24 in the step of tempering 130 and providing 140 an overpressure.

The glass flow process 130, 140 can therefore be carried out in a pressure-controlled furnace 50. The glass wafer (cover substrate) 20 is blown out in the area of the cavities 30 up to the height h, which can be determined by a stop surface 40-1 of the stop element 40. The stop 40 and thus the stop surface 40-1 is designed to be flat, for example. After the glass flow process 130, 140, the cover substrate 20' is cooled, for example, and the cover substrate 20' is removed from the furnace 50.

According to an embodiment of the flow chart 100-4 of the method 100, the cover substrate 20 has, on a main surface region 20-1 of the cover substrate 20 facing away from the mold substrate 10, the lens material section formed as a lens structure 22 at a position which, in the step of tempering 130 and providing 140 an overpressure, corresponds to a lateral side wall region 24-1 of the cover element 24 of the molded cover substrate 20'.

According to an embodiment of the flow chart 100-4 of the method 100, in a step 142 of cooling the molded cover substrate 20' in a temperature range above 650°C, e.g. between 650°C and 955°C or between 650°C and 750°C, an atmospheric overpressure or alternatively an atmospheric underpressure can be brought about in the closed cavities 30 compared to the surrounding atmosphere in order to produce a curvature of the side wall regions (side windows) 24-1 of the cover element 24 of the molded cover substrate 20' outwards (convex) or alternatively inwards (concave).

According to an embodiment, the flowchart 100-4 of the method 100 may further comprise the step 142 of cooling the stop element 40, the mold substrate 10 and the molded cover substrate 20', wherein the mold substrate 10 is then subsequently removed in step 150 by means of an etching process, e.g. a silicon or semiconductor etching process of the silicon or semiconductor material of the mold substrate.

In a subsequent step 150, the stop element 40 and the mold substrate 10 are now removed from the molded cover substrate 20', whereby the molded cover substrate 20' now forms the lid substrate 20' with the at least one lid element 24. The lid substrate 20' can be used, for example, to house one or a plurality of optical or optoelectronic components.

According to one embodiment, the method further comprises a step 152 of removing the stiffening structures 28, 28-1, 29 from the molded cover substrate 20' after the step 130, 140 of annealing and providing an overpressure. The removal of the stiffening structures 28, 28-1 and 29 can also be carried out by means of an etching process, e.g. together with the etching process of the mold substrate 10, e.g. by means of a silicon or semiconductor etching process of the silicon or semiconductor material.

Since the cover substrate 20 according to one embodiment comprises a single homogeneous material, e.g. a glass material, the molded cover substrate 20', i.e. the cover substrate or the glass cap, is also formed in one piece with the at least one cover element 24 and from a single homogeneous material, e.g. the glass material. In step 150, for example, a glass cover substrate 20' with convex lenses 26 in a side window 24-1 of the cover element (= the glass cap) 24 and an inclined side window 24-1 of the cover element 24 of the molded cover substrate 20', e.g. on (laterally) opposite sides of the cover element 24, are thus obtained after the silicon of the mold substrate 10 and the stop element 50 have been removed from both sides. Thus, for example, a glass cover substrate 20' with at least one convex lens 26 in at least one first side window 24-1 and one angled planar surface 24-1, for example on the opposite side to the first side window 24-1 after the removal of the silicon on both sides.

In an (optional) subsequent step 160, the process flow 100-4 of the method 100 may further comprise applying or depositing a metallization 60 as a (continuous) frame structure or as a sealing frame on connection regions 62 on non-bulged regions (base regions) 24-3 of the cover elements 24 of the molded cover substrate (the cover substrate) 20'.

According to one embodiment, at step 160, an anti-reflective coating 64 may further be applied or deposited on an inside and/or outside region, e.g., inside and/or outside on the ceiling region 24-2 and/or sidewall region 24-1, of the lid member 24 of the molded cover substrate 20'.

According to an embodiment of the method, the cover substrate 20' can then optionally be designed such that a side wall 24-1 is designed with a lens element 26 and the opposite, inclined side wall 24-1 is designed with an inner mirror coating 65, which acts, for example, as a deflecting mirror.

In an (optional) subsequent step 170, the process sequence 100-4 of the method 100 may further comprise a singulation, e.g. by sawing or laser separation, of the shaped cover substrate 20' in order to obtain individual cover elements (caps) 24' with which, for example, optical structures at the individual substrate level or at the wafer level can be hermetically sealed by individual capping.

6 now shows a further exemplary basic flow chart 100-5 of the inventive manufacturing method 100 according to a further embodiment. In the following, essential differences or different method steps of the flow chart 100-5 of 6 compared to flow charts 100-1 - 100-4 of 2 - 5 Therefore, the above description of the 1 - 5 accordingly to the following description of the embodiment of 6 applied, whereby the following description also describes differences, such as different (= alternative and/or additional) process steps and/or elements, to the previous process sequences and the resulting technical effects.

In step 110, first the mold substrate 10, e.g. a semiconductor or silicon wafer, is provided with the structured surface region 10-1, i.e. the mold substrate 10 is provided with at least one depression or recess 12. Furthermore, the cover substrate 20, e.g. a glass wafer, is provided. The cover substrate 20 further has at least one lens material section 22 on the second main surface region (on the second side surface) 20-2 thereof, wherein the cover substrate 20 with the lens material section 22 has a glass material.

According to one embodiment, the cover substrate 20 has a stiffening structure 28, which is arranged on the cover substrate 22 on an opposite (first) side surface 20-1 of the cover substrate and (with respect to a vertical projection) opposite and centered (= centered aligned) to the lens material section 22 on the cover substrate 20. Furthermore, the cover substrate 20 has a further stiffening structure 29, which is arranged on the cover substrate 20 as a structured stiffening layer on or above the lens material section 22, i.e. covering the lens material section 22. The further stiffening structure 29 covers the lens material section 22 at least partially or completely. Thus, a double-sided stiffening structure 28, 29 is provided over the lens material portion 22 and on an opposite side surface 20-1 of the cover substrate 20 to maintain the lens shape during the glass flow process (steps 130, 140).

According to a further (alternative) embodiment, the lens material section 22 (with the further stiffening structure 29) can also be arranged on the first main surface area 20-1 of the cover substrate 20 and the stiffening structure 28 on the second main surface area (side surface) 20-2 of the cover substrate and (with respect to a vertical projection) opposite and centered (= centered alignment) to the lens material section 22 on the cover substrate 20. The following process steps are accordingly applicable to this swapped arrangement of the lens material sections 22 and the stiffening structure(s) 28, 29 on the cover substrate 20.

According to one embodiment, the cover substrate 20 can further comprise further stiffening structures, which can be arranged locally on the cover substrate 20 on the side surfaces 20-1, 20-2 of the cover substrate 20. The optional further stiffening structures can be arranged individually or in pairs opposite each other (and centered / aligned) on the cover substrate 20. The further stiffening structures can now be provided in order to obtain an inclined (angled) or vertical, planar side wall region 24-1 of the cover element 24 of the formed cover substrate 20' in the (later) tempering step 130.

Thus, on the surface regions 20-1, 20-2 of the cover substrate 20, the lens material sections (= lens structures) 22 as well as further regions are locally coated or covered with the stiffening structures 28, 29 (= structured stiffening layers).

In a step 112, the cover substrate 20 is arranged in alignment on the structured surface region 10-1 of the mold substrate 10 in order to arrange the lens material section 22 of the cover substrate in an aligned or predetermined position (= alignment) with the structured surface region 10-1 of the mold substrate 10. For example, the lens material section 22 with the stiffening structure 29 can be arranged on the second main surface region 20-2 of the cover substrate 20 within one of the recesses 12 of the mold substrate 10, i.e. between the raised regions of the structured surface region 10-1 of the mold substrate 10.

In a step 114, the cover substrate 20 is then connected to the mold substrate 10, e.g. hermetically connected by means of anodic bonding (e.g. in a defined atmosphere) in order to form at least one closed cavity 30 between the cover substrate 20 and the mold substrate 10. The anodic bonding is carried out, for example, in such a way that the current flow during the bonding process is (if possible) not conducted via the raised (elevated) stiffening structures 28, 29 (e.g. silicon stiffening structures 28, 29).

In this case, the depression 12 arranged in the mold substrate 10 or the depressions 12 arranged in the mold substrate 10 then each form the at least one closed cavity 30 between the cover substrate 20 and the mold substrate 10. According to an embodiment of the flow chart 100-5 of the method 100, the (hermetic) connection 114 of the cover substrate 20 to the mold substrate 10 is carried out in an atmosphere with a defined atmospheric ambient pressure in order to enclose a defined atmospheric pressure in the closed cavities 30. The lens structures 22 therefore face the mold substrate 10.

In preparation for the actual manufacturing process, a glass wafer 20 (= cover substrate) prepared with lens structures 22 (lens material sections) is provided, which has one or a plurality of stiffening structures 28 on the front side (on the front side 20-1) and the stiffening structure 29 on the back side (on the back side 20-2) above the lens structure 22 (lens material section). The stiffening structures have a semiconductor material, such as silicon, or consist of the semiconductor material, e.g. silicon.

In preparation, the mold substrate 10, e.g. a silicon mold substrate, is also provided with one-sided cavities and channel structures 12 (= recesses or depressions). The glass wafer 20 is aligned with the mold substrate 10 and bonded, for example anodically, in a defined atmosphere in order to enclose a (defined) gas pressure in the cavities and channel structures 30. The lens structures 22 face the mold substrate 10.

Thus, in step 120, the mold substrate 10 and the cover substrate 20 bonded together are provided, wherein the surface region 10-1 of the mold substrate 10 is structured (formed with recesses or channel structures 12).

In the (subsequent) step 130, the cover substrate 20 and the mold substrate 10 are now tempered, i.e. subjected to a temperature treatment or heated (warmed) in order to reduce the viscosity of the glass material of the cover substrate 20. Furthermore, in a step 140, an overpressure is provided in the (at least one) closed cavity or the closed cavities 30 compared to the surrounding atmosphere in order to cause a defined bulging, e.g. blowing out or deformation, of the glass material of the cover substrate 20. The defined bulging of the glass material of the cover substrate 20 thus produces a molded cover substrate 20' with (at least) one cover element 24 (= bulging or deformation).

Furthermore, a lens element 26 is formed or formed on the cover element 24 by the defined bulging of the cover substrate 20 from the lens material section 22 on the cover substrate 20. Due to the aligned or predetermined position of the lens material section 22 on the cover substrate 20 with respect to the position of the closed cavity 30, the lens element 26 is formed at a predetermined position and/or with a predetermined orientation on the cover element 24 of the cover substrate 20' by the bulging process 130, 140 of the cover substrate 20.

Due to the aligned or predetermined position of the opposing stiffening structures 28, 29, the step of tempering 130 and providing 140 an overpressure now causes a lateral inner lens 26 to be formed on the cover element 24. Furthermore, the double-sided, opposing arrangement of the stiffening structures 28, 29 over the lens material section 22 and on an opposite side surface 20-2 of the cover substrate can achieve the desired lens shape of the lens structure 22 in the glass flow process (steps 130, 140).

According to an embodiment of the flow chart 100-5 of the method 100, the step of tempering 130 and providing 140 an overpressure is carried out as a glass flow process in a vacuum furnace 50 in order to obtain a defined atmospheric overpressure in the closed cavity 30 compared to the surrounding atmosphere. According to an embodiment of the flow chart 100-5 of the method 100, the cover substrate 20 is bulged or blown out in the step of tempering 130 and providing 140 an overpressure in the region of the closed cavity 30 up to a height h that is predetermined by the vertical distance of the stop surface 40-1 of the stop 40 to the first main surface region 20-1 of the cover substrate 20.

According to an embodiment of the flow chart 100-5 of the method 100, the region of the stop surface 40-1 of the stop element 40 opposite the cavity 30 or the cavity regions 30 is flat and parallel to the main surface region 20-1 of the cover substrate 20 in order to form a flat cover region 24-2 of the cover element 24 in the step of tempering 130 and providing 140 an overpressure.

The glass flow process 130, 140 can therefore be carried out in a pressure-controlled furnace 50. The glass wafer (cover substrate) 20 is blown out in the area of the cavities 30 up to the height h, which can be determined by a stop surface 40-1 of the stop element 40. The angle of attack (with respect to the reference plane) of the lenses 26 can thus be controlled and adjusted. The stop 40 and thus the stop surface 40-1 is designed to be flat, for example. After the glass flow process 130, 140, the cover substrate 20' is cooled, for example, and the cover substrate 20' is removed from the furnace 50.

According to an embodiment of the flow chart 100-5 of the method 100, the cover substrate 20 has, on a main surface region 20-1 of the cover substrate 20 facing away from the mold substrate 10, the lens material section formed as a lens structure 22 at a position which, in the step of tempering 130 and providing 140 an overpressure, corresponds to a lateral side wall region 24-1 of the cover element 24 of the molded cover substrate 20'.

According to an embodiment of the flow chart 100-5 of the method 100, in a step 142 of cooling the molded cover substrate 20' in a temperature range above 650°C, e.g. between 650°C and 955°C or between 650°C and 750°C, an atmospheric overpressure or alternatively an atmospheric underpressure can be brought about in the closed cavities 30 compared to the surrounding atmosphere in order to produce a curvature of the side wall regions (side windows) 24-1 of the cover element 24 of the molded cover substrate 20' outwards (convex) or alternatively inwards (concave).

In a subsequent step 150, the stop element 40 and the mold substrate 10 are now removed from the molded cover substrate 20', whereby the molded cover substrate 20' now forms the lid substrate 20' with the at least one lid element 24. The lid substrate 20' can be used, for example, to house one or a plurality of optical or optoelectronic components.

According to an embodiment, the flowchart 100-5 of the method 100 may further comprise the step 142 of cooling the stop element 40, the mold substrate 10 and the molded cover substrate 20', wherein the mold substrate 10 is then subsequently removed in the step 150 by means of an etching process, e.g. a silicon or semiconductor etching process of the silicon or semiconductor material of the mold substrate.

According to one embodiment, the method further comprises a step 152 of removing the stiffening structures 28, 29 from the molded cover substrate 20' after the step 130, 140 of annealing and providing an overpressure. The removal of the stiffening structures 28, 29 can also be carried out by means of an etching process, e.g. together with the etching process of the mold substrate 10, e.g. by means of a silicon or semiconductor etching process of the silicon or semiconductor material.

Since the cover substrate 20 according to an embodiment comprises a single homogeneous material, e.g. a glass material, the formed cover substrate 20', ie the Cover substrate or the glass cap, with the at least one cover element 24, is formed in one piece (in one piece) and from a single homogeneous material, e.g. the glass material. In step 150, a glass cover substrate 20' with one or more convex lenses 26 in the side window 24-1 of the cover element (= the glass cap) 24 and an inclined or vertical side window 24-1 of the cover element 24 of the molded cover substrate 20', e.g. on (laterally) opposite sides of the cover element 24, is thus obtained after the removal of the silicon of the mold substrate 10 and the stop element 50 on both sides.

In an (optional) subsequent step 160, the process flow 100-5 of the method 100 may further comprise applying or depositing a metallization 60 as a (continuous) frame structure or as a sealing frame on connection regions 62 on non-bulged regions (base regions) 24-3 of the cover elements 24 (on the second main surface region 20-2) of the molded cover substrate (the cover substrate) 20'.

According to one embodiment, at step 160, an anti-reflective coating 64 may further be applied or deposited on an inside and/or outside region, e.g., inside and/or outside on the ceiling region 24-2 and/or sidewall region 24-1, of the lid member 24 of the molded cover substrate 20'.

According to an embodiment of the method, the cover substrate 20' can then optionally be designed such that a side wall 24-1 is formed with a lens element and the opposite, inclined side wall 24-1 is formed with an inner mirror coating 65, which acts, for example, as a deflecting mirror.

In an (optional) subsequent step 170, the process sequence 100-5 of the method 100 may further comprise a singulation, e.g. by sawing or laser separation, of the shaped cover substrate 20' in order to obtain individual cover elements (caps) 24' with which, for example, optical structures at the individual substrate level or at the wafer level can be hermetically sealed by individual capping.

In the following, some process steps of process flow 100-5 of method 100 of 6 summarized again. 6 thus shows a flow chart 100-5 which illustrates a further process sequence 100-5 for producing the cover substrate 20' using steps 110 to 170.

First, in step 110, a mold substrate 10 is provided with a surface region 10-1 structured with depressions 12, wherein the mold substrate 10 comprises, for example, silicon or consists of silicon. This is followed by step 112 of arranging a cover substrate 20 with a structured stiffening layer 29 on the underside 20-2 preformed with lenses (lens material structures) 22 and structured stiffening structures 28 on the top side 20-1 of the cover substrate 20 on the surface region 10-1 of the mold substrate 10 prestructured with depressions 12, wherein the cover substrate 20 comprises (or consists of) a glass material and the stiffening structures or stiffening layers 28, 29 comprise (or consist of) silicon. The covered lenses 22, 29 face toward the mold substrate 10, with the stiffening structure(s) 28 facing away from the mold substrate 10, and with stiffening layers or stiffening structures 28, 29 aligned with each other (e.g., opposite each other in pairs).

In the step 114 of bonding the cover substrate 20 to the mold substrate 10, the structured surface 10-1 of the mold substrate 10 is bonded to the surface 20-2 of the cover substrate 20 in a gas-tight manner with a defined enclosed internal atmosphere in the recesses 12 to provide the bonded substrates 10, 20 (step 120). In the step 130 of annealing the bonded substrates 10, 20 in a vacuum furnace 50, the glass material of the cover substrate 20 is blown out with respect to the recesses 12 of the mold substrate 10 by the enclosed pressure in relation to the furnace pressure. The flow front stops at the stop surface 40-1 of the stop element 40 at the adjustable distance h in the vacuum furnace 50, wherein the stop element 40 with the stop surface 40-1 has a silicon wafer or consists of a silicon wafer. The adjustable distance h in the vacuum furnace is fixed and remains unchanged during the blowing and cooling process. Finally, the connected substrates 10, 20 are cooled under a defined or reproducible temperature and pressure ramp and then removed from the furnace. In step 152, the stop surface 40-1 and the mold substrate 10 are removed from the molded cover substrate 20' in order to obtain the structured cover substrate 20' obtained from the cover substrate 20 by the blowing process.

In the above 3-6 The use of stiffening structures for the manufacturing process was described, whereby the structure and function of “thin” stiffening structures in 3 , 4 , 5 , 6 and of “thick” stiffening structures in 5 were presented.

The 3 to 6 thin stiffening structures shown (in 3 thin stiffening structures 28, in 4 thin stiffening structures 28, 28-1, 28-2, in 5 thin stiffening structures 28-1, and in 6 Thin stiffening structures 28) are designed, for example, as thin plates which, for example, comprise or consist of a silicon material such as Si, SiGe, ..., which, for example, have a thickness in a range from 150 µm to 400 µm or in a range from 200 µm to 300 µm. Furthermore, the thin stiffening structures can have a lateral dimension (e.g. length and/or width) in a range of a few millimeters, e.g. in a range from 1 mm to 5 mm or from 2 mm to 4 mm.

The thick stiffening structure 28 of 5 may have a thickness in a range of 250 µm to 1000 µm or from about 400 µm to 725 µm. Regarding the lateral dimensions (length and/or width) of the thick stiffening structure 28 of 5 a horizontal width of the stiffening structure can be in a range from a few mm to about 12 mm (eg from 2 to 12 mm) and a standing length (after the bulging process or blowing out) of the stiffening structure can be in a range from 1 µm to 5 mm. This means that the width of the stiffening element 28 of 5 (in the representation of step 130/140) extends vertically to the drawing plane (parallel to the y-direction), while the length of the stiffening structure 28 extends in the drawing plane (parallel to the z-axis).

7 now shows a further exemplary basic flow chart 100-6 of the inventive manufacturing method 100 according to a further embodiment. In the following, essential differences or different method steps of the flow chart 100-6 of 7 compared to the flow charts 100-1 - 100-6 of 2 - 6 Therefore, the above description of the 1 - 6 accordingly to the following description of the embodiment of 7 applied, whereby the following description also describes differences, such as different (= alternative and/or additional) process steps and/or elements, to the previous process sequences and the resulting technical effects.

In step 110, first the mold substrate 10, e.g. a semiconductor or silicon wafer, is provided with the structured surface region 10-1, i.e. the mold substrate 10 is provided with at least one depression or recess 12. Furthermore, the cover substrate 20, e.g. a glass wafer, is provided. The cover substrate 20 further has at least one lens material section 22 on the first main surface region (on the first side surface or front side) 20-1 thereof, wherein the cover substrate 20 with the lens material section 22 has a glass material. The cover substrate 20 is thus designed, for example, as a glass wafer 20 structured on one side (on the top side 20-1) (produced by glass etching processes or glass flow technology), i.e. the lens material sections 22 can be produced by glass etching processes or glass flow technology in preparation for the further production process.

According to one embodiment, the cover substrate 20 can optionally have stiffening structures that can be arranged locally on the cover substrate 20 on the side surfaces 20-1 and/or 20-2 of the cover substrate 20. The optional additional stiffening structures can be arranged, for example, individually or in pairs opposite one another (and centered/aligned) to one another on the cover substrate 20. The additional stiffening structures can now be provided in order to obtain an inclined (angled) or vertical, planar side wall region 24-1 of the cover element 24 of the molded cover substrate 20' in the (later) tempering step 130.

In a step 112, the cover substrate 20 is arranged in alignment on the structured surface area 10-1 of the mold substrate 10 in order to arrange the lens material section 22 of the cover substrate in an aligned or predetermined position (= alignment) with the structured surface area 10-1 of the mold substrate 10. For example, the lens material section 22 can be arranged on the first main surface area 20-1 of the cover substrate 20 (e.g. centered) opposite one of the recesses 12 of the mold substrate 10.

In a step 114, the cover substrate 20 is then connected to the mold substrate 10, e.g. hermetically connected by means of anodic bonding (e.g. in a defined atmosphere) in order to form at least one closed cavity 30 between the cover substrate 20 and the mold substrate 10. The (hermetic) connection 114 of the cover substrate 20 to the mold substrate 10 can be carried out in an atmosphere with a defined atmospheric ambient pressure in order to enclose a defined atmospheric pressure in the closed cavities 30. The cover substrate 20 and/or the mold substrate 10 are designed to form the closed cavity 30 with one or more a plurality of closed cavity regions 30 between the cover substrate 20 and the mold substrate 10, wherein the closed cavity regions 30 are arranged fluidically separated from one another, or wherein gas exchange channels 30-1 can also be provided between the cavity regions 30 closed from the ambient atmosphere in order to fluidically connect them to one another in order to obtain a common defined atmospheric pressure in the connected cavity regions 30. The lens structures 22 face away from the mold substrate 10.

Thus, in step 120, the mold substrate 10 and the cover substrate 20 bonded together are provided, wherein the surface region 10-1 of the mold substrate 10 is structured (formed with recesses or channel structures 12).

In the (subsequent) step 130, the cover substrate 20 and the mold substrate 10 are now tempered, i.e. subjected to a temperature treatment or heated (warmed) in order to reduce the viscosity of the glass material of the cover substrate 20. Furthermore, in a step 140, an overpressure is provided in the (at least one) closed cavity or the closed cavities 30 compared to the surrounding atmosphere in order to cause a defined bulging, e.g. blowing out or deformation, of the glass material of the cover substrate 20. The defined bulging of the glass material of the cover substrate 20 thus produces a molded cover substrate 20' with (at least) one cover element 24 (= bulging or deformation).

Furthermore, a lens element 26 is formed or formed on the cover element 24 by the defined bulging of the cover substrate 20 from the lens material section 22 on the cover substrate 20. Due to the aligned or predetermined position of the lens material section 22 on the cover substrate 20 with respect to the position of the closed cavity 30, the lens element 26 is formed at a predetermined position and/or with a predetermined orientation on the cover element 24 of the cover substrate 20' by the bulging process 130, 140 of the cover substrate 20.

According to an embodiment of the flow chart 100-6 of the method 100, the step of tempering 130 and providing 140 an overpressure is carried out as a glass flow process in a vacuum furnace 50 in order to obtain a defined atmospheric overpressure in the closed cavity 30 compared to the surrounding atmosphere. According to an embodiment of the flow chart 100-6 of the method 100, the cover substrate 20 is bulged or blown out in the step of tempering 130 and providing 140 an overpressure in the region of the closed cavity 30 up to a height h that is predetermined by the vertical distance of the stop surface 40-1 of the stop 40 to the first main surface region 20-1 of the cover substrate 20.

According to an embodiment of the flow chart 100-6 of the method 100, the region of the stop surface 40-1 of the stop element 40 opposite the cavity 30 or the cavity regions 30 is flat and parallel to the main surface region 20-1 of the cover substrate 20 in order to form a flat cover region 24-2 of the cover element 24 in the step of tempering 130 and providing 140 an overpressure. The glass flow process 130, 140 can therefore be carried out in a pressure-controlled furnace (e.g. in a vacuum furnace) 50. The glass wafer (cover substrate) 20 is blown out in the region of the cavities 30 up to the height h, which can be determined by a stop surface 40-1 of the stop element 40.

According to one embodiment, the cover substrate 20 thus has the lens material section 22 at a position on a main surface region 20-1 of the cover substrate 20 facing away from the mold substrate 10 in order to form the (e.g. inwardly curved) lens structure 26 in the step 130, 140 of tempering and providing an overpressure on an inner ceiling wall region 24-2 of the cover element 24. The manufacturing method 100 according to the flow chart 100-6 thus represents, in the glass flow process of steps 130, 140), a lens inversion from the top side 20-1 of the cover substrate 20 to the bottom side 20-2 of the structured cover substrate 20'. The resulting convex lens elements 26 can be manufactured in the cover element 24 with a refractive power that is somewhat lower than in the previous embodiments, since a certain lens flattening can or will occur without stiffening elements.

According to an embodiment of the flow chart 100-6 of the method 100, in a step 142 of cooling the molded cover substrate 20' in a temperature range above 650°C, eg between 650°C and 955°C or between 650°C and 750°C, an atmospheric overpressure or alternatively an atmospheric underpressure can be brought about in the closed cavities 30 compared to the surrounding atmosphere in order to prevent a curvature of the side wall regions (side window) 24-1 of the cover element 24 of the molded cover substrate 20' outwardly (convex) or alternatively inwardly (concave).

In a subsequent step 150, the stop element 40 and the mold substrate 10 are now removed from the molded cover substrate 20', whereby the molded cover substrate 20' now forms the lid substrate 20' with the at least one lid element 24. The lid substrate 20' can be used, for example, to house one or a plurality of optical or optoelectronic components.

According to an embodiment, the flowchart 100-6 of the method 100 may further comprise the step 142 of cooling the stop element 40, the mold substrate 10 and the molded cover substrate 20', wherein the mold substrate 10 is then subsequently removed in the step 150 by means of an etching process, e.g. a silicon or semiconductor etching process of the silicon or semiconductor material of the mold substrate.

Since the cover substrate 20 according to one embodiment comprises a single homogeneous material, e.g. a glass material, the molded cover substrate 20', i.e. the cover substrate or the glass cap, is also formed in one piece with the at least one cover element 24 and from a single homogeneous material, e.g. the glass material. In step 150, for example, a glass cover substrate 20' with one or more convex lenses 26, which are aligned in the direction of the cavity 30, is thus obtained on the ceiling region 24-2 of the respective cover elements (= the glass caps) 24 after the silicon of the mold substrate 10 and the stop element 50 have been removed from both sides.

In an (optional) subsequent step 160, the process flow 100-6 of the method 100 may further comprise applying or depositing a metallization 60 as a (continuous) frame structure or as a sealing frame on connection regions 62 on non-bulged regions (base regions) 24-3 of the cover elements 24 (on the second main surface region 20-2) of the molded cover substrate (the cover substrate) 20'.

According to one embodiment, at step 160, an anti-reflective coating 64 may further be applied or deposited on an inside and/or outside region, e.g., inside and/or outside on the ceiling region 24-2 and/or sidewall region 24-1, of the lid member 24 of the molded cover substrate 20'.

According to an embodiment of the method, the cover substrate 20' can then optionally be designed such that a side wall 24-1 is formed with a lens element and the opposite, inclined side wall 24-1 is formed with an inner mirror coating 65, which acts, for example, as a deflecting mirror.

In an (optional) subsequent step 170, the process sequence 100-6 of the method 100 may further comprise a singulation, e.g. by sawing or laser separation, of the shaped cover substrate 20' in order to obtain individual cover elements (caps) 24' with which, for example, optical structures at the individual substrate level or at the wafer level can be hermetically sealed by individual capping.

In the following, some process steps of process flow 100-6 of method 100 of 7 summarized again. 7 thus shows a flow chart 100-6 which illustrates a further process sequence 100-6 for producing the cover substrate 20' using steps 110 to 170.

First, in step 110, a mold substrate 10 is provided with a surface region 10-1 structured with depressions 12, wherein the mold substrate 10 comprises, for example, silicon or consists of silicon. This is followed by step 112 of arranging the cover substrate 20 pre-structured with elevations 22 on the surface region 10-1 of the mold substrate 10 pre-structured with depressions 12, wherein the cover substrate 20 comprises (or consists of) a glass material. The lens structures 22 (on the front side 20-1 of the cover substrate 20) face away from the mold substrate 10.

In the step 114 of connecting the cover substrate 20 to the mold substrate 10, the structured surface 10-1 of the mold substrate 10 is connected to the surface 20-2 of the cover substrate 20 in a gas-tight manner with a defined enclosed internal atmosphere in the recesses 12 to provide the interconnected substrates 10, 20 (step 120).

In the step 130 of tempering the bonded substrates 10, 20 in a vacuum oven 50, a blowing out of the glass material of the cover substrate 20 relative to the recesses 12 of the mold substrate 10 is caused by the enclosed pressure in relation to the oven pressure. The flow front stops at the stop surface 40-1 of the stop element 40 at the adjustable distance h in the vacuum oven 50, wherein the stop element 40 with the stop surface 40-1 comprises, for example, a silicon wafer or is made of a silicon wafer The adjustable distance h in the vacuum oven is fixed and remains unchanged during the inflation and cooling process.

Finally, the connected substrates 10, 20 are cooled under a defined or reproducible temperature and pressure ramp and then removed from the oven. In step 152, the stop surface 40-1 and the mold substrate 10 are removed from the molded cover substrate 20' in order to obtain the structured cover substrate 20' obtained from the cover substrate 20 by the blow-out process.

8 now shows a further exemplary basic flow chart 100-7 of the inventive manufacturing method 100 according to a further embodiment. In the following, differences or different method steps of the flow chart 100-7 of 8 compared to flow charts 100-1, 100-2, 100-3, 100-4, 100-5, 100-6 of 2 to 7 Therefore, the above description of the 1 to 7 accordingly to the following description of the embodiment of 8 applied, whereby the following description focuses primarily on differences, such as different (= alternative and/or additional) process steps and/or elements, to the previous process sequences and the resulting technical effects.

In step 110, first the mold substrate 10, e.g. a semiconductor or silicon wafer, is provided with the structured surface region 10-1, i.e. the mold substrate 10 is provided with at least one depression or recess 12. Furthermore, the cover substrate 20, e.g. a glass wafer, is provided. The cover substrate 20 further has at least one lens material section 22 on the first main surface region (on the first side surface or front side) 20-1 thereof, wherein the cover substrate 20 with the lens material section 22 has a glass material. The cover substrate 20 is thus designed, for example, as a glass wafer 20 structured on one side (on the top side 20-1) (produced by glass etching processes or glass flow technology), i.e. the lens material sections 22 can be produced by glass etching processes or glass flow technology in preparation for the further production process.

According to one embodiment, the cover substrate 20 can optionally have stiffening structures that can be arranged locally on the cover substrate 20 on the side surfaces 24-1 and/or 24-2 of the cover substrate 20. The optional additional stiffening structures can be arranged, for example, individually or in pairs opposite one another (and centered/aligned) to one another on the cover substrate 20. The additional stiffening structures can now be provided in order to obtain an inclined (angled) or vertical, planar side wall region 24-1 of the cover element 24 of the molded cover substrate 20' in the (later) tempering step 130.

In a step 112, the cover substrate 20 is arranged in an aligned manner on the structured surface region 10-1 of the mold substrate 10 in order to arrange the lens material section 22 of the cover substrate in an aligned or predetermined position (= alignment) with the structured surface region 10-1 of the mold substrate 10. For example, the lens material section 22 can be arranged on the first main surface region 20-1 of the cover substrate 20 laterally offset from one of the recesses 12 of the mold substrate 10 or (with respect to a vertical projection) between two adjacent recesses 12 of the mold substrate 10.

In a step 114, the cover substrate 20 is then connected to the mold substrate 10, e.g. hermetically connected by means of anodic bonding (e.g. in a defined atmosphere) to form at least one closed cavity 30 or a plurality of partial cavities between the cover substrate 20 and the mold substrate 10. The (hermetic) connection 114 of the cover substrate 20 to the mold substrate 10 can be carried out in an atmosphere with a defined atmospheric ambient pressure in order to enclose a defined atmospheric pressure in the closed cavities 30. The cover substrate 20 and/or the mold substrate 10 are designed to form the closed cavity 30 with one or a plurality of closed cavity regions 30 between the cover substrate 20 and the mold substrate 10, wherein the closed cavity regions 30 are arranged fluidically separated from one another, or wherein gas exchange channels 30-1 can also be provided between the cavity regions 30 closed from the ambient atmosphere in order to fluidically connect them to one another in order to obtain a common defined atmospheric pressure in the connected cavity regions 30. The lens structures 22 face away from the mold substrate 10.

In step 120, the mold substrate 10 and the cover substrate 20, which are (firmly) connected to each other, are provided, wherein the surface region 10-1 of the mold substrate 10 is structured (formed with recesses or channel structures 12).

In the (subsequent) step 130, the cover substrate 20 and the mold substrate 10 are now tempered, ie subjected to a temperature treatment or heated (warmed) in order to reduce the viscosity of the glass material of the cover substrate 20. Furthermore, in a step 140, an overpressure is provided in the (at least one) closed cavity or the closed cavities 30 compared to the surrounding atmosphere in order to bring about a defined bulging, e.g. blowing out or deformation, of the glass material of the cover substrate 20. By the defined bulging of the glass material of the cover substrate 20, a shaped cover substrate 20' with (at least) one cover element 24 is thus obtained, wherein the bulges or deformations, ie the blown-out areas, then form the side wall areas 24-1 and the base areas 24-3 of the resulting cover elements 24, and further wherein the ceiling areas 24-2 of the cover element 24 with the (inwardly aligned) lens element 26 arranged thereon.

As a result of the defined bulging of the cover substrate 20, a lens element 26 is created or formed on the ceiling region 24-2 of the cover element 24 from the lens material section 22 on the cover substrate 20. Due to the aligned or predetermined position of the lens material section 22 on the cover substrate 20 with respect to the position of the closed cavity 30, the lens element 26 is created by the bulging process 130, 140 of the cover substrate 20 at a predetermined position and/or with a predetermined orientation on the ceiling region 24-2 of the cover element 24 of the cover substrate 20'.

According to an embodiment of the flow chart 100-7 of the method 100, the step of tempering 130 and providing 140 an overpressure is carried out as a glass flow process in a vacuum furnace 50 in order to obtain a defined atmospheric overpressure in the closed cavity 30 compared to the surrounding atmosphere. According to an embodiment of the flow chart 100-7 of the method 100, the cover substrate 20 is bulged or blown out in the step of tempering 130 and providing 140 an overpressure in the region of the closed cavity 30 up to a height h which is predetermined by the vertical distance of the stop surface 40-1 of the stop 40 to the first main surface region 20-1 of the cover substrate 20.

According to an embodiment of the flow chart 100-7 of the method 100, the region of the stop surface 40-1 of the stop element 40 opposite the cavity 30 or the cavity regions 30 is flat and parallel to the main surface region 20-1 of the cover substrate 20 in order to form a flat cover region 24-2 of the cover element 24 in the step of tempering 130 and providing 140 an overpressure. The glass flow process 130, 140 can therefore be carried out in a pressure-controlled furnace (e.g. in a vacuum furnace) 50. The glass wafer (cover substrate) 20 is blown out in the region of the cavities 30 up to the height h, which can be determined by a stop surface 40-1 of the stop element 40.

According to one embodiment, the cover substrate 20 thus has the lens material section 22 at a position on a main surface region 20-1 of the cover substrate 20 facing away from the mold substrate 10 in order to form the (e.g. inwardly curved) lens structure 26 in the step 130, 140 of tempering and providing an overpressure on an inner ceiling wall region 24-2 of the cover element 24.

In the case of 8 In the further process sequence 100-7 of the manufacturing method 100 shown, the frames (side wall regions 24-1 and ceiling regions 24-2) of the cover elements 24 are blown up or out. This essentially results in an inversion of the glass cap (cavity points upwards = z-direction) with the lens element 26 in the ceiling region 24-2. With this procedure, it can be achieved that (exactly) predefined lens shapes are not affected by the glass flow process. The cover substrate 20 with the lens material section 22 pointing (vertically) upwards is anodically bonded to the mold substrate 10 and the circumferential channel structures or trench structures 12 in the mold substrate 10 are blown out and forms the cavity(ies) 30 with the distance h.

By inverting the blown-out areas 30, the preformed lens shape 22 can be very well preserved and high-refractive lens elements 26 are thus provided with a spacer (height h). According to their focus distance plus an optional addition to compensate for a component height, they are vertically offset parallel to the former main surface 10-1 of the mold substrate 10.

As an alternative, the process sequence 100-7 can also be designed in such a way that, for example, the saw frames lie over circumferential trench structures 12 and are blown out with the lens material section 22 for the lens elements 26. The resulting lens elements 26 are set at an angle via the stop 40. In this way, the The necessarily wider circumferential trench structure 12 results in a lower yield per wafer (substrate). However, since the upper window 24-2, ie the ceiling region 24-2 with the lens material section 22, is not blown out and remains on the silicon wafer, its optical quality is retained.

2 - 8 illustrate possible and optional sub-steps and process sequences of the method 100 for producing a cover substrate 20', as described in 1 This in 2-8 The partial steps and process sequences shown are only to be seen as examples and can have variations in other embodiments. Possible process sequences are shown as to how the production of the cover wafer 20', i.e. the cover substrates 20', with integrated vertical optical window surfaces 24-1, 24-2 can proceed. The method 100 is essentially based on so-called glass flow techniques. In a preparatory step, a silicon wafer 40, i.e. a stop surface 40-1, is coated with a glass-repellent layer.

The special cover substrate 20' is, for example, a prerequisite for producing improved housed radiation-emitting components 1' using the method 200 described below. The above sub-steps and process sequences are only to be seen as examples and can have variations in other embodiments. A possible process sequence is shown as to how the production of these cover wafers, i.e. the cover substrates, with integrated vertical and/or lateral optical window surfaces 24-1, 24-2 can proceed.

9 now shows, for example, a flow chart of a method 200 according to the invention for producing a hermetically packaged optical component 1' according to a further embodiment

Before the following embodiments are explained in more detail with reference to the drawings, it is pointed out again that identical, functionally equivalent or equivalent elements, objects, functional blocks and/or method steps in the different figures are provided with the same reference numerals, so that the description of these elements, objects, functional blocks and/or method steps shown in different embodiments is interchangeable or can be applied to one another.

In the method 200 for producing a hermetically housed optical component, e.g. an optoelectronic transmitting and/or receiving component, the following steps are now carried out. First, the method 100 described above is carried out with the exemplary process sequences 100-1, 100-2, 100-3, 100-4, 100-5, 100-6 for producing a shaped cover substrate (= structured cover substrate) 20'. The shaped cover substrate 20' can have a single or isolated cover element 24' or can also have a plurality or a multiplicity of cover elements 24.

Furthermore, in step 220, a component substrate 2 with at least one optoelectronic component 1 (= transmitting and/or receiving component) arranged thereon is provided. According to one embodiment, a component substrate 2 can be provided with a single optoelectronic component 1 or as a component wafer 2 with a plurality of optoelectronic components 1 arranged thereon.

According to one embodiment, the method further comprises, for example, a step 210 of carrying out the method 200 for producing (hermetically) housed optical components 1' at wafer level, wherein a plurality of optical components 1 are arranged on the component substrate 2, and wherein the formed cover substrate 20' has a plurality of cover elements 24. In this context, reference is also made, for example, to the 10 - 13 and the corresponding description.

According to one embodiment, the method further comprises, for example, a step 230 of connecting the component substrate 2 and the formed cover substrate 20' along an intermediate connection region 60, 61, such as a bonding frame. In this context, reference is also made, for example, to the 10 - 14 and the corresponding description.

According to an embodiment of the method 20, the connection region 60 on the second main surface region 20-2 has, for example, a metallization in order to form a frame structure, eg a continuous frame structure, on non-bulged regions 24-3 (= base regions) of the formed cover substrate 20', wherein the method 200 further comprises, for example, a step 230 of connecting the formed cover substrate 20' and the component substrate 2 by means of a bonding frame 60. The bonding frame 60 can, for example, comprise a metallic solder material 66. In this context, reference is also made, for example, to the 10 - 14 and the corresponding description.

According to one embodiment, the method 200 further comprises, for example, a step 230 of connecting the component substrate 2 and the cover substrate 20' by means of laser direct welding, laser soldering, eutectic soldering, thermocompression bonding, glass frit bonding, reactive nano-metal layer soldering (RMS) or induction soldering along the connection region 62. In this context, reference is also made, for example, to the 10 - 14 and the corresponding description.

According to one embodiment, the method 200 further comprises, for example, the steps of singulating 170 the shaped cover substrate 20' in order to obtain singulated cover elements 24' and (hermetically) connecting 230 the singulated cover element 24' to a component substrate 2 in order to obtain the packaged optical component 1'. In this context, reference is also made, for example, to the 14 and the corresponding description.

According to one embodiment, the method 200 further comprises, for example, the steps of (hermetically) connecting 230 the formed cover substrate 20' with the plurality of cover elements 24 to the component substrate 2, which has a plurality of optoelectronic components 1, in order to obtain a plurality of packaged optical components 1' (at wafer level), and further the step of singulating 240 the plurality of packaged optical components 1' in order to obtain singulated, hermetically packaged optical components 1'. The step of singulating 240 can be carried out, for example, by sawing or by laser separation. In this context, reference is also made, for example, to the 10 - 13 and the corresponding description.

According to one embodiment, the method 200 further comprises, for example, the steps of singulating the shaped cover substrate 20' in order to obtain singulated cover elements 24', singulating the component substrate 2 in order to obtain singulated components 1 on the singulated component substrates 2', and (hermetically) connecting 230 each of the singulated cover elements 24' to the singulated component 1 in order to obtain a housed optical component 1'. In this context, reference is also made, for example, to the 14 and the corresponding description.

In the method 200 for producing a housed radiation-emitting component 1, which can be carried out, for example, at wafer level, it is also provided according to an embodiment that the arrangement and hermetic bonding 230 of the substrates 2, 20', i.e. the component substrate 2 and the shaped cover substrate 20', takes place under a predetermined atmosphere. This ensures that the housing 2, 20' or its internal volume 30 is completely free of organic substances or water vapor, so that the service life of the optoelectronic components 1, such as light-emitting diodes or laser diodes, is not impaired.

For example, the cavity 30 contains dry air (= reactive atmosphere), nitrogen or another type of inert atmosphere, but a negative pressure or even a complete vacuum can also be set in principle and can also be maintained over long periods of time by introducing special getter layers 4. A reduced atmospheric pressure (underpressure) in the cavity 30 of approximately 100 Torr, 50 Torr, 5 Torr or 1 Torr or lower pressure values can be considered a vacuum. The cavity 30 can also be hermetically sealed against the ingress of water vapor. In this context, reference is also made to the 10 - 14 and the corresponding description.

In some embodiments, the packaged optoelectronic (radiation-emitting or radiation-sensitive) component 1 is designed such that the component substrate 2 serves as a housing base and as a bearing surface for the radiation-emitting component 1, wherein the cover substrate 20' cooperates with the housing base 2 to hermetically seal the cavity 30 of the housing 5. In this context, reference is also made, for example, to the 11 and the corresponding description.

In some embodiments, the packaged radiation-emitting component 1' is designed such that the housing base 2 (component substrate) is designed as a base wafer comprising a plurality of housing base elements 2' and/or the cover substrate 20' is designed as a cover wafer comprising a plurality of cover elements 24. In this context, reference is also made, for example, to the 10 - 14 and the corresponding description.

In some embodiments, the housed radiation-emitting component 1' is designed such that an intermediate carrier 6 for the radiation-emitting component 1 is arranged between the component substrate 2 and the radiation-emitting component 1, so that the component substrate 2 carries the radiation-emitting component 1 indirectly (via the intermediate carrier 6). In this context, reference is also made, for example, to the 10 and 12 - 14 and the corresponding description.

In some embodiments, the packaged radiation-emitting component 1' is designed such that the component substrate 2 and the cover substrate 20' are attached to one another by means of a bonding frame 60, 61, which has a metallic solder material 66. The bonding frame 60, 61 can bond the opposing metallizations 60, 61 to the cover substrate 20' (on the second main surface region 20-2) and the component substrate 2 (on the first main surface region 2-1) with the solder material 66 in between, which establishes a mechanical and electrical connection between the metallizations 60, 61. In this context, reference is also made, for example, to the 10 - 14 and the corresponding description.

In some embodiments, the housed radiation-emitting component 1' is designed such that a conductor track 7 for electrically connecting the radiation-emitting component 1 is arranged on the side of the component substrate 2 and the conductor track 7 is led out of the cavity 30, e.g. laterally, between the cover substrate 20' and the component substrate 2. In this context, reference is also made, for example, to the 10 - 14 and the corresponding description.

In some embodiments, the housed radiation-emitting component 1' is designed such that a conductor track 7 for electrically connecting the radiation-emitting component 1 is arranged on the component substrate 2 and the conductor track 7 is led downwards through the component substrate 2 out of the cavity 30. For this purpose, for example, a TSV and/or TGV arrangement 7-1 (Through silicon vias (TSV) or Through Glass Via (TGV)) can be used. In this context, reference is also made, for example, to the 10 - 14 and the corresponding description.

In some embodiments, the housed radiation-emitting component 1' is designed such that an optical bench 8 with one or more additional optical elements 8-1, e.g. discrete lens elements, is arranged in front of the optical output window (optical side window) 24-1 on the component substrate 2, so that the optical output window 24-1 is arranged between the optical bench 8 with the additional optical element 8-1 and the radiation-emitting component 1. In this context, reference is also made, for example, to the 12 - 14 and the corresponding description.

In some embodiments, the housed radiation-emitting component 1 is designed such that the optical bench 8 with the additional optical elements 8-1, e.g. lenses, prisms, mirrors, apertures, etc., is arranged on the component substrate 2 and is located in the radiation direction of the radiation-emitting component 2. In this context, reference is also made, for example, to the 12 - 14 and the corresponding description.

In some embodiments, the housed radiation-emitting component 1 is designed such that it further comprises an element (conversion element) 9 which is effective for a light color conversion of the emitted light, so that the optical coupling-out window 24-1 is arranged between the effective element 9 and the radiation-emitting component 1.

In some embodiments, the housed radiation-emitting component 1 is designed such that the cavity 30 has a reactive atmosphere and/or the cavity 30 contains exclusively inorganic substances. The cavity 30 can also be hermetically sealed against the ingress of water vapor. This can ensure or at least support long-lasting operation of, for example, blue and green laser diodes.

In some embodiments, the housed radiation-emitting component 1 is designed such that an electronic driver circuit 3 is arranged in the cavity. The electronic driver circuit 3 can be integrated, for example, in the assembly substrate 2.

In some embodiments, the packaged optoelectronic component 1 comprises a detector element and an emitter element in a housing 5.

• Eine Verkappung von einzelnen Laserdioden 1 (oder allg. einzelnen optoelektronischen Bauelementen 1) auf einem Submount 6 in einem hermetisch dichten Gehäuse 5, geschaffen durch Aufbonden eines Deckels 20' mit mindestens einer seitlichen optischen Fensterfläche 24-1.

In accordance with the above statements, the manufacturing method 200 for hermetically packaging an optoelectronic component 1 enables various embodiments and configurations of the resulting hermetically packaged optoelectronic component 1', for example:

• A capping of individual laser diodes 1 (or generally individual optoelectronic components 1) on a submount 6 in a hermetically sealed housing 5, created by bonding a cover 20' with at least one lateral optical window surface 24-1.

A capping of individual laser diodes 1 directly on the substrate 2 in a hermetically sealed housing 5, created by bonding a Cover 20' with at least one lateral optical window surface 24-1.

A casing of individual laser diodes 1 and individual passive optical elements in a hermetically sealed housing 5, created by bonding a cover 20' with at least one lateral window surface 24-1.

A capping of one or more laser diodes 1 with “fast focus collimation” by a common cylindrical lens 26 in an optical window area 24-1, 24-2 (top or side), optionally with one further lens each or a common multiple cylindrical lens 8 for slow axis collimation outside the hermetic housing 5.

A casing of one or more laser diodes 1 with beam collimation by individual collecting lenses 26 in an optical window area 24-1, 24-2 (top or side), optionally with one further lens each or a common multiple collecting lens 8 for further beam collimation outside the hermetic housing 5.

A casing of one or more laser diodes 1 with beam collimation by individual collecting lenses 26 in an optical window area 24-1, 24-2 (top or side), optionally with a further lens or a common multiple collecting lens 8 for further beam collimation outside the hermetic housing 5, optionally with an optical structure for beam superposition and optionally for static beam deflection.

A capping of one or more laser diodes 1 with or without submount with or without fast-axis collimation and a light color conversion by an externally arranged phosphor body, which is fixed as a molded body or dispensed and cured as phosphor bound in a polymer (epoxy or silicone matrix).

The optically active components arranged on the outside (= outside the housing 5) can be soldered or fixed by gluing, because organic outgassing does not cause clouding in the beam exit.

A capping of at least one semiconductor-based light source 1 and at least one photodetector 1-2 in the hermetically sealed housing 5 created by bonding (= method 200) a glass cover 20' produced according to the aforementioned method 100, e.g. with an optical window surface pointing away from the substrate 2.

The components 1 arranged in the cavity 30 and the capping 20' itself can be joined, for example, by metallic joining methods such as soldering, eutectic AuSn soldering, etc. in order to avoid organic outgassing in the housing 5. Fluxes do not need to be used.

The above embodiments and configurations can be used individually or in any combination for the inventive concept.

In the following, the 10 - 14 exemplary process sequences or process flows for the implementation of the 9 The basic manufacturing process 200 shown in FIG. 1 is described in 10 - 14 the drawing plane again extends parallel to the xz-plane.

All process alternatives to the method 200 described below are based on the basic concept that first the shaped cover substrate 20', i.e. the structured cover substrate with one or a plurality of cover elements 24, is carried out using the above method 100. Furthermore, a component substrate 2 on which one or a plurality of optoelectronic components 1 is arranged is provided (step 220). In a step 230, the shaped cover substrate 20' and the component of the substrate 1 are now connected to one another, e.g. hermetically connected/bonded to one another, in order to hermetically house the optical component 1, i.e. to accommodate it in a housing that is hermetically sealed against the ambient atmosphere or against ambient influences. A hermetic or hermetically sealed housing is considered to be a fluidically tight, mechanical connection (encapsulation) of the component substrate 2 and the molded cover substrate 20'.

10 now shows a first exemplary basic flow diagram 200-1 of the inventive method 200 for producing a hermetically packaged optical component 1' according to a further embodiment. In particular, 10 a sequence of the capping process 200-1 with optically active side windows 24-1 at wafer level up to wafer separation according to an embodiment in a variant with lenses 26 in the lateral window surface 24-1, wherein the optically active coupling-out windows (side windows) 24-1 have a lens geometry with, for example, a 90° orientation to the carrier substrate plane (xy plane), and wherein the radiation-emitting component 1 has, for example, a radiation direction or main radiation direction (in the case of a diverging or widening beam) essentially parallel to the carrier substrate plane (xy plane).

In the method 200 for producing a hermetically packaged optical component, e.g. an optoelectronic transmitting and/or receiving component, the following steps are now carried out. First, the method 100 described above is carried out with the exemplary process sequences 100-1, 100-2, 100-3, 100-4, 100-5 for producing a shaped cover substrate (= structured cover substrate) 20'. The shaped cover substrate 20' can have a plurality or multiplicity of cover elements 24. Furthermore, in step 220, a component substrate 2, e.g. as a component wafer, with a plurality of optoelectronic components 1 arranged thereon is provided. An optoelectronic component 1 can be assigned to each cover element 24. In the step of (hermetically) connecting 230 the shaped cover substrate 20' with the plurality of cover elements 24 to the component substrate 2, which in turn has a plurality of optoelectronic components 1, a plurality of packaged optical components 1' (at wafer level) is thus obtained.

The step of connecting the component substrate 2 and the formed cover substrate 20' can be carried out, for example, along an intermediate connection region 60, such as a bonding frame. The connection region 60 can have a metallization in order to form a frame structure, e.g. a continuous frame structure, on non-bulged regions 24-3 (= base regions) of the formed cover substrate 20'. The bonding frame 60 can have a metallic solder material 66, for example.

The step of connecting 230 the device substrate 2 and the cover substrate 20' can also be carried out by means of laser direct welding, laser soldering, eutectic solder bonding, thermocompression bonding, glass frit bonding, reactive nano metal layer soldering (RMS) or induction soldering along the connection region 60.

Furthermore, a step of singulating 240 the plurality of housed optical components 1' is carried out in order to obtain singulated, hermetically housed optical components 1'. The step of singulating 240 can be carried out, for example, by sawing or by laser separation.

The method 200 for producing a housed radiation-emitting component 1 can be carried out, for example, at wafer level, with the arrangement and hermetic bonding 230 of the substrates 2, 20', i.e. the component substrate 2 and the shaped cover substrate 20', taking place under the predetermined atmosphere. This ensures that the housing 2, 20' or its internal volume 30 is completely free of organic substances or water vapor, so that the service life of the optoelectronic components 1, such as light-emitting diodes or laser diodes, is not impaired. The cavity 30 contains, for example, dry air (= reactive atmosphere), nitrogen or another type of inert atmosphere, but a negative pressure or even a complete vacuum can also be set in principle and can also be maintained over long periods of time by introducing special getter layers 4. A reduced atmospheric pressure (underpressure) in the cavity 30 of approximately 100 Torr, 50 Torr, 5 Torr or 1 Torr or lower pressure values can be considered a vacuum. The cavity 30 can also be hermetically sealed against the ingress of water vapor.

Furthermore, an intermediate carrier 6 for the radiation-emitting component 1 can be arranged between the component substrate 2 and the radiation-emitting component 1, so that the component substrate 2 carries the radiation-emitting component 1 indirectly (= via the intermediate carrier 6). In the embodiments, the housed radiation-emitting component 1' is designed such that a conductor track 7 for electrically connecting the radiation-emitting component 1 is arranged on the side of the component substrate 2 and the conductor track 7 is led out of the cavity 30, e.g. laterally, and/or downwards, between the cover substrate 20' and the component substrate 2. For this purpose, for example, a TSV and/or TGV arrangement 7-1 (through silicon vias (TSV) or through glass via (TGV)) can be used.

11 now shows a further exemplary basic flow diagram 200-2 of the inventive method 200 for producing a hermetically packaged optical component 1' according to a further embodiment. In particular, 11 a sequence of the capping process 200-2 with optically active side windows 24-2 at wafer level up to wafer separation according to an embodiment in a variant with lenses 26 in the upper window surface 24-2, wherein the optically active coupling-out window (ceiling window) 24-2 has a lens geometry with, for example, a parallel alignment to the carrier substrate plane (xy plane), and wherein the radiation-emitting component 1 has, for example, a radiation direction or main radiation direction (in the case of a diverging beam) essentially perpendicular to the carrier substrate plane (xy plane).

In the method 200 for producing a hermetically housed optical component, e.g. an optoelectronic transmitting and/or receiving component, the following steps are now carried out. First, the method 100 described above is carried out with the exemplary process sequence 100-6 for producing a shaped cover substrate (= structured lid substrate) 20'. The shaped cover substrate 20' can have a plurality or multiplicity of lid elements 24. Furthermore, in step 220, a component substrate 2, e.g. as a component wafer, with a plurality of optoelectronic components 1 arranged thereon is provided. An optoelectronic component 1 can be assigned to each lid element 24. In the step of (hermetically) connecting 230 the shaped cover substrate 20' with the plurality of cover elements 24 to the component substrate 2, which in turn has a plurality of optoelectronic components 1, a plurality of packaged optical components 1' (at wafer level) is thus obtained.

Furthermore, a step of singulating 240 the plurality of housed optical components 1' is carried out in order to obtain singulated, hermetically housed optical components 1'. The step of singulating 240 can be carried out, for example, by sawing or by laser separation.

12 now shows a further exemplary basic flow diagram 200-3 of the inventive method 200 for producing a hermetically packaged optical component 1' according to a further embodiment. In particular, 12 a sequence of the capping process 200-3 with optically active side windows on the wafer level up to the wafer separation according to an embodiment in a variant with lenses 26 in the lateral window area 24-1, wherein the optically active coupling-out windows (side windows) 24-1 have a lens geometry with, for example, a 90° orientation to the carrier substrate plane (xy plane), and wherein the radiation-emitting component 1 has, for example, a radiation direction or main radiation direction (in the case of an expanding beam) essentially parallel to the carrier substrate plane (xy plane).

In the method 200 for producing a hermetically housed optical component, e.g. an optoelectronic transmitting and/or receiving component, the following steps are now carried out. First, the method 100 described above is carried out with the exemplary process sequences 100-1 ... 100-6 for producing a shaped cover substrate (= structured cover substrate) 20'. The shaped cover substrate 20' can have a plurality or multiplicity of cover elements 24. Furthermore, in step 220, a component substrate 2, e.g. as a component wafer, with a plurality of optoelectronic components 1 arranged thereon is provided. An optoelectronic component 1 can be assigned to each cover element 24. In the step of (hermetically) connecting 230 the shaped cover substrate 20' with the plurality of cover elements 24 to the component substrate 2, which in turn has a plurality of optoelectronic components 1, a plurality of packaged optical components 1' (at wafer level) is thus obtained (= 12a) .

Furthermore, a step of singulating 240 the plurality of housed optical components 1' is carried out in order to obtain singulated, hermetically housed optical components 1'. The step of singulating 240 can be carried out, for example, by sawing or by laser separation.

In the step of separating 240, as in 12b As shown, an intermediate region 20'-1 of the cover substrate 20' is separated, for example by sawing or laser separation, and at 12c removed from the arrangement. When arranging 12c Thus, the optoelectronic components 1 are each individually hermetically housed on the component substrate 2 with a cover element 24'.

1. 1. Alternative - Prozessfolge gemäß 12a-b-c-d-f: Wie bei 12d beispielhaft dargestellt ist, können die gehäusten, optoelektronischen Bauelemente 1' vereinzelt werden, um die vereinzelten, hermetisch gehäusten, optoelektronischen Bauelemente 1' zu erhalten. Gemäß der ersten Alternative werden nun an den vereinzelten Bauelementsubstraten 2' jeweils (zumindest) eine optische Bank 8 vorgelagert zu dem optischen Auskoppelfenster 24-1, d.h. außerhalb des Gehäuses 5 mit dem strahlungsemittierenden Bauelement (optoelektronischen Bauelement) 1, angeordnet. Somit wird die in 12f dargestellte Anordnung der vereinzelten, hermetisch gehäusten optischen Bauelementen 1' mit der vorgelagerten optischen Bank 8 auf dem Bauelementsubstrat 8 erhalten.
2. 2. Alternative - Prozessfolge gemäß 12a-b-c-e-f: Wie bei 12c beispielhaft dargestellt ist, werden die einzeln gehäusten, optoelektronischen Bauelemente 1' auf dem gemeinsamen Bauelementsubstrat 2 erhalten. Gemäß der zweiten Alternative wird nun an dem Bauelementsubstrat 2 jeweils (zumindest) eine optische Bank 8 mit dem zusätzlichen optischen Element 8-1 vorgelagert zu dem optischen Auskoppelfenster 24-1, d.h. außerhalb des Gehäuses 5 mit dem strahlungsemittierenden Bauelement (optoelektronischen Bauelement) 1, angeordnet, wie dies in 21e dargestellt ist. Wie bei 21f beispielhaft dargestellt ist, werden nun die gehäusten, optoelektronischen Bauelemente 1' vereinzelt, um die vereinzelten, hermetisch gehäusten, optoelektronischen Bauelemente 1' zu erhalten. Somit wird wieder die in 12f dargestellte Anordnung der vereinzelten, hermetisch gehäusten optischen Bauelementen 1' mit der vorgelagerten optischen Bank 8 mit dem zusätzlichen optischen Element 8-1 auf dem Bauelementsubstrat 8 erhalten.

As in 12d -f is shown by way of example, the step of isolating 240 the plurality of housed optoelectronic components 1' can be divided into different sub-process sequences. According to one embodiment, the housed radiation-emitting component 1' can now be designed such that an optical bench 8 with the additional optical element 8-1 is arranged in front of the optical coupling-out window (optical side window) 24-1 on the component substrate 2, so that the optical coupling-out window 24-1 is arranged between the optical bench 8 and the radiation-emitting component (optoelectronic component) 1.

1. 1st alternative - process sequence according to 12a -bcdf: As with 12d As shown by way of example, the housed optoelectronic components 1' can be separated in order to obtain the separated, hermetically housed optoelectronic components 1'. According to the first alternative, (at least) one optical bench 8 is arranged on the separated component substrates 2' in front of the optical coupling-out window 24-1, ie outside the housing 5 with the radiation-emitting component (optoelectronic component) 1. Thus, the 12f illustrated arrangement of the individual, hermetically packaged optical components elements 1' with the upstream optical bench 8 on the component substrate 8.
2. 2nd alternative - process sequence according to 12a -bcef: As with 12c As shown by way of example, the individually housed optoelectronic components 1' are obtained on the common component substrate 2. According to the second alternative, (at least) one optical bench 8 with the additional optical element 8-1 is arranged on the component substrate 2 in front of the optical coupling-out window 24-1, ie outside the housing 5 with the radiation-emitting component (optoelectronic component) 1, as shown in 21e As with 21f As shown by way of example, the housed optoelectronic components 1' are now separated in order to obtain the separated, hermetically housed optoelectronic components 1'. Thus, the 12f illustrated arrangement of the isolated, hermetically housed optical components 1' with the upstream optical bench 8 with the additional optical element 8-1 on the component substrate 8 is obtained.

The 12a -f thus show a sequence of a capping process with optically active side windows 24-1 at wafer level up to wafer separation. The carrier substrate 2 is equipped with an optical bench 8 with the additional optical element 8-1. Joining processes with high temperature requirements are first carried out on the carrier substrate. The capping is carried out at wafer level with a glass cap wafer. The standard procedure is carried out from 12a -c, where a branching of the process sequence by substrate separation in 12a -bcef (1st alternative) or 12a -bcdf (2nd alternative). The process flow branches here: The sequence abcdf shows the optics assembly on the optical bench 8 in the case of upstream wafer separation, while the sequence abcef shows the optics assembly on the optical bench 8 in the case of downstream wafer separation. In addition to the semiconductor emitters 1, monitor diodes 1-2 for monitoring the laser power, lenses or other optical elements are optionally mounted within the hermetic housing 5, e.g. soldered on. The additional optical elements 8-1 are mounted on the open optical bench using adhesive.

The optical functions necessary for beam collimation and beam combination can be integrated or arranged on an open, connected optical bench 8 outside the hermetic housing 5.

12f thus shows a distributed arrangement of the optical elements 8, 26, with some of the optical functions being constructed as part of the hermetically sealed housing 5 in the glass cover 20' as the lens elements 26. For this purpose, organic-free connection techniques based on soft solder are preferably used. Other necessary optical elements 8-1 are constructed on the connected optical bench 8.

12a -f also shows an example of an embodiment in which the component substrate 2, in this case e.g. a silicon carrier chip, was lowered in the area of the optics 8 (optical bench) by etching by a lowering height “Δz” in order to thereby create more vertical installation space for the optics 8. The optics 8 can be arranged as the optical bench 8 on the component substrate 2 by means of adhesive connections. As in 12f As shown, the plane of the optical bench 8 is located on a different, (vertically) lower height plane than the mounting plane for the laser diodes 1 or the sealing frame 3.

According to further embodiments, the plane of the optical bench 8 with the additional optical element 8-1 can also be located on a different, vertically higher height plane than the mounting plane for the laser diodes 1 or the sealing frame 3. A raised mounting plane can also be formed in the carrier wafer (e.g. as a mesa structure).

13 now shows a further exemplary basic flow diagram 200-4 of the inventive method 200 for producing a hermetically packaged optical component 1' according to a further embodiment. In particular, 12 a sequence of the capping process 200-4 with optically active side windows on the wafer level up to the wafer separation according to an embodiment in a variant with lenses 26 in the lateral window area 24-1, wherein the optically active coupling-out windows (side windows) 24-1 have a lens geometry with, for example, a 90° orientation to the carrier substrate plane (xy plane), and wherein the radiation-emitting component 1 has, for example, a radiation direction or main radiation direction (in the case of a diverging beam) essentially parallel to the carrier substrate plane (xy plane).

In the method 200 for producing a hermetically housed optical component, e.g. an optoelectronic transmitting and/or receiving component, the following steps are now carried out. First, the method 100 described above is carried out with the exemplary process sequences 100-1 ... 100-6 for producing a shaped cover substrate (= structured cover substrate rat) 20', wherein the formed cover substrate 20' is separated in order to obtain separated cover elements 24' and to provide these for the subsequent bonding step. Thus, the formed cover substrate 20' can each have a separated cover element 24'. Furthermore, in step 220, a component substrate 2, e.g. as a component wafer, with a plurality of optoelectronic components 1 arranged thereon is provided. In this case, an separated cover element 24' can be assigned to each optoelectronic component 1 on the component substrate 2 (component wafer). In the step of (hermetic) bonding 230, the isolated cover elements 24' of the molded cover substrate 20' are bonded to the component substrate 2, which has a plurality of optoelectronic components 1, in order to hermetically house the optoelectronic components and thus to obtain a plurality of housed optical components 1' on the component substrate 2.

Furthermore, a step of singulating 240 the plurality of housed optical components 1' is carried out in order to obtain singulated, hermetically housed optical components 1'. The step of singulating 240 can be carried out, for example, by sawing or by laser separation.

In process flow 200-4 of 13 Thus, the optoelectronic components 1 are individually capped with the individual cover elements 24', whereby compared to the process sequence 200-4 of 12 a removal of a central portion 20'-1 of the cover substrate 20' is not necessary. As with 13c As shown by way of example, the individually housed optoelectronic components 1' are maintained on the common component substrate 2.

As in 13d -f is shown by way of example, the step of isolating 240 the plurality of housed optoelectronic components 1' can be divided into different sub-process sequences. According to one embodiment, the housed radiation-emitting component 1' can now be designed such that an optical bench 8 with the additional optical element 8-1 is arranged in front of the optical coupling-out window (optical side window) 24-1 on the component substrate 2, so that the optical coupling-out window 24-1 is arranged between the optical bench 8 and the radiation-emitting component (optoelectronic component) 1.

The above description of the process flow 200-3 regarding the 12d -f is with the different alternatives is equally and accordingly also the process flow 200-4 in the 13d -f applicable.

The 13a -f thus shows a sequence of a capping process with optically active side windows 24-1 at wafer level up to wafer separation. The carrier substrate 2 is equipped with an optical bench 8. Joining processes with high temperature requirements are first carried out on the carrier substrate. The capping is carried out at wafer level by means of individual glass caps. The standard procedure is carried out from 13a -c, where a branching of the process sequence by substrate separation in 13a -bcef (1st alternative) or 13a -bcdf (2nd alternative). The process flow branches here: The sequence abcdf shows the optics assembly on the optical bench 8 in the case of upstream wafer separation, while the sequence abcef shows the optics assembly on the optical bench 8 in the case of downstream wafer separation. In addition to the semiconductor emitters 1, monitor diodes 1-2 for monitoring the laser power, lenses or other optical elements are optionally mounted within the hermetic housing 5, e.g. soldered on. Additional optical elements 8-1 are mounted on the open optical bench using adhesive. This also applies if the caps are put on individually, but are all hermetically joined to the carrier substrate together in one joining process step.

14 now shows a further exemplary basic flow diagram 200-5 of the inventive method 200 for producing a hermetically packaged optical component 1' according to a further embodiment. In particular, 14 a sequence of an individual capping process 200-5 with optically active side windows 24-1. This device is produced from individual carrier substrates 2' and glass caps 24' on the individual substrate level. According to one embodiment, the optically active coupling-out windows (side windows) 24-1 are arranged with a lens geometry in, for example, a 90° alignment to the carrier substrate plane (xy plane), wherein the radiation-emitting component 1 has, for example, a radiation direction or main radiation direction (with an expanding beam) essentially parallel to the carrier substrate plane (xy plane).

In the method 200 for producing a hermetically housed optical component, e.g. an optoelectronic transmitting and/or receiving component, the following steps are now carried out. Firstly, the method 100 described above is carried out with the exemplary process sequences 100-1 ... 100-6 for producing a shaped cover substrate (= structured cover substrate) 20'. The shaped cover substrate 20' can be a single or combined individual cover element 24' or a plurality or a multiplicity of cover elements 24 are provided in the molded cover substrate 20'. Furthermore, in step 220, a component substrate with an optoelectronic component (transmitting and/or receiving component) arranged thereon is provided. According to one embodiment, a component substrate with a single optoelectronic component or a component substrate as a component wafer with a plurality of optoelectronic components (eg semiconductor light sources or photodetectors) arranged thereon can be provided.

In the step of (hermetically) connecting 230 the shaped cover substrate 20', e.g. with the plurality of cover elements 24', to the component substrate 2, which in turn has e.g. a plurality of optoelectronic components 1, the housed optical components 1' are thus obtained.

As in 14a As shown by way of example, in the step of (hermetically) connecting 230 the shaped cover substrate 20' to the component substrate 2, the shaped cover substrate 20' or the window cap 24' is placed on the component substrate 2' (= carrier substrate) with pre-assembled and contacted semiconductor emitters (or semiconductor detectors) 1 and connected. Optionally, a monitor diode 1-2 can be provided in this case as an example for an integrated optical sensor system.

According to one embodiment, an optical bench 8 with an additional optical element 8-1 can now be arranged on the component substrate 2' in front of the optical coupling-out window 24-1, ie outside the housing 5 with the radiation-emitting component (optoelectronic component) 1. Lenses 8-1 can therefore be mounted on the optical bench 8 of the same carrier substrate 2' outside the glass cap 24', as is shown by way of example in 14b is shown.

As now in 14c As shown by way of example, a housing element or additional cover element 68 with a window region 68-1 can optionally be provided, which is joined (eg not hermetically) to the component substrate 2' in order to seal off the optoelectronic component 1' accommodated in the housing 5 from the outside.

In 14d the resulting arrangement is shown as an example with indicated light beams L ₁ , L ₂ . Here, for example, an integrated monitor diode 1-2 measures the beam power L ₂ of an edge-emitting laser diode 1 with the coupled-out light beam L ₁ .

Thus, 14 a sequence of a single capping process 200-5 with optically active side windows 24-1. This device is produced from individual carrier substrates 2' and glass caps 24' at the single substrate level.

The process sequence 200-5 of 14 is also applicable to the case where a plurality of housed optoelectronic components 1' are arranged on the component substrate 2, wherein the step of singulating 240 the plurality of housed optical components 1' can then optionally also be carried out in order to obtain the singulated, hermetically housed optical components 1'.

Embodiments thus describe a method 200 for the hermetically sealed housing of radiation-emitting and radiation-detecting components 1, for example laser diodes or LEDs and PIN diodes, APD, SPAD, silicon photomultiplier, which can be referred to as WLP-IVA (wafer level packages - with integrated vertical optical apertures). The optical window region 24-1, 24-2, which allows a lateral to vertical beam coupling and coupling to the carrier substrate 2', can be particularly advantageous. The optical window region 24-1, 24-2 with a lens 26 is characterized in the sense of the present description by an influence on the beam propagation, so that an additional change in direction impressed on the beam when passing through the window moves in the range greater than 6°. Window areas with a reflective mirror coating 65 are, in the sense of the present description, flat and curved surfaces inclined to the base plane of the cover substrate 20' for beam deflection and beam focusing. Lenses 26 in the sense of the present description are passively imaging elements, e.g. uniaxial cylinder lenses, rotationally symmetrical converging lenses and free-form lenses.

The assembly of the laser diodes 1, 1A and possibly further optical elements and photodetectors 1-2 can be carried out, for example, on a semiconductor wafer as a substrate, for example a silicon wafer, and the capping process can be carried out for all components assembled up to this step on the substrate together by bonding a cover substrate with window areas, usually with a similar arrangement. If additional optical elements 8-1 are to be mounted on an optical bench 8, this step preferably takes place after separating the cover substrate, whereby the areas of the optical bench are freely accessible for assembly. For reasons of system technology, increasing yield and also in order to keep the heat input low, individual capping can be carried out by bonding placing and sealing individual (pre-measured) glass covers. The optical bench 8 remains exposed and can be directly equipped with further optical elements 8-1. Only then is the carrier substrate separated or separated into individual chips, or more precisely into individual components, for both process variants.

Alternatively, the laser diodes can be mounted on a single piece of an already separated semiconductor wafer, referred to here as a single substrate, for example a sawn-out chip from a carrier wafer, and the encapsulation process for the mounted components on the single substrate can be carried out by bonding a glass cover with at least one optical window that has already been separated from a cover substrate.

15 now shows an exemplary embodiment for a hermetically packaged optoelectronic component 1' according to an embodiment, which is manufactured, for example, using a method 200 described above.

As in 15 As shown by way of example, the hermetically housed optoelectronic component 1', which is produced, for example, using the production method 200, has an optical component 1 arranged on the separated component substrate 2', and furthermore a shaped cover substrate 20' or separated cover element 24', which provides a hermetically sealed cover or housing 5 for the optical component 1. The optical component 1 is housed within the housing 5. The shaped cover substrate 20' can have a (curved) cover element 24' with a (inwardly or outwardly) curved side wall region 24-1 between a ceiling region 24-2 and a base region 24-3.

According to one embodiment, the side wall region 24-1 and/or the ceiling region 24-2 of the cover element 24 of the molded cover substrate 20' comprises a material that is permeable to the transmitting or receiving radiation of the optoelectronic component 1 and is provided for coupling in and/or coupling out electromagnetic radiation (the transmitting or receiving radiation).

According to one embodiment, the hermetically sealed cover 24' with the cavity 30 has a reactive atmosphere and/or the cavity 30 contains exclusively inorganic substances. According to one embodiment, the hermetically sealed cover 24' with the cavity 30 is hermetically sealed against the ingress of water vapor. In the 15 In the embodiment shown, a hermetically sealed region is produced with sealing, for example, at a height level, wherein a variant with optical bench 8 with the additional optical element 8-1 at the surface level of the carrier wafer 2' is shown as an example.

In the following description of further embodiments of the hermetically packaged optoelectronic component 1', the respective differences (= alternative and/or additional elements) compared to the arrangement of 15 and the resulting technical effects are described. Therefore, the above description of the 15 can also be applied accordingly to the following description of the other embodiments.

16 now shows a further exemplary embodiment for a hermetically packaged optoelectronic component 1' according to an embodiment, which is produced, for example, using a method 200 described above

16 shows an embodiment in which, for example, a lowered optical bench 8 is arranged on the isolated component substrate 2' for mounting passive optical components 8, 26. The level of the optical bench 8 with the additional optical element 8-1 can be at a different height than the mounting level for the components 1, such as laser diodes, or the sealing frame. The component substrate can be lowered in the area of the optics 8 (optical bench), e.g. by etching, by a lowering height "Δz". A raised mounting level can also be formed in the carrier wafer 2', e.g. in the form of a mesa structure.

For example, no adhesives are used inside the glass cover 24'. Outside, lenses, prisms, mirrors, apertures, etc., e.g. as part of the optical bench, are assembled preferably with UV adhesive. There can also be several optical elements 8-1 (lenses, prisms, mirrors, apertures, etc.) on the same optical bench 8.

This arrangement with lateral vias 7-2 can be used for one or more components 1, e.g. laser diodes, and can be arranged in such a way that beams L ₁ that are parallel to the axis or that cross at a point are produced. In addition, the active components 1 can also be electrically contacted using flip-chip technology.

17 now shows a further exemplary embodiment for a hermetically packaged optoelectronic component 1' according to an embodiment, which can be produced, for example, using the method 200 described above and eg the Process flow 100-3 of method 100. According to an embodiment of the hermetically housed optoelectronic component 1', the cover substrate 20' can optionally be designed such that a side wall 24-1 is designed with a lens element and the opposite, inclined side wall 24-1 is designed with an inner mirror coating 65, which acts as a deflection mirror, for example.

This shows 17 for example, an arrangement for a photodetector 1 with indicated light beams L ₁ with a first lens 26 in the window area 24-1 of the glass cover 24' and a deflection mirror 65 on the opposite side. The angle of attack of both the mirror 65 and the lens 26 can be set in a defined angle range from 0° to 100°, e.g. with the process sequence 100-3 of the method 100. The carrier substrate 2' has hermetic lateral metallizations 7 with vertical vias 7-1, which can be used both for laser contacting by means of wire bands and also by means of flip-chip connection techniques.

18 now shows a further exemplary embodiment for a hermetically packaged, optoelectronic component 1' according to an embodiment, which is produced, for example, using the method 200 described above and eg the process sequence 100-6 of the method 100. According to an embodiment of the hermetically packaged, optoelectronic component 1', the cover substrate 20' can optionally be formed such that the upper side wall 24-2 is formed with a lens element 26.

The lens 26 is therefore provided in the upper window surface 24-2, wherein the optically active coupling-out window (ceiling window) 24-2 has a lens geometry with, for example, a parallel alignment to the carrier substrate plane (xy plane), and wherein the radiation-emitting component 1 has, for example, a radiation direction or main radiation direction (in the case of a diverging beam) with the coupled-out light beam L ₁ iW perpendicular to the carrier substrate plane (xy plane).

When arranging 18 the glass caps 24' (independent of the geometry of the side windows 24-1) also enable optical coupling or coupling upwards or away from the carrier substrate 2' (e.g. vertically).

19 now shows a further exemplary embodiment for a hermetically housed optoelectronic component 1' according to an embodiment, which is produced, for example, using a method 200 described above. According to an embodiment of the hermetically housed optoelectronic component 1', the cover substrate 20' can optionally be designed such that the upper side wall 24-2 is formed with two lens elements 26, 26-1. The optoelectronic component 1 has, for example, a radiation-emitting semiconductor component 1A, such as an optoelectronic transmitting component, and a radiation-sensitive semiconductor component 1B, such as an optoelectronic receiving component or a photodiode. The first lens element 26 is assigned to the radiation-emitting semiconductor component 1A, wherein the second lens element 26-1 is assigned to the radiation-sensitive semiconductor component 1B.

The lens 26 is therefore provided in the upper window surface 24-2, wherein the optically active coupling-out window (ceiling window) 24-2 has a lens geometry with, for example, a parallel alignment to the carrier substrate plane (xy plane), and wherein the radiation-emitting component 1A has, for example, a radiation direction or main radiation direction (in the case of a diverging beam) with the coupled-out light beam L ₁ pointing away from the carrier substrate plane (xy plane).

19 thus shows an embodiment in which further electronic components are integrated into the housing 24' for the laser 1A, i.e. into the cavity 30. This is suitable for applications when, for example, one or more additional photodiodes 1B are to be provided for monitoring the performance of the radiation-emitting component 17, for example the laser 1A, or the driver circuits for the radiation-emitting components 1A. The radiation reflected by the object 70 can be detected by the receiving element 1B.

In the 19 The driver IC with the transmitting element 1A and a monitor photodiode 1B are shown in the cavity. 19 In the embodiment shown, an electronic driver circuit is arranged in the cavity 30 of the cover element 24' as part of the transmitting element 1A.

20 now shows a further exemplary embodiment for a hermetically packaged optoelectronic component 1' according to an embodiment, which is manufactured, for example, using a method 200 described above. 20 shows an arrangement with multiple cavities 30 with optical decoupling.

The arrangement of the packaged optoelectronic component 1 of 20 differs only in this from the arrangement of 19 that the radiation-emitting semiconductor component element 1A, such as an optoelectronic transmitting component, and the radiation-sensitive semiconductor component 1B, such as an optoelectronic receiving component or a photodiode, are arranged in optically separated cavities 30, 30' of the cover element 24', wherein the first lens element 26 in the cavity 30 is again assigned to the radiation-emitting semiconductor component 1A and the second lens element 26-1 in the cavity 30' is assigned to the radiation-sensitive semiconductor component 1B.

The component 1 is provided with two individual cavities 30, 30' in the cap 24', with an optical absorber layer 25 optically separating and optically decoupling the two cavities 30, 30' of the cover element 24'. This optical decoupling can be produced by a variety of other techniques: e.g. by surface metallization, which is automatically deep-drawn in the separation area, by a thin surface coating with silicon, which is deep-drawn and melted, by subsequent thin-film deposition (metal, metal oxides) and structuring of the exit apertures, by a dispensed polymer layer with a dark or black color, etc.

The 10 -14 and the 15 - 20 show embodiments with advantageous electrical contacting. For a particularly compact structure of the laser diode housing 5, i.e. the housed radiation-emitting component 1', it is advantageous to lead the electrical connections 7 in the form of vertical feedthroughs 7-1 through the component substrate 2'. On the back, the necessary connection pads can be provided with a solderable metallization 7, as shown in the figures. If these connection areas are designed to be particularly surface-intensive, these areas are also suitable for ensuring the heat dissipation of the housing. Otherwise, in the exemplary embodiments, the cover substrate 20', i.e. the glass cover, and the component substrate 2, in this case a silicon chip, are again connected to one another by means of a bonding frame 60, 61, 66, so that a hermetic cavity 30 is provided for a radiation-emitting component 1, e.g. a laser diode. The optical surfaces can be provided with an anti-reflective coating 64 (ARC=Anti Reflex Coating).

Furthermore, embodiments with several radiation-emitting components can be formed in the same housing. This is an example of an embodiment for the assembly of several laser diodes in a housing, e.g. an RGB laser source. The three radiation-emitting components 1, for example, are each mechanically connected to the component substrate 2' via intermediate carriers 6. This achieves favorable heat dissipation. The radiation-emitting components 1 are each electrically connected by means of conductor tracks 7 and lateral feedthroughs 7-2, which are led out of the cavity 30 through a hermetically sealed bonding frame. It can be advantageous to place the respective optical components for beam processing outside the hermetically sealed housing 5 and in front of the optical window, i.e. the optical surfaces. These optical components can be, for example, cylindrical lenses or other types of lenses. These optical components can then also include substances that are undesirable in the hermetically sealed cavity, such as organic substances.

Although some aspects of the present disclosure have been described as features in the context of an apparatus, it is clear that such a description may also be considered as a description of corresponding method features. Although some aspects have been described as features in the context of a method, it is clear that such a description may also be considered as a description of corresponding features of an apparatus or the functionality of an apparatus. Some or all of the method steps may be performed by a hardware apparatus (or using a hardware apparatus), such as a microprocessor, a programmable computer, or an electronic circuit. In some embodiments, some or more of the method steps may be performed by such an apparatus. Depending on particular implementation requirements, embodiments of the invention may be implemented in hardware or in software, or at least partially in hardware or at least partially in software.

In the foregoing Detailed Description, in some cases, various features have been grouped together in examples in order to streamline the disclosure. This manner of disclosure should not be interpreted as an intention that the claimed examples have more features than are expressly recited in each claim. Rather, as the following claims reflect, the subject matter may lie in fewer than all of the features of a single disclosed example. Accordingly, the following claims are hereby incorporated into the Detailed Description, with each claim being able to stand as its own separate example. While each claim may stand as its own separate example, it should be noted that although dependent claims in the claims refer to a specific combination with one or more other claims, other examples may also refer to a combination of dependent claims with the subject matter of any other dependent claim or a combination of any feature with other dependent or independent claims. Such combinations are intended to be encompassed unless it is stated that a specific combination is not intended. Furthermore, it is intended to encompass a combination of features of a claim with any other independent claim, even if that claim is not directly dependent on the independent claim.

Claims (36)

Method (100) for producing a molded cover substrate (20') with the following steps: Providing (120) a mold substrate (10) and a cover substrate (20) which are connected to one another, wherein a surface area of the mold substrate (10) and/or the cover substrate (20) is structured to form a closed cavity (30) between the cover substrate (20) and the mold substrate (10), wherein the cover substrate (20) comprises a glass material with a lens material portion (22) which is formed as a pre-structured elevation and arranged in an aligned position with the closed cavity (30); Tempering (130) the cover substrate (20) and the mold substrate (10) to reduce the viscosity of the glass material of the cover substrate, and providing (140) an overpressure in the closed cavity (30) relative to the surrounding atmosphere in order to cause, based on the reduced viscosity of the glass material of the cover substrate (20) and the overpressure in the closed cavity (30) relative to the surrounding atmosphere, a defined bulging of the glass material of the cover substrate (20) starting from the closed cavity (30) up to a stop surface (40-1) of a stop element (40) spaced apart from the cover substrate in order to obtain a molded cover substrate (20') with a cover element (24), wherein the defined bulging causes the formation of a lens element (26) from the lens material section (22) on the cover element; and removing (150) the stop member (40) and the mold substrate (10) from the molded cover substrate (20'). procedure according to claim 1 , wherein the step (120) of providing the mold substrate and cover substrate comprises the following steps: - providing (110) a mold substrate (10) having a structured surface region and a cover substrate (20) comprising a glass material with a lens material portion (22) formed as a pre-structured elevation; - aligned placement (112) of the cover substrate (20) on the structured surface region of the mold substrate (10) to arrange the lens material portion (22) of the cover substrate (20) in an aligned position with the structured surface region of the mold substrate (10); - bonding (114) the cover substrate (20) to the mold substrate (10) to form a sealed cavity (30) between the cover substrate (20) and the mold substrate (10). procedure according to claim 1 , wherein the step of providing (120) a mold substrate (10) and a cover substrate (20) comprises the following steps: - providing (110) a mold substrate (10) and a cover substrate (20) having a structured surface area and further comprising a glass material with a lens material portion (22) formed as a pre-structured elevation; - aligning (112) the cover substrate (20) on the mold substrate (10); - bonding (114) the cover substrate (20) to the mold substrate (10) to form the sealed cavity (30) between the cover substrate (20) and the mold substrate (10). Method according to one of the preceding claims, wherein the cover substrate (20) has, on a main surface region of the cover substrate (20) facing away from the mold substrate (10), the lens material section (22) formed as a lens structure at a position which, after the step of tempering and providing an overpressure, corresponds to a side wall region (24-1) of the cover element (24) of the molded cover substrate (20'). Method according to one of the preceding claims, wherein the cover substrate (20) has, on a main surface region of the cover substrate (20) facing away from the mold substrate (10), two lens material sections (22) formed as lens structures at positions which, after the step of tempering and providing an overpressure on opposite side wall regions (24-1) of the cover element (24) of the molded cover substrate (20'), are formed as opposite lens structures (26). Method according to one of the preceding claims, wherein the cover substrate (20) has a stiffening structure (28) which is attached to the cover substrate (20) on an opposite side surface of the cover substrate (20) and is arranged opposite and centered to the lens material portion (22). procedure according to claim 6 , further comprising the step of: removing the stiffening structure (28) from the molded cover substrate (20') after the step of annealing (130) and providing an overpressure (140). Method according to one of the Claims 1 until 5 , wherein the cover substrate (20) has two opposing stiffening structures (28, 29) which are arranged on the cover substrate (20) on opposite side surfaces of the cover substrate (20) and opposite one another at a position to obtain an inclined, planar side wall region (24-1) of the cover element (24) of the molded cover substrate (20') in the step of tempering (130) and providing an overpressure (140). Method according to one of the Claims 1 until 5 , wherein the cover substrate (20) has a stiffening structure (28) which is arranged on the cover substrate (20) on an opposite side surface of the cover substrate (20) and opposite the lens material section (22) in order to form a defined surface area on the ceiling area (24-2) of the cover element (24) of the cover substrate (20') vertically opposite the lens structure (26) during the step of tempering (130) and providing (140) an overpressure on the ceiling area (24-2) of the cover element (24) of the cover substrate (20'). Method according to one of the preceding claims, wherein the cover substrate (20) has the lens material section (22) at a position on a main surface region facing away from the mold substrate (10) or on a main surface region of the cover substrate (20) facing the mold substrate (10) in order to form the lens structure (26) in the step of tempering (130) and providing an overpressure (140) on an inner top wall region of the cover element (24). Method according to one of the Claims 2 or 3 , wherein the bonding (114) of the cover substrate (20) to the mold substrate (10) is carried out in an atmosphere with a defined ambient atmospheric pressure in order to enclose a defined atmospheric pressure in the closed cavity (30). Method according to one of the preceding claims, wherein the cover substrate (20) and/or the mold substrate (10) are designed to form the closed cavity (30) with a plurality of closed cavity regions between the cover substrate (20) and the mold substrate (10), wherein the closed cavity regions (30) are arranged fluidically separated from one another, or wherein gas exchange channels (30-1) are further provided between the cavity regions (30) closed from the ambient atmosphere in order to fluidically connect them to one another in order to obtain a common defined atmospheric pressure in the connected cavity regions (30). Method according to one of the preceding claims, wherein the step of tempering (130) and providing (140) an overpressure is carried out as a glass flow process in a vacuum furnace (50) in order to obtain a defined atmospheric overpressure in the closed cavity (30) compared to the surrounding atmosphere. A method according to any preceding claim, wherein the step of removing (150) the stop element (40) and the mold substrate (10) further comprises the steps of: cooling (142) the stop element (40), the mold substrate (10) and the molded cover substrate (20'), and subsequently removing (150) the mold substrate (10) by means of an etching process. procedure according to claim 14 , further comprising the following step: subsequent removal (150) of the stop element (40) by means of an etching process. Method according to one of the Claims 1 until 14 , wherein the stop element (40) is designed as a reusable tool and has a non-stick coating (40-1) for the glass material of the cover substrate (20) at least on the region of the stop surface opposite the cavity or on the entire stop surface. Method according to one of the preceding claims, wherein the cover substrate (40) is bulged in the step of tempering (130) and providing (140) an overpressure in the region of the closed cavity (30) up to a height which is predetermined by the distance of the stop surface (40-1) from the cover substrate (20). Method according to one of the preceding claims, wherein the cavity (30) or the The region of the stop surface (40-1) of the stop element (40) opposite the cavity regions (30) is flat and parallel to the main surface region of the cover substrate (20) in order to form a flat ceiling region of the cover element (24) in the step of tempering (130) and providing (140) an overpressure. Method according to one of the Claims 14 or 15 , wherein during the cooling (142) of the molded cover substrate (20') in a temperature range above 650°C or between 650°C and 955°C, an atmospheric overpressure is caused in the closed cavity (30) compared to the surrounding atmosphere in order to produce an outward curvature of the side wall regions of the cover element (24) of the molded cover substrate (20). procedure according to claim 19 , wherein the step of annealing (130) and providing (140) an overpressure is carried out in a vacuum furnace (50), wherein the atmospheric overpressure in the closed cavity (30) relative to the surrounding atmosphere is maintained by a reduced atmospheric pressure in the vacuum furnace (50). Method according to one of the Claims 14 or 15 , wherein during the cooling (142) of the molded cover substrate (20') in a temperature range above 650°C or between 650°C and 955°C, an atmospheric negative pressure is caused in the closed cavity (30) compared to the surrounding atmosphere in order to produce an inward curvature of the side wall regions of the cover element (24) of the molded cover substrate (20'). procedure according to claim 21 , wherein the step of annealing (130) and providing (140) an overpressure is carried out in a vacuum furnace (50), wherein further the atmospheric negative pressure in the closed cavity (30) relative to the surrounding atmosphere is maintained by an increased atmospheric pressure in the vacuum furnace (50). A method according to any preceding claim, further comprising the step of: applying (160) a metallization (60) as a frame structure on connection areas (62) at non-bulged areas of the molded cover substrate (20'). A method according to any preceding claim, further comprising the step of: applying (160) an anti-reflective coating (64) to a portion of the cover member (24) of the molded cover substrate (20'). Use of the method (100) according to claim 1 for producing a cover substrate (20') for housing one or a plurality of optical components, wherein the molded cover substrate (20') forms the cover substrate with the cover element (24). Method (200) for producing a hermetically packaged optical component (1'), comprising the following steps: carrying out (210) the method (100) for producing a shaped cover substrate (20') according to one of the Claims 1 until 24 , Providing (220) a component substrate (2) with an optical component (1) arranged thereon, and connecting (230) the molded cover substrate (20') to the component substrate (2) in order to house the optical component (1). procedure according to claim 26 , further comprising the following step: carrying out the method (200) for producing packaged optical components at wafer level, wherein a plurality of optical components (1) are arranged on the component substrate (2), and wherein the molded cover substrate (20') has a plurality of cover elements (24). procedure according to claim 26 or 27 , further comprising the following step: connecting (230) the component substrate (2) and the cover substrate (20') along an intermediate connecting region (60, 61). procedure according to claim 28 , wherein the connection region (60, 61) has a metallization to form a frame structure on non-bulged regions of the molded cover substrate (20'), further comprising the step of: connecting (230) the molded cover substrate (20') and the component substrate (2) by means of a bonding frame (60, 61) which has a metallic solder material (66). procedure according to claim 28 , further comprising the following step: connecting (230) the component substrate (2) and the cover substrate (2) by means of laser direct welding, laser soldering, eutectic solder bonding, thermocompression bonding, glass frit bonding, reactive nano-metal layer soldering (RMS) or induction soldering along the connection region (60, 61). Method according to one of the Claims 27 until 30 , further comprising the following steps: separating (170) the formed cover substrate rats (20') to obtain isolated cover elements (24'), and connecting (230) the isolated cover element (24') to a component substrate (2) to obtain a housed optical component (1'). Method according to one of the Claims 27 until 30 , further comprising the steps of: connecting (230) the molded cover substrate (20') with the plurality of cover elements (24') to the component substrate (2) having a plurality of optical components (1) to obtain a plurality of packaged optical components (1'); and singulating (240) the plurality of packaged optical components (1') to obtain singulated, hermetically packaged optical components. Method according to one of the Claims 27 until 30 , further comprising the following steps: singulating (170) the formed cover substrate (20') to obtain singulated cover elements (24'), singulating (240) the component substrate (2) to obtain singulated components (1'), and connecting (240) the singulated cover element (24') to the singulated components (1') to obtain a housed optical component. Hermetically sealed optical component (1') manufactured by the manufacturing method (200) according to the claims 26 until 33 is manufactured, with the following features: the optical component (1) arranged on the component substrate (2); and the molded cover substrate (20') which provides a hermetically sealed cover for the optical component (1), within which the optical component (1) is housed, wherein the molded cover substrate (20') has the cover element (24) with the lens element (26) arranged thereon and with the curved side wall region (24-1) between the base region (24-3) and the ceiling region (24-2). Hermetically sealed optical component (1') according to claim 34 , wherein the lens element (26) in the side wall region (24-1) and/or the ceiling region (24-2) of the cover element (24) of the molded cover substrate (24) has a material that is permeable to the transmitting or receiving radiation of the optical component (1), and is provided for coupling in and/or coupling out electromagnetic radiation. Housed radiation-emitting component (1') according to claim 34 or 35 , wherein the hermetically sealed cover (20') has a reactive atmosphere and/or the cavity (30) contains exclusively inorganic substances, and/or wherein the hermetically sealed cover (20') is hermetically sealed against the penetration of water vapor.

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