DE102009058825B4 - Kontaktvorrichtung zum Befestigen an einer Leiterplatte, Verfahren zum Befestigen einer Kontaktvorrichtung an einer Leiterplatte und Leiterplatte - Google Patents
Kontaktvorrichtung zum Befestigen an einer Leiterplatte, Verfahren zum Befestigen einer Kontaktvorrichtung an einer Leiterplatte und Leiterplatte Download PDFInfo
- Publication number
- DE102009058825B4 DE102009058825B4 DE102009058825.6A DE102009058825A DE102009058825B4 DE 102009058825 B4 DE102009058825 B4 DE 102009058825B4 DE 102009058825 A DE102009058825 A DE 102009058825A DE 102009058825 B4 DE102009058825 B4 DE 102009058825B4
- Authority
- DE
- Germany
- Prior art keywords
- contact
- circuit board
- arrangement
- contact device
- recess
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000000034 method Methods 0.000 title claims abstract description 40
- 238000005476 soldering Methods 0.000 claims abstract description 68
- 230000013011 mating Effects 0.000 claims abstract description 20
- 239000011324 bead Substances 0.000 claims abstract description 9
- 229910000679 solder Inorganic materials 0.000 claims description 19
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000018109 developmental process Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 210000002105 tongue Anatomy 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000007373 indentation Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
- H05K3/308—Adaptations of leads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/7082—Coupling device supported only by cooperation with PCB
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/10—Sockets for co-operation with pins or blades
- H01R13/11—Resilient sockets
- H01R13/115—U-shaped sockets having inwardly bent legs, e.g. spade type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/7005—Guiding, mounting, polarizing or locking means; Extractors
- H01R12/7011—Locking or fixing a connector to a PCB
- H01R12/7052—Locking or fixing a connector to a PCB characterised by the locating members
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R2101/00—One pole
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Multi-Conductor Connections (AREA)
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102009058825.6A DE102009058825B4 (de) | 2009-12-18 | 2009-12-18 | Kontaktvorrichtung zum Befestigen an einer Leiterplatte, Verfahren zum Befestigen einer Kontaktvorrichtung an einer Leiterplatte und Leiterplatte |
| MX2012006947A MX2012006947A (es) | 2009-12-18 | 2010-12-06 | Dispositivo de contacto para sejecion a un tablero de circuitos, metodo para sujetar un dispositivo de contacto a un tablero de circuitos, y tablero de circuitos. |
| CN201080051663.6A CN102612866B (zh) | 2009-12-18 | 2010-12-06 | 附着到印刷电路板的接触装置、将接触装置附着到印刷电路板的方法以及电路板 |
| KR1020127013643A KR101504696B1 (ko) | 2009-12-18 | 2010-12-06 | 회로 기판에 고정하기 위한 접촉 소자, 접착 소자를 회로 기판에 고정하기 위한 방법, 및 회로 기판 |
| PCT/DE2010/001423 WO2011072643A1 (fr) | 2009-12-18 | 2010-12-06 | Dispositif de contact à fixer à une carte de circuits imprimés, procédé de fixation d'un dispositif de contact à une carte de circuits imprimés et carte de circuits imprimés |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102009058825.6A DE102009058825B4 (de) | 2009-12-18 | 2009-12-18 | Kontaktvorrichtung zum Befestigen an einer Leiterplatte, Verfahren zum Befestigen einer Kontaktvorrichtung an einer Leiterplatte und Leiterplatte |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE102009058825A1 DE102009058825A1 (de) | 2011-08-04 |
| DE102009058825B4 true DE102009058825B4 (de) | 2021-08-05 |
Family
ID=43734113
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE102009058825.6A Active DE102009058825B4 (de) | 2009-12-18 | 2009-12-18 | Kontaktvorrichtung zum Befestigen an einer Leiterplatte, Verfahren zum Befestigen einer Kontaktvorrichtung an einer Leiterplatte und Leiterplatte |
Country Status (5)
| Country | Link |
|---|---|
| KR (1) | KR101504696B1 (fr) |
| CN (1) | CN102612866B (fr) |
| DE (1) | DE102009058825B4 (fr) |
| MX (1) | MX2012006947A (fr) |
| WO (1) | WO2011072643A1 (fr) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102021109720A1 (de) | 2021-04-19 | 2022-10-20 | Turck Holding Gmbh | Leiterplatte, elektrisches Steckermodul und Herstellverfahren |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102394403B (zh) * | 2011-09-20 | 2014-04-02 | 华为机器有限公司 | 一种盲插连接器 |
| US8672688B2 (en) * | 2012-01-17 | 2014-03-18 | International Business Machines Corporation | Land grid array interposer with compressible conductors |
| GB2512263B (en) * | 2012-01-17 | 2017-04-19 | Ibm | Interposer With Compressible Conductors |
| DE102013004377A1 (de) * | 2013-03-12 | 2014-09-18 | Valeo Schalter Und Sensoren Gmbh | Verfahren zur Montage eines Verbindungsstücks auf einer Leiterplatte, Verbindungsstück und elektrische Verbindungseinheit, insbesondere für ein Kraftfahrzeug |
| DE102015225159A1 (de) * | 2015-12-14 | 2017-06-14 | Continental Automotive Gmbh | Magnetfeldsensor mit einem Steckersockel |
| US11688978B2 (en) * | 2019-09-25 | 2023-06-27 | Omega Engineering, Inc. | Surface-mountable thermocouple connector with reverse polarity protection |
| KR102497452B1 (ko) * | 2020-05-22 | 2023-02-08 | 주식회사 에이치엘클레무브 | 터미널 단자 |
| CN114221142A (zh) * | 2020-09-18 | 2022-03-22 | 南京德朔实业有限公司 | 一种电池包极片及电池包 |
| KR102492648B1 (ko) * | 2020-12-30 | 2023-01-27 | 주식회사 에이치엘클레무브 | 터미널 단자 및 그 제조방법 |
| CN113118583B (zh) * | 2021-02-26 | 2022-07-22 | 深圳市太美亚电子科技有限公司 | 一种自动焊接系统、焊接方法及焊接品的连接结构 |
| DE102021112799B4 (de) * | 2021-05-18 | 2023-01-12 | Bjb Gmbh & Co. Kg | Lampenfassung mit Halteklammer für Lampe |
| KR102768811B1 (ko) * | 2021-08-13 | 2025-02-18 | (주)한신단자공업 | 핀플러그용 소켓 커넥터 |
| KR102580096B1 (ko) * | 2021-08-13 | 2023-09-19 | (주)한신단자공업 | 판플러그용 소켓 커넥터 |
| DE102022104592B3 (de) | 2022-02-25 | 2023-06-15 | Cherry Europe Gmbh | Anschlussvorrichtung zum elektrischen Anschließen eines Funktionsmoduls an ein Schaltungssubstrat für eine Tastatur, Tastatur und Verfahren zum Herstellen einer Tastatur |
| JP2024166761A (ja) * | 2023-05-19 | 2024-11-29 | 株式会社オートネットワーク技術研究所 | 筒端子、同軸コネクタ及び筒端子の固定構造 |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4978307A (en) | 1989-08-07 | 1990-12-18 | Amp Incorporated | Electrical socket for substrates |
| DE19735409A1 (de) | 1997-08-14 | 1999-03-04 | Kathrein Werke Kg | Leiterplatine sowie zugehöriges Kontaktelement |
| US6050845A (en) | 1997-11-20 | 2000-04-18 | The Whitaker Corporation | Electrical connector for terminating insulated conductors |
| US6295726B1 (en) | 1997-08-08 | 2001-10-02 | Nokia Networks Oy | Method of manufacturing surface-mountable SIL hybrid circuit |
| DE102007041904A1 (de) | 2007-09-04 | 2009-03-05 | Robert Bosch Gmbh | Kombinierte Lötverbindung für Signal- und Lastströme |
| EP2073614A2 (fr) | 2007-12-17 | 2009-06-24 | Hosiden Corporation | Contact et dispositif de connexion |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4634195A (en) * | 1985-06-20 | 1987-01-06 | Amp Incorporated | Electrical interconnection device |
| US4904192A (en) * | 1989-01-05 | 1990-02-27 | Motorola, Inc. | Battery contacts |
| JP2002305363A (ja) * | 2001-04-09 | 2002-10-18 | Matsushita Electric Ind Co Ltd | 表面実装型電子部品 |
| US6764319B1 (en) * | 2003-05-15 | 2004-07-20 | Hon Hai Precision Ind. Co., Ltd. | Electrical connector having contacts with anti-wicking means |
-
2009
- 2009-12-18 DE DE102009058825.6A patent/DE102009058825B4/de active Active
-
2010
- 2010-12-06 MX MX2012006947A patent/MX2012006947A/es active IP Right Grant
- 2010-12-06 CN CN201080051663.6A patent/CN102612866B/zh active Active
- 2010-12-06 KR KR1020127013643A patent/KR101504696B1/ko active Active
- 2010-12-06 WO PCT/DE2010/001423 patent/WO2011072643A1/fr not_active Ceased
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4978307A (en) | 1989-08-07 | 1990-12-18 | Amp Incorporated | Electrical socket for substrates |
| US6295726B1 (en) | 1997-08-08 | 2001-10-02 | Nokia Networks Oy | Method of manufacturing surface-mountable SIL hybrid circuit |
| DE19735409A1 (de) | 1997-08-14 | 1999-03-04 | Kathrein Werke Kg | Leiterplatine sowie zugehöriges Kontaktelement |
| US6050845A (en) | 1997-11-20 | 2000-04-18 | The Whitaker Corporation | Electrical connector for terminating insulated conductors |
| DE102007041904A1 (de) | 2007-09-04 | 2009-03-05 | Robert Bosch Gmbh | Kombinierte Lötverbindung für Signal- und Lastströme |
| EP2073614A2 (fr) | 2007-12-17 | 2009-06-24 | Hosiden Corporation | Contact et dispositif de connexion |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102021109720A1 (de) | 2021-04-19 | 2022-10-20 | Turck Holding Gmbh | Leiterplatte, elektrisches Steckermodul und Herstellverfahren |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102612866B (zh) | 2016-02-24 |
| CN102612866A (zh) | 2012-07-25 |
| KR20120079477A (ko) | 2012-07-12 |
| WO2011072643A1 (fr) | 2011-06-23 |
| MX2012006947A (es) | 2012-07-30 |
| KR101504696B1 (ko) | 2015-03-20 |
| DE102009058825A1 (de) | 2011-08-04 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R079 | Amendment of ipc main class |
Free format text: PREVIOUS MAIN CLASS: H01R0012320000 Ipc: H01R0012580000 |
|
| R079 | Amendment of ipc main class |
Free format text: PREVIOUS MAIN CLASS: H01R0012320000 Ipc: H01R0012580000 Effective date: 20120119 |
|
| R079 | Amendment of ipc main class |
Free format text: PREVIOUS MAIN CLASS: H01R0012580000 Ipc: H01R0012570000 |
|
| R079 | Amendment of ipc main class |
Free format text: PREVIOUS MAIN CLASS: H01R0012580000 Ipc: H01R0012570000 Effective date: 20131113 |
|
| R016 | Response to examination communication | ||
| R079 | Amendment of ipc main class |
Free format text: PREVIOUS MAIN CLASS: H01R0012570000 Ipc: H01R0012510000 |
|
| R016 | Response to examination communication | ||
| R018 | Grant decision by examination section/examining division | ||
| R020 | Patent grant now final |