DE102009003301A1 - Assembly for high-power light-emitting diode lamp, has lamp housing and high-output light-emitting diode chip that produces thermal power, where chip carrier extends into heat dissipating element - Google Patents

Abstract

The assembly has a lamp housing (3) and high-output light-emitting diode chip (5) that produces thermal power. A chip carrier (2) extends into heat dissipating element. The partial surface of a side surface of the chip carrier is formed by heat dissipation. An independent claim is also included for a high-output light-emitting diode chip.

Description

The The invention relates to an assembly for a high power LED lamp with a lamp housing, that in the intended use the heat output produced by a high power LED chip leads to the environment, and with an LED chip carrier, the with one with the lamp housing in Wärmeleitverbindung standing heat dissipation element the assembly, in particular with a reflector or directly with the lamp housing itself, in Wärmeleitkontakt stands, wherein on a first partial surface of the chip carrier at least a high-power LED chip is arranged and via at least a second partial surface of the chip carrier heat to lamp housing is derived.

The Invention also relates a high performance LED chip carrier, equipped for equipping a high power LED lamp, with a first partial surface and a second partial surface, being on the first sub-surface the high performance LED chip is arranged and over the second part surface in the intended use Heat to lamp housing is derived.

An assembly of this type and a chip carrier of this type are known from the prior art. Typical of a chip carrier known in the art is the in 1 shown. One or a plurality of high-power LED chips is placed in the center of a flat, honeycomb-like component. The chips are preferably covered by a glass or plastic lens. In order to be able to derive the heat generated in lighting operation with sufficient certainty, such a chip carrier has on its underside a thermally highly conductive layer which is in heat-conducting contact with the LED chips and which in turn is in contact with a heat dissipation element of an LED lamp. In particular, such chip carriers are adhesively bonded to the heat dissipation element of the LED lamp over the underside.

adversely in the embodiment described above is that for a such a chip carrier one relatively large area at the LED lamp is to provide, on which these are then placed can. Due to the relatively large area of the carrier Compared to the chip itself, one is also in the design of Limited LED lamps. A mere Reduction of the heat dissipative surface of the chip carrier However, this is not easily possible because high-performance LED chips for a already slightly too high temperature level extremely sensitive are and the service life seriously from a sufficient heat dissipation depend. Too high a temperature level of the operating environment would be the LED chips in the shortest possible time Destroy time.

The chip carrier Beyond that for safe heat dissipation always with opposite the outer lamp shape recessed Components of a LED lamp thermally connected. This is possible the heat in a structurally simple way and on a short way into outer parts initiate the lamp assembly, for example in the form of a ribbed reflector screen provide a very large area, around the accumulating heat derive and the operating temperature level at a low, long service life possible Measure too hold. This for However, the prior art typical, set-back construction has again the disadvantage that the beam angle of the lamp through the the chip surrounded components is severely limited. Reason for such a "hide" against the visible outer lamp shape is also that the known chip carrier an outwardly unattractive one Appearance and therefore not on the external appearance shaping the lamp surface would like to attach.

Basically exists a big Interest in high-power LED lamps, as these are due to downtime of up to 50,000 hours, one with the same light output up to to 95% lower energy consumption, significantly lower heat generation and the fact that high-power LED chips are not harmful UV and IR radiation produce significant advantages over conventional light bulbs have.

task The invention is therefore an LED lamp with a high-power LED chip as a light source to disposal in spite of ensuring a sufficient heat dissipation away from the LED chip a higher Design freedom, a visually appealing appearance and a larger viewing angle can be achieved.

These Task is with regard to the assembly for a high-power LED lamp solved by that the chip carrier into the heat sink into and / or through the heat dissipation element extends and the heat dissipating second partial surface from a side surface of the chip carrier is formed.

Regarding of the chip carrier itself is provided that this formed as a rod-shaped insert is, the high-performance LED chip on the front side on the insert is attached and the heat dissipating second sub-surface at least partially, preferably completely, formed by a side surface of the chip carrier is.

Of the Invention is based on the finding that a sufficient heat dissipation not only then guarantee can, if you put the heat over the Bottom of a relative leads to the LED chip itself large-area chip carrier, but also then, if you make sure there is enough side surface area of the chip carrier for heat dissipation to disposal stands. Of course, this second surface area must have a The thermal transfer member the lamp assembly in Wärmeleitkontakt stand, so it is necessary that the chip carrier through the heat sink through or at least extends into this. In the result can the part surface the chip carrier, put on the LED chip, significantly smaller, which is what opens up new creative freedom.

Especially is provided that the chip carrier as a rod-shaped Insert part is formed, the high-power LED chip frontally is placed on the insert and the side surfaces of the rod-shaped Insert part with the heat dissipation element in Wärmeleitkontakt stand. The chip carrier forms in this way a compact, structurally particularly simple to be handled design element. Rod-shaped means in this context above all cylindrical. It can but also be provided other cross-sectional shapes.

Further preferred are the side surfaces of the chip carrier threaded, wherein the chip carrier via the thread with the heat dissipation element in Wärmeleitkontakt stands. The thread allows not only a particularly simple and, if necessary, detachable connection between the chip carrier and the heat sink, but the thread increases also authoritative the heat transfer to disposal standing surface. in principle but it is also possible the chip carrier form as plug-in or push-in element, which is to be provided in a Intake, the sufficient Wärmeleitkontakt is able to produce, is used. It can also be complementary or alternative aids such as thermal paste or thermally conductive Adhesives are used.

When The thermal transfer member the assembly can be provided various components. For example, a chip carrier be connected to a reflector, which then passes the heat back to the lamp housing. The chip carrier is preferred but inserted or screwed directly into the lamp housing. In In this case, the heat dissipation element from the lamp housing itself educated. The term lamp housing is in particular an outward visible and for the external appearance meant assembly-determining component of the assembly.

The lamp housing can be tubular be formed and have an end face to receive the chip carrier able, whereby the chip carrier is arranged on the front side of the lamp housing such that the Beam angle of the high-power LED chip in one of the front side pioneering direction is not limited by the lamp housing, the radiation angle of the lamp, in particular not less than 150 °, preferably about 160 ° to 170 °. The Front side of the lamp housing is while preferably closed except for the inclusion of the LED chip carrier.

Around one possible huge To achieve radiation angle is also provided that the chip carrier such in the heat sink, in particular directly into the lamp housing, is embedded that the first part surface the chip carrier, on the one or more LED chip (s) are placed, essentially flush with the surface the heat dissipation element, especially with the front of the lamp housing is, or slightly out of this surface the heat dissipation element protrudes.

Around the lamp housing can be provided with a lamp base can be provided that the lamp housing at the end, that of the chip carrier facing receiving face, a mounting option for a commercial Lamp base has.

Around the heat donating surface of the lamp housing continue to increase can be provided that the lamp housing outside umtaufende grooves having. For the same purpose, it may be useful if am Lamp housing at the front a circumferential, the other lamp body radially outwardly superior Footbridge is provided.

alternative to the possibility the chip carrier over a Threading directly into the lamp housing can also be provided that the chip carrier through the heat sink is plugged and back through a union nut with the heat dissipation element is screwed. The heat then less is over the direct contact between heat dissipation element and the side surface of the chip carrier derived rather than indirectly via the detour of the union nut, the with your internal thread absorbs the heat produced by the LED chip and over the contact surface with the heat dissipation element passes.

In order to be able to arrange the LED chip particularly easily on the chip carrier, it preferably has an end-face, dish-like depression. This serves on the one hand to hold the LED chip itself as well as to secure a recording LED chip covering resin coating.

In order to the arranged on the front side of the chip carrier LED chips supplied with the required electrical energy for operation can be are in the chip carrier Through holes provided in the axial direction through the chip carrier pass through. contact wires for the current supply of the LED chip are through the through holes passed.

The previously described embodiment a high-power LED lamp or a chip carrier for LED high-performance chips has especially the additional Advantage that even LED lamps in case of destruction of the actual light source not in the future Completely, So including the lamp housing and socket, need to be replaced, but that the exchange of the no longer sufficiently functional chip carrier will suffice.

Further Features and advantages of the invention will become apparent from the dependent claims and from the following description of preferred embodiments based on the drawings.

In the drawings shows

1 a prior art chip carrier for high power LED chips,

2 a lamp that has a high-power LED chip as the light source,

3 a first chip carrier for a high power LED chip,

4 a second chip carrier for a high power LED chip,

5 a third chip carrier for a high power LED chip,

6 an overall perspective view of a chip carrier according to 3 .

7 an overall perspective view of a chip carrier according to 4 .

8th an alternative construction of an assembly for a radiator with a high-power LED chip as a light source in a sectional view, and

9 an overall view of a radiator according to the sectional view 8th ,

In 1 is a well-known from the prior art, flat and honeycomb-like designed LED chip carrier. The usually barely more than one square millimeter sized LED chips are below the one in the center of the 1 represented chip carrier arranged lens mounted on the chip carrier. Usually it is a plurality of individual LED chips. The heat produced by the LED chips is dissipated via the underside of the chip carrier to a heat dissipation element of the lamp.

In 2 is a high power LED lamp 1 with a chip carrier 2 shown, which is designed as a rod-shaped insertion element. This extends in the center of a lamp housing 3 into this and stands with its lateral sub-surfaces with the lamp housing 3 in Wärmeleitkontakt. It is on one end of the lamp housing 3 attached and slightly protrudes from the surface. This arrangement ensures compared to a set back in a lamp housing construction a large beam angle of approximately 180 °. Even with the front side of a lamp housing flush-mounted or in contrast only slightly recessed chip carrier ensures a sufficiently large beam angle.

The lamp housing 3 is designed as a tubular hollow body and even on a lamp base 4 attached, which is exemplified here for inclusion in an E27 socket. Of course, lamp sockets can also be used for other sockets, for example for MR16, GU10 or E14 sockets. Since a single LED chip itself has only a power consumption in the range of a Watts and are operated with a voltage which is lower than the operating voltage of the circuit in which the LED chips are used, is in the lamp base 4 a converter electronics provided (not shown).

On one end of the LED chip carrier 2 is at least an LED chip 5 placed. Because of the achievable higher light output, it will usually be a group of multiple LED chips. The LED chip 5 is electrically connected via wires with the transducer electronics located in the lamp base and supplied with electrical energy. The wires are through in the chip carrier 2 provided, axial through holes 9 passed.

The chip carrier 2 is designed as a rod-shaped insert with external thread screw-like and a in the lamp housing 3 provided, matching internal thread screwed with this and is about this connection with the lamp housing 3 in Wärmeleitkontakt. The contact surface is sized so that the heat dissipation through the thread is sufficient to the operation Keep the temperature of the LED chip or the group of multiple LED chips at such a low level that the desired life is guaranteed. The size of the contact surface can be over the axial contact length, ie over the height of the chip carrier 2 in conjunction with the material thickness of the lamp housing, in particular the material thickness in the region of the chip carrier receptacle, or influence over the effective in terms of heat dissipation diameter of the chip carrier.

In addition, the lamp housing 3 in terms of its material thickness, the dimensioning of its external dimensions, its surface and its choice of materials designed such that it from the LED chip 5 produced and over the chip carrier 2 in the lamp housing 3 well absorbed heat and can dissipate. It has at its periphery a plurality of circumferential grooves 7 due to the formation of cooling rings to maximize the heat-emitting surface of the lamp housing 3 serve. Also for this serves the circulating heat dissipation web 8th , It is preferable to use good heat-conducting light metals.

Those skilled in the art will appreciate the design of the lamp housing and the size of the contact surface between the chip carrier and the lamp housing corresponding to that on the chip carrier 2 installed chip power to adapt to the resulting, required heat dissipation know.

The heat transfer from the chip carrier 2 in the lamp housing 3 If required, it can also be connected to the chip carrier via an end face 2 provided, circumferential support collar 10 improve the contact area between chip carriers 2 and lamp housing 3 further increased. The support collar 10 may be such that it allows the attachment of a tool for screwing or unscrewing, so be executed in particular in the manner of a four- or hexagon nut.

A plate-like depression in the front of the chip carrier 2 serves to accommodate a translucent synthetic resin coating 6 , which protects the LED chip from external influences and also can influence the light color.

Depending on the design of the lamp and the number of LED chips have lamps after the in 2 shown type a power consumption between 0.4 and 20 watts at a brightness of about up to 110 lumens per installed watts, which is already emerging developments, according to which even higher brightness levels can be achieved with the same electrical power. The power consumption of the concrete in 2 For example, the lamp shown is 3 watts (gross power consumption), which then accounts for about 2.3 watts on the LED chips. The beam angle of in 2 The lamp shown is about 160 °, the color temperature of the light produced by the LED chip is 2700 K-6500 K. The dimensions of such a lamp are in the illustrated base shape at about 90-100 mm and a diameter of about 50 mm. By contrast, a comparable lamp with 5 watts of gross electrical power would have a larger lamp housing and further cooling rings or circumferential grooves.

To the angle of radiation of a high-power LED lamp in the manner of in 2 shown further increase, in addition to the centrally provided in the front page chip carrier 2 additional chip carriers in the side surfaces of the lamp housing 3 be provided, which radiate substantially to the side. Depending on the design of the lamp housing so radiation angle of a high-power LED lamp can be achieved, which correspond to that of a conventional light bulb.

3 to 5 show various possible embodiments of a not yet equipped with an LED chip chip carrier 2 for LED high performance chips. Common to the illustrated embodiments is the fact that the chip carriers 2 are formed as rod-shaped, screw-like insertion elements with external thread, in which the high-performance LED chip is placed on the end face on the insert and the side surfaces of the rod-shaped insert in the intended installation state with a heat sink of the high-power LED lamp are in Wärmeleitkontakt.

In addition, the chip carriers have a support collar 10 in addition to its function to support the occurring bolt forces against the heat dissipation of the lamp, in the intended installation state also increases the contact surface to the lamp housing, thus further improving the heat transfer. The chip carriers 2 have through holes 9 can be passed through the contact wires for energizing the LED chips. The support collar 10 of in 4 illustrated chip carrier 2 also has two holes, which can be used for attaching a tool, for example.

In 6 respectively. 7 are the chip carriers off 3 respectively. 4 shown in a perspective view and with inserted LED chips, wherein the in 7 chip carrier shown the holes were not taken in the support collar. In 6 and 7 clearly visible are the ends of the guided through the through holes contact wires 11 to recognize that can serve as solder joints.

The LED chips themselves hide behind a synthetic resin coating 6 and are covered by this.

An alternative embodiment of a high-power LED lamp 1 in the way of a spotlight is in 8th shown. Here is the chip carrier 2 again formed as a rod-shaped insertion element and corresponds to the previously described to the other figures chip carriers. He is not directly with the lamp housing 3 but by means of a union nut 12 first with a reflector 13 screwed, the heat-conducting contact with the lamp housing 3 manufactures. Both the reflector 12 as well as the lamp housing have a ribbing 14 to maximize the heat-emitting surface. The chip carrier is through a glass pane 15 protected.

The of the LED chips 5 Heat produced initially passes over the lateral surface areas of the chip carrier 2 , so in particular on the thread flanks, on the nut 12 over and then continue into the reflector 13 derived. The support collar 10 also contributes to heat dissipation.

9 shows a equipped with 7 chip carriers emitter whose internal structure of the in 8th represented cross section corresponds. The number of provided in such a radiator chip carrier can be varied almost arbitrarily depending on the desired achievable light output.

The extra diameter of the in the 2 to 9 represented chip carrier is in the range of external thread preferably 8 to 12 mm. As an external thread in particular a metric M8, M10 or M12 external thread, preferably as a fine thread, provided, since in this case the heat transfer is better.

1

High-power LED lamp

2

chip carrier

3

lamp housing

4

lamp base

5

LED chip

6

Resin coating

7

Umfansnut

8th

peripheral land

9

Through Hole

10

support collar

11

contact wires

12

Nut

13

reflector

14

ribbing

15

pane

Claims (15)

Assembly for a high power LED lamp ( 1 ) with a lamp housing ( 3 ), which in the intended use of a high-performance LED chip ( 5 ) dissipates heat output toward the environment, and with an LED chip carrier ( 2 ), one with the lamp housing ( 3 ) in Wärmeleitverbindung stationary heat dissipation element of the assembly, in particular with a reflector ( 13 ) or directly with the lamp housing ( 3 ) itself, is in Wärmeleitkontakt, wherein on a first part surface of the chip carrier ( 2 ) at least one high power LED chip ( 5 ) is arranged and over at least a second partial surface of the chip carrier ( 2 ) Heat to the lamp housing ( 3 ), characterized in that the chip carrier ( 2 ) extends into the heat dissipation element and / or extends through the heat dissipation element and the heat dissipating second sub-surface of a side surface of the chip carrier ( 2 ) is formed. An assembly according to claim 1, characterized in that the chip carrier ( 2 ) is designed as a rod-shaped insert part, the high-performance LED chip ( 5 ) is placed on the front side of the insert and the side surfaces of the rod-shaped insert part with the heat dissipation element in Wärmeleitkontakt. Assembly according to one of the two preceding claims, characterized in that the side surfaces of the chip carrier ( 2 ) are threaded and the chip carrier ( 2 ) is in thermal contact with the heat dissipation element via the thread. Assembly according to one of the preceding claims, characterized in that the chip carrier ( 2 ) directly into the lamp housing ( 3 ) is screwed. Assembly according to one of the preceding claims, characterized in that the heat dissipation element from the lamp housing ( 3 ) is formed, wherein the Lam pen housing ( 3 ) is externally visible and is the component of the assembly which determines the external appearance of the assembly. Assembly according to one of the preceding claims, characterized in that the lamp housing ( 3 ) has an end face that supports the chip carrier ( 2 ), the chip carrier ( 2 ) Such on the front side of the lamp housing ( 3 ) is arranged such that the emission angle of the high-power LED lamp ( 1 ) is not limited by the lamp housing in a direction away from the end face, so that the angle of radiation of the lamp ( 1 ) 150 ° to 180 ° is. Assembly according to one of the preceding claims, characterized in that the chip carrier ( 2 ) in such a way in the heat dissipation element, in particular in the lamp housing ( 3 ), is embedded, that the first part surface of the chip carrier ( 2 ) substantially flush with the surface of the heat dissipation element, in particular with the end face of the lamp housing ( 3 ), or protrudes slightly from this surface of the heat dissipation member. Assembly according to one of the preceding claims, characterized in that the lamp housing ( 3 ) at the end that the chip carrier ( 2 ) receiving end face opposite, having a receptacle for a commercially available lamp cap. Assembly according to one of the preceding claims, characterized in that the lamp housing ( 3 ) outer circumferential grooves ( 7 ) having. Assembly according to one of the preceding claims, characterized in that the lamp housing ( 3 ) a circumferential heat dissipation web ( 8th ) having. Assembly according to one of the preceding claims, characterized in that the chip carrier ( 2 ) is inserted through the heat dissipation element and at the back by a union nut ( 12 ) is screwed to the heat sink. High performance LED chip carrier ( 2 ), equipped for equipping a high-power LED lamp ( 1 ), having a first sub-surface and a second sub-surface, wherein on the first sub-surface of the high-power LED chip ( 5 ) is arranged and over the second sub-surface in the intended use heat to the lamp housing ( 3 ), characterized in that the chip carrier ( 2 ) is designed as a rod-shaped insert part, the high-performance LED chip ( 5 ) is mounted on the front side of the insert part and the heat dissipating second part surface at least partially from a side surface of the chip carrier ( 2 ) is formed. Chip carrier according to claim 12, characterized in that side surfaces of the chip carrier ( 2 ) are threaded. chip carrier according to one of the claims 12 or 13, characterized in that the front side a plate-like Well is provided. Chip carrier according to one of claims 12 to 14, characterized in that in the axial direction by the chip carrier ( 2 ) Through holes ( 9 ) and contact wires ( 11 ) for energizing the LED chip ( 5 ) through the through holes ( 9 ) are passed.