DE102014211827A1 - Method for producing and intermediate product of an injection-molded circuit carrier and injection-molded circuit carrier - Google Patents

Abstract

The invention relates to a method and an intermediate product for producing an injection-molded circuit carrier (30) and an injection-molded circuit carrier (30). In order to be able to produce the circuit carrier (30) in a simple manner, the latter has a holding element (14) for positive connection with a counter holding element (4) of a carrier (1) for a connection element for contacting printed conductors (23) of the circuit carrier (30).

Description

The present invention relates to a method for producing an injection-molded circuit carrier, in which a base body of the circuit substrate is injection-molded and conductor tracks are applied to the base body. Furthermore, the present invention relates to an intermediate product of an injection-molded circuit carrier, with an injection-molded base body and arranged thereon conductor tracks. Moreover, the present invention relates to an injection-molded circuit carrier having a main body having tracks.

State of the art

Methods of making injection molded circuit boards, injection molded circuit board intermediates, and injection molded circuit boards are well known. Arranged on the main body traces, so for example electrical components interconnecting contact tracks and / or plug contact elements and layer connectors are often formed lithographically on the body and are then to contact, for example, to check them. For example, the printed conductors must be brought into contact with a voltage source in order to be able to check them. Injection-molded circuit carriers often have a multiplicity of conductor tracks to be contacted. For example, an injection-molded circuit carrier may have fifty interconnects which are each to be contacted twice in turn. However, attaching one hundred contact points makes it difficult to manufacture the injection-molded circuit substrate. Consequently, it is known in the art to contact the interconnects in common. However, before the injection-molded circuit carrier can be processed further, the common contact must be removed. If this happens mechanically, there is a risk that the body will be damaged. A separation can be done, for example, by milling or laser induced. However, these known methods are expensive. In addition, dust and metallic chips can form, which can cause contamination or a short circuit. Consequently, the injection-molded circuit carrier is subsequently cleaned with care, thereby complicating the manufacture of the injection-molded circuit carrier.

Disclosure of the invention

According to the invention a method of the type mentioned is provided, in which the base body with a holding element and a support for a connection element for contacting at least one of the conductor tracks are configured with a counter-holding element, wherein the holding element and the counter-holding element are formed, together a positive connection train. Furthermore, an intermediate product of an injection-molded circuit carrier of the type mentioned above is provided according to the invention, wherein the intermediate product has a carrier for a connection element for contacting printed conductors of the injection-molded circuit carrier, and the base body has a holding element and the carrier has a counter holding element, which forms the base body and the carrier in a form-fitting manner connect with each other. Furthermore, the invention provides an injection-molded circuit carrier of the aforementioned type, wherein the base body has a holding element for positive connection with a counter-holding element of a carrier for a connection element for contacting the conductor tracks.

In the manufacture of the circuit substrate, the conductor tracks can be contacted by means of the connection element, for example to test their correct formation. If the connection element is no longer needed, then the carrier can be easily detached from the body without damaging the body thereby. In particular, the positive connection can be easily solved, for example, by a manual or automated removal of the carrier from the body. Elaborate sawing or milling, which would possibly lead to contamination of the body, are not necessary.

The solution according to the invention can be further improved by various configurations which are advantageous in each case and, if not stated otherwise, can be combined with one another as desired.

In order to be able to connect at least one of the conductor tracks to the connection element in an electrically conductive manner, at least one connection element and one of the conductor tracks can be electrically conductively connected to one another and be formed from the conductor path via the holding element and the counter holding element to the connection element.

When separating the carrier from the main body, the connecting element can be interrupted and, for example, torn. In particular, by releasing the positive connection, the connecting element can be interrupted and, for example, torn, so that no additional process steps for interrupting the connecting element are necessary. Rather, the positive connection can be solved simultaneously with the interruption of the connecting element. Alternatively, the connecting element before releasing the positive connection interrupted or at least mechanically weakened to form a predetermined separation point. The interruption of the connecting element can therefore be optimized separately from the release of the carrier from the main body. For example, the connecting element can be severed mechanically or by means of a laser or at least mechanically weakened.

The conductor tracks, the connecting element and the at least one connecting element can be applied to the base body or to the carrier after the base body and the carrier have been positively connected to each other. This avoids that the base body or the carrier is to be provided in several steps with electrically conductive materials, whereby the injection-molded circuit carrier can be made more efficient.

In the production of the injection-molded circuit carrier, it may be necessary to thicken at least the conductor tracks or also other line elements of the circuit carrier in order to mechanically stabilize them and to increase their conductivity. Consequently, the conductor tracks can be galvanically coated and for this purpose an electrical voltage can be applied to the connection element. After the galvanic coating, the positive connection between the base body and the carrier can be released if the connection element connected to the one of the conductor tracks impairs the function of the circuit carrier.

Not only the main body, but also the carrier can be produced by injection molding. In this case, the positive connection can be formed during injection molding of the base body and / or the carrier, so that they are not subsequently combined after injection molding. For example, first the carrier can be formed with the counter-holding element and in particular injection-molded. Cross-sections of the holding element and the counter-holding element can be formed complementary to each other in order to provide the positive connection can.

For example, the holding element may be configured with a claw-shaped cross-section. The counter-holding element can form a cylindrical or bead-shaped edge of the carrier. The cylindrical or bead-shaped edge of the carrier can be used in the claw-shaped holding element. A maximum outer diameter of the counter-holding element can substantially correspond to a maximum inner diameter of the claw-shaped holding element. In order to protect the carrier from falling out of the holding element, a clear width of an opening of the claw-shaped holding element is preferably smaller than the maximum outer diameter of the counter-holding element. In particular, the inside width of the opening may substantially correspond to a thickness of a portion of the carrier which adjoins the counter-holding element.

The positive connection between the base body and the carrier can be produced in a particularly simple manner if a material forming the holding element is injected around the counter holding element. Alternatively, a material forming the counter-holding element can be injected into the holding element. The holding element or the counter-holding element thus forms a shape for the counter-holding element or the holding element. Care must be taken to ensure that the material injected or sprayed around does not form a material seal with the material forming the mold. Particularly suitable for the formation of the holding element or the counter-holding element are liquid crystal polymers, since an existing liquid crystal polymer injection skin by a further injection molding process does not readily cause a plastic fusion. By the common or successive injection molding of the holding element and the counter-holding element, only the positive connection, which does not cause any mechanical damage to the body for the separation of the connection element from the base body results.

The circuit carrier may comprise at least one of the conductor tracks contacting connecting element or a remaining portion thereof, wherein a free end of the connecting element or the remaining portion is arranged on the holding element or even ends therewith. In this way and by the holding element of the circuit carrier according to the invention of known circuit carriers is readily distinguishable.

The intermediate product and the circuit carrier may each have two holding elements in order to contact the conductor tracks with a first and a second connection element. The two connection elements may be provided in each case or together on a carrier.

drawings

The invention is explained below by way of example with reference to embodiments with reference to the drawings. The different features of the embodiments can be combined independently of each other, as has already been explained in the individual advantageous embodiments. Show it:

1 a schematic sectional view of an embodiment of a carrier according to the invention,

2 a schematic sectional view of a main body of a circuit substrate according to the invention,

3 a schematic sectional view of an intermediate product according to the invention of a circuit substrate,

4 a schematic sectional view of an injection-molded circuit carrier according to the invention and the separated carrier, and

5 a schematic representation of a method according to the invention for producing an injection-molded circuit substrate.

Embodiments of the invention

First, structure and function of a carrier according to the invention for a connection element for contacting at least one conductor track of an injection-molded circuit carrier with respect to the embodiment of 1 described.

1 shows a carrier 1 for a connection element for contacting at least one conductor track of an injection-molded circuit carrier schematically in a sectional view. The carrier 1 has, for example, a plate-shaped section 2 on, on which the connection element can be applied. In a border area 3 of the carrier 1 this has a counter-holding element 4 for the positive connection of the carrier 1 with a main body of the circuit carrier. In the embodiment of 1 is the counter-holding element 4 configured with a substantially circular cross-section, so that the counter-holding element 4 can also be referred to as a retaining bead. An outer diameter A of the counter-holding element 4 is larger than, for example, a thickness D of the plate-shaped portion 2 , The outer diameter A and the thickness D are shown parallel to each other and pointing to the drawing plane. Perpendicular to the thickness D and pointing parallel to the drawing plane, the carrier 1 a width B on. The carrier points perpendicular to the plane of the drawing 1 a length extending along a longitudinal direction L of the carrier 1 extends.

On a top 5 of the carrier 1 , for example, from the plate-shaped section 2 except for the counter-holding element 4 can extend, the connection element and a connection element for electrically conductive connection of the connection element can be applied to one of the conductor tracks. Alternatively, the connection element can be up to the counter-holding element 4 extend and contact the connecting element at a transition between the holding element and the counter-holding element.

2 shows an embodiment of a base body 10 an injection-molded circuit carrier according to the invention schematically in a sectional side view, wherein the sectional view of the main body 10 essentially the sectional representation of the carrier 1 equivalent.

The main body 10 has a section 11 on, which may be designed to receive electronic components and, for example, plate-shaped. On the section 11 Conductor tracks can be arranged. Especially on a top 12 of the section 11 the printed conductors can be applied.

In a border area 13 of the basic body 10 this is with a holding element 14 for positive connection with the retaining element 4 of the carrier 1 educated. The holding element 14 has a cross-section, which is preferably substantially complementary to the cross-section of the counter-holding element 4 is designed. In particular, the retaining element 14 have a claw-shaped cross-section. An inner diameter I of the claw-shaped retaining element 14 preferably corresponds substantially to the outer diameter A of the counter-holding element 4 , Off the section 11 pointing, the holding element has 14 an open page 15 on, through which the counter-holding element 4 in the holding element 14 can be used and removed from this. Is the counterhold element 4 in the holding element 14 used, so they form the positive connection between the carrier 1 and the body 10 ,

The open side 15 has a clear width W, which is preferably smaller than the inner diameter I or as the outer diameter A. Because the clear width W is less than the outer diameter A and as the inner diameter I, the counter-holding element 4 against accidental falling out of the claw-shaped retaining element 14 secured.

The open side 15 is from two support arms 16 . 16 ' of the holding element 14 shown flanked, wherein at least one of the support arms and in particular the support arm 16 elastic from the opposite arm 16 ' can be moved away, so that the retaining element 4 from the holding element 14 is removable, without the body 10 by releasing the positive connection between the carrier 1 and the body 10 is damaged.

3 shows a first embodiment of an intermediate product 20 an injection-molded conduit carrier schematically in a lateral sectional view, wherein the sectional view of the representations of the carrier 1 and the basic body 10 in the 1 and 2 equivalent. The intermediate 20 indicates the carrier 1 and the main body 10 on. For elements that are in function and / or construction elements of the embodiments of the 1 or 2 correspond, the same reference numerals are used. For the sake of brevity, in the following, only the differences from the exemplary embodiments of FIGS 1 and 2 received.

For shaping the intermediate product 20 is the carrier 1 at the base body 10 appropriate. For this purpose, the holding element 14 and the counter-holding element 4 positively connected with each other. To form the positive connection projects the counter-holding element 4 through the open side 15 of the holding element 14 into this. To accidentally fall out of the counter-holding element 4 from the holding element 14 To avoid one of the retaining arms 16 . 16 ' and in particular the holding arm 16 through the carrier 1 Elastic away from the other arm 16 ' be deflected so that in addition to the positive connection, a frictional friction connection between the support member 14 and the counter-holding element 4 can be present. Due to the frictional connection are also undesirable pivotal movements of the wearer 1 relative to the main body 10 and one perpendicular to the cutting plane through the counter-holding element 4 extending pivot axis 21 at least suppressed or even prevented.

On the top 5 of the carrier 1 is a connection element 22 arranged. The connection element 22 For example, is a Kontaktierleiste or -leiterbahn on the top 5 rests. On the top 12 of the basic body 10 is a conductor track 23 arranged. A the connection element 22 and the track 23 electrically conductive contacting connecting element 24 extends from the connection element 22 over the retaining element 4 and the holding element 14 to the conductor track 23 ,

The connection element 22 , the conductor track 23 and the connecting element 24 For example, after joining the carrier 1 and the basic body 10 educated. For the formation of the connection element 22 , the conductor track 23 and the connecting element 24 For example, known lithography processes can be used. Optionally, the connection element 22 , the conductor track 23 and the connecting element 24 be galvanically coated with conductive material, in which case only the connection element 22 and none of the tracks 23 to contact directly with electricity.

The holding arm 16 ' is with one of the support arm 16 and from the section 11 pointing away contact page 25 educated. The contact page 25 is at least partially tangent to an adjacent portion of the counter-holding element 14 designed so that a possible stepless transition between the holding element 14 and the counter-holding element 4 provided. For example, the connecting element 24 easier to be formed on the stepless transition as possible on a gradual transition.

In the embodiment of 3 are the connection element 22 , the conductor track 23 and the connecting element 24 shown as separate elements. Especially with lithographic and possibly additional galvanic production of connection element 22 , Trace 23 and connecting element 24 However, these can also be designed consistently.

4 schematically shows a circuit carrier 30 in a sectional side view, which corresponds to the views of the previous figures. The circuit carrier 30 corresponds essentially to the intermediate product 20 , where the carrier 1 from the main body 10 of the circuit board 30 is disconnected. For elements that are in function and / or construction elements of the embodiment of 3 correspond, the same reference numerals are used. For the sake of brevity, in the following only the differences from the exemplary embodiment of FIG 3 received.

In the embodiment of 4 is the counter-holding element 4 of the carrier 1 through the open side 15 of the holding element 14 pulled out and the conductor track 23 thereby from the connection element 22 separated. For example, the connecting element 24 be interrupted thereby. The connecting element 24 For example, when removing the carrier 1 from the main body 10 mechanically overloaded and thereby interrupted or torn. Alternatively, the connecting element 24 even before the separation of carrier 1 and basic body 10 mechanically or laser cut or at least mechanically weakened.

The circuit carrier 30 So not just the track 23 , but also a remaining section 31 of the connecting element 24 on. The rest section 31 extends over the retaining element 14 and may in particular away from the plate-shaped section 11 pointing with the retaining element 14 or the holding arm 16 ' and in particular with its contact page 25 end up.

5 shows a method according to the invention 40 for producing an injection-molded circuit carrier 30 schematically as a flowchart.

The procedure 40 starts with a first process step 41 , In the process step 41 For example, an injection molding machine for injection molding molding of the body 10 and / or the vehicle 1 to be started.

Im on the procedural step 41 following process step 42 can the carrier 1 be injection molded. In the following process step 43 can the basic body 10 of the circuit board 30 be injection molded. The carrier 1 and the main body 10 can be injection molded temporally or spatially separated from each other. Preferably, however, initially either the carrier 1 or the main body 10 injection molded. Once the carrier 1 or the main body 10 has reached a minimum cooling temperature, the other component can be injection-molded so that the already cooled and solidified component is used as part of the injection mold. Preferably, the retaining element 14 in the process step 43 around the counterhold element 4 sprayed around so that the retaining element 14 has a cross-section which is substantially complementary to the cross-section of the counter-holding element 4 is. For example, by deliberate cooling of the retaining element 14 Forming material, the retaining arms 16 . 16 ' be formed so that at least one of the support arms 16 . 16 ' after completion of the injection molding elastically deflectable against the retaining element 4 suppressed.

After the process step 43 are the carrier 1 and the main body 10 So preferably already attached positively to each other.

In the following process step 44 become the carrier 1 and the main body 10 with the connection element 22 the conductor track 23 and the connecting element 24 Mistake. The connection element 22 , the conductor track 23 and the connecting element 24 are preferably simultaneously, for example by means of a lithography process, on tops 5 . 12 of the carrier 1 and the basic body 10 applied.

In an optional following process step 45 can the connection element 22 , the conductor track 23 and / or the connecting element 24 be electroplated with a conductive material, in particular a metal, to improve their mechanical stability and electrical conductivity. For galvanic coating, the connection element 22 be electrically contacted to a current through the connection element 22 , the connecting element 24 and the track 23 to flow. Alternatively or additionally, the connection element 22 be contacted before or after the galvanic coating, to ensure the correct formation of the conductor track 23 to test.

In the following process step 46 becomes the carrier 1 from the main body 10 separated by the retaining element 4 from the holding element 5 for example, is pulled out. This allows the connecting element 24 mechanically overloaded and torn, for example. Alternatively, the connecting element 24 before separating the carrier 1 from the main body 10 mechanically or by means of a laser separated or at least mechanically weakened. Furthermore, the carrier can 1 around the pivot axis 21 be twisted around to the connecting element 24 to interrupt or at least mechanically weaken.

In the process step 47 the procedure ends. For example, the circuit carrier 30 supplied to a placement machine to equip this with electrical components.

The main body 10 and the carrier 1 Thus, they are preferably structured together in positive engagement, for example by a lithographic process and / or electroplated. After structuring and / or coating, the base body 10 and the carrier 1 simply separated from each other.

Claims (10)

Procedure ( 40 ) for producing an injection-molded circuit carrier ( 30 ), in which a basic body ( 10 ) of the circuit carrier ( 30 ) ( 43 ) and printed conductors ( 23 ) on the base body ( 10 ) are applied ( 44 ), characterized in that the basic body ( 10 ) with a holding element ( 14 ) and a carrier ( 1 ) for a connection element ( 22 ) for contacting at least one of the conductor tracks ( 23 ) with a counter-holding element ( 4 ) ( 42 . 43 ), wherein the retaining element ( 14 ) and the counter-element ( 4 ) are formed to form a positive connection with each other. Procedure ( 40 ) according to claim 1, wherein at least one of the connecting element ( 22 ) and one of the tracks ( 23 ) electrically conductive interconnecting and from the conductor track ( 23 ) via the retaining element ( 14 ) and the counter-holding element ( 4 ) to the connection element ( 22 ) extending connecting element ( 24 ) is formed. Procedure ( 40 ) according to claim 2, wherein the printed conductors ( 23 ), the connecting element ( 22 ) and the at least one connecting element ( 24 ) on the basic body ( 10 ) or on the carrier ( 1 ) are applied ( 44 ), after the main body ( 10 ) and the carrier ( 1 ) were positively connected with each other. Procedure ( 40 ) according to one of claims 1 to 3, wherein a retaining element ( 14 ) forming material around the counter-holding element ( 4 ) is splashed around ( 43 ). Procedure ( 40 ) according to one of claims 1 to 4, wherein the conductor tracks ( 23 ) are electroplated ( 45 ) and to the connection element ( 22 ) an electrical voltage is applied, wherein after the galvanic coating ( 45 ) the positive connection between the base body ( 10 ) and the carrier ( 1 ) is solved ( 46 ). Procedure ( 40 ) according to claim 5, wherein the connecting element ( 24 ) by releasing the positive connection ( 46 ) is interrupted. Procedure ( 40 ) according to claim 5, wherein the connecting element ( 24 ) before releasing the positive connection ( 46 ) is interrupted. Intermediate product ( 20 ) of an injection-molded conductor carrier ( 30 ) with an injection-molded basic body ( 10 ) and arranged thereon tracks ( 23 ), characterized by a carrier ( 1 ) for a connection element ( 22 ) for contacting printed conductors ( 23 ) of the circuit carrier ( 30 ), where the basic body ( 10 ) a holding element ( 14 ) and the carrier ( 1 ) a counter-holding element ( 4 ), which the basic body ( 10 ) and the carrier ( 1 ) connect positively with each other. Injection-molded circuit carrier ( 30 ) with a conductor tracks ( 23 ) having basic body ( 10 ), characterized in that the basic body ( 10 ) a holding element ( 14 ) for positive connection with a counter holding element ( 4 ) of a carrier ( 1 ) for a connection element ( 22 ) for contacting the printed conductors ( 23 ) having. Injection-molded circuit carrier ( 30 ) according to claim 9, wherein the circuit carrier ( 30 ) at least one remaining section ( 31 ) one of the tracks ( 23 ) contacting connecting element ( 24 ), wherein a free end of the remaining portion ( 31 ) on the holding element ( 14 ) is arranged.

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