DE102024201314A1 - Device and method for activating a reactive multilayer system, manufacturing arrangement and method for producing a component - Google Patents

Abstract

A device (110) for activating a reactive multilayer system (108) comprises a capacitor (120), a charging device (122) for providing a charging voltage, a contact element (124) for applying a voltage potential of an activation voltage for activating the reactive multilayer system (108) to a stack (102) comprising the reactive multilayer system (108), and a switching device (128) with a first switching position for connecting a terminal (132) of the capacitor (120) to the charging device (122) or to the contact element (124) in order to provide the voltage potential of the activation voltage to the contact element (124).

Description

The present invention relates to a device and a method for activating a reactive multilayer system, a manufacturing arrangement and a method for producing a component.

A reactive multilayer system, such as a reactive multilayer film (RMS), can be used to bond elements.

Against this background, the present invention provides an improved device and an improved method for activating a reactive multilayer system, an improved manufacturing arrangement, and an improved method for producing a component according to the main claims. Advantageous embodiments emerge from the subclaims and the following description.

The energy required to activate a reactive multilayer system can be provided in the form of electrical energy. Advantageously, the electrical energy can be provided using a capacitor.

• einen Kondensator;
• eine Ladeeinrichtung mit einem Ladekontakt zum Bereitstellen einer Ladespannung;
• ein Kontaktelement zum Anlegen eines Spannungspotentials einer Aktivierungsspannung zum Aktiveren des reaktive Multischicht-Systems an den Stapel;
• eine Schalteinrichtung mit einer ersten Schaltstellung zum schaltbaren Verbinden eines Anschlusses des Kondensators mit dem Ladekontakt, um den Kondensator unter Verwendung der Ladespannung auf die Aktivierungsspannung aufzuladen, und mit einer zweiten Schaltstellung zum schaltbaren Verbinden des Anschlusses des Kondensators mit dem Kontaktelement, um das Spannungspotential der Aktivierungsspannung an das Kontaktelement bereitzustellen.

A device for activating a reactive multilayer system in a stack of a first component, a second component and the reactive multilayer system, wherein the reactive multilayer system is arranged between the first component and the second component and is shaped to effect a mechanical and electrically conductive connection between the first component and the second component in response to the activation, has the following features:

• a capacitor;
• a charging device with a charging contact for providing a charging voltage;
• a contact element for applying a voltage potential of an activation voltage to activate the reactive multilayer system to the stack;
• a switching device having a first switching position for switchably connecting a terminal of the capacitor to the charging contact in order to charge the capacitor to the activation voltage using the charging voltage, and having a second switching position for switchably connecting the terminal of the capacitor to the contact element in order to provide the voltage potential of the activation voltage to the contact element.

The component can be an assembly of components. The first component can be an electronic component or a sensor. For example, the first component can be a semiconductor component or power semiconductor component, a chip, or a wafer. For example, the component can be embodied as a transistor, diode, or force sensor. The second component can be a carrier for the first component. For example, the second component can be a carrier for electronic components, such as a circuit board, or a substrate, such as a copper or ceramic substrate. The second component can also be a machine element, such as a connecting element or an element for transmitting forces or movements, such as a shaft. The reactive multilayer system can be a reactive multilayer film, or RMS for short, which can provide instantaneous heat for a variety of applications in many industries. The reactive multilayer system can be produced by vapor deposition of thousands of alternating nanoscale layers, for example, made of aluminum and nickel. The reactive multilayer system can be arranged as a film between the components, or it can comprise reactive layers that have been applied successively directly to one of the components or to both components to form the reactive multilayer system. Thus, the components and the reactive multilayer system can be provided as a pre-assembled stack or as individual parts to be stacked. The electrical energy used for activation can be temporarily stored using the capacitor and transferred to the stack using the contact element. Activation can also be referred to as ignition of the reactive multilayer system. The activation voltage can be applied to the stack in such a way that the current flow caused by the activation voltage is introduced into or discharged from the reactive multilayer system via at least one of the components, or flows exclusively through the reactive multilayer system. The magnitude of the activation voltage can be selected such that the current flow in the region of the reactive multilayer system generates sufficient thermal energy to reach a temperature required to activate the reactive multilayer system. The voltage potential of the activation voltage can be applied, for example, to one of the components or to the reactive multilayer system using the contact element. For this purpose, the contact element can touch the stack or be spaced from the stack, allowing ignition sparks to arc over. The mechanical and electrically conductive connection achieved by activating the reactive multilayer system between the first component and the second component can represent a material connection, which can also be referred to as a multilayer bond connection or can be realized by multilayer bonding.

A commercially available capacitor suitable for quickly providing the activation voltage can be used as the capacitor. The charging device can have a suitable voltage source for generating the charging voltage. For example, the charging device can comprise a series circuit consisting of a voltage source and a resistor. The contact element can be shaped as an electrical contact tip. Such a contact tip enables contacting of very small contact surfaces. Furthermore, special connecting elements, such as plugs, on the stack side can be dispensed with. The switching device can have a suitable switching element, such as a transistor. By appropriately controlling the switching device, the capacitor can first be charged and then electrically connected to the stack in order to activate the reactive multilayer system.

The charging device can be configured to provide the charging voltage as a high voltage. For example, the charging voltage can be more than 1 kV. This allows for safe and rapid activation of the reactive multilayer system.

The device may comprise a control device configured to provide a first switching signal to the switching device in a preparation mode to transfer the switching device to the first switching position, and to provide a second switching signal to the switching device in an activation mode to transfer the switching device to the second switching position. In this way, charging of the capacitor and subsequent activation of the reactive multilayer system can be carried out automatically.

The control device can be configured to provide the second switching signal to the switching device only briefly or in a pulsed manner, in order to transfer the switching device to the second switching position only briefly or in a pulsed manner. As a result, the voltage potential of the activation voltage can be provided to the contact element only briefly or in a pulsed manner. This enables activation of the reactive multilayer system by a defined high-voltage pulse. "Shortly" can, for example, mean a period of less than 10 µs, less than 10 ms, or less than 1 s.

The device can comprise a displacement device for displacing the contact element. The displacement device can enable the contact element to be moved toward and away from the stack. If the contact element is already connected to one of the components, the displacement device can be used to move the contact element together with the connected component, for example, to approach the reactive multilayer system. This allows elements of the stack to be provided first, and then the contact element can be suitably positioned to activate the reactive multilayer system.

In this case, the control device can be configured to provide an approach signal to the displacement device in the activation mode to move the contact element, for example, to the reactive multilayer system or at least a component of the stack to be connected. In this way, the approach of the contact element can be synchronized with the activation.

The device can comprise a further contact element for applying a further voltage potential of the activation voltage to the stack. A circuit can be closed via the capacitor, the two contact elements, and the reactive multilayer system during activation of the reactive multilayer system. The further contact element can be designed in accordance with the contact element. The further contact element can be used, for example, to contact the reactive multilayer system or one of the components. For example, a ground potential can be applied to the stack via the further contact element.

The charging device and another terminal of the capacitor can both be connected to the additional contact element. This allows for a simple design of the charging device.

Alternatively, the device may comprise a further switching device. In a further first switching position, the further switching device may be used to connect a further terminal of the capacitor to a further charging contact of the charging device. As a result, the capacitor may be charged to the activation voltage using the charging voltage. In a further second switching position, the further switching device may be used to connect the A further connection of the capacitor to the additional contact element can be used. This allows the additional voltage potential of the activation voltage to be provided to the additional contact element. The additional switching device enables galvanic isolation between the charging device and the stack.

• einen Stapel aus einem ersten Bauelement, einem zweiten Bauelement und einem reaktiven Multischicht-System, wobei das reaktive Multischicht-System zwischen dem ersten Bauelement und dem zweiten Bauelement angeordnet ist und ausgeformt ist, um ansprechend auf eine Aktivierung eine mechanische und elektrisch leitfähige Verbindung zwischen dem ersten Bauelement und dem zweiten Bauelement zu bewirken; und
• einer genannten Vorrichtung zum Aktivieren des reaktive Multischicht-Systems.

A manufacturing arrangement for producing a component has the following features:

• a stack of a first component, a second component, and a reactive multilayer system, wherein the reactive multilayer system is arranged between the first component and the second component and is shaped to effect a mechanical and electrically conductive connection between the first component and the second component in response to activation; and
• a device for activating the reactive multilayer system.

Advantageously, the device can be used to connect a provided stack of components using an intermediately disposed reactive multilayer system. Depending on the embodiment, the contact element of the device can already contact one of the components or the reactive multilayer system before the reactive multilayer system is activated, or it can be arranged at a distance from the elements of the stack.

Depending on the embodiment, the contact element can thus be shaped to apply the voltage potential of the activation voltage to the first component or the second component or the reactive multilayer system. If one of the components is electrically conductive, an electrical circuit for activating the reactive multilayer system can be closed via this component.

• Verbinden eines Anschlusses eines Kondensators mit einem Ladekontakt einer Ladeeinrichtung zum Bereitstellen einer Ladespannung, um den Kondensator unter Verwendung der Ladespannung auf eine Aktivierungsspannung aufzuladen; und
• Verbinden des Anschlusses des Kondensators mit einem Kontaktelement zum Anlegen eines Spannungspotentials der Aktivierungsspannung an den Stapel, um das reaktive Multischicht-Systems zu aktivieren.
• Auf diese Weise kann der Kondensator zunächst aufgeladen werden. Anschließend kann die gespeicherte Energie zum Aktivieren des reaktiven Multischicht-Systems verwendet werden.

A method for activating a reactive multilayer system in a stack of a first component, a second component and the reactive multilayer system, wherein the reactive multilayer system is arranged between the first component and the second component and is shaped to effect a mechanical and electrically conductive connection between the first component and the second component in response to the activation, comprises the following steps:

• Connecting a terminal of a capacitor to a charging contact of a charging device for providing a charging voltage to charge the capacitor to an activation voltage using the charging voltage; and
• Connecting the terminal of the capacitor to a contact element for applying a voltage potential of the activation voltage to the stack to activate the reactive multilayer system.
• In this way, the capacitor can first be charged. The stored energy can then be used to activate the reactive multilayer system.

• Bereitstellen eines Stapels aus einem ersten Bauelement, einem zweiten Bauelement und einem reaktiven Multischicht-System, wobei das reaktive Multischicht-System zwischen dem ersten Bauelement und dem zweiten Bauelement angeordnet ist und ausgeformt ist, um ansprechend auf eine Aktivierung eine mechanische und elektrisch leitfähige Verbindung zwischen dem ersten Bauelement und dem zweiten Bauelement zu bewirken; und
• Verbinden eines Anschlusses eines Kondensators mit einem Ladekontakt einer Ladeeinrichtung zum Bereitstellen einer Ladespannung, um den Kondensator unter Verwendung der Ladespannung auf eine Aktivierungsspannung aufzuladen; und
• Verbinden des Anschlusses des Kondensators mit einem Kontaktelement zum Anlegen eines Spannungspotentials der Aktivierungsspannung an den Stapel, um das reaktive Multischicht-Systems zu aktivieren.

A method for manufacturing a component comprises the following steps:

• Providing a stack of a first component, a second component, and a reactive multilayer system, wherein the reactive multilayer system is arranged between the first component and the second component and is shaped to effect a mechanical and electrically conductive connection between the first component and the second component in response to activation; and
• Connecting a terminal of a capacitor to a charging contact of a charging device for providing a charging voltage to charge the capacitor to an activation voltage using the charging voltage; and
• Connecting the terminal of the capacitor to a contact element for applying a voltage potential of the activation voltage to the stack to activate the reactive multilayer system.

Depending on the embodiment, the contact element can be connected to an element of the stack before, at the same time or after the connection of the capacitor terminal to a contact element.

• 1 eine Darstellung eines Ausführungsbeispiels einer Fertigungsanordnung;
• 2 eine Darstellung eines Ausführungsbeispiels einer Fertigungsanordnung;
• 3 eine Darstellung eines Ausführungsbeispiels einer Fertigungsanordnung;
• 4 eine Darstellung einer Aktivierung eines Ausführungsbeispiels eines reaktiven Multischicht-Systems;
• 5 eine schematische Darstellung eines Bauteils; und
• 6 ein Ablaufdiagramm eines Ausführungsbeispiels eines Verfahrens zum Herstellen eines Bauteils.

The invention is explained in more detail by way of example with reference to the accompanying drawings. They show:

• 1 a representation of an embodiment of a manufacturing arrangement;
• 2 a representation of an embodiment of a manufacturing arrangement;
• 3 a representation of an embodiment of a manufacturing arrangement;
• 4 a representation of an activation of an embodiment of a reactive multilayer system;
• 5 a schematic representation of a component; and
• 6 a flow diagram of an embodiment of a method for producing a component.

In the following description of preferred embodiments of the present invention, the same or similar reference numerals are used for the elements shown in the various figures and having a similar effect, whereby a repeated description of these elements is omitted.

1 shows a schematic representation of an embodiment of a manufacturing arrangement 100 for producing a component. The manufacturing arrangement 100 comprises a stack 102 consisting of a first component 104, a second component 106, and a reactive multilayer system 108 arranged between the first component 104 and the second component 106. The reactive multilayer system 108 has not yet been ignited. Thus, the components 104, 106 are not yet permanently and firmly connected to one another as a component. Furthermore, the manufacturing arrangement 100 comprises a device 110 for activating the reactive multilayer system 108. According to one embodiment, the device 110 for activating the reactive multilayer system 108 represents a system that is used to successively contact different stacks, such as the stack 102, in order to produce components. Thus, the device 110 can be handled independently of the stack 102.

The shape and arrangement of the components 104, 106 is chosen only as an example and can also be interchanged here and in the embodiments described with reference to the following figures, so that, for example, the lower of the 1 shown components 104, 106 as the first component and the upper one of the 1 shown components 104, 106 can also be referred to as a second component.

According to one embodiment, the first component 104 is an electronic component, for example a semiconductor component, and the second component 106 is a carrier for the first component 104. For example, the second component 106 is a circuit board or a substrate, for example a copper substrate. For example, the first component 104 is a chip, merely by way of example a transistor or a diode. According to one embodiment, at least one electrical connection of the first component 104 is permanently electrically and mechanically connected to an electrical contact of the second component 106 after ignition of the reactive multilayer system 108.

According to an alternative embodiment, the first component 104 is a sensor, and the second component 106 is a machine element, for example, a shaft for an electric drive or a transmission. For example, the first component 104 is a force sensor that is firmly connected to the second component 106 after the reactive multilayer system 108 is triggered in order to detect a deformation of the second component 106.

According to one embodiment, the reactive multilayer system 108 comprises a plurality of alternating nanoscale layers and is configured to react exothermically in response to ignition, thereby establishing a material connection between the components 104, 106. For example, the reactive multilayer system 108 is embodied as a reactive multilayer film placed between the components 104, 106. Alternatively, the layers of the reactive multilayer system 108 are grown, for example, on a surface of one of the components 104, 106.

According to the approach described here, the ignition temperature required for activating the reactive multilayer system 108 is achieved by applying an electrical activation voltage to the stack 102. For example, the activation voltage is applied between two spaced-apart contact regions of the reactive multilayer system 108. Alternatively, the activation voltage can be applied, for example, between contact regions of the components 104, 106 or between a contact region of the reactive multilayer system 108 and a contact region of one of the components 104, 106.

The activation voltage is provided using the device 110 for activating the reactive multilayer system 108. The device 110 includes a capacitor 120, a charging device 122, a contact element 124, and optionally a further contact element 126, as well as a switching device 128.

Using the switching device 128, the capacitor 120 can be switchably connected either to the charging device 122 or to the contact element 124. When the capacitor 120 is connected to the charging device 122, it is charged by the charging device 122. When the capacitor 120 is connected to the contact element 124, the activation voltage stored in the capacitor 120 can be transferred via the contact element 124. tact element 124 can be used to activate the reactive multilayer system 108.

The charging device 122 has a charging contact 130 for providing a charging voltage. The switching device 120 has a first switching position in which a terminal 132 of the capacitor 120 is connected to the charging contact 130. As a result, the capacitor 120 can be charged to the activation voltage using a charging voltage provided by the charging device 122. The switching device 120 has a second switching position in which the terminal 132 of the capacitor 120 is connected to the contact element 124. As a result, a first voltage potential, here for example a positive potential, of the activation voltage is provided to a contact 134 of the contact element 124. Optionally, a discharge resistor 136 is arranged between the contact 134 and the contact element 124.

The charging device 122 has a voltage source 140 and optionally a charging resistor 142 connected in series with the voltage source 140. For example, one terminal of the voltage source 140 is connected to the charging contact 130 via the charging resistor 142, and another terminal of the voltage source 140 is connected to ground. According to one embodiment, the voltage source 140 is designed to provide a high voltage U _HV . Voltage sources commonly used in connection with electrical circuits can be used for the voltage source 140.

According to one embodiment, a second terminal 144 of the capacitor 120 is connected to ground and to a contact of the further contact element 126. This provides a second voltage potential, here, for example, a negative potential, of the activation voltage to the contact of the further contact element 126.

When the capacitor 120 is charged to the activation voltage and the switching device 128 connects terminal 132 of the capacitor 120 to contact 134 of the contact element 124, an electrical circuit can be closed via the capacitor 120, the contact element 124, the reactive multilayer system 108, and the further contact element 126. This requires that the contact elements 124, 126 touch the stack 102 or be arranged so close to the stack 102 that a voltage jump is possible.

For example, the further contact element 126 contacts the reactive multilayer system 108 and the contact element 124 is spaced from the reactive multilayer system 108. To activate the reactive multilayer system 108, the contact element 124 is brought closer to the reactive multilayer system 108 until a voltage flashover occurs or the contact element 124 contacts the reactive multilayer system 108.

According to alternative embodiments, the circuit is closed via at least one of the components 104, 106. In this case, the contact elements 124, 126 are positioned accordingly to contact at least one of the components 104, 106 or to enable a voltage flashover to at least one of the contact elements 124, 126.

According to one embodiment, the contact elements 124, 126 are formed as electrical contact tips.

Optionally, the device 110 comprises a displacement device 150 which is designed to move the contact element 124, here in the direction of the reactive multilayer system 108, in order to activate the reactive multilayer system 108.

Optionally, the device 110 comprises a control device 152 configured to control a position of the switching device 128 and additionally or alternatively a movement of the displacement device 150. For this purpose, the control device 152 is connected to the switching device 128 and additionally or alternatively to the displacement device 150 in a signal-transmitting manner. Alternatively, according to one embodiment, the device 110 has an optional interface for connecting the device 110 to a corresponding control device.

According to one embodiment, the control device 152 is configured to provide a first switching signal 160 to the switching device 128 in a preparation mode in order to transfer the switching device 128 to the first switching position for charging the capacitor 120, and to provide a second switching signal 162 to the switching device 128 in an activation mode in order to transfer the switching device 128 to the second switching position for activating the reactive multilayer system 108. According to one embodiment, the control device 152 is configured in the activation mode to provide an approach signal 164 to the displacement device 150 in order to bring the contact element 124 closer to the reactive multilayer system 108. In order to provide the activation voltage in a pulsed manner, the control device 152 is configured, according to one embodiment, to hold the switching device 128 in the second switching position only briefly.

A reactive multilayer film (RMS), which can be used as a reactive multilayer system 108 according to one embodiment, is a film that provides instant heat for a variety of applications in many industries. This reactive multilayer film is produced by vapor deposition of thousands of alternating nanoscale layers, for example, made of aluminum (Al) and nickel (Ni). Activation is triggered by a small local energy pulse from an electrical source, thus eliminating the need for additional optical or thermal sources. Such sources can optionally be used additionally. The reactive multilayer system 106 reacts exothermically and releases precise local heat up to 1500°C in fractions of a second.

Since the activation of the reactive multilayer system 108 is carried out by applying the electrical activation voltage to the stack 102 and not by a special laser or by applying a direct heat source to the reactive multilayer system 106, it is not absolutely necessary for the reactive multilayer system 108 to be accessible for ignition.

According to one embodiment, the first component 102 represents, for example, a bare chip, i.e., an unpackaged chip, which is connected to the reactive multilayer system 108, for example an RMS film, with the second component 106, for example a substrate.

By using a battery or a conventional low-voltage power supply (e.g., 9V or 12V) to provide the activation voltage for the capacitor 120, a high voltage can be used to activate the reactive multilayer system 108 instead of a low voltage. Therefore, to generate an ignition spark between the reactive multilayer system 108 and, for example, a tip of the contact element 124, the distance between the two parts does not need to be as small as when using a low voltage. This is advantageous because air has a breakdown field of approximately 3 kV/mm, meaning that with a 12V power supply, the distance is only approximately 4 µm. This can prevent successful activation of the RMS foil in certain configurations, e.g., when the RMS system is activated through a hole in a foil. Furthermore, the activation and bonding process during the ignition of the foil can be influenced, e.g., by approaching the conductive part. Furthermore, the duration of the current flow from a battery or the (fairly high) output capacitance of a low-voltage power supply is very high; it lasts as long as the circuit between the two terminals is closed. This can potentially damage sensitive equipment. Such damage can be avoided by using capacitor 120.

A further advantage of using capacitor 120 is that the energy actually transferred to the reactive multilayer system 108 is largely defined. Therefore, it is unlikely that the energy is either too low or too high above the optimal required activation energy, which also positively influences the reaction within the reactive multilayer system 108.

Using capacitor 120, the activation energy can be precisely adjusted. Activation is possible using a defined high-voltage pulse or multiple high-voltage pulses. Furthermore, the duration of the current flow is limited, enabling ignition without contact between the contact element 124 and the reactive multilayer system 108 at greater distances than when using a low voltage. Furthermore, the activation and bonding process can be influenced by bringing the contact element 124 and the reactive multilayer system 108 closer together.

According to one embodiment, an ignition spark generated by the activation voltage is not achieved with a low voltage and a longer current flow duration, but with a short pulsed high voltage provided by the capacitor 120, for example in the form of a small HV capacitor.

E

Energie

C

Kapazität des Kondensators 120

UHV

Spannung der Energiequelle 140

The capacitance and voltage level of the capacitor 120 are selected to correspond to the activation energy of the reactive multilayer system 108, for example in the form of an RMS foil: $$\text{E}=\mathrm{0,5}*{\text{C*U}}_{\text{HV}}{}^2$$

E

energy

C

Capacitor capacity 120

UHV

Voltage of the energy source 140

z

Abstand zwischen Kontaktelement 124 und reaktiven Multischicht-System 108, bei dem ein Funke entsteht

UHV

Spannung der Energiequelle 140

E

kritisches elektrisches Feld der Luft [~3kV/mm]

Therefore, the ignition distance, i.e. the distance between a tip of the contact element 124 and the reactive multilayer system 108, can be adjusted by the voltage of the energy source 140 (see equation 1). $$\text{z}={\text{U}}_{\text{HV}}/{\text{E}}_{\text{crit}}$$

z

Distance between contact element 124 and reactive multilayer system 108 at which a spark occurs

UHV

Voltage of the energy source 140

E

critical electric field of air [~3kV/mm]

• Die Schaltreinrichtung 128, beispielsweise in Form eines Schalters, befindet sich in der ersten Schaltstellung. Dies führt dazu, dass der Kondensator 120 über den Ladewiderstand 142 und die Spannungsquelle 140, beispielsweise in Form einer Hochspannungsquelle, auf die Spannung U_HV aufgeladen wird, bis der Kondensator 120 die in Gleichung 1 definierte Energie speichert.

The basic process steps are as follows according to an example:

• The switching device 128, for example in the form of a switch, is in the first switching position. This causes the capacitor 120 to be charged to the voltage U _HV via the charging resistor 142 and the voltage source 140, for example in the form of a high-voltage source, until the capacitor 120 stores the energy defined in Equation 1.

Subsequently, the switching device 128 switches to the second switching position. This results in the capacitor 120 being charged, but no current can flow.

This is followed by an approach to the reactive multilayer system 108 with the contact element 124, for example, in the form of a contact tip "+." With sufficient distance (see Equation 2), an ignition spark between the reactive multilayer system 108 and the contact element 124 activates the reactive multilayer system 108, i.e., the capacitor 120 with a defined energy (Equation 1) discharges via the discharge resistor 136. In principle, the discharge resistor 136 can also be omitted or set to 0 ohms. Activation establishes the desired connection between the components 104, 106, for example, between a component and a substrate.

The charging voltage provided by the charging device 122 can be achieved as a high voltage in the charging circuit by various methods such as transformers, high voltage generators, etc.

The contact element “+” and the other contact element “-” can also be swapped.

2 shows a schematic representation of an embodiment of a manufacturing arrangement 200 for producing a component. The manufacturing arrangement 200 corresponds to the 1 described manufacturing arrangement, with the difference that the manufacturing arrangement 200 has a device 210 which, in contrast to the device in 1 described device additionally has a further switching device 228.

The further switching device 228 is used to switchably connect the further terminal 144 of the capacitor 120 either to the charging device 122 or to the further contact element 126.

According to one exemplary embodiment, the further switching device 228 has a further first switching position in which the further terminal 144 of the capacitor 120 is connected to a further charging contact 222 of the charging device 120. If the switching device 128 is simultaneously in the first switching position, the capacitor 120 can be charged to the activation voltage using the charging voltage of the charging device 122. Accordingly, the further switching device 228 has a further second switching position in which the further terminal 144 of the capacitor 120 is connected to a contact 226 of the further contact element 126. As a result, the further voltage potential of the activation voltage can be applied to the further contact element 126. If the switching device 128 is simultaneously in the second switching position, a circuit can be closed via the capacitor 120 and the reactive multilayer system 108 in order to activate the reactive multilayer system 108.

According to one embodiment, the 1 The control device described is designed to further provide the first switching signal to the further switching device 228 in the preparation mode in order to transfer the further switching device 228 into the further first switching position for charging the capacitor 120, and to further provide the second switching signal to the further switching device 228 in an activation mode in order to transfer the further switching device 228 into the further second switching position for activating the reactive multilayer system 108.

The further switching device 228 is designed according to an embodiment in the form of a further switch with the further first switching position as the third position and the further second switching position as the fourth position and which is based on 1 described charging device is added. After charging the capacitor 120 - first switching device 128 in the first switching position, further switching device 228 in the further first switching position - the ignition circuit can now be galvanically decoupled from the charging circuit by transferring the first switching device 128 to the second switching position and the further switching device 228 to the further second switching position.

3 shows a schematic representation of an embodiment of a manufacturing arrangement 200 for producing a component. The manufacturing arrangement 200 corresponds to the 2 described manufacturing arrangement, with the difference that the stack 102 is not yet completely stacked.

By way of example, the reactive multilayer system 108 is already arranged on a surface of the second component 106. However, the first component 104 is still arranged at a distance from the reactive multilayer system 108.

According to the embodiment shown, the contact element 124 is already connected to the first component 104 and the composite of the contact element 124 and the first component 104 is brought closer to the reactive multilayer system 108 in order to activate the reactive multilayer system 108, for example using the 1 shown. In this case, the first component 104 is designed to be completely or at least partially electrically conductive, so that a current flow via the contact element 124 and the first component 104 to the reactive multilayer system 108 is possible.

According to this exemplary embodiment, the further contact element 126 contacts the second component 104. Alternatively, the further contact element 126 can contact the reactive multilayer system 108, as described with reference to the preceding figures. Alternatively, the further contact element 126 can be moved together with the contact element 124.

According to this exemplary embodiment, the conductive first component 104 is already connected to the contact element 124 and is brought together as a whole. This represents only a basic principle, but other combinations are also possible, for example, in which the contact element 124 is moved together with a composite of the first component 124 and the reactive multilayer system 108, thereby contacting the first component 124 or the reactive multilayer system 108.

4 shows a schematic representation of a reaction of an embodiment of a reactive multi-layer system 108, such as is used, for example, to manufacture a component. The reactive multi-layer system 108 is constructed, for example, from a plurality of first layers 470 and a plurality of second layers 472 arranged alternately, with optionally intermixed regions 474 being located between adjacent layers 470, 472.

A position of activation is shown schematically, exemplified in the form of an ignition spark 476. Starting from the position of activation, the material of the reactive multilayer system 108 reacts to form reacted material of a reacted reactive multilayer system 478. A corresponding propagation direction is indicated by an arrow.

The reactive multilayer system 108, according to one embodiment, is a reactive multilayer film. This is a film that provides instant heat for a variety of applications in many industries. This reactive multilayer film is manufactured by vapor deposition of thousands of alternating nanoscale layers, which are 4 schematically represented by layers 470, 472 and consisting, for example, of aluminum (Al) and nickel (Ni). Activation is triggered by a small local energy pulse from an electrical source in the form of a capacitor. The reactive multi-layer system 108 reacts exothermically to generate precise local heat up to 1500 °C in fractions of a second.

In this way, a connection that is both electrically and thermally conductive can be established, e.g. between a bare chip in electronics and a leadframe, a packaged chip and a printed circuit board, etc. - i.e., generally a connection between two parts, which are referred to here as components by way of example.

5 shows an illustration of an embodiment of a component 500. For example, the component 500 has been manufactured using a manufacturing arrangement as described with reference to the preceding figures.

The component 500 comprises a first component 104, for example an unpackaged chip, which is integrally connected to a second component 106 using an activated reactive multilayer system 478.

6 shows a flow diagram of an embodiment of a method for manufacturing a component. The component, for example, the one based on 5 The component shown can be manufactured using a manufacturing arrangement described with reference to the previous figures.

In a step 601, a stack of a first component, a second component, and a reactive multilayer system is provided. The individual elements of the stack can be provided lying one on top of the other or at least partially spaced apart from one another, as is shown, for example, by the 1 to 3 is shown.

In a step 603, a terminal of a capacitor is connected to a charging contact of a charging unit device for providing a charging voltage to charge the capacitor to an activation voltage using the charging voltage.

In a step 605, the capacitor terminal is connected to a contact element for applying a voltage potential of the activation voltage to the stack. This activates the reactive multilayer system. Optionally, the capacitor terminal is disconnected from the contact element again after a short period of time sufficient to trigger an ignition spark. Optionally, the capacitor terminal is alternately connected and disconnected to the contact element, so that the activation voltage is applied to the contact element in a pulsed manner.

Optionally, in a step 607, the contact element is moved during the single or pulsed application of the activation voltage to the contact element, i.e., brought closer to the stack or, together with at least one element of the stack, brought closer to the remaining element(s) of the stack.

According to one embodiment, steps 603, 605 and optionally step 607 are performed separately as substeps of a method for activating a reactive multi-layer system.

Reference symbol

100

Production arrangement

102

stack

104

first component

106

second component

108

reactive multilayer system

110

device

120

capacitor

122

Charging device

124

Contact element

126

additional contact element

128

Switching device

130

Charging contact

132

Connecting the capacitor

134

Contact of the contact element

136

Discharge resistance

140

Voltage source

142

Charging resistance

144

second connection

150

Traversing device

152

Control device

160

first switching signal

162

second switching signal

164

Approach signal

200

Production arrangement

210

device

222

Charging contact

226

Contact of the further contact element

228

additional switching device

470

first layer

472

second layer

474

mixed regions

476

ignition spark

478

activated reactive multilayer system

500

component

601

Deployment step

603

Connecting step

605

Connecting step

607

Step of moving

Claims (10)

Device (110; 210) for activating a reactive multilayer system (108) in a stack (102) comprising a first component (104), a second component (106), and the reactive multilayer system (108), wherein the reactive multilayer system (108) is arranged between the first component (104) and the second component (106) and is shaped to effect a mechanical and electrically conductive connection between the first component (104) and the second component (106) in response to the activation, the device (110; 210) having the following features: a capacitor (120); a charging device (122) with a charging contact (130) for providing a charging voltage; a contact element (124) for applying a voltage potential of an activation voltage to activate the reactive multilayer system (108) to the stack (102); and a switching device (128) having a first switching position for connecting a terminal (132) of the capacitor (120) to the charging contact (130) in order to charge the capacitor (120) to the activation voltage using the charging voltage to charge, and with a second switching position for connecting the terminal (132) of the capacitor (120) to the contact element (124) in order to provide the voltage potential of the activation voltage to the contact element (124). Device (110; 210) according to Claim 1 , wherein the charging device (122) is designed to provide the charging voltage as a high voltage. Device (110; 210) according to one of the preceding claims, with a control device (152) which is designed to provide a first switching signal (160) to the switching device (128) in a preparation mode in order to transfer the switching device (128) into the first switching position and to provide a second switching signal (162) to the switching device (128) in an activation mode in order to transfer the switching device (128) into the second switching position. Device (110; 210) according to Claim 3 , in which the control device (152) is designed to provide the second switching signal (162) to the switching device (128) only briefly or in a pulsed manner in the activation mode, to transfer the switching device (128) only briefly or in a pulsed manner into the second switching position, in order to provide the voltage potential of the activation voltage to the contact element (124) only briefly or in a pulsed manner. Device (110; 210) according to one of the Claims 3 or 4 , with a displacement device (150) for moving the contact element (124), wherein the control device (152) is designed to provide an approach signal (164) to the displacement device in order to move the contact element (124). Device (210) according to one of the preceding claims, with a further contact element (126) for applying a further voltage potential of the activation voltage to the stack (102) and with a further switching device (228) with a further first switching position for connecting a further terminal (144) of the capacitor (120) to a further charging contact (222) of the charging device (122) in order to charge the capacitor (120) to the activation voltage using the charging voltage, and with a further second switching position for connecting the further terminal (144) of the capacitor (120) to the further contact element (126) in order to provide the further voltage potential of the activation voltage to the further contact element (126). Manufacturing arrangement (100; 200) for manufacturing a component (500), wherein the manufacturing arrangement (100; 200) has the following features: a stack (102) comprising a first component (104), a second component (106) and a reactive multilayer system (108), wherein the reactive multilayer system (108) is arranged between the first component (104) and the second component (106) and is shaped to effect a mechanical and electrically conductive connection between the first component (104) and the second component (106) in response to an activation; and a device (110; 210) according to one of the Claims 1 until 6 to activate the reactive multilayer system (108). Production arrangement (100) according to Claim 7 , wherein the contact element (124) is shaped to apply the voltage potential of the activation voltage to the first component (104) or the second component (106) or the reactive multilayer system (108). A method for activating a reactive multilayer system (108) in a stack (102) comprising a first component (104), a second component (106), and the reactive multilayer system (108), wherein the reactive multilayer system (108) is arranged between the first component (104) and the second component (106) and is shaped to effect a mechanical and electrically conductive connection between the first component (104) and the second component (106) in response to the activation, the method comprising the following steps: Connecting (603) a terminal (132) of a capacitor (120) to a charging contact (130) of a charging device (122) for providing a charging voltage in order to charge the capacitor (120) to an activation voltage using the charging voltage; and Connecting the terminal (132) of the capacitor (120) to a contact element (124) for applying a voltage potential of the activation voltage to the stack (102) to activate the reactive multilayer system (108). A method for producing a component (1000), the method comprising the following steps: providing (601) a stack (102) comprising a first component (104), a second component (106) and a reactive multilayer system (108), the reactive multilayer system (108) being arranged between the first component (104) and the second component (106) and being shaped to form a mechanical and electrically conductive layer in response to activation connection between the first component (104) and the second component (106); and connecting (603) a terminal (132) of a capacitor (120) to a charging contact (130) of a charging device (122) for providing a charging voltage in order to charge the capacitor (120) to an activation voltage using the charging voltage; and connecting (605) the terminal (132) of the capacitor (120) to a contact element (124) for applying a voltage potential of the activation voltage to the stack (102) in order to activate the reactive multilayer system (108).