DE102008062211A1 - Method for manufacturing semiconductor component, involves applying electronic component on flexible carrier substrate, and determining reference point at flexible carrier substrate - Google Patents

Abstract

In order to further simplify known methods for producing a semiconductor component, the invention proposes a method for producing a semiconductor component, in which an electronic component is applied to a flexible carrier substrate, wherein the method is characterized in that at least one reference point is determined on the carrier substrate , starting from which at least one further structure is arranged on and / or on the carrier substrate.

Description

The The invention relates to a method for producing a Semiconductor device, wherein an electronic component on a flexible carrier substrate is applied. On the other hand the invention relates to a semiconductor device with a single, flexible film substrate and with an arranged on it electronic Component in which on the single, flexible film substrate a foldable folding area is formed.

generic Methods are well known in the art and have come to be known proven so far in various ways. Currently Even smaller chip components usually by means of mechanical working Pick & place machines gripped and mounted on a suitable wiring carrier, with little or no self-alignment effects of the chip components used to properly place the chip components to be able to arrange the wiring carrier. A Electrical contacting of the chip components is often done here in terms of a suitable flip-chip method, for example in connection with ACA (anisotropic conductive adhesive) or ACF (Anisotropic conductive foil / film) under pressure and heat input. However, on the one hand limit the indexers required for this purpose and on the other hand placing the individual chip components the Production speed. In addition, this way due to a risk of breakage hardly very thin chip components are processed. The handling is also thinner Chip components with such mechanically working pick & place machines as difficult, so it has already been proposed, an exact alignment the individual chip components on the wiring substrate by means of a self-aligning effect with respect to a suitable one Fluids, which previously applied to the wiring substrate was to make additional. By means of such a designed Flip-chip methods can not only be RFID semiconductor devices and LED semiconductor devices are manufactured, wherein an electrical contact in a LED semiconductor device mainly by wire bonding is produced, but also other semiconductor devices.

For example, in the document JP 2005115916 A describes a method for producing an RFID semiconductor device, in which an RFID chip is mechanically mounted by means of a conventional flip-chip method on a metallic transmitter and receiver structure of a carrier material. Subsequently, the carrier material is folded, so that both the metallic transmitter and receiver structure and the RFID chip are particularly well protected against harmful environmental influences.

A similar method of manufacturing an RFID semiconductor device is in the publication "An Ultra-Small RFID Chip: μ-Chip" by Mitsuo Usami (2004 IEEE Asia-Pacific Conference on Advanced Systems Integrated Circuits (AP-ASIC2004) / Aug 4-5, 2004) described in which a two-sided provided with electrical connections RFIP chip is covered on both sides. On the one hand, the RFID chip is connected and covered with a first thin antenna made of an anisotropic, electrically conductive film, abbreviated to ACF (anisotropic conductive foil / film), wherein the anisotropic, electrically conductive film forms the carrier substrate of the RFID semiconductor device. On the other hand, the RFID chip with a second thin antenna of another thin metal foil is connected and covered, wherein the other thin metal foil is folded such that the other thin metal foil is attached to the underside of the ACF and thus the RFID chip on both sides of each a thin antenna is covered. Due to the fact that both an anisotropic, electrically conductive film and an additional metal foil for producing the RFID semiconductor device are required, the RFID semiconductor device builds quite complex, even if it can be designed here advantageously thin.

It is the object of the invention generic method to simplify the manufacture of a semiconductor device in such a way that even the smallest chip components are fast, reliable and well protected on a carrier applied can be or are applied.

The The object of the invention is a method for producing a Semiconductor device solved in which an electronic Component on a carrier substrate, in particular on a flexible carrier substrate is applied, wherein the method primarily characterized in that on the carrier substrate at least one reference point is determined from which starting at least one further structure on and / or on the carrier substrate is arranged.

Thereby, that on the carrier substrate, such a reference point is determined, from which, ideally, always measured, can all other actions with respect to the carrier substrate be made very precise and accurate.

A further advantageous embodiment provides that a plurality of reference points to a reference line is summarized, from which starting at least one other Structure on and / or arranged on the flexible carrier substrate becomes.

Although, for example, a local situation of another Structure on the carrier substrate can be advantageously determined by means of a single reference point, however, the proposed location can be determined even more accurately, if more than one reference point is provided for this purpose. Preferably, a reference line is formed by means of at least two reference points.

Of the Reference point, the reference line or a differently designed Reference range can be directly on a physical Surface of the flexible carrier substrate determined or be marked. It is understood that such reference marks, from which, starting from locations of further structures are measured can also be determined on the basis of spatial coordinates which not directly with the physical surface of the flexible carrier substrate coincide. For example is a reference point based on suitable spatial coordinates above the flexible carrier determined.

extraordinarily simply one reference point or several such Created reference points on the flexible carrier substrate when the reference point is defined by a metallic structure, such as an antenna of the semiconductor device, on the flexible one Carrier substrate is marked. For example, the reference point formed by an edge of the me-metallic structure. Of this Edge can then all other places on the flexible Carrier substrate can be determined exactly.

Especially It is advantageous if the reference point by means of a folding edge and / or a punched edge on the flexible carrier substrate is marked, as well as the effort to determine a suitable reference point can be advantageously reduced.

Around in particular, the electronic component, especially against such a structure, exactly on the flexible carrier substrate To be able to place, it is advantageous if before and / or during the application of the electronic component at least a reference point marked on a flexible carrier substrate becomes.

through of the reference point may be locations on the flexible carrier substrate be determined very reliably and accurately.

With the term "electronic components" are present any electrical and / or electronic components of a semiconductor device detected, which on a preferably flexible carrier substrate can be applied, in particular RFID components, LED components or the like. Often, such electronic Components also referred to as a chip.

It it is understood that the carrier substrate in any shape may be present, which is for producing a semiconductor device suitable. For the purposes of the invention, it is extraordinary advantageous if the carrier substrate is a flexible carrier substrate is that easily elastic or plastically deformable without being destroyed to become. Preferably, such a flexible carrier substrate provided by a film substrate, which is so in itself is foldable, that two areas of the film substrate to each other can be worked out. Preferably, the flexible comprises Carrier substrate, a polymer film, such as PET, PEN or PI. But also different flexible carrier substrates can be used advantageously, such as Paper or composite materials.

Around the electronic component procedurally simple in the flexible To be able to integrate carrier substrate, sees one exceptionally advantageous embodiment prior to that, a foldable folding area, such as a tab, on the flexible carrier substrate is formed, wherein a spatial position of the foldable folding area on the carrier substrate starting is measured and determined from the reference point.

hereby can the spatial position of the foldable folding area on the carrier substrate be determined very precisely. This is especially true then extraordinarily advantageous, if further structures as a function of the reference point on the carrier substrate to be ordered.

Of the Term "foldable folding area" describes in the sense of the invention, a region of the flexible carrier substrate, which of other areas of the flexible carrier substrate is at least delimited so that the delimited area at least partially on remaining areas of the carrier substrate can be worked. The foldable area can here as a Structures are considered within the meaning of the invention.

One Delimiting the foldable folding area can be more diverse Be made way. For example, by mechanical methods, such as Punching, cutting, notching, scoring, embossing and / or perforating, or laser-assisted methods, such as cutting, notches or Perforating, a suitable demarcation can be reliable and fast respectively. On the basis of all this on the carrier substrate configured structures or in particular boundary edges can at least an advantageous reference point can be determined.

Advantageously, one or more folding folding regions can be separated from the flexible carrier substrate, wherein at least one Connection of the thus separated folding folding region remains to the flexible carrier substrate, so that a kind of tab may arise. For example, a rectangular tab is made by three severed boundary edges and a non-perforated or partially severed, perforated, notched or otherwise modified boundary edge. There are also other geometric shapes of the tabs possible, such as a nearly arbitrary polygon, a curve or a freeform.

A Folding the flexible carrier substrate may also be complete take place in a web running direction or transversely to a web running direction, an edge can be introduced in advance, but not is mandatory.

By the foldable folding area, the electronic component can be more advantageous Way in the manner of a sandwich construction procedurally simple between including two layers of the flexible carrier substrate be, making electronic component particularly well compared Protected against harmful environmental influences can be.

One In addition, gap between the two layers may, for example be filled by means of a suitable adhesive, whereby a particularly high mechanical load of the semiconductor device produced can be achieved. In addition, electronic component is thereby additional protected.

Around also the electronic component particularly precise on the Carrier substrate, in particular on the foldable folding area, To be able to place, it is advantageous if the electronic component starting from the reference point on the foldable folding area of the Carrier substrate is applied. This can be the electronic Component also considered as a structure within the meaning of the invention become.

A Another advantageous variant of the method provides that the foldable Folding area with the electronic component arranged thereon The metallic structure is folded over to the electronic component to be able to flip on the carrier substrate. specially This makes it possible to produce a semiconductor component in particular be advantageously simplified.

Become Connecting means for connecting the electronic component with the carrier substrate arranged on the carrier substrate, wherein a spatial position of the connecting means on the carrier substrate starting can be measured and determined by the reference point, their location also very precise, especially with regard to others Structures, are determined, causing the manufacture of semiconductor devices can be specified again.

Advantageous it is further, if the electronic component without contact is applied to the flexible carrier substrate, wherein the electronic component by means of a fluid, in particular on Reason of adhesive properties of an adhesive on which flexible Carrier substrate is aligned in an end position.

Thereby, that the electronic component without contact on the carrier substrate is applied, eliminates a mechanical assembly of the electronic component by means of a mechanical gripper, the the respective electronic component on the carrier substrate stores. In this respect, the application of the electronic component present much faster than usual.

Especially the present method is suitable for semiconductor devices, where electronic components with a manageable Number of electrical connections equipped are.

in this connection describes the term "contactless apply" a Mounting the electronic component on the carrier substrate, in which the electronic component at least at the moment of applying or Mounting on the carrier substrate of any mechanical Device is mechanically held and guided.

So another variant of the method also provides that the electronic Component in a free fall on a flexible carrier substrate is applied. Here, the electronic component alone due to gravity on the flexible carrier substrate be applied, whereby the present method is particularly easy to design.

Advantageous It is also when the electronic component is non-contact is accelerated toward a flexible carrier substrate. For example, the electronic component in this case by means of compressed air support additionally accelerated and more effective on the flexible Carrier substrate are applied.

Cumulative it is advantageous if the electronic component without contact on means for bonding and / or fixing the electronic component is applied. With the means for bonding and / or fixing can the electronic component structurally simple on the flexible carrier substrate be attached.

The Means for bonding and / or fixing can be constructive here be provided particularly easily by means of a fluid.

Alternatively or cumulatively, it is advantageous if the electronic component contacts without contact Means is applied for aligning the electronic component. In this case, the electronic component can not only be advantageously applied to the flexible carrier substrate, but, moreover, can also be properly aligned on the flexible carrier substrate.

The Aligning means may be procedurally fluidized simply be provided.

suitable For example, fluids can be an acrylate adhesive Epoxy adhesive, water, flux, organic solvents and their mixtures.

The Fluids can flow both on designated areas of the flexible Carrier substrate as well as the electronic component applied become.

Around in particular the means for bonding and / or fixing the electronic Component and / or the means for aligning the electronic component to be able to place exactly on the flexible carrier substrate, it is advantageous if before and / or during application the electronic component is a flexible carrier substrate in a wettable with respect to a fluid area and in a with respect to the fluid-wettable area is divided, wherein a location of at least one of the areas on the carrier substrate is measured and determined from the reference point.

Of the This selectively wettable area can be characterized in particular characterized in that a fluid applied thereto on the flexible Carrier substrate can form a meniscus, its base similar to the base of the electronic component is, thereby self-aligning the electronic component in Depending on the wettable area allows is.

Of the wettable area may preferably depending on used fluids are selected.

to Production of a structured and wettable surface on the flexible carrier substrate, for example, but not exclusively, structured metallizations, about for processes with a lot, plasma treatments, about for processes with an acrylate adhesive or water become. This can be a special surface topography For example, by embossing, punching or by additive Methods, such as by an additive deposition of silicones, Resins and / or waxes and the combination of several such processes getting produced.

Especially For example, the electronic component can be placed on the flexible carrier substrate procedurally simply connected to other functional components electrically be when the flexible carrier substrate a corresponding Structure already has and is prestructured accordingly.

Therefore it is also advantageous if before and / or during the Applying the electronic component, the flexible carrier substrate with an electrically conductive structure, in particular with a metallic structure, is coated. Especially the wettable area can be achieved by means of an electrically conductive Structure produced on the flexible carrier substrate advantageous become.

There Methods for such self-alignment already are known in the present case only to the extent that to self-align the electronic component on the flexible Carrier substrate the effect of minimizing a free Interfacial energy of a system preferably from a locally structured, flexible carrier substrate, a Fluid and an electronic component is used.

often become fluids for self-aligning an electronic Component used, which are rather regarded as low viscous In particular, to achieve a sufficiently fast self-alignment to ensure the electronic component. In a simple case, only water can be used as a means of alignment which after successfully aligning the electronic The component ideally completely evaporates, creating a Lot or a highly viscous adhesive with the aligned electronic Component can come into contact. Take over the solder or the high-viscosity adhesive in each case the issue of a permanent fixing and / or Contacting the electronic component to a carrier substrate.

Favorable Manner is present as a means for aligning the electrical Component uses an adhesive which viscose similar Inherent properties like water. This can be an electronic Component on the one hand in no time with an adhesive aligned with the flexible carrier substrate and on the other hand attached with the adhesive to the flexible carrier substrate become.

In this context, it is advantageous if the means for aligning the electronic component in the form of an adhesive have a viscosity which deviates from the viscosity of H ₂ O less than 30%, preferably less than 10%. Thus, a sufficiently fast alignment of the electrical component can be ensured in particular before sticking the electrical component.

Of the Self-aligning effect can also be achieved with higher viscosity Liquids are observed, albeit a movement in terms of self-alignment, this process is correspondingly slower. Care must be taken to ensure that funds are available for Align it to harden more slowly so that it sticks to it electrical component takes place after alignment.

Consequently provides a particularly advantageous variant that an electronic Component by means for aligning with a flexible carrier substrate both aligned and permanently attached.

A particularly noteworthy property of the present invention Means for aligning the electronic component is in particular therein to see that a corresponding fluid wetting particularly well can work. As a result, an adhesive may be ideal good in corners of a wettable surface area reach. In this respect, a correspondingly good angular alignment of the electrical component, as an effective angular orientation in particular from the corner regions of a fluid starting on the electrical Component can act. This is true both in terms of electronic Component as well as in terms of the flexible carrier substrate.

A Good wetting of corner areas of a wettable area with means for aligning the electrical component may be related to a rectangular or square adhesive deposit on the flexible Substrate to a particularly good angle alignment of the electrical Component lead, creating a very high accuracy and reproducibility of an alignment, in particular a rotational one Self-alignment, the electronic component guaranteed can be.

Becomes in addition, before and / or during the application of the electronic Component to a landing zone for the electronic component formed the flexible support substrate, the electronic Component particularly precise on the flexible carrier substrate be applied. Preferably, the landing zone is based on measured the reference point and thereby their location on the flexible Carrier substrate determined exactly. The landing zone can be structurally particularly easy by means of a fluid wettable area be formed. In this respect, in the landing zone too easily means for bonding and / or fixing the electronic Component or means for aligning the electronic component be provided.

As already described above, it is advantageous if the electronic Component is applied to the foldable folding area. For example the electronic component becomes with that of its sides one with suitable connecting means and / or means for Aligning the electronic component acted upon foldable Folded area applied, on which no electrical connections are provided of the electronic component and which the electrical connections facing away. This can cause the electronic Component for example by means of aligning on the Fold foldable folding area particularly well before the foldable Folded area is folded onto the flexible carrier substrate. By folding down the electrical connections of the electronic component with an electrically conductive Structure electrically connected, creating a functional semiconductor device can be produced.

Preferably the foldable folding area is much smaller than the rest Formed areas of the flexible carrier substrate, so the remaining areas are not complete if needed be covered.

Especially It is advantageous in this context that the production an electrical contacting of the electronic component and a mechanical fixation of the electronic component with or but without fluids or connecting materials, such as the means for bonding and / or for aligning the electronic component, only by Folding a single, structured and flexible carrier substrate can be done. Here, the electrical contact using Lot, ICA, ACA, ACF or Studbumps and NCA. It can be used for contacting different electrical Connections of an electronic component also different Connecting materials are used.

All in all The electronic component can be folded by folding a folding area not only beneficial to the flexible carrier substrate fixed to the flexible carrier substrate but also with electrical conductive structures are contacted.

Out the reasons mentioned above, the characteristics or the feature combinations with regard to the foldable folding area conventional method for manufacturing a semiconductor device Even without the other features of the invention advantageous develop. In this respect, these features or Feature combinations are considered inventive.

In this connection, the object of the invention is also achieved by a semiconductor device with a single, flexible film substrate and with an electronic component arranged thereon, in which case the single, flexible film substrate, a foldable folding area is formed, wherein the foldable folding area is formed as a function of a specific to the single, flexible film substrate reference point.

hereby The location of the foldable folding area can be extraordinary be precisely determined, which is especially true at Small semiconductor devices is of great advantage.

It It is understood that other entities starting from the reference point advantageously arranged on the single, flexible film substrate as already mentioned above with regard to the Procedure described.

Yet more compact, a semiconductor device can be constructed when the folding folding area has a folding area base, which is smaller than a semiconductor device footprint.

On the one hand, the semiconductor component designed in accordance with the invention has a substantially simpler structure than the RFID semiconductor component shown in the publication cited above, since the present semiconductor component merely consists of a single, flexible film substrate, by means of which two layers are created, between which the electronic component is embedded. On the other hand, the present semiconductor device also borders on the semiconductor device from the document cited at the outset JP 2005115916 A from here, since only a small folding area of the single, flexible film substrate is folded down.

Favorable Way, the folding area floor is more than a third, preferably more than half, smaller than the semiconductor device footprint, thereby only a smaller folding area needs to be folded. Especially can thereby electrically conductive structures on the single, flexible film substrate from the folded area folded over it remain uncovered, whereby, for example, a send and / or Receiving performance of an RFID semiconductor device can be improved can.

The single, flexible film substrate of the semiconductor device can also build very stable in a folded fold area, if the foldable folding area a window area within the single, flexible film substrate forms.

Of the Term "window area" describes a Materialausnehmung, which is within the only, flexible Foliensubstrats results in folded fold area. The window area or the material recess is still completely from the only flexible film substrate edged.

It is understood that in other embodiments, the material recess also not completely surrounded by the single, flexible film substrate have to be.

A preferred, because also technically very easy to control Embodiment variant provides that on the single, flexible film substrate arranged on the electronic component foldable folding area opposite the single, flexible Foil substrate is hinged attached. This allows the electronic Component about using the foldable fold easily on a metallic structure, by means of which the only flexible film substrate be at least partially coated, be unfolded.

A Accordingly, advantageous embodiment sees ago that the only flexible foil substrate with an electric conductive, in particular with a metallic structure, coated, which has at least one reference point on the single, marked flexible film substrate. For example, by means of a Such structure structurally simple a transmitting and / or receiving device an RFID semiconductor device can be provided.

The electronic component is on the only flexible film substrate easy to align and fasten when the electronic component aligned by means of a fluid on the single flexible film substrate and / or attached. Preferably, suitable Fluid depots are applied under air atmosphere.

It is understood that the fluid can be electrically conductive, so by means of the fluid, the electronic component to electrically conductive Structures can be electrically connected.

Advantageous but it is also when the fluid is electrically insulating. in this connection can an electrical connection of the electronic component only by a folding of the foldable folding area can be achieved, namely if electrical connection devices of the electronic component with an electrical structure of the flexible carrier substrate comes into contact.

A specific solution to the object of the invention proposes a method for producing a semiconductor device with an electronic component, in which a metallic structure is applied to a surface of a flexible film substrate, and then in which the thus structured, flexible film substrate a continuous assembly process, such as a roll-to-roll assembly process can be fed, the method further characterized net, that at least one reference edge on the structured, flexible film substrate is determined based on the metallic structure, in which starting from the reference edge in the structured, flexible film substrate, a foldable folding area is introduced, in which, starting from the reference edge connecting means applied to the foldable folding area in which, starting from the reference edge, the electronic component is applied to the connecting means in the foldable folding region, in which the electronic component aligns on the surface of the structured, flexible film substrate by means of the connecting means, in which case the foldable folding region coexists with the electronic component the metallic structure is folded, whereby the electronic component is at least electrically connected to the metallic structure.

Especially By this method is a very good low-cost assembly of a almost any electronic component on a preferably flexible carrier substrate feasible.

One Roll-to-roll assembly process is particularly noticeable here characterized in that an assembly line, which along an assembly line is moved, ideally never has to be stopped to a mounting step to perform with respect to a semiconductor device. In this respect, such a procedure allows a significant increase in throughput compared to today's processes for mounting electronic components on structured, flexible Carrier substrates.

The allow methods described here or process variants also an assembly of very small electronic components with few electrical connection devices, in particular also in connection with transponder interposer or inlays for RFID. Whereby a high production speed while at the same time high reliability can be ensured even when mounting very small and / or very thin electronic Components, on the one hand in particular a non-contact Assembly of an electronic component and on the other hand self-alignment an electronic component on a suitable carrier substrate can be enabled.

A Another advantageous embodiment provides that the electronic component more than an electrical connection device, preferably two to four electrical connection devices.

Accordingly provides another advantageous embodiment, the electronic component has fewer than ten electrical connection devices, preferably less than five electrical connection devices, having.

in this connection It does not matter if the electrical connection devices only on a single chip side, such as in terms of an RFID chip, or each on two chip sides, such as regarding an LED chip.

Further Advantages, objects and characteristics of the present invention explained on the basis of the following description of the appended drawing, in which example the inventive method and semiconductor components produced therewith are shown.

It demonstrate:

1 schematically a method step in which a chip element is fed to a film substrate without contact;

2 schematically a further method step, in which the chip element is aligned by means for aligning on the film substrate;

3 schematically a subsequent process step in which the chip element is permanently fixed by means for aligning the film substrate;

4 schematically a plan view of an interposer with a flipped RFID chip;

5 schematically a sectional view of the interposer of the 4 along the section line AA according to the 4 ;

6 schematically a process flow for producing the interposer from the 4 and 5 ;

7 schematically a plan view of another interposer with a flipped LED chip;

8th schematically a sectional view of the further Interposers from the 7 along the section line AA according to the 7 ;

9 schematically a process flow for producing the further Interposers from the 7 and 8th ; and

10 schematically a flow chart of a process chain for a roll-to-roll method for contacting an electronic chip by means of folding a single, structured and flexible film substrate.

In the in the 1 to 3 shown process sequence for producing a semiconductor device 1 (please refer 3 ) becomes a chip 2 as an electronic component without contact on a flexible carrier substrate 3 applied, wherein the flexible carrier substrate 3 in this embodiment as a flexible film substrate 4 is designed.

All representations after the 1 to 3 are here in upper side views 5 and in supervisions below 6 divided, the process flow according to the arrow 7 from left to right.

As shown by the 1 is on the flexible film substrate 4 a square landing zone 8th formed whose surface shape in about the surface shape of the chip 2 equivalent. At the chip 2 it can almost be any electrical and / or electronic component element.

The flexible film substrate 4 is at his the chip 2 facing surface 9 in a wettable area 10 and an unwettable area 11 divided, the wettable area 10 essentially the square landing zone 8th on the flexible film substrate 4 formed.

In the wettable area 10 can be a fluid 12 as a connecting means 13 , especially as a means 14 to align the chip 2 on the flexible film substrate 4 be applied. The fluid 12 spreads in the wettable area 10 to a fluid depot 15 ,

Will now be the chip 2 in free fall 16 contactless on the flexible film substrate 4 accelerated towards the fluid depot 15 applied (see 1 ), comes the chip 2 inevitably with the fluid 12 in contact (see 2 ). By means of the effect 17 minimizing the free interfacial energy in the area of the fluid 12 , the chip becomes 2 on the flexible film substrate 4 opposite the square landing zone 8th aligned, so the chip 2 with the square landing zone 8th or with the wettable area 10 is brought into overlap. This succeeds especially well if at one of the square landing zone 8th facing chip side 18 one with regard to the fluid 12 good wettable chip area 19 is provided.

Subsequently, the fluid 12 harden and the chip 2 is on the flexible film substrate 4 flipped so that the semiconductor device 1 is available for further use (see 3 ).

In this embodiment, the unwettable region 11 by means of a metallic structure 20 formed on the flexible film substrate 4 is applied. In this respect, the square landing zone 8th from the metallic structure 20 completely surrounded, leaving the fluid 12 defined on the flexible substrate 4 can be positioned.

By means of the metallic structure 20 immediately becomes a reference edge 21 on the flexible film substrate 4 from which, starting from which preferably all method steps are measured, so that with regard to the semiconductor device 1 a very high precision can be guaranteed.

In the in the 4 and 5 shown semiconductor device 101 it is an interposer 125 with an RFID chip 102 , The semiconductor device 101 has a flexible film substrate 104 on, which partially with a structured copper metallization 120 is coated. By means of structured copper metallization 120 is also a reference edge 121 on the flexible film substrate 104 provided. Starting from the reference edge 121 all other location-relevant steps are measured, so that they with respect to the flexible film substrate 104 exceptionally precise.

On the flexible film substrate 104 is a foldable folding area 126 available as a tab 127 from the flexible film substrate 104 punched out.

Between the tab 127 and the structured copper metallization 120 is the RFID chip 102 arranged, the RFID chip 102 with not shown in detail electrical connection devices with the structured copper metallization 120 is electrically connected as soon as the foldable folding area 126 as shown in the 5 was folded.

Before folding, the RFID chip 102 by means of an epoxy adhesive depot 115 on the foldable folding area 126 bonded, so the RFID chip 102 easily together with the tab 127 could be folded.

The thus from the flexible film substrate 104 worked out and onto the flexible film substrate 104 folded flap 127 leaves a material recess 128 in the form of a window area 129 in the flexible film substrate 104 ,

Advantageously, in the semiconductor device 101 with only a single and flexible film substrate 104 an encapsulation of the RFID chip 102 possible, so the RFID chip 102 is particularly well protected against harmful environmental influences.

To a gap 130 in the area between the folded flap 127 and the flexible film substrate 104 In addition to be able to seal well, there is another epoxy adhesive 131 arranged.

As shown by the 6 is a continuous process 132 for the production of the interposer 125 from the 4 and 5 shown, with the input side 133 a flexible film web 134 already with the structured copper metallization 120 pre-structured flexible film substrates 104 is supplied.

In a process step shown here first 135 becomes the epoxy adhesive depot 115 on the foldable folding area 126 aufgejettet. In a subsequent process step 136 becomes the RFID chip 102 Contactless on the epoxy adhesive depot 115 stored. Now harden the epoxy adhesive depot 115 off and the RFID chip 102 is according to a further method step 137 on the flexible film substrate 104 attached. Now a flux 138 on the RFID chip 102 be based on the next procedural step 138 is recognizable. Subsequently, the foldable folding area 126 as a tab 127 together with the RFID chip 102 on the flexible film substrate 104 or on the structured copper metallization 120 worked out (see method step 140 ), then the RFID chip 102 with the aid of the flux 138 with the structured copper metallization 120 in an additional process step 141 to solder. Around column 130 (please refer 5 ) in addition to closing, is in a further process step 142 another epoxy adhesive 131 on the flexible film substrate 104 applied, which then hardens (see method step 143 ), and the individual semiconductor devices fabricated herein 101 output side 144 can be provided for further processing.

In the in the 7 and 8th shown further semiconductor device 201 it is another interposer 225 with a flexible film substrate 204 , on which this time an LED chip 202 was applied without contact. The flexible film substrate 204 is at least partially with structured copper metallizations 220 and 220A coated. in particular by means of structured copper metallization 220A is also a reference edge 221 on the flexible film substrate 204 provided, from which, starting all other essential steps are coordinated.

On the flexible film substrate 204 is also here a foldable folding area 226 provided as a tab 227 from the flexible film substrate 204 punched out.

Between a first structured copper metallization 220 and the tab 227 or another structured copper metallization 220A is the LED chip 202 placed, with the LED chip 202 with not shown in detail electrical connection devices both with the first structured copper metallization 220 as well as with the further structured copper metallization 220A is electrically connected as soon as the foldable folding area 226 as shown in the 8th was folded.

Before folding, the LED chip 202 this time by means of one on the foldable folding area 226 printed solder paste depots 215 on the foldable folding area 226 attached so that the LED chip 202 easily together with the tab 227 could be folded.

The thus from the flexible film substrate 204 worked out and onto the flexible film substrate 204 folded flap 227 leaves a material recess 228 in the form of a window area 229 in the flexible film substrate 204 ,

Advantageously, in the semiconductor device 201 with only a single and flexible film substrate 204 an encapsulation of the LED chip 202 possible, so the LED chip 202 This is also particularly well protected against harmful environmental influences.

To a gap 230 in the area between the folded flap 227 and the flexible film substrate 204 In addition to be able to seal well, there is epoxy adhesive 231 fed.

As shown by the 9 is another ongoing process 232 for the production of the other interposer 225 from the 7 and 8th shown, with the input side 233 a flexible film web 234 already with the structured copper metallizations 220 respectively. 220A pre-structured flexible film substrates 204 is supplied.

In the process step shown here first 235 becomes the solder paste depot 215 on the flexible film substrate 204 printed. In a subsequent process step 236 becomes the LED chip 202 Contactless on the solder paste depot 215 deposited, causing the LED chip 202 on the flexible film substrate 204 at least prefixed. Now the foldable folding area 226 on the LED chip 202 be unfolded, as based on the further process step 237 is recognizable. Subsequently, the LED chip 202 with the structured copper metallizations 220 and 220A in an additional process step 238 soldered. Around column 230 (please refer 8th ) in addition to closing, is in a next step 239 Epoxy adhesive 231 on the flexible foliensubs joined 204 applied, which then hardens (see further process step 240 ). Thereafter, the individual semiconductor devices fabricated herein can be used 201 output side 244 be provided for further processing.

At the in the flow chart 350 shown process chain 351 a roll-to-roll process becomes a flexible film substrate 304 on the one hand with an electrically conductive structuring 352 and on the other hand with a selectively wettable structuring 353 equipped, with the electrically conductive structuring 352 and the selectively wettable structuring 353 can be identical. In particular, the electrically conductive structuring 352 this can be an antenna, an interposer, a strap or the like. Additionally there is a preparation 354 for a folding operation of the flexible film substrate 304 instead, by adding a foldable fold area to the flexible film substrate 304 is perforated. This is a pre-structuring 355 of the flexible film substrate 304 essentially completed. With the help of electrically conductive structuring 352 In addition, a reference point or reference area can be created, from which, by means of a camera, the exact positions, for example a position of the perforation and / or a position of a chip, can be measured and determined.

Now with an order 356 a fluid or bonding material on the flexible film substrate 304 applied, followed by a feed 357 A chip takes place by means of the fluid or bonding material on the flexible substrate 304 align yourself.

Next is a connection formation or fixation 358 between the chip and the flexible film substrate 304 instead of.

Another particular electrical contact 359 the chip is made by folding the flexible film substrate 304 , whereby first an order 360 a connecting material is made. Subsequently, a convolution takes place 361 the foldable folding area, whereby a further particular electrical connection formation 362 he follows.

By means of the explained process chain 351 For example, a flexible film substrate equipped with at least one chip can be used 304A be provided for further processing.

The process chain 351 may also be used to fabricate the semiconductor devices exemplified above 1 . 101 and 102 be used.

All Features disclosed in the application documents are considered to be essential to the invention as far as they are individually or in combination the prior art are new.

1

Semiconductor device

2

chip or electronic component

3

flexible carrier substrate

4

flexible foil substrate

5

upper page views

6

supervisions

7

arrow

8th

square landing zone

9

surface

10

wettable Area

11

unbenetzbarer Area

12

fluid

13

connecting means

14

medium to align

15

fluid depot

16

free case

17

effect

18

chip side

19

Good wettable chip area

20

metallic structure

21

reference edge

101

Semiconductor device

102

RFID chip

104

flexible foil substrate

115

Epoxy adhesive Depot

120

structured copper metallization

121

reference edge

125

interposer

126

foldable fold area

127

flap

128

material recess

129

pane

130

gap

131

Another Epoxy adhesive

132

transitory process

133

the input side

134

flexible sheet

135

first shown process step

136

followed by step

137

Another step

138

flux

139

Next step

140

step

141

additional step

142

Another step

143

step

144

output side

201

Semiconductor device

202

LED chip

204

flexible foil substrate

215

Solder paste depot

220

first structured copper metallization

220A

Further structured copper metallization

221

reference edge

225

another interposer

226

foldable fold area

227

flap

228

material recess

229

pane

230

gap

231

Epoxy adhesive

232

Another continuous process

233

the input side

234

flexible sheet

235

first shown process step

236

followed by step

237

Another step

238

additional step

239

Next step

240

Another step

244

output side

304

flexible foil substrate

304A

stocked, flexible film substrate

350

Flow chart

351

process chain

352

electrical conductive structuring

353

selectively wettable structuring

354

preparation

356

assignment

357

feed

358

fixation

359

Further contact

360

assignment

361

folding

362

Education connection

QUOTES INCLUDE IN THE DESCRIPTION

This list The documents listed by the applicant have been automated generated and is solely for better information recorded by the reader. The list is not part of the German Patent or utility model application. The DPMA takes over no liability for any errors or omissions.

Cited patent literature

• - JP 2005115916 A [0003, 0064]

Cited non-patent literature

• - "Ultra-Small RFID Chip: μ-Chip" by Mitsuo Usami (2004 IEEE Asia-Pacific Conference on Advanced Systems Integrated Circuits (AP-ASIC2004) / Aug. 4-5, 2004) [0004]

Claims (15)

Method for producing a semiconductor component ( 1 ; 101 ; 201 ), in which an electronic component ( 2 ; 102 ; 202 ) on a flexible carrier substrate ( 3 . 4 ; 104 ; 204 ; 304 . 304A ) is applied, characterized in that on the flexible carrier substrate ( 3 . 4 ; 104 ; 204 ; 304 . 304A ) at least one reference point ( 21 ; 121 ; 221 ), from which starting at least one further structure on and / or on the flexible carrier substrate ( 3 . 4 ; 104 ; 204 ; 304 . 304A ) is arranged. Method according to claim 1, characterized in that a plurality of reference points ( 21 ; 121 ; 221 ) is combined to form a reference line, starting from which at least one further structure on and / or on the flexible carrier substrate ( 3 . 4 ; 104 ; 204 ; 304 . 304A ) is arranged. Method according to claim 1 or 2, characterized in that the reference point ( 21 ; 121 ; 221 ) by means of a metallic structure ( 20 ; 120 ; 220 . 220A ), such as an antenna of the semiconductor device ( 1 ; 101 ; 201 ), on the flexible carrier substrate ( 3 . 4 ; 104 ; 204 ; 304 . 304A ) is marked. Method according to one of the preceding claims, characterized in that the reference point ( 21 ; 121 ; 221 ) by means of a folding edge and / or a punching edge on the flexible carrier substrate ( 3 . 4 ; 104 ; 204 ; 304 . 304A ) is marked. Method according to one of the preceding claims, characterized in that a foldable folding area ( 126 ; 226 ), such as a tab ( 127 ; 227 ) on the flexible carrier substrate ( 3 . 4 ; 104 ; 204 ; 304 . 304A ) is formed, wherein a spatial position of the foldable folding area ( 126 ; 226 ) on the flexible carrier substrate ( 3 . 4 ; 104 ; 204 ; 304 . 304A ) starting from the reference point ( 21 ; 121 ; 221 ) is measured and determined. Method according to one of the preceding claims, characterized in that the electronic component ( 2 . 102 . 202 ) starting from the reference point ( 21 ; 121 ; 221 ) on a foldable folding area ( 126 ; 226 ) of the flexible carrier substrate ( 3 . 4 ; 104 ; 204 ; 304 . 304A ) is applied. Method according to one of the preceding claims, characterized in that a foldable folding area ( 126 ; 226 ) with the electronic component ( 2 . 102 . 202 ) on the metallic structure ( 20 ; 120 ; 220 . 220A ) is folded down to the electronic component ( 2 . 102 . 202 ) on the flexible carrier substrate ( 3 . 4 ; 104 ; 204 ; 304 . 304A ) to be able to flip. Method according to one of the preceding claims, characterized in that connecting means ( 12 . 13 . 15 ; 115 ; 215 ) for connecting the electronic component ( 2 . 102 . 202 ) with the flexible carrier substrate ( 3 . 4 ; 104 ; 204 ; 304 . 304A ) on the flexible carrier substrate ( 3 . 4 ; 104 ; 204 ; 304 . 304A ), wherein a spatial position of the connecting means ( 12 . 13 . 15 ; 115 ; 215 ) on the flexible carrier substrate ( 3 . 4 ; 104 ; 204 ; 304 . 304A ) starting from the reference point ( 21 ; 121 ; 221 ) is measured and determined. Method according to one of the preceding claims, characterized in that the carrier substrate ( 3 . 4 ; 104 ; 204 ; 304 . 304A ) in terms of a fluid ( 12 . 13 . 15 ) wettable area ( 10 ) and in terms of the fluid ( 12 . 13 . 15 ) non-wettable area ( 11 ), wherein a location of at least one of the areas ( 10 . 11 ) on the carrier substrate ( 3 . 4 ; 104 ; 204 ; 304 . 304A ) starting from the reference point ( 21 ; 121 ; 221 ) is measured and determined. Method according to one of the preceding claims, characterized in that the electronic component ( 2 . 102 . 202 ) contactlessly on the flexible carrier substrate ( 3 . 4 ; 104 ; 204 ; 304 . 304A ) is applied, wherein the electronic component ( 2 . 102 . 202 ) by means of a fluid ( 12 . 13 . 15 ; 115 ; 215 ), in particular due to adhesive properties of an adhesive ( 115 ), on the flexible carrier substrate ( 3 . 4 ; 104 ; 204 ; 304 . 304A ) is aligned in an end position. Semiconductor device ( 1 ; 101 ; 201 ) with a single, flexible film substrate ( 3 . 4 ; 104 ; 204 ; 304 . 304A ) and with an electronic component ( 2 ; 102 ; 202 ), in which on the single, flexible film substrate ( 3 . 4 ; 104 ; 204 ; 304 . 304A ) a foldable folding area ( 126 ; 226 ) is formed, characterized in that the foldable folding area ( 126 ; 226 ) depending on a single, flexible film substrate ( 3 . 4 ; 104 ; 204 ; 304 . 304 A ) certain reference point ( 21 ; 121 ; 221 ) is trained. Semiconductor device ( 1 ; 101 ; 201 ) according to claim 11, characterized in that the foldable folding area ( 126 ; 226 ) has a folded area base area smaller than a semiconductor device footprint. Semiconductor device ( 1 ; 101 ; 201 ) according to claim 12, characterized in that the Faltbereichsgrundfläche more than a third, preferably more than half, is smaller than the Halbleiterbauteilgrundfläche. Semiconductor device ( 1 ; 101 ; 201 ) according to claim 11 to 13, characterized in that the um foldable folding area ( 126 ; 226 ) a window area ( 129 ; 229 ) within the single, flexible film substrate ( 3 . 4 ; 104 ; 204 ; 304 . 304A ) trains. Semiconductor device ( 1 ; 101 ; 201 ) according to any one of claims 11 to 14, characterized in that on the single, flexible film substrate ( 3 . 4 ; 104 ; 204 ; 304 . 304A ) arranged electronic component ( 2 ; 102 ; 202 ) on the foldable folding area ( 126 ; 226 ) against the single, flexible film substrate ( 3 . 4 ; 104 ; 204 ; 304 . 304A ) is attached folded down.