DE102021209286B3 - INTEGRATED MICROSTRUCTURED TRANSCEIVER DEVICE - Google Patents

Abstract

The present invention relates to an integrated transceiver component (100) manufactured using microstructuring technology, having at least one optical emitter device (101) manufactured using microstructuring technology for emitting electromagnetic radiation and at least one acoustic receiver device (102) manufactured using microstructuring technology to receive acoustic waves , which are generated based on the photo-, opto- or thermoacoustic effect of a test object in response to the optical emitter device (101) emitted electromagnetic radiation. Both the optical emitter device (101) and the acoustic receiver device (102) are integrated on a common microtechnological substrate (110) and thus form an integrated photo-, opto- or thermoacoustic micro-transceiver component (100).

Description

The innovative concept described herein relates to an integrated transceiver component that is manufactured using microstructuring technology and has an optical emitter device and an acoustic receiver device, both of which are manufactured using microstructuring technology and are arranged on a common microtechnological carrier substrate. The integrated micro-transceiver component can be used in photoacoustic, optoacoustic or thermoacoustic measurement systems in which the advantages of optics are combined with the advantages of acoustics. These measurement systems are used, for example, in medical technology, and here in particular in imaging diagnostics.

Photo-, opto- or thermoacoustic processes are based on the excitation of acoustic waves by electromagnetic radiation. These systems or probes essentially have two main components, namely an electromagnetic source and an acoustic receiver of the photo-, opto- or thermo-acoustically induced acoustic waves.

Such methods and associated devices are, for example, in the publications U.S. 2011/0 190 617 A1 or DE 10 2016 205 024 A1 described.

The provision of electromagnetic radiation for opto-, photo- or thermoacoustic methods is decisive with regard to the penetration depth into the measurement object and the axial and lateral resolution. The aim is to achieve the largest possible, powerful illumination of a measurement object without being covered by an acoustic receiver. Likewise, the acoustic receiver should have as large an area as possible in order to receive signals with a high sensitivity and thus to measure even the smallest signals from deep sample layers. In particular for applications with a small required system size, e.g. endoscopy, mobile devices, etc., the provision of electromagnetic radiation is complex and difficult.

The electromagnetic radiation for generating a photo-, opto- or thermoacoustic signal is generated by a source or transmitter, e.g. laser [1], microwave oscillator [2], LEDs, etc. Their radiation must be directed onto the sample to be examined in order to in the sample, in response to the electromagnetic radiation, to excite an acoustic wave. In this case, the electromagnetic radiation must be guided past the acoustic converter.

Depending on the structure of such a photo-, opto- or thermoacoustic system, there are different advantages and disadvantages. For example, the electromagnetic source and the acoustic transducer can be placed opposite each other. In this case, the electromagnetic source and the acoustic transducer are operated in a transmission mode, with the sample to be examined being located between the electromagnetic source and the acoustic transducer. Covering up of the mutual fields of vision can be avoided in this way. However, there is a disadvantage here in that transmission operation is not possible with all samples, especially with medical in-vivo measurements, since the object to be examined is too large to generate acoustic waves deep enough in the tissue. In addition, bones or other objects can reflect the acoustic wave and thus shadow the receiver. The receiver then no longer measures a signal and an exact localization of the excitation point in the object is not possible.

Other setups, in which the optical path of the electromagnetic source and the acoustic path of the acoustic transducer lie on the same axis, require complex beam paths for the electromagnetic radiation or a reduction in the acoustic receiver area.

Alternative designs that are under development use acoustic receivers that are transparent in a certain electromagnetic wavelength range [4]. Disadvantages of this method, however, are transparency in a limited wavelength range and thus a limitation in the detection of wavelength-specific endogenous or exogenous chromophores. Furthermore, the transparent acoustic receiver can influence the propagation of the electromagnetic radiation, i. H. the intensity can decrease or the direction of propagation can be changed. Thus, an undesirable influence on the penetration depth and resolution is possible.

It would therefore be desirable to improve known photoacoustic, optoacoustic or thermoacoustic measuring systems in such a way that the optical and acoustic main components can be designed flexibly without negatively affecting each other (e.g. shadowing, reduction of the acoustic receiver area, etc.), and despite all of this an uncomplicated beam guidance is realized in order to enable a simple and inexpensive construction.

This goal is achieved with an integrated transceiver component manufactured using microstructuring technology for a photoacoustic, opto-acoustic or thermo-acoustic measuring systems with the features according to one of claims 1 or 4.

The inventive integrated transceiver component manufactured using microstructuring technology has at least one optical emitter device manufactured using microstructuring technology for emitting electromagnetic radiation and at least one acoustic receiver device manufactured using microstructuring technology for receiving acoustic waves. Based on the photo-, opto- or thermoacoustic effect, these acoustic waves are generated by a test object in response to the electromagnetic radiation emitted by the emitter device. According to the invention, both the optical emitter device and the acoustic receiver device are integrated on a common micro-technological substrate and thus form an integrated photo-, opto- or thermo-acoustic micro-transceiver component for a photo-, opto- or thermo-acoustic measuring system. As the name suggests, the integrated micro-transceiver component serves as both an emitter and a receiver. Electromagnetic radiation, e.g. in the form of light in a wavelength range that is visible or invisible to humans, is radiated onto a sample to be examined. The light is preferably directed onto the sample in a pulsed manner. In response to the (pulsed) light, the sample emits acoustic waves. These can be registered by means of the acoustic receiver. According to the invention, both the acoustic receiver device and the optical emitter device are manufactured using microstructuring technology. They can therefore have dimensions in the microscale or nanoscale range. According to the invention, both the optical emitter device and the acoustic receiver device are integrated on a common microtechnology substrate. A micro-technological substrate is to be understood as meaning substrates on or in which micro-technologically manufactured structures can be produced, for example by means of suitable photolithographic methods, etching and the like. For example, classic semiconductor substrates can be used for this. Classic printed circuit boards or circuit boards, so-called PCBs (PCB: Printed Circuit Board), are therefore not among the microtechnological substrates within the meaning of the present invention. The joint integration of the optical emitter device and the acoustic receiver device on a common microtechnological substrate offers the advantage that a highly compact and miniaturized transceiver component can be produced that combines the function of an optical emitter and the function of an acoustic receiver in one component. This combination can significantly simplify the otherwise complex requirements with regard to beam guidance, both the emitted optical radiation and the reflected acoustic radiation. The common integration on a common microtechnological substrate also allows any arrangement of the emitter device relative to the receiver device. In addition, the otherwise remaining inactive areas, i.e. the areas not occupied by either the emitter device or the receiver device, can be significantly minimized on the substrate. Furthermore, otherwise existing losses due to absorption, scattering and reflection of the radiation at the sample can be significantly minimized with an additional directed beam guidance onto the sample. In particular, there are no longer any shading effects since the emitter device and the receiver device can be arranged next to one another on the common microtechnology substrate. The common integration on the common microtechnological substrate also makes it possible for the integrated micro-transceiver component to be arranged as a single integrated component on a housing of a test head of a photoacoustic, optoacoustic or thermoacoustic measurement system. This eliminates the otherwise existing need to provide additional carriers and attachment options on the housing, which were previously required according to the prior art in order to attach the emitter device and the separate receiver device to a housing of such a measurement system.

A first main embodiment of the invention provides that the optical emitter device has a plurality of individual emitter elements, and the acoustic receiver device has a plurality of individual receiver elements, the individual emitter elements and the individual receiver elements each being ring-shaped and arranged concentrically next to one another are so that they form a ring-shaped emitter-receiver array on the common micro-technological substrate.

A second main embodiment of the invention provides that the optical emitter device and the acoustic receiver device are monolithically integrated by being integrated on the same chip substrate, this chip substrate forming the common microtechnological substrate, and the acoustic receiver device around the optical emitter device is arranged around.

Further embodiments and advantageous aspects of this micro-transceiver device are mentioned in the respective dependent patent claims.

• 1 eine schematische Draufsicht auf ein beispielhaft beschriebenes Mikro-Transceiver-Bauelement,
• 2A eine schematische Seitenansicht eines monolithisch integrierten erfindungsgemäßen Mikro-Transceiver-Bauelements mit einer optionalen Mikrolinse gemäß einem Ausführungsbeispiel,
• 2B eine schematische Draufsicht auf das Mikro-Transceiver-Bauelement aus 2A,
• 3 eine schematische Seitenansicht eines Beispiels für ein heterogen integriertes Mikro-Transceiver-Bauelement,
• 4 eine schematische Draufsicht auf ein beispielhaftes Mikro-Transceiver-Bauelement mit mehreren einzelnen Emitter- und Empfängerelementen, die in einer eindimensionalen (1D) Array Anordnung angeordnet sind,
• 5 eine schematische Draufsicht auf ein beispielhaftes Mikro-Transceiver-Bauelement mit mehreren einzelnen Emitter- und Empfängerelementen, die in einer zweidimensionalen (2D) Array Anordnung angeordnet sind, und
• 6 eine schematische Draufsicht auf ein erfindungsgemäßes Mikro-Transceiver-Bauelement mit mehreren einzelnen Emitter- und Empfängerelementen, die in einer Zielscheiben-förmigen Ring-Array-Anordnung angeordnet sind.

Some exemplary embodiments are shown as examples in the drawing and are explained below. Show it:

• 1 a schematic plan view of a micro-transceiver component described as an example,
• 2A a schematic side view of a monolithically integrated micro-transceiver component according to the invention with an optional micro-lens according to an embodiment,
• 2 B Figure 12 shows a schematic plan view of the micro-transceiver component 2A ,
• 3 a schematic side view of an example of a heterogeneously integrated micro-transceiver component,
• 4 a schematic plan view of an exemplary micro-transceiver component with a plurality of individual emitter and receiver elements arranged in a one-dimensional (1D) array arrangement,
• 5 a schematic plan view of an exemplary micro-transceiver device with multiple individual emitter and receiver elements, which are arranged in a two-dimensional (2D) array arrangement, and
• 6 a schematic plan view of a micro-transceiver component according to the invention with a plurality of individual emitter and receiver elements which are arranged in a target-shaped ring array arrangement.

Exemplary embodiments are described in more detail below with reference to the figures, elements with the same or similar function being provided with the same reference symbols.

Method steps that are depicted or described within the scope of the present disclosure can also be carried out in a different order than that depicted or described. In addition, method steps that relate to a specific feature of a device are interchangeable with that same feature of the device, and vice versa.

If a microtechnological substrate is mentioned within this disclosure, this is to be understood as meaning substrates on or in which microtechnologically manufactured structures can be produced, for example by means of so-called microstructuring technology, such as suitable photolithographic processes, etching and the like. The emitter device according to the invention and the receiver device according to the invention are also manufactured using such a microstructuring technique. Classic semiconductor substrates can be used in microstructuring technology. It should be explicitly mentioned again at this point that the microstructured emitter device according to the invention and the microstructured receiver device according to the invention are integrated on or in the common microtechnological substrate. This common micro-technology substrate can then in turn be arranged on a carrier substrate, e.g. a PCB (PCB: Printed Circuit Board), if required. According to the wording used here, an explicit distinction is made between an integration of components on a microtechnology substrate and an arrangement of (integrated) components on a carrier substrate, e.g. a circuit board or a PCB. Classic printed circuit boards or circuit boards, so-called PCBs, therefore do not count among the micro-technological substrates within the meaning of the present invention.

1 FIG. 1 shows a schematic plan view of an integrated micro-transceiver component 100 described purely by way of example. The micro-transceiver component 100 is manufactured using microstructuring technology. The micro-transceiver component 100 can be, for example, a so-called MEMS (Micro Electro-Mechanical System), or a purely micro-electrical or micro-mechanical system.

The MEMS transceiver component 100 has at least one optical emitter device 101 manufactured using microstructuring technology. The optical emitter device 101 can also be a so-called MEMS or a purely microelectrical or micromechanical system.

The optical emitter device 101 is designed to emit electromagnetic radiation and can therefore also be referred to as an electromagnetic source.

The emitted electromagnetic radiation can be light in a wavelength range that is visible or invisible to humans. The optical emitter device 101 can be designed, for example, to emit pulsed light or individual light pulses with a predefined frequency.

The optical emitter device 101 can have at least one light-emitting diode (LED) or a laser diode, for example. The LED can generate light in a predetermined wavelength spectrum that is visible to humans or invisible to humans. the For example, LED can emit infrared radiation or ultraviolet radiation. The laser diode, on the other hand, can emit laser light.

The micro-transceiver component 100 can be used, inter alia, in medical diagnostics, where a sample to be examined is irradiated with the electromagnetic radiation emitted by the emitter device. In response to the electromagnetic radiation emitted by the emitter device, the sample can undergo a structural shape change based on the photo-, opto- or thermoacoustic effect, whereby the sample emits acoustic sound waves. These sound waves can in particular be ultrasonic waves.

In order to receive these acoustic sound waves, the micro-transceiver component 100 has at least one acoustic receiver device 102 manufactured using microstructuring technology. The acoustic receiver device 102 can also be a so-called MEMS or a purely microelectrical or micromechanical system

The acoustic receiver device 102 can be configured to convert the received acoustic waves into an electrical signal. For this purpose, the receiver device 102 can have, for example, at least one microstructured sound transducer, for example in the form of a MEMS microphone. The electrical signal generated by the acoustic receiver device or the sound transducer can be forwarded to a signal processing device, which uses it to generate data (e.g. image data for imaging the sample to be examined).

For example, the acoustic receiver device 102 can have at least one micromechanical sound transducer, and in particular a micromechanical ultrasonic transducer, a so-called MUT (Micromachined Ultrasonic Transducer).

The micromechanical sound transducer can be designed in particular to receive sound waves in the ultrasonic range and to convert them into a corresponding electrical signal.

The micromechanical ultrasonic transducer (MUT) can be, for example, a capacitive micromechanical ultrasonic transducer, a so-called CMUT (CMUT: Capacitive Micromachined Ultrasonic Transducer). However, the micromechanical ultrasonic transducer (MUT) can also be designed as a piezoelectric micromechanical ultrasonic transducer, a so-called PMUT (PMUT: Piezoelectric Micromachined Ultrasonic Transducer).

Both the optical emitter device 101 and the acoustic receiver device 102 are integrated on a common microtechnology substrate 110 . They thus form an integrated photo-, opto- or thermoacoustic micro-transceiver component 100.

The common microtechnology substrate 110 can be, for example, a microelectronic substrate, e.g. a semiconductor substrate with one or more integrated semiconductor components. The common microtechnology substrate 110 can have silicon or consist of silicon, for example.

As already mentioned at the outset, both the optical emitter device 101 and the acoustic receiver device 102 are designed as components manufactured using microstructuring technology. Examples include the aforementioned LEDs, laser diodes, PMUTs and CMUTs, as well as optical interferometer and resonator microphones.

Due to the microstructural manufacturing processes, their respective geometric and functional structure is flexible and possible with high accuracy in the micro or nanometer range. Since both the fabrication of the microstructured optical emitter device 101 and the fabrication of the microstructured acoustic receiver device 102 can be based on the same materials and processes, the optical emitter device 101 and the acoustic receiver device 102 can be monolithically integrated on one and the same chip.

the 2A and 2 B FIG. 1 shows an embodiment of a possible monolithic integration of the optical emitter device 101 and the acoustic receiver device 102 on a common micro-technological substrate 110 according to an embodiment of the invention.

This is a monolithic integration in which the optical emitter device 101 and the acoustic receiver device 102 are integrated on one and the same chip substrate 110, i.e. the chip substrate forms the common microtechnological substrate 110 in this case the chip substrate 110 may be a semiconductor substrate, for example.

During the manufacturing process, a plurality of micro-transceiver components 100 according to the invention can be produced on a semiconductor wafer. In this case, the semiconductor wafer would be a microtechnology substrate 110 within the meaning of the present disclosure. The micro-transceiver components 100 are typically then isolated, so that several individual chips are formed, with a micro-transceiver component 100 according to the invention being integrated on each chip. Such an isolated chip is in the 2A and 2 B shown, wherein in this case the chip substrate 110 forms the common microtechnology substrate 110 according to the invention.

Optionally, the MEMS transceiver device 100 may include at least one microlens 103 optically coupled to the optical emitter device 101 . The microlens 103 is used for directional beam shaping of the electromagnetic radiation emitted by the optical emitter device 101 .

The microlens 103 can likewise be arranged on the common microtechnology substrate 110 . In this regard, the microlens 103 can be arranged, for example, on the optical emitter device 101, or else on at least one emitter element (e.g. a single LED) of the emitter device 101. The microlens 103 can be applied to the emitter device 101 by means of an ink jet printing method, for example.

In the in the 2A and 2 B In the embodiment shown, the acoustic receiver device 102 is arranged laterally around the optical emitter device 101, according to a main embodiment of the invention. For example, the optical emitter device 101, as shown purely by way of example in 2 B shown, may be located at the center of the acoustic receiver device 102. Such an arrangement can be advantageous in that the optical emitter device 101 can emit the electromagnetic radiation along a directed optical path, which can be aimed directly at the sample to be examined. The (ultra) sound waves emitted or reflected by the sample, on the other hand, can radiate diffusely along an acoustic path and scatter accordingly. An acoustic reception area that is as wide or as large as possible is therefore advantageous. This can be realized with the arrangement shown here.

The inventive arrangement of the acoustic receiver device 102 laterally around the (entire) optical emitter device 101 also offers the advantage that the optical path and the acoustic path are essentially coaxial, so that the electromagnetic radiation emitted by the emitter device 101 (on the optical path) and the (ultra) sound waves emitted or reflected by the sample (on the acoustic path) are routed as directly as possible from the emitter device 101 to the sample, or from the sample to the receiver device 102.

Alternatively, but not belonging to an embodiment of the invention, the arrangement of the emitter device 101 relative to the receiver device 102 could also be inverted, i.e. the optical emitter device 101 could be arranged laterally around the (entire) acoustic receiver device 102. Accordingly, the acoustic receiver device 102 could then also be arranged in the center of the optical emitter device 101 .

As also in 2A As can be seen, the optical emitter device 101 and the acoustic receiver device 102 can be arranged in the same plane. For example, the optical emitter device 101 and the acoustic receiver device 102 could both be directly and immediately arranged on the microengineered substrate 110 .

3 shows a conceivable alternative, not part of the invention, to that referred to in FIG 2A and 2 B discussed monolithic integration. At the in 3 The variant shown can be heterogeneous integration, ie the optical emitter device 101 and the acoustic receiver device 102 are heterogeneously integrated in that they are first integrated on different individual chip substrates 104, 105, with one of these two individual chip substrates 104, 105 then in turn forms the common microtechnology substrate 110 on which both the optical emitter device 101 and the acoustic receiver device 102 are arranged or integrated. Nonetheless, of course, each of the two chip substrates 104, 105 still represents a microtechnology substrate in itself.

Here, the optical emitter device 101 is integrated on a first chip substrate 104 and the acoustic receiver device 102 is integrated on a second chip substrate 105 different from the first chip substrate 104 .

In this case, the first chip substrate 104 is arranged on the second chip substrate 105, so that the second chip substrate 105 forms the common microtechnology substrate 110 on which both the optical emitter device 101 and the acoustic receiver device 102 are arranged or integrated.

in the in 3 In the example shown, the first chip substrate 104 is arranged on the second chip substrate 105 . This corresponds to a heterogeneous integration, in which case the first chip substrate 104 together with the optical emitter device 101 integrated thereon, but also the acoustic receiver device 102 are all on the second chip substrate 105 are arranged. This means that in this case the second chip substrate 105 forms the common microtechnology substrate 110 on which both the optical emitter device 101 and the acoustic receiver device 102 are arranged or integrated. An inverted arrangement, in which the first chip substrate 104 forms the common microtechnology substrate 110, would likewise not be within the scope of the present invention, but would also be conceivable in principle.

The optical emitter device 101 can be directly and immediately integrated in or on the first chip substrate 104 . The acoustic receiver device 102 can be integrated directly and immediately in or on the second chip substrate 105 . The first chip substrate 104 can be arranged directly and immediately on the second chip substrate 105 .

there in the in 3 In the example shown, the first chip substrate 104 has a certain height, the optical emitter device 101 arranged thereon is correspondingly spaced from the substrate surface of the second chip substrate 105, ie the optical emitter device 101 and the acoustic receiver device 102 are not in the same plane.

It would also be conceivable, for example, for the common microtechnology substrate 110 (here: the second chip substrate 105) to have a recess or depression. The first chip substrate 104 could then be arranged in this recess, so that the emitter device 101 would be spaced less far from the receiver device 102 than is the case in FIG 3 is shown. It would also be conceivable that the first chip substrate 104 would be inserted into the recess so far that the emitter device 101 and the receiver device 102 would be arranged in the same plane, comparable to 2A .

Also in the referring to 3 example discussed, analogously to that previously referred to with reference to the 2A and 2 B discussed embodiment, an optional microlens may be additionally provided, which may be located on the optical emitter device 101 or on a single emitter element.

In addition, here too the acoustic receiver device 102 can be arranged laterally around the optical emitter device 101 or around the first chip substrate 104 . For example, the optical emitter device 101 can be arranged in the center of the acoustic receiver device 102 .

It would be conceivable, but not part of the invention, for the 3 The arrangement shown is inverted, ie the optical emitter device 101 and the acoustic receiver device 102 can be interchanged, so that, for example, the optical emitter device 101 can be arranged on the second chip substrate 105 and the acoustic receiver device 102 can be arranged on the first chip substrate 104. Accordingly, the optical emitter device 101 could be arranged laterally around the acoustic receiver device 102 or around the first chip substrate 104 . Accordingly, the acoustic receiver device 102 could then be arranged in the center of the optical emitter device 101 .

As one to 3 As an alternative configuration, it would be conceivable for the first chip substrate 104 and the second chip substrate 105 to be arranged on a separate microtechnology carrier substrate. Accordingly, this separate microtechnology carrier substrate would then be the common microtechnology substrate 110 on which both the optical emitter device 101 (including the first chip substrate 104) and the acoustic receiver device 102 (including the second chip substrate 105) would be arranged. Such an arrangement could also form a heterogeneously integrated micro-transceiver component 100 .

As already mentioned, the inventive integration of the optical emitter device 101 together with the acoustic receiver device 102 on a common microtechnological substrate 110 allows a relatively free design possibility in the arrangement of the emitter or receiver device 101, 102. In addition, the emitter and the receiver device 101, 102 can be arranged side by side on the common substrate 110 in a very space-saving manner. the 4 and 5 each show examples of different arrangement options for the emitter or receiver device 101, 102 on a common substrate 110. 6 shows an embodiment belonging to the invention. the 4 until 6 each show top views of a common microtechnology substrate 110.

4 1 shows an example with an emitter device 101 arranged on the common substrate 110 with a plurality of (here by way of example two) emitter elements 101a, 101b and a receiver device 102 also arranged on the common substrate 110 with a plurality of (here by way of example two) receiver elements 102a, 102b .

Here the individual emitter elements 101a, 101b and the individual receiver elements 102a, 102b are arranged in a row along a line 106, ie in one dimension, so that the individual emitter elements 101a, 101b and the individual receiver elements 102a , 102b form a one-dimensional emitter-receiver array on the common microtechnology substrate 110. Said line 106 along which the emitter-receiver array extends can be a straight line, as in FIG 4 shown, or alternatively curved.

As an alternative to the in 4 Although the arrangement shown is along a row, the individual emitter elements 101a, 101b and the individual receiver elements 102a, 102b can also extend along a column. In this case, the line 106 or the direction in which the array extends would be offset by 90°.

in the in 4 In the example shown, the individual emitter elements 101a, 101b and the individual receiver elements 102a, 102b are arranged alternately next to one another. However, it can also be conceivable that the individual emitter elements 101a, 101b and the individual receiver elements 102a, 102b are grouped in a different way.

5 1 shows another example with an emitter device 101 arranged on the common substrate 110 with a plurality of (here by way of example ten) emitter elements 101a, 101b, ..., 101n and a receiver device 102 also arranged on the common substrate 110 with a plurality of (here by way of example ten) receiver elements 102a, 102b, ..., 102n.

The substrate 110 has a surface that extends substantially in a two-dimensional plane. This two-dimensional plane is spanned by two extension directions 107, 108, for example a length and a width of the substrate 110 along an x or y direction.

in the in 5 Example shown are the individual emitter elements 101 a, 101 b, ..., 101n and the individual receiver elements 102a, 102b, ..., 102n along several rows and columns distributed over the surface of the substrate 110 arranged so that they form a two-dimensional emitter-receiver array on the common microtechnology substrate 110 .

In the present example, the individual emitter elements 101a, 101b, ..., 101n and the individual receiver elements 102a, 102b, ..., 102n are arranged in a checkerboard arrangement. This means that the individual emitter elements 101a, 101b, . . . , 101n and the individual receiver elements 102a, 102b, .

But it would also be conceivable that the individual emitter elements 101a, 101b, ..., 101n and the individual receiver elements 102a, 102b, ..., 102n are arranged next to each other in a random arrangement, so that they are on the common micro-technological Substrate 110 form a randomized emitter-receiver array.

6 1 shows an exemplary embodiment of the present invention with an emitter device 101 arranged on the common substrate 110 with a plurality of (here by way of example two) emitter elements 101a, 101b and a receiver device 102 likewise arranged on the common substrate 110 with a plurality of (here by way of example two) receiver elements 102a, 102b.

Here the individual emitter elements 101a, 101b and the individual receiver elements 102a, 102b are each configured in the shape of a ring and are arranged concentrically to one another, so that they form a ring-shaped emitter-receiver array on the common microtechnology substrate 110. Here, too, the individual emitter elements 101a, 101b and the individual receiver elements 102a, 102b (seen in the radial direction) are arranged alternately, so that they have an approximately target-shaped pattern.

In all embodiments of the present invention, the optical emitter device 101 and the acoustic receiver device 102 are arranged on the common microtechnological substrate 110 in such a way that their respective active surface is oriented in the same direction, i.e. both point away from the substrate 110 or are from the Surface of the substrate 110 facing away. An active area of the optical emitter device 101 would be understood to mean the area which emits the electromagnetic radiation. An active area of the acoustic emitter device 102 would be the area that receives the acoustic (ultrasonic) waves.

Accordingly, the optical emitter device 101 and the acoustic receiver device 102 can be arranged, for example, on the common microtechnology substrate 110 in such a way that both the optical emitter device 101 and the acoustic receiver device 102 face a test object and are aimed at the test object from the same side. This distinguishes the inventive microstructured transceiver component 100 from other systems that work according to the transmissive principle. In contrast to this, the sample to be examined does not have to be transilluminated with the micro-transceiver component 100 according to the invention, so that an otherwise possibly insufficient penetration of the sample does not play a role here.

In principle, in all embodiments of the present invention, the above, with reference to 2A microlens described by way of example may be present, which may be arranged on the entire optical emitter device 101 . Alternatively, a microlens can be arranged on one or more individual emitter elements 101a, 101b, ..., 101n.

It also applies to all embodiments of the present invention that micro-transceiver device 100 may include at least one acoustic matching layer operably (i.e., acoustically) coupled to acoustic receiver device 102 . Such an acoustic matching layer is used for acoustic impedance matching between the receiver device 102 and a medium surrounding the receiver device 102, e.g. air. The acoustic matching layer can also be arranged on the common microtechnology substrate 110 . The acoustic matching layer can preferably be located on the acoustic receiver device 102, or on one or more individual receiver elements 102a, 102b, ..., 102n. The acoustic matching layer can have, for example, polydimethylsiloxane (PDMS) or be made of polydimethylsiloxane.

The acoustic matching layer can also serve as an optical beam shaper and thus, for example, take on the function of a previously described microlens. That is, the acoustic matching layer may be operatively (i.e., optically) coupled to the optical emitter device 101, for example, to effect beam shaping of the electromagnetic radiation emitted by the emitter device 101.

It also applies to all embodiments of the present invention that the common micro-engineered substrate 110 can have one or more micro-fluidic channels to cool the optical emitter device 101 . Accordingly, the microfluidic channels can be arranged in the vicinity of the optical emitter device 101 and functionally (cooling function) coupled to the emitter device 101 .

The present invention also relates to a photo-, opto- or thermo-acoustic measuring system with a test head which has at least one integrated photo-, opto- or thermo-acoustic micro-transceiver component 100 as described herein.

• Hierin beschrieben ist ein integrierter Wandler für photo-, opto- oder thermoakustische Anwendungen. Es werden mikrotechnologische Herstellungsverfahren genutzt, um einen flexibleren Entwurf der optischen und akustischen Eigenschaften des photoakustischen Systems (= Mikro-Transceiver-Bauelement 100) zu ermöglichen. Anstatt eine elektromagnetische Quelle (= optische Emittervorrichtung 101) und einen akustischen Empfänger 102 als getrennte Komponenten aufzubauen, sollen beide Bestandteile in einem System mittels mikrotechnologischer Verfahren integriert werden.

In the following, the present disclosure is to be briefly summarized again in other words:

• Described herein is an integrated transducer for photo, opto, or thermoacoustic applications. Micro-technological manufacturing processes are used to enable a more flexible design of the optical and acoustic properties of the photoacoustic system (= micro-transceiver component 100). Instead of constructing an electromagnetic source (= optical emitter device 101) and an acoustic receiver 102 as separate components, both components are to be integrated in one system using micro-technological processes.

The optical emitter device 101 and the acoustic receiver device 102 can be monolithic ( 2A and 2 B) or heterogeneous ( 3 ) to get integrated. This means that in addition to a monolithic integration of the two devices 101, 102 on a common chip substrate, a heterogeneous integration of two separately manufactured components (transmitter or source 101 and receiver 102) is also possible. The emitter and receiver devices 101, 102 can then be integrated into a component (micro-transceiver component) 100 by means of wafer or chip bonding processes. Both micro-technological approaches open up the potential for any arrangement of arrays or patterns of acoustic receiving areas and electromagnetic source areas on a component.

The integration of micro-lenses on the components for focusing or beam shaping is also possible for integrated photo-, opto- or thermoacoustic systems. Likewise, acoustic matching layers, e.g. PDMS, can serve as protection and beam shapers for the electromagnetic source.

Optional cooling of the electromagnetic source can be implemented using microfluidic channels, for example.

• • Keine komplexen Strahlführungen für die Bereitstellung der elektromagnetischen Strahlung notwendig,
• • Beliebige Anordnungen von elektromagnetischen Quellen und akustischen Empfängern herstellbar,
• • Kompaktes und miniaturisierbares System,
• • Minimierung der nicht aktiven Flächen,
• • Minimierung von elektromagnetischen Verlusten durch Absorption, Streuung und Reflektion bei zusätzlicher Strahlführung zur Probe,
• • Keine zusätzlichen Träger und Befestigungen am Gehäuse des photoakustischen Prüfkopfs notwendig, um die (ansonsten auf jeweils separaten PCBs montierten) photoakustische Quelle und akustischer Empfänger separat voneinander am Prüfkopf zu montieren [7],
• • MUT-Bauelemente besitzen im Vergleich zu konventionellen Wandlern eine hohe Empfangssensitivität und ein höheres Signal-Rausch-Verhältnis [5, 6]. Somit können die Signalqualität und die Eindringtiefe potentiell verbessert werden,
• • beliebige Anordnung von LED und MUT-Komponenten möglich.

The device described herein has the following advantages, among others:

• • No complex beam guides necessary for the provision of the electromagnetic radiation,
• • Arbitrary arrangements of electromagnetic sources and acoustic receivers can be produced,
• • Compact and miniaturizable system,
• • minimization of non-active surfaces,
• • Minimization of electromagnetic losses through absorption, scattering and reflection with additional beam guidance to the sample,
• • No additional supports and attachments on the housing of the photoacoustic probe are required to mount the photoacoustic source and acoustic receiver (which are otherwise mounted on separate PCBs) separately from each other on the probe [7],
• • Compared to conventional converters, MUT components have a high reception sensitivity and a higher signal-to-noise ratio [5, 6]. Thus, signal quality and penetration depth can potentially be improved
• • any arrangement of LED and MUT components possible.

• • Die Integration kann monolithisch oder heterogen erfolgen. Bei der monolithischen Integration werden die Emittervorrichtung 101 und die Empfängervorrichtung 102 auf dem gleichen Träger 110 hergestellt und betrieben. Bei der heterogenen Integration werden beide auf separaten Trägern 104, 105 hergestellt und dann auf dem Träger des jeweils anderen integriert.
• • Die Integration einer elektromagnetischen Quelle 101 beinhaltet ebenso die Herstellung von Wellenleitern direkt auf dem gleichen Träger des akustischen Empfängers 102, z.B. mittels Zwei-Photonen-Lithografie oder anderer mikrotechnologischer Herstellungsprozesse.
• • Weiterhin beschreibt der Begriff elektromagnetische Quelle 101 LEDs oder andere elektromagnetische Strahlung erzeugende Strukturen, die mittels Mikrotechnologien hergestellt werden können und damit auf einem gemeinsamen Träger 110 integriert werden können.

A photo-, opto- or thermo-acoustic system 100 with an electromagnetic source 101 and an acoustic receiver 102, which are integrated on a common micro-technological carrier 110, would be conceivable.

• • The integration can be monolithic or heterogeneous. In the case of monolithic integration, the emitter device 101 and the receiver device 102 are manufactured and operated on the same carrier 110 . In heterogeneous integration, both are fabricated on separate carriers 104, 105 and then integrated onto each other's carrier.
• • The integration of an electromagnetic source 101 also includes the production of waveguides directly on the same carrier of the acoustic receiver 102, eg by means of two-photon lithography or other micro-technological production processes.
• Furthermore, the term electromagnetic source 101 describes LEDs or other structures that generate electromagnetic radiation, which can be produced using microtechnology and can therefore be integrated on a common carrier 110 .

• • Nutzung des gleichen Materials für beide Einsatzzwecke, z.B. PDMS.
• • Nutzung von unterschiedlichen Materialien für die Einsatzzwecke.
• • Strukturierung ebendieser Materialien für die akustische und elektromagnetische Beeinflussung des Wellenfeldes, z.B. Mikrolinsen.

The integration of materials for use as an acoustic matching layer as well as a lens 103 and as an electromagnetic beam shaper would also be conceivable:

• • Use of the same material for both purposes, eg PDMS.
• • Use of different materials for the purposes.
• • Structuring of these same materials for the acoustic and electromagnetic influencing of the wave field, eg micro-lenses.

• • Nutzung von mikrofluidischen Kanalstrukturen, welche im oder auf dem Träger 104, 110 der elektromagnetische Quelle 101 hergestellt werden können.

An integration of cooling devices for the electromagnetic source 101 would also be conceivable in order to protect it from overheating and destruction

• • Use of microfluidic channel structures, which can be produced in or on the carrier 104, 110 of the electromagnetic source 101.

The embodiments described above are merely illustrative of the principles of the innovative concept described herein. It is understood that modifications and variations of the arrangements and details described herein will occur to those skilled in the art. Therefore, it is intended that the concepts described herein be limited only by the scope of the claims below and not by the specific details presented in the description and explanation of the exemplary embodiments herein.

Although some aspects have been described in the context of a device, it is understood that these aspects also represent a description of the corresponding method, so that a block or a component of a device is also to be understood as a corresponding method step or as a feature of a method step. Similarly, aspects described in connection with or as a method step also constitute a description of a corresponding block or detail or feature of a corresponding device.

Sources

1. [1] Y. Zhou, J. Yao, and L. V. Wang, "Tutorial on photoacoustic tomography," Journal of biomedical optics, vol. 21, no. 6, p. 61007, 2016, doi: 10.1117/1.JB0.21.6.061007.
2. [2] DR Bauer, X Wang, J Vollin, H Xin, and R S Witte, "Thermoacoustic imaging and spectroscopy for enhanced breast cancer detection," in 2011 IEEE International Ultrasonics Symposium, Orlando, FL, USA, Oct. 2011 - Oct. 2011, pp. 2364-2367.
3. [3] S. Jeon, J. Kim, D. Lee, J. W. Baik, and C. Kim, "Review on practical photoacoustic microscopy," Photoacoustics, vol. 15, p. 100141, 2019, doi: 10.1016/j. pacs.2019.100141.
4. [4] AK Ilkhechi, C. Ceroici, Z. Li, and R. Zemp, “Transparent capacitive micromachined ultraso nic transducer (CMUT) arrays for real-time photoacoustic applications,” Optics express, vol. 28, no. 9, pp. 13750-13760, 2020, doi: 10.1364/OE.390612.
5. [5] R Manwar, K Kratkiewicz, and K Avanaki, "Overview of Ultrasound Detection Technologies for Photoacoustic Imaging," Micromachines, vol. 11, no. 7, 2020, doi: 10. 3390/m i 11070692.
6. [6] M. Vallet et al., "Quantitative comparison of PZT and CMUT probes for photoacoustic imaging: Experimental validation," Photoacoustics, vol. 8, pp. 48-58, 2017, doi: 10.1016/j. pacs.2017.09.001.
7. [7] TS Ralston, M Omar, LC West, and JM Rothberg, "Methods and apparatuses for photoacoustic imaging," U.S. 2020/0205670 A1 , USA 62/785962 .

Claims (14)

Integrated microstructured transceiver device (100) comprising: at least one optical emitter device (101) manufactured using microstructuring technology for emitting electromagnetic radiation, at least one acoustic receiver device (102) manufactured using microstructuring technology for receiving acoustic waves which are generated based on the photo-, opto- or thermoacoustic effect of a test object in response to the electromagnetic radiation emitted by the optical emitter device (101), wherein both the optical emitter device (101) and the acoustic receiver device (102) are integrated on a common microtechnological substrate (110) and thus form an integrated photo-, opto- or thermoacoustic transceiver component (100), wherein the optical emitter device (101) comprises a plurality of individual emitter elements (101a, 101b), and wherein the acoustic receiver device (102) comprises a plurality of individual receiver elements (102a, 102b), and wherein the individual emitter elements (101a, 101b) and the individual receiver elements (102a, 102b) are each configured in the shape of a ring and are arranged concentrically next to one another, so that they form a ring-shaped emitter-receiver array on the common microtechnology substrate (110). . Transceiver component (100) according to claim 1 , the optical emitter device (101) and the acoustic receiver device (102) being monolithically integrated by being integrated on one and the same chip substrate, this chip substrate constituting the common microtechnological substrate (110). Transceiver component (100) according to claim 1 , wherein the optical emitter device (101) and the acoustic receiver device (102) are heterogeneously integrated by being integrated on different chip substrates (104, 105), wherein the optical emitter device (101) on a first chip substrate (104) is integrated, and wherein the acoustic receiver device (102) is integrated on a second chip substrate (105), and wherein one of the two chip substrates (104, 105) is on the other of the two chip substrates (104, 105) is arranged so that the other of the two chip substrates (104.105) forms the common microtechnology substrate (110). Integrated microstructured transceiver device (100) comprising: at least one optical emitter device (101) manufactured using microstructuring technology for emitting electromagnetic radiation, at least one acoustic receiver device (102) manufactured using microstructuring technology for receiving acoustic waves which are generated based on the photo-, opto- or thermoacoustic effect of a test object in response to the electromagnetic radiation emitted by the optical emitter device (101), wherein both the optical emitter device (101) and the acoustic receiver device (102) are integrated on a common microtechnological substrate (110) and thus form an integrated photo-, opto- or thermoacoustic transceiver component (100), the optical emitter device (101) and the acoustic receiver device (102) being monolithically integrated by being integrated on one and the same chip substrate, this chip substrate constituting the common microtechnological substrate (110), and wherein the acoustic receiver device (102) is arranged around the optical emitter device (101). Transceiver component (100) according to any one of the preceding claims, wherein the optical emitter device (101) and the acoustic receiver device (102) are arranged on the common microtechnological substrate (110) in such a way that both the optical emitter device (101) and the acoustic receiver device (102) face a test object and from the same side the test object are directed. Transceiver component (100) according to one of the preceding claims, wherein the common micro-technology substrate (100) is a semiconductor substrate with one or more integrated semiconductor components. Transceiver component (100) according to any one of the preceding claims, wherein the optical emitter device (101) is arranged in the center of the acoustic receiver device (102). Transceiver component (100) according to any one of the preceding claims, wherein the emitter device (101) comprises at least one light emitting light emitting diode (LED) or one laser diode. Transceiver component (100) according to any one of the preceding claims, wherein the receiver device (102) has at least one micromechanical ultrasonic transducer. Transceiver component (100) according to any one of the preceding claims, wherein the transceiver component (100) has at least one microlens (103) optically coupled to the optical emitter device (101) for beam shaping of the electromagnetic radiation emitted by the optical emitter device (101), wherein the microlens (103) is also arranged on the common microtechnological substrate (110). Transceiver component (100) according to any one of the preceding claims, wherein the transceiver component (100) has at least one acoustically coupled to the acoustic receiver device (102) acoustic matching layer for acoustic impedance matching between the receiver device (102) and a medium surrounding the receiver device (102), wherein the acoustic matching layer is also arranged on the common microtechnological substrate (110). Transceiver component (100) according to claim 11 , wherein the acoustic matching layer additionally serves as an optical beam shaper, which has an optical coupling with the optical emitter device (101) for beam shaping of the electromagnetic radiation emitted by the emitter device (101). Transceiver component (100) according to any one of the preceding claims, wherein the common microengineered substrate (110) comprises one or more microfluidic channels arranged in the vicinity of the optical emitter device (101) and operatively coupled to the emitter device (101) in order to cool it. Photo-, opto- or thermo-acoustic measuring system with a test head which has at least one integrated photo-, opto- or thermo-acoustic transceiver component (100) according to one of the preceding claims.

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