DE102009053255A1 - Method of making an assembly - Google Patents

Abstract

The invention relates i.a. to a method for producing an arrangement in which (a) a first electrical component (60) is arranged on a first carrier (10), (b) a second electrical component (260) is arranged on a second carrier (200) and (c) the two carriers are connected to one another, the order of steps (a) to (c) being arbitrary. According to the invention it is provided that the two carriers are glued to one another with an adhesive (310) containing electrically conductive particles (300) to form an anisotropically conductive adhesive layer (320), the adhesive layer forming an electrical connection between at least one electrical contact surface (80) the first carrier and at least one electrical contact surface (240) is produced on the second carrier.

Description

The invention relates to a method having the features according to the preamble of patent claim 1. In such a method, a first electrical component is arranged on a first carrier, a second electrical component is arranged on a second carrier, and the two carriers are connected to one another. The order of the mentioned steps is arbitrary.

The current trend for technical innovations in the field of electronic products always points in the same direction, namely in the direction of extending the functionality while reducing size and weight. This is particularly evident in products such as mobile phones, memory cards, digital cameras or game consoles. However, this also applies to products of medical and PC technology in general.

A miniaturization of electronic assemblies by lateral (horizontal) compression of the components in a plane (2D) are limited. The development of the third dimension (z-axis -> 3D) extends these limits considerably. Prerequisite for this is the possibility of 3-dimensional trace guidance and 3-dimensional placement of the components. Although passive components occupy the largest number and area in today's electronic components, the three-dimensional integration of active components, such. B. integrated electronic components (ICs), also of great importance. In all areas, the marketability or acceptance of the finished modules is decisively determined by the manufacturing costs.

There are currently various methods for producing three-dimensional structures; These methods can be divided into three groups, namely "direct stacking of the components", "stacking of modules" and mixed forms thereof. In a direct stacking of electrical components, the bare components are stacked (without housing) stacked and electrically contacted by different technologies and mechanically connected. When modules are stacked, single or multi-chip modules are stacked on top of each other and electrically contacted using different technologies and mechanically connected.

The preparation of the mechanical connections requires prior art methods other equipment than the equipment required for the electrical connection of the components. With regard to previously known "stacking methods", reference is made, for example, to the following documents:
[1] Karnezos, M. "3-D Packaging: Where All Technologies Come Together", Proc. of the IEEE / SEMI Int'l Electronics Manufacturing Technology Symposium, 2004
[2] Aschenbrenner, et al., "Process Flow and Manufacturing Concept for Embedded Active Devices", Proc. of IEEE / Electronics Packaging Technology Conference, 2004, pp. 605-609
[3] Pohl, J. et al., "Package Optimization of a Stacked Flip Chip Based Test Package", Proc. of the IEEE / Electronics Packaging Technology Conference, 2004

The invention has for its object to provide a method for producing an arrangement that can be carried out particularly simple and therefore cost.

This object is achieved by a method having the features according to claim 1. Advantageous embodiments of the method according to the invention are specified in subclaims.

Thereafter, the invention provides that two carriers are glued together with an adhesive containing an electrically conductive adhesive to form an anisotropically conductive adhesive layer, wherein the adhesive layer with an electrical connection between at least one electrical contact surface on the first carrier and at least one electrical contact surface on the second carrier will be produced.

A significant advantage of the method according to the invention is that with a single manufacturing step, namely the bonding of the two carriers by means of the anisotropically conductive adhesive layer, both a stable mechanical connection of the carrier and simultaneously produce a very good electrical connection between the electrical contact surfaces of the two carriers leaves. Namely, the anisotropically conductive adhesive can be placed unstructured and flat, for example over the entire area, between the two carriers, wherein nevertheless an electrical connection is produced exclusively between those electrical contact surfaces which, at least approximately, are opposite one another.

Another essential advantage of the method according to the invention is the spacer function, which is ensured by the particles in the adhesive or in the adhesive layer. The particles guarantee a predetermined gap between the two carriers, so that the bonding process during bonding of the two carriers is very insensitive to tolerances.

A third significant advantage of the method according to the invention is that, when the carriers are bonded, at the same time an encapsulation of the components located between the carriers can take place if they are embedded in the anisotropically conductive adhesive layer.

The attachment and electrical contacting of the electrical components on the carriers can be done in any way, for example in flip-chip technology.

In order to achieve a particularly good conductivity between the carriers, it is considered advantageous if the carriers are pressed against one another such that the distance between the carriers and thus the thickness of the adhesive layer located between the carriers is at most the particle size of the particles contained in the adhesive is equal to or smaller than this particle size.

The conductivity of the adhesive as such is preferably less than the conductivity of the conductive particles. Particularly preferably, the adhesive is not conductive or at least very poorly conductive; the conductivity of the particles should preferably be at least ten times greater than that of the adhesive. The electrically conductive particles may be, for example, solder particles or solderable particles.

It is also considered advantageous if a thermal treatment of the adhesive layer is carried out during and / or after a compression of the two carriers. By a thermal treatment, the adhesive can harden and at the same time also achieve a reduction of the contact resistance between particles and contact surfaces.

In order to save space and to create the most compact possible arrangement, it is considered advantageous if at least one of the electrical components between the two mutually facing support surfaces is embedded in the adhesive layer.

Preferably, an adhesive is used with particles whose particle size is greater than the total height of the highest arranged between the carriers electrical component (total height = component height plus connection thickness of the electrical contacts for connection to the respective carrier). In this case, the particles exert a spacer function (termed "spacer function"), which complicates too close compression of the carrier each other.

Particularly preferred is an adhesive with elastically and / or plastically deformable particles is used. This makes it possible to more plastically and / or elastically deform the electrically conductive particles which are arranged in the region between the component upper side of the components embedded in the adhesive layer than those electrically conductive particles which are in the region in which the two facing support surfaces directly opposite, are.

The invention also relates to an arrangement with at least two carriers, on each of which at least one electrical component is arranged.

According to the invention, it is provided with respect to such an arrangement that the two carriers are mechanically connected by an anisotropically conductive adhesive layer which adheres two mutually facing carrier surfaces of the two carriers, and the adhesive layer an electrical connection between at least one electrical contact surface on the one carrier and at least one electrical Make contact surface on the other carrier.

The conductivity direction of the anisotropic conductive adhesive layer is preferably aligned perpendicular to the layer plane of the adhesive layer, at least approximately perpendicular thereto.

The adhesive layer preferably contains electrically conductive particles whose particle size is at least as great as the distance between the two mutually facing electrical contact surfaces. The electrically conductive particles are preferably plastically and / or elastically deformed.

The electrical component, which is arranged on the one carrier, may, for example, be located between the two mutually facing carrier surfaces of the two carriers. In this case, the distance between the component facing the other carrier top of the electrical component and the support surface of this other carrier will be smaller than the distance between the two mutually facing support surfaces of the two carriers. The electrically conductive particles which are arranged in the region between the component upper side of the component and the other carrier are then preferably more plastically and / or elastically deformed than the electrically conductive particles which are in the region in which the two mutually facing carrier surfaces directly are opposite, are arranged.

According to a particularly preferred embodiment of the arrangement, it is provided that the two carriers are each formed by a printed circuit board having metallized at least one side and electrical conductor tracks, wherein at least a conductor track on the one circuit board with at least one conductor on the other circuit board is indirectly or directly electrically connected by at least one electrically conductive particles of the adhesive.

In addition, it may be provided, for example, that the arrangement has a carrier stack with at least three carriers and between the carriers in each case an anisotropically conductive adhesive layer is present, with which the carriers are glued to form the carrier stack and electrically connected.

The invention will be explained in more detail with reference to embodiments; thereby show exemplarily:

1 - 3 a first embodiment of a method according to the invention,

4 A second embodiment of a method according to the invention and

5 - 9 Further embodiments of arrangements according to the invention, which can be produced by the method according to the invention.

For the sake of clarity, the same reference numbers are always used in the figures for identical or comparable components.

In the 1 you recognize a first carrier 10 , which is metallised and structured on both sides and on its upper support surface 20 electrical conductors 30 having. At the first carrier 10 it may be, for example, an electrical circuit board.

On the upper support surface 20 There are electrical connections 40 that with electrical contacts 50 a first electrical component 60 be electrically connected. The electrical connection between the contacts 50 and the connections 40 can be made for example by soldering or gluing with conductive adhesive.

The mechanical application of the electrical component 60 on the upper support surface 20 of the first carrier 10 and the electrical connection of the electrical contacts 50 with the connections 40 is in the 1 visualized by an arrow with the reference numeral A.

As reflected in the 1 In addition, the first carrier points 10 on its lower support surface 70 contact surfaces 80 on that via vias 90 or via in the carrier integrated or buried interconnects 100 with the tracks 30 or the connections 40 on the upper support surface 20 keep in touch. The integrated tracks 100 For example, at least approximately, in the center of the first carrier 10 be introduced.

In the 1 In addition, one recognizes a second carrier 200 , which is also metallized and structured on both sides, and on its lower support surface 210 with tracks 220 Is provided. On the upper support surface 230 there are contact surfaces 240 as well as electrical connections 250 , The contact surfaces 240 and the connections 250 can with the tracks 220 via vias 255 keep in touch. The electrical connections 250 serve to connect the second carrier 200 to a second electrical component 260 that with his electrical contacts 270 on the electrical connections 250 of the second carrier 200 is put on. The electrical contacts 270 of the second component 260 can with the electrical connections 250 on the upper support surface 230 for example, be soldered.

The process step of mechanically and electrically connecting the second electrical component 260 with the second carrier 200 is in the 1 marked with an arrow with the reference symbol B.

The 2 shows by way of example how the two carriers equipped with components 10 and 200 subsequently connect with each other. For example, on the upper support surface 230 of the second carrier 200 an adhesive 310 applied, the electrically conductive particles 300 otherwise electrically conductive, or preferably at least worse than the particles 300 passes. Subsequently, the lower support surface 70 of the first carrier 10 on the glue 310 put on and in the direction of the second carrier 200 pressed. At this compression is with the particles 300 as well as the adhesive 310 an anisotropically conductive adhesive layer 320 educated.

The process steps of bonding the two carriers 10 and 200 with the glue 310 is in the 2 marked with arrows with the reference character C.

The after bonding of the two carriers 10 and 200 resulting arrangement is exemplary in the 3 shown. It can be seen that the thickness D of the adhesive layer arranged between the carrier surfaces 320 so small is that in the glue 310 located conductive particles 300 between the contact surfaces 80 on the lower support surface 70 of the first carrier 10 and the contact surfaces 240 on the upper support surface 230 of the second carrier 200 to make an electrical connection. Preferably, the thickness D of the adhesive layer 320 chosen such that the particles which produce an electrical conductivity between opposite contact surfaces of the carrier are at least slightly plastically or elastically deformed. In the 3 are those particles that are deformed and make a conductive connection between the two carriers, with the reference numeral 300a characterized.

In the 3 In addition, one recognizes further particles which are identified by the reference numeral 300b Marked are. Although these particles are conductive, they do not connect contact surfaces of the opposing support surfaces 70 and 230 so that they have no electrical function or are inactive.

In addition, in the 3 Particles with the reference numeral 300c characterized. These particles are between the component top 360 of the second electrical component 260 clamped so that they are very strong plastic or elastically deformed. Electrically play with the reference number 300c Particles marked no matter because they have no opposite contact surfaces of the two carriers 10 and 200 connect with each other.

Summarized by the conductive particles 300a . 300b and 300c formed an anisotropically conductive adhesive layer, that is, an adhesive layer which is electrically active only along the z-direction and is electrically conductive only along the z-direction, provided that the adhesive layer 320 opposite contact surfaces on the lower or upper support surface of the two carriers 10 and 200 combines. In the x and y direction, ie in the layer plane of the adhesive layer 320 , is the adhesive layer 320 electrically non-conductive or poorly conductive, since the adhesive 310 the adhesive layer 320 not or at least less conductive than the particles 300 is.

In connection with the 4 In the following, a second embodiment for producing an electrical arrangement will be described. In the embodiment according to the 4 be the procedural steps in the 1 to 3 are indicated by the arrows with the reference numerals A, B and C, performed in a different order. First, the second component 260 on the upper support surface 230 of the second carrier 200 applied, the electrical contacts 270 of the second electrical component with the terminals 250 on the second carrier 200 be electrically connected. The application of the second electrical component 260 on the second carrier 200 is in the 4 indicated by an arrow with the reference numeral A.

The following is the non or at least poorly conductive adhesive 310 with the electrically conductive particles 300 on the upper support surface 230 of the second carrier 200 applied, and it becomes the first carrier 10 with its lower support surface 70 on the glue 310 placed. The bonding of the two carriers 10 and 200 is in the 4 indicated by two arrows with the reference B.

The two carriers 10 and 200 are subsequently pressed together so that through the particles 300 and the glue 310 an anisotropically conductive adhesive layer 320 is formed, which are the two carriers 10 and 200 connects both mechanically and electrically. With regard to the electrical connection between the two carriers, reference is made to the above statements in connection with 3 directed.

In a further process step, which in the 4 is denoted by an arrow with the reference numeral C, the first electrical component 60 with his electrical contacts 50 on the connections 40 on the upper support surface 20 of the first carrier 10 placed. After completion of the process step C results in an arrangement as shown in the 3 shown and related to the 3 already described above.

The 5 shows a further embodiment of a device with two carriers 10 and 200 by means of an anisotropically conductive adhesive layer 320 connected to each other both mechanically and electrically. In contrast to the arrangement according to 3 is in the arrangement according to 5 a third electrical component 400 provided to the lower support surface 210 of the second carrier 200 connected. In the embodiment according to the 5 Thus, electrical components are in three different planes, namely on the lower support surface 210 , between the two support surfaces 70 and 230 as well as on the upper support surface 20 ,

The 6 shows an embodiment of an arrangement in which an electrical component 500 on the upper support surface 20 of the first carrier 10 , an electrical component 510 on the lower support surface 70 of the first carrier 10 and an electrical component 520 on the lower support surface 210 of the second carrier 200 are arranged. Between the two carriers 10 and 200 is an anisotropically conductive adhesive layer 320 arranged, which are the two carriers 10 and 200 both mechanically bonded and electrically connected. To the in the 6 To enable electrical connection shown, is the first carrier 10 equipped with buried tracks, which in different tracks levels 530 and 540 are arranged. Of the second carrier 200 In contrast, comes with a single buried interconnect level, in the 6 with the reference number 550 is marked.

The 7 shows an embodiment of an arrangement with a total of three carriers 600 . 610 and 620 , With the three carriers are two electrical components 630 and 640 in conjunction, in anisotropically conductive adhesive layers 650 and 660 are embedded. The arrangement according to 7 can be prepared as exemplified in the context of 1 to 4 has been explained.

In the 8th is an embodiment with three carriers 600 . 610 and 620 shown by means of two anisotropically conductive adhesive layers 650 and 660 connected to each other. With the three carriers are a total of three electrical components 630 . 640 such as 670 in conjunction, two of which, namely the reference numerals 630 and 640 marked, in each case one of the two adhesive layers 650 respectively. 660 are embedded.

The 9 shows an embodiment of a three-carrier arrangement 600 . 610 and 620 also with three electrical components 630 . 640 and 670 are equipped. In contrast to the embodiment according to 8th is in the embodiment according to 9 the middle electrical component 630 not on the upper support surface 700 of the carrier 610 but on the lower support surface 710 of the carrier 600 , Also the structure according to 9 can be made by the three carriers 600 . 610 and 620 with an anisotropically conductive electrical adhesive layer 650 respectively. 660 glued together.

• – Die Herstellung der mechanischen und elektrischen Verbindung(en) zwischen den Bauelementen und den Trägern sowie zwischen den beteiligten Trägern kann mit derselben Technologie, nämlich dem Kleben mit anisotropem Klebstoff, erfolgen. Es kann dabei dieselbe gerätetechnische Ausstattung verwendet werden, wodurch eine Kosteneinsparung erzielt werden kann.
• – Dennoch ist es alternativ möglich, zur Herstellung der mechanischen Verbindungen und der elektrischen Verbindungen zwischen den Bauelementen und den Trägern unterschiedliche Technologien (z. B. FlipChip Löten) einzusetzen.
• – Das Layout der Verdrahtungsstrukturen auf und in den Trägern bzw. Zwischenträgern ist weitgehend unbeschränkt.
• – Es gibt keine wesentlichen Einschränkungen bei der Wahl des Klebstofftyps (Material, Paste oder Film) und Partikeltyps (Material, Größe), der Auftragungsart und der Verarbeitungsbedingungen.
• – Die Herstellung der vertikalen elektrischen Kontakte zwischen den Metallisierungen der Träger ist bei gleichzeitig elektrischer Isolation zwischen den Kontakten in horizontaler Richtung möglich.
• – Es wird durch die Partikel eine Abstandshalter-Funktion (Spacer-Funktion) zur mechanischen und elektrischen Überbrückung des Spaltes zwischen den Zwischenträgern (Überbrückung von Bauelementen) erreicht.
• – Es erfolgt eine Verkapselung der Bauelemente im Spalt zwischen den Trägern.
• – Es ist eine nahezu beliebige dreidimensionale Leiterbahnführung möglich. Bei entsprechendem Layout besteht die Möglichkeit zur Herstellung kurzschlussfreier elektrisch leitfähiger Verbindungen zwischen den Kontakten aller Bauelemente und den entsprechenden Metallisierungen auf der Unterseite des untersten Trägers und/oder Oberseite des obersten Trägers.
• – Beliebige weitere Prozesse, wie zusätzliche Verkapselung, Aufbringung von Lotkugeln oder Vereinzelung sowie die elektrische und mechanische Anbindung an weitere Bauelemente sind möglich.
• – Als elektrisch leitfähige Partikel zur Herstellung der vertikalen elektrischen und mechanischen Verbindungen zwischen den Trägern können quasi alle elektrisch leitfähigen Partikel einschließlich Lotpartikel und lötfähiger Partikel eingesetzt werden.
• – Es besteht die Möglichkeit eines großflächigen Klebstoffauftrags. Dieser muss zur Herstellung der elektrischen Verbindung zwischen den Zwischenträgern also nicht lokal im Bereich der Kontakte platziert und strukturiert aufgetragen werden, sondern kann großflächig auf dem entsprechenden Träger und den mittels der leitenden Partikel zu verbindenden bzw. zu überbrückenden Bauelemente lediglich grob strukturiert aufgetragen werden. Die elektrische und mechanische Verbindung kann während eines einzigen Prozessschrittes hergestellt werden.
• – Die Überbrückung des vertikalen Abstands zwischen den Trägern, bedingt durch die Metallisierungsdicke der Träger sowie die Chip- und Chipkontaktierungsdicke, bedarf keiner zusätzlichen Technologie (z. B. durch Aufbringen sog. ”Abstandselemente” oder Einbringung von Kavitäten in die Zwischenträger im Bereich des Chips), d. h. es können mittels Standard-Leiterplattenprozessen hergestellte Träger, die als Substrate starr oder flexibel sein können, verwendet werden.
• – Besondere Bedeutung erlangt diese Technologie in Verbindung mit der Verwendung sehr dünner Bauelemente (dünne, ultradünne ICs und Substrate). Je geringer die Höhe des zur elektrischen und mechanischen Kontaktierung zu überbrückenden Spalts, desto kleiner kann der Partikeldurchmesser der leitfähigen Partikel des anisotropen Klebstoffes zur mechanischen und elektrischen Kontaktierung der Zwischenträger gewählt werden. Dies hat zum großen Vorteil, dass der Füllgrad (Partikel/Klebstoffvolumen) erhöht werden kann. Das Rastermaß (= Abstand zwischen den Kontakten + Kontaktbreite) auf den Zwischenträgern kann somit weiter reduziert werden, ohne das Risiko von Kurzschlüssen zu erhöhen. Dies hat zum Vorteil, dass sich der Bedarf der benötigten Fläche bei gleicher Anzahl von Kontakten reduziert.
• – Mittels der beschriebenen Stapeltechnologie können die Signalwege innerhalb des Chipstapels signifikant verkürzt werden. Dies wird durch die Verwendung dünner Bauelemente (Dicke < 10 μm) und dünner Träger unterstützt.

The example in connection with the 1 to 9 described method has a number of advantages, which will be briefly explained below:

• - The production of mechanical and electrical connection (s) between the components and the carriers as well as between the carriers involved can be done with the same technology, namely bonding with anisotropic adhesive. It can be used the same equipment, whereby a cost saving can be achieved.
• - Nevertheless, it is alternatively possible to use different technologies (eg FlipChip soldering) for producing the mechanical connections and the electrical connections between the components and the carriers.
• The layout of the wiring structures on and in the carriers or intermediate carriers is largely unlimited.
• - There are no significant restrictions on the choice of type of adhesive (material, paste or film) and type of particle (material, size), method of application and processing conditions.
• - The production of vertical electrical contacts between the metallizations of the carrier is possible with simultaneous electrical isolation between the contacts in the horizontal direction.
• - It is achieved by the particles a spacer function (spacer function) for mechanical and electrical bridging of the gap between the intermediate carriers (bridging of components).
• - There is an encapsulation of the components in the gap between the carriers.
• - It is possible almost any three-dimensional trace guidance. With a corresponding layout, it is possible to produce short-circuit-free, electrically conductive connections between the contacts of all the components and the corresponding metallizations on the underside of the lowermost carrier and / or the upper side of the uppermost carrier.
• - Any other processes, such as additional encapsulation, application of solder balls or separation and the electrical and mechanical connection to other components are possible.
• - As electrically conductive particles for the production of vertical electrical and mechanical connections between the carriers quasi all electrically conductive particles including solder particles and solderable particles can be used.
• - There is the possibility of a large-area adhesive application. For the production of the electrical connection between the intermediate carriers, therefore, this does not have to be placed locally in the area of the contacts and applied in a structured manner, but can only be applied over a large area on the corresponding carrier and the components to be connected or bridged by means of the conductive particles. The electrical and mechanical connection can be made during a single process step.
• The bridging of the vertical distance between the carriers, due to the metallization thickness of the carriers and the chip and chip contacting thickness, requires no additional technology (eg by applying so-called "spacer elements" or introducing cavities into the intermediate carriers in the region of the chip ), ie supports made by standard printed circuit board processes, which can be rigid or flexible as substrates, can be used.
• - This technology is of particular importance in connection with the use of very thin components (thin, ultrathin ICs and substrates). The smaller the height of the gap to be bridged for electrical and mechanical contacting, the smaller the particle diameter of the conductive particles of the Anisotropic adhesive for mechanical and electrical contacting of the intermediate carrier can be selected. This has the great advantage that the degree of filling (particle / adhesive volume) can be increased. The pitch (= distance between the contacts + contact width) on the subcarriers can thus be further reduced without increasing the risk of short circuits. This has the advantage that reduces the need for the required area with the same number of contacts.
• By means of the described stacking technology, the signal paths within the chip stack can be significantly shortened. This is supported by the use of thin components (thickness <10 μm) and thin carrier.

LIST OF REFERENCE NUMBERS

10

first carrier

20

upper support surface

30

conductor tracks

40

electrical connections

50

electrical contacts

60

first electrical component

70

lower support surface

80

contact surfaces

90

vias

100

integrated buried tracks

200

second carrier

210

lower support surface

220

conductor tracks

230

upper support surface

240

contact surfaces

250

electrical connections

255

vias

260

second electrical component

270

electrical contacts

300

electrically conductive particles

300a

particle

300b

particle

300c

particle

310

adhesive

320

adhesive layer

360

Component top

400

third electrical component

500

electrical component

510

electrical component

520

electrical component

530

Interconnect level

540

Interconnect level

550

Interconnect level

600

carrier

610

carrier

620

carrier

630

module

640

module

650

adhesive layer

660

adhesive layer

670

module

700

upper support surface

710

lower support surface

A

arrow

B

arrow

C

arrow

D

thickness

QUOTES INCLUDE IN THE DESCRIPTION

This list of the documents listed by the applicant has been generated automatically and is included solely for the better information of the reader. The list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions.

Cited non-patent literature

• Karnezos, M. "3-D Packaging: Where All Technologies Come Together", Proc. of the IEEE / SEMI Int'l Electronics Manufacturing Technology Symposium, 2004 [0005]
• Aschenbrenner, et al., "Process Flow and Manufacturing Concept for Embedded Active Devices", Proc. of IEEE / Electronics Packaging Technology Conference, 2004, pp. 605-609 [0005]
• Pohl, J. et al., "Package Optimization of a Stacked Flip Chip Based Test Package", Proc. of the IEEE / Electronics Packaging Technology Conference, 2004 [0005]

Claims (10)

Method for producing an arrangement in which (a) on a first support ( 10 ) a first electrical component ( 60 ), (b) on a second support ( 200 ) a second electrical component ( 260 ) and (c) the two supports are joined together, the sequence of steps (a) to (c) being arbitrary, characterized in that - the two supports are provided with an electrically conductive particle ( 300 ) containing adhesive ( 310 ) to form an anisotropically conductive adhesive layer ( 320 ) are bonded together, - wherein the adhesive layer is an electrical connection between at least one electrical contact surface ( 80 ) on the first support and at least one electrical contact surface ( 240 ) is produced on the second carrier. A method according to claim 1, characterized in that the carriers are pressed onto one another such that the distance (D) between the carriers and thus the thickness of the adhesive layer located between the carriers corresponds at most to the particle size of the particles contained in the adhesive or smaller than the particle size is. Method according to one of the preceding claims, characterized in that at least one of the electrical components between the two mutually facing support surfaces is embedded in the adhesive layer. A method according to claim 3, characterized in that an adhesive is used with particles whose particle size is greater than the total height of the highest arranged between the carriers electrical component. Method according to one of the preceding claims, characterized in that - an adhesive with elastically and / or plastically deformable particles is used and - the electrically conductive particles which are in the region between the top of the component ( 360 ) are arranged embedded in the adhesive layer components are more plastically and / or elastically deformed than the electrically conductive particles, which are located in the region in which the two mutually facing support surfaces are directly opposite. Arrangement with at least two supports ( 10 . 200 ), on each of which at least one electrical component ( 60 . 260 ), characterized in that - the two supports are mechanically separated by an anisotropically conductive adhesive layer ( 320 ) are connected, the two mutually facing support surfaces ( 230 . 70 ) of the two carriers glued, and - the adhesive layer an electrical connection between at least one electrical contact surface ( 80 ) on the one support and at least one electrical contact surface ( 240 ) on the other carrier. Arrangement according to claim 6, characterized in that the adhesive layer comprises electrically conductive particles ( 300 ) whose particle size is at least as large as the distance between the two mutually facing electrical contact surfaces. Arrangement according to claim 6 or 7, characterized in that the electrically conductive particles are plastically and / or elastically deformed. Arrangement according to one of the preceding claims 6-8, characterized in that the electrical component, which is arranged on the one carrier, located between the two mutually facing support surfaces of the two carriers. Arrangement according to claim 9, characterized in that the electrically conductive particles, which are arranged in the region between the component upper side of the component and the other carrier, are deformed more plastically or elastically than the electrically conductive particles which are in the region in which the two mutually facing support surfaces directly opposite, are arranged.

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