DE102011100070A1 - Method for optically personalizing portable data carriers - Google Patents

Abstract

The invention relates to a method for the optical personalization of portable data carriers, a method for producing the data carrier and the data carrier itself, wherein the data carriers are in particular chip cards and especially subscriber identification modules. The data carriers have a first form factor and are incorporated into a form adapter for proper function. The form adapter has a shape factor different from the first form factor. Initially, the data carrier is produced on a carrier substrate tape (20) and then personalized electronically. Thereafter, personalization data (11) corresponding to the electrical personalization data is applied to an upper surface of the data carrier.

Description

The invention relates to a method for the optical personalization of portable data carriers, a method for producing these data carriers and the data carrier, in particular a subscriber identification module for use in a mobile communication terminal.

In a portable data carrier is preferably to disk with appropriate security features such. As smart cards, smart cards, M2M modules or subscriber identification cards. In particular, the invention relates to chip edges with external dimensions which are still below the normalized standard dimensions of conventional SIM cards.

From the DE 10 2004 028 218 A1 a manufacturing method for portable data carriers is known, in which the potting compound is formed such that the data carrier is already configured in a form factor. The carrier substrate tape is separated with a punching tool and is then part of the data carrier.

In view of an increasing miniaturization of mobile communication terminals or an increasing functionality of the communication terminals, a constant need for the further reduction of the standard called "mini-plug-in" standard for SIM smart cards is foreseen and desirable.

A need continues to be that the SIM cards can continue to operate in older communication devices or in terminals that require a different form factor for SIM cards.

Therefore, it has been customary to use form adapters, also called plug-ins. Plug-ins are smart cards in ID-000 or ID-3FF format. One of the corners of the plug-in is bevelled to facilitate orientation for the user of the card when inserting it into the terminal. Typically, plug-ins have been made from a 54x85.6mm size ISO-ID ID-1 card. During production, a cavity is milled into the body of this card, into which a prefabricated chip card module is inserted, which comprises ISO contact surfaces and a chip contacted with the contact surfaces in an electrically conductive manner, which is encased with the potting compound for protection against damage. The plug-in is then punched out of the ID-1 card or broken out by the user. Alternatively, the card can be produced directly in plug-in format, for example in injection molding technology, and the chip card module can be retrofitted in it.

During the production of the data carrier, the semiconductor circuit is initialized and personalized with electronic, that is to say, vendor-specific, vendor-specific and user-specific profiles are introduced into the memory area of the data carrier. For example, during electrical personalization, the data carrier receives a unique IMSI with which the subscriber uniquely identifies himself in the mobile radio network. Through this personalization of the disk is electrically individualized.

If the chip module is introduced into a form adapter, the data carrier is optically personalized in a further production process, that is to say the electrical personalization data are also partly printed on the card body in order to be able to identify the semiconductor circuit after production.

This optical personalization has hitherto been an extra manufacturing step and only possible with great difficulty in terms of the machine, since the semiconductor chip has to be read out or the production has to be carried out piece-by-piece the insertion of the data carrier in the form adapter.

The invention is therefore based on the object to further simplify the production of data carriers on. In particular, data carriers that are already manufactured in a first form factor should be personalized more efficiently. The backward compatibility with other form factors has to be guaranteed. In particular, it should be achieved in a personalization step that the data carrier is both personalized optically and electrically finished.

The object of the invention is achieved by the measures described in the independent independent claims. Advantageous embodiments are described in the respective dependent claims.

In particular, the object is achieved by methods for optically personalizing portable data carriers, in particular chip cards, wherein the data carriers have a first form factor and for functionally appropriate determination in a form adapter which has a different form factor from the first form factor, are introduced. The method comprises the steps of: producing the data carrier on a carrier substrate; Electrically personalizing the data carrier; and applying personalization data corresponding to the electrical personalization data to an upper side of the data carrier.

The first form factor is preferably a form factor of the already standardized and known form factors ID-1, ID-000 and ID-3FF and in particular has smaller outer dimensions. It can not be ruled out that the first form factor is a future standardized form factor for SIM cards, in particular with reduced dimensions to the ID-3FF form factor.

The optical personalization data are, for example, subscriber-specific data, such as the International Mobility Subscriber Identity Number, IMSI, data carrier-specific data, such as a serial number of the SIM card, manufacturer-specific information, such as product cycle number or code number of the manufacturer and / or mobile operator-specific data.

The optical personalization data are preferably applied to the potting compound, which is arranged in SIM cards on the opposite side of the contact surface side. This is done by means of pressure or laser process. This is preferably done before the separation of the data carriers, that is, the punching out of the data carriers for obtaining individual data carriers, which are then actually used as subscriber identification modules.

This ensures that the data carriers are optically personalized after electrical personalization. This production step therefore no longer needs to be stored downstream, which enormously simplifies the assignment of optical and electronic personalization data.

The obtained data carrier in the first form factor can now be used a variety of different form adapter, such as ID-1, ID-000, ID-3FF. These form adapters are well known and described. In order to keep the optical personalization data visible through the respective mold adapter, the respective mold adapter has a transparent region. The applied to the potting compound optical personalization data are now visible and visible even after the introduction into the form adapter through the visible area. Thus, the disk can be used in any type of form adapter without the form adapter must be optically personalized in a further personalization process with the electrical personalization data corresponding. If the form adapter is such that the data carrier is introduced into a cavity of the form adapter, then the bottom of the cavity should be transparent, so that the optical personalization data are visible from the outside after inserting the data carrier.

A transparent region is understood in particular to be a region that is transparent to the human eye. Alternatively, the mold adapter can be made entirely of a transparent material.

In an alternative embodiment, the optical personalization data are applied only after the separation and after the introduction of the data carrier in the form adapter. This embodiment is useful when the mold adapter has a cavity and the bottom of the cavity is very thin-walled. By means of a tool, for example a laser, the optical personalization data are then applied through the rear wall of the form adapter to the potting compound of the data carrier. As a result of this embodiment, the form adapter and the data carrier are marked at the same time, which has hitherto been carried out in two personalization steps.

In particular, the data carrier is mechanically releasably introduced into the mold adapter. This is done for example by means of releasable adhesive, snap or clamp connections, as they are known from the prior art, the advantage is that the disk has the optical personalization data and in another form adapter, for example, when using another mobile communication terminal, which another form adapter needed, can be used.

Alternatively, the data carrier can also be introduced mechanically insoluble in the form adapter. By means of suitable adhesive media and adapter are permanently connected. This can then be a production step if it is established that the data carriers are intended for only one type of form adapter. The adhesive must be transparent in the cured state, if the design is selected with partially transparent form adapters.

Since the data carriers will in future always have smaller dimensions, it may be difficult for a user to be able to determine or read out all optical personalization data. Therefore, it is advantageous if the optical personalization data can be read out by machine so that a barcode scanner or high-resolution camera can be used to determine which data carrier is involved.

The object is further achieved by a portable data carrier, in particular a subscriber identification module for appropriate use in a mobile communication terminal. The data carrier has - a carrier substrate; a semiconductor integrated circuit on a first top side of the carrier substrate; a contact surface field with at least one contact surface on a second top side opposite the first top Top of the carrier substrate, wherein the contact surface for communicating with external terminals is electrically connected to the semiconductor circuit; and a potting compound on the second top side of the carrier substrate for protecting the semiconductor circuit, wherein the potting compound is shaped such that the data carrier is configured in a first form factor. The data carrier has optical personalization data, which are applied to the potting compound of the data carrier. These visual personalization data are also visible when the data carrier is inserted into a form adapter with a form factor different from the first form factor for the intended use in a mobile communication terminal.

The object is further achieved by a method for producing portable data carriers in a first form factor. The method comprises: providing a carrier substrate tape on which a plurality of data carriers are arranged with arranged on a first top surface of the carrier substrate tape contact surface field; Arranging the semiconductor integrated circuit on a second top side of the carrier substrate tape opposite the first top side; The casting of the integrated semiconductor circuit by means of a potting compound, wherein the potting compound is shaped such that the data carrier has a first form factor; Electric personalization of data carriers; and optically personalizing the data carriers by applying optical personalization data corresponding to the electrical personalization data to the data carrier.

The invention or further embodiments and advantages of the invention will be explained in more detail with reference to figures, the figures only describe embodiments of the invention. Identical components in the figures are given the same reference numerals. The figures are not to be considered as true to scale, it can be exaggerated large or exaggerated simplified individual elements of the figures.

Show it:

1 A data carrier according to a first embodiment of the invention

2 A top view of the in 1 illustrated data carrier according to the invention

3 A plan view of a data carrier according to the invention, introduced into a form adapter according to the invention

4 A plug-in with an incorporated chip module according to the prior art

5 A carrier substrate tape with data carriers according to the invention from a first plan view

6 A carrier substrate tape with data carriers according to the invention from a second plan view

7 A data carrier according to the invention in a form adapter according to a first embodiment of the invention

8th A data carrier according to the invention in a form adapter according to a second embodiment of the invention

1 shows a cross section through a portable data carrier in a first form factor 7 , The data carrier is in this case a subscriber identification module, SIM for short, which can be set up in a mobile device. Alternatively, form adapters according to 3 used to bring the SIM card in the mobile device in the intended manner.

The SIM card has a carrier substrate 2 on. On the first top 21 of the substrate 2 becomes a contact surface field 3 consisting of several contact surfaces 3a . 3b . 3c educated. On the second top 22 is the semiconductor chip 4 arranged. In 1 is the semiconductor chip by means of wire-bond wiring with the contact surfaces 3a . 3b . 3c electrically connected to allow electrical data communication between the semiconductor chip of the SIM card and the mobile device. Alternatively, the connection can be designed in flip-chip technology.

The form factor 7 is during production of the data carrier by targeted shaping of the potting compound 1 achieved, which sheathes and protects the semiconductor chip. On the potting compound 11 are optical personalization data 11 applied to the electrical personalization data during electrical personalization in the semiconductor chip 4 were introduced, correspond. The optical personalization data 11 are, for example, subscriber-specific data, such as the International Mobility Subscriber Identity Number, IMSI short, data volume-specific data, such as a serial number of the SIM card, manufacturer-specific information, such as product cycle number, date of manufacture or identification of the manufacturer and / or mobile operator-specific data. Thus, the disk is immediately identifiable without having to be read electrically.

This optical personalization data 11 are applied to the disk in connection with the electrical personalization of the data carrier, in particular in a printing, laser, milling or etching process.

Under first form factor 7 In particular, a standardized form factor for the form adapters ID-1, ID-000 or ID-3FF is understood for SIM cards, which in particular has smaller outer dimensions. It is not excluded that this first form factor 7 is also standardized in the future.

In 2 the data carrier according to the invention is shown in a plan view and in particular shows the contact field 3 with the known and standardized contact surfaces in the prior art 3f for power supply; 3c for reset; 3e for tact; 3b for ground; 3a for example, a data transmission using a single-wire protocol, short SWP and 3d for an input / output data transmission.

The semiconductor chip 4 is usually central below the ground contact area 3b arranged and usually not visible when viewing the disk in plan view. The data carrier essentially has the shape of the contact field 3 , what by the form factor 7 in 2 is indicated. Thus, the essential shaping is through the contact field 3 given.

In 3 is now the disk with form factor 7 introduced into the already standardized form adapter. In particular, the form adapter with the second form factor is shown 8th shown, which corresponds to the ID-3FF form factor and is also referred to as mini-plug-in SIM. Furthermore, the mold adapter with the third form factor 9 shown, which corresponds to the ID-000 format and is also referred to as a plug-in SIM. Finally, the form adapter is the fourth form factor 10 shown, which corresponds to the ID-1 format, the standard measure for chip cards and smart cards. In addition, other form factors that are not the ISO 7816 or GSM standard possible, in which the disk with the first form factor 7 can be used.

In 3 are now all common form adapter 8th . 9 . 10 represented, in which the disk can be used. Here it is thought that the user decides which form adapter after receiving the SIM by the mobile service provider 8th . 9 . 10 he wants to use and breaks this out on the basis of the drawn webs. Alternatively, it is also conceivable that the disk machine in only one of the form adapter 8th . 9 . 10 is used and thus the user is provided only a form adapter.

In 4 is an ID-000 plug-in SIM form adapter 9 according to the prior art, which has a third form factor and has been broken out of an ID-1 form adapter. In a cavity 13 is the chip module consisting of contact surfaces 3 , Potting compound and semiconductor chip 4 used and glued. The optical personalization with application of the personalization data 11 is carried out independently and in an additional production step. This is costly, time and cost inefficient, especially since the additional miniaturization will allow more form factors, which will further limit the space for the label.

In 5 is a carrier substrate tape 20 shown in a first plan view, so that the first top 21 you can see. On the carrier substrate tape are fragmentary 8th SIM card data carrier presented that has a first form factor 7 exhibit. In this manufacturing process, the electrical personalization of the data carriers for describing memory areas of the data carrier is carried out with individual and specific data.

In 6 is the carrier substrate tape 20 of the 5 shown in a back view. Here are the data carriers with potting compound 1 in the form of the first form factor 7 shown. After electrical personalization, the optical personalization data is applied here 11 directly on the potting compound. Thus, the personalization data can be quickly and automatically 11 be applied before the separation of the disk. In a subsequent step, these data carriers are separated and can now be used directly in mobile communication terminals or by means of form adapter 8th . 9 . 10 be brought into other forms.

In a subsequent step, the data carriers are separated as usual, that is to say by means of a punching tool, the individual data carriers from the carrier substrate tape 20 separated. The volume in the first form factor 7 is finished and already has the optical personalization at this time 11 on.

In departure of the 5 and 6 is already isolated in an unrepresented variant of the disk. These data carriers are delivered in their own packaging, so-called blister tape, whereby the packages are interconnected so that a large number of machines can be processed by machine.

In 7 is a first embodiment of a form adapter 9 of the third form factor. The mold adapter has an unillustrated cavity 13 on, in which the disk is inserted. The bottom of the cavity 13 is at least partially transparent. Through the transparent area 12 are the, on the potting compound 1 the data carrier applied optical personalization data 11 visible through. A user of the volume and the form adapter 9 Thus, without removing the disk is able to the data 11 read.

The transparent area 12 is shown here in the form of the data carrier, so that the entire Vergussmassenoberseite is visible through this area. Alternatively, the entire bottom of the form adapter 9 made in a transparent material. Alternatively, the entire mold adapter is made in a transparent material.

In an unrepresented embodiment, the form adapter is 8th . 9 . 10 designed as a frame. The disk is thus held only on the side walls in the form adapter. This has the advantage that the data carrier can already have a greater thickness, so that more functionality in the semiconductor chip 4 can be introduced.

In 8th is one too 7 illustrated alternative embodiment. Here is also an unrepresented cavity 13 in the form adapter 9 , in which the volume with the first form factor 7 is introduced. The data carrier is only electrically personalized at this time and receives its optical personalization data 11 by input or laser of the optical personalization data 11 through the back wall of the mold adapter 9 therethrough. Such form adapter are cheaper to produce as a form adapter with transparent areas.

The data carriers can be introduced mechanically detachably or mechanically non-detachably into the form adapter. For releasable design variants are adhesive connectors with low adhesion, detent or clamp connections, as they are widely known in the art.

Non-releasable mechanical connection is made in particular by adhesives 6 achieved for the embodiment according to 7 should be transparent in the cured state or alternatively not in the area of personalization data 11 should be arranged.

LIST OF REFERENCE NUMBERS

1

potting compound

2

carrier substrate

20

Carrier substrate band

21

First top of the carrier substrate

22

Second top of the carrier substrate

3

Contact field

3a, b, c

contact area

4

Integrated semiconductor chip

5

Smart card body

6

adhesive

7

First form factor

8th

Form adapter with second form factor

9

Form adapter with third form factor

10

Form adapter with fourth form factor

11

Optical personalization data / serial number / IMSI

12

Transparent area

13

Cavity in the mold adapter

QUOTES INCLUDE IN THE DESCRIPTION

This list of the documents listed by the applicant has been generated automatically and is included solely for the better information of the reader. The list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions.

Cited patent literature

• DE 102004028218 A1 [0003]

Cited non-patent literature

• ISO 7816 [0042]

Claims (15)

Method for optically personalizing portable data carriers, in particular chip cards, the data carriers having a first form factor ( 7 ) and for proper function in a mold adapter ( 8th . 9 . 10 ) one of the first form factor ( 7 ) having different form factor are introduced, with the method steps: - producing the data carrier on a carrier substrate ( 2 ); - Electrical personalization of the data carrier; - applying personalization data corresponding to the electrical personalization data ( 11 ) on an upper side of the data carrier. The method of claim 1, wherein the data carrier is configured as a subscriber identification module and is introduced for use in a mobile communication terminal and the top of the data carrier is the top surfaces opposite the contact surfaces. Method according to one of the preceding claims, wherein due to the potting compound ( 1 ) of the volume in the first form factor ( 7 ) and the optical personalization data ( 11 ) on the potting compound ( 1 ) are applied. Method according to one of the preceding claims, wherein the optical personalization data ( 11 ) are applied to the disk prior to singulation. The method of claim 4, wherein the mold adapter ( 8th . 9 . 10 ) a transparent area ( 12 ), whereby the optical personalization data applied to the data medium before separation ( 11 ) after inserting the data carrier in the form adapter ( 8th . 9 . 10 ) remain visible. Method according to claims 1 to 3, wherein the optical personalization data ( 11 ) only after the separation and the introduction into the form adapter ( 8th . 9 . 10 ) are applied to the disk by means of laser. Method according to one of the preceding claims, wherein the data carrier mechanically releasable in the form adapter ( 8th . 9 . 10 ) is introduced. Method according to one of the preceding claims, wherein the data carrier mechanically inseparable in the form adapter ( 8th . 9 . 10 ) is introduced. Method according to one of the preceding claims, wherein the optical personalization data ( 11 ) are readable by machine. Portable data carrier, in particular a subscriber identification module for convenient use in a mobile communication terminal, comprising: - a carrier substrate ( 2 ); A semiconductor integrated circuit ( 4 ) on a first upper side ( 21 ) of the carrier substrate ( 2 ); - a contact surface field ( 3 ) with at least one contact surface ( 3a . 3b . 3c ) on one of the first upper side ( 21 ) opposite the second upper side ( 22 ) of the carrier substrate ( 2 ), where the contact surface ( 3a . 3b . 3c ) for communicating with the mobile communication terminal in an electrically conductive manner with the semiconductor circuit ( 4 ) connected is; and - a potting compound ( 1 ) on the second upper side ( 22 ) of the carrier substrate ( 2 ) for protecting the semiconductor circuit ( 4 ), the casting compound ( 1 ) is shaped such that the data carrier in a first form factor ( 7 ) is configured; characterized in that - optical personalization data ( 11 ) of the data carrier on the potting compound ( 1 ) and these optical personalization data ( 11 ) even when inserting the data carrier in a form adapter ( 8th . 9 . 10 ) with a first form factor ( 7 ) different form factor for the intended use in the mobile communication terminal are visible. Portable data carrier according to claim 10, wherein the optical personalization data ( 11 ) are readable by machine. Method of manufacturing portable data carriers in a first form factor ( 7 ) comprising the following steps: - providing a carrier substrate tape ( 20 ) on which a plurality of data carriers with on a first top ( 21 ) of the carrier substrate tape ( 20 ) arranged contact surface field ( 3 ) are arranged; Arranging the semiconductor integrated circuit ( 4 ) on one of the first upper side ( 21 ) opposite the second upper side ( 22 ) of the carrier substrate tape ( 20 ); Potting the semiconductor integrated circuit ( 4 ) by means of a potting compound ( 1 ), the casting compound ( 1 ) is shaped such that the data carrier has a first form factor ( 7 ) having; - Electrical personalization of the data carriers; and - optically personalizing the data carriers by applying optical personalization data corresponding to the electrical personalization data ( 11 ) on the disk. The method of claim 12, wherein the data carrier is singulated after the optical personalization. The method of claim 12, wherein the data carrier is singulated prior to optical personalization. Method according to claims 12 to 14, wherein the optical personalization data ( 11 ) are machine readable.

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