DE102008041072A1 - Electromagnetic band gap structure for use in system in package, has dead end passed through dielectric film, where part of end is placed in flat upper surface, which is different from flat upper surface in which metal plates are placed - Google Patents

Abstract

The structure (200) has a dead end (230) designed such that dead end electrically connects metal plates (210a-210c) i.e. copper plates, with each other. The dead end is passed through a dielectric film. A part of the dead end is placed in a flat upper surface, which is different from a flat upper surface in which the metal plates are placed. A spacing (234) possesses an end part, which is connected at an end part of a channel (232), where the end part of the channel is connected to an end part of a channel (236). The dielectric film is placed between the plates and a metal layer (220).

Description

CROSS-REFERENCE TO RELATED REGISTRATIONS

This application claims the benefit of Korean Patent Application Nos. 10-2007-0079261 and 10-2008-0057462 , issued by the Korean Intellectual Property Office on August 7, 2007, and June 18, 2008, the publication of which is hereby incorporated by reference in its entirety.

BACKGROUND

1. Technical area

The The present invention relates to an electromagnetic band gap structure, More specifically, an electromagnetic bandgap structure and a circuit board having the same, which one Signal which exceeds a predetermined frequency band is sufficient to prevent it from being transmitted.

2. Description of the state of the technique

New electronic devices and communication devices become progressively smaller, thinner and lighter, taking them reflect today's value for increasing mobility.

These electronic and communication devices have different complex electronic circuits (i.e., analog circuits and digital circuits) to their functions and work processes perform. These electronic circuits lead Typically their functions are characterized by being printed on one Printed circuit board (PCB) are implemented. The electronic circuits on the PCB usually have different from each other Operating frequencies.

The printed circuit board on which various electronic Printed circuit boards often has a noise (i. H. Mixed signal) problem due to the transferring and causing the interference of an electromagnetic (EM) wave which is from the operating frequency and the corresponding harmonic Shares of an electronic circuit over a other electronic circuit. The transmitted noise can be approximate in radiation noise and line noise to be grouped.

The Radiation noise can be easily achieved by covering with a protective cap be prevented on the electronic circuit. However, that is preventing from line noise not so easy, because the line noise over a signal transmission path is transmitted within the printed circuit board.

The noise problem will be discussed in more detail with reference to 1 described. 1 Fig. 10 is a sectional view showing a printed circuit board including two electronic circuits having different operating frequencies. Even though 1 a four-layer printed circuit board 100 As will be apparent, it will be apparent that the printed circuit board can be modified to have a 2-, 6- or 8-layer structure.

As in 1 is shown includes the printed circuit board 100 metal layers 110-1 . 110-2 . 110-3 and 110-4 (hereinafter jointly referred to as 110 and dielectric layers 120-1 . 120-2 and 120-3 (hereinafter jointly referred to as 120 designated), which between the metal layers 110 are created. The top metal layer 110-1 the printed circuit board 100 is with two electronic circuits 130 and 140 equipped with different operating frequencies (hereinafter each as a first electronic circuit 130 and a second electronic circuit 140 designated). In a mobile communication device, such. As a mobile phone, the two electronic circuits 130 and 140 which have different operating frequencies, be a digital circuit that functions as a microprocessor, and be an RF circuit (ie, an analog circuit) to receive and transmit an RF signal.

If it is assumed that the metal layer represented by the reference number 110-2 is designated, an earth layer, and the metal layer, which by the reference number 110-3 is a power layer, here is each earth pin of the first electronic circuit 130 and the second electronic circuit 140 electrically connected to the metal layer indicated by the reference number 110-2 and each power supply pin is electrically connected to the metal layer represented by the reference number 110-3 is reproduced. In the printed circuit board 100 All earth layers are also electrically connected to each other via paths. Similarly, all power layers are also electrically connected to each other via paths (with reference to the reference number 160 in 1 ).

If the first electronic circuit 130 and the second electronic circuit 140 have different operating frequencies, is a line noise 150 which is determined by an operating frequency of the first electronic circuit 130 and their harmonic components is on the second electro-American circuit 140 transfer, as in 1 will be shown. This has a deleterious effect on the accurate operation / operation of the second electronic circuit 140 ,

Together with the growing complexity of electronic devices and higher operating frequencies of digital circuits It is increasingly difficult to solve this line noise problem. Especially, the typical bypass capacitor method or the Decoupling capacitor method to address the line noise problem solve, no longer adequate, since the electronic Devices use a higher frequency band.

Furthermore are the solutions mentioned above inadequate, when multiple active devices and passive devices in one Complex wiring board to implement which are different Own types of electronic circuits which are on the same Board or in a narrow area, such. B. one System in the housing (SiP), are formed, or if a high Frequency band is required for the operating frequency, such as in a network board.

SUMMARY OF THE INVENTION

The The present invention provides an electromagnetic bandgap structure and a printed circuit board having the same, which the Noise of a specific frequency is lowered, this one has compact size and a low band gap frequency.

The The present invention also provides an electromagnetic bandgap structure and a printed circuit board having the same, which It makes it easy to shape these by taking a compact size possess and whereby a high impedance and a high inductance in the case of applying a plurality of active elements and passive elements on a narrow surface, such as in a system in the housing (SiP).

additionally The present invention provides an electromagnetic bandgap structure and a printed circuit board having the same, which a mixed signal problem in an electronic device (e.g. B. a mobile communication device) triggers, wherein an RF circuit and a digital circuit are included which placed on the same board.

One Aspect of the present invention characterizes an electromagnetic bandgap structure, which includes: a dielectric layer; a variety of conductive or conductive plates; and a stitch or Stichweg, which is constructed so that it the conductive plates connects with each other. At this time, the creep path through the lead dielectric layer, and part of the Stichweges can be placed in a flat surface which is different from a flat surface in which the conductive plates are placed.

Here can include the cuspile: a first path, which through the dielectric layer leads and which has an end portion, which is connected to any one of the two adjacent conductive plates is; a second path through which the dielectric layer leads and which has an end part, which with the another of the two adjacent conductive plates is connected; and a connection grid having an end part, which is connected to the other end part of the first way, and the other end part has, which with the other end part the second way is connected.

The Electromagnetic band structure may further include a conductive layer include, wherein the dielectric layer between the conductive Plates and the conductive layer is placed. At this point For example, the conductive layer may have a void opening Own clearance hole, and the terminal grid can in this void opening be housed.

The conductive plate can be a polygonal, circular or elliptical shape. The conductive plates can have the same size. Alternatively, the senior Plates can be divided into a variety of groups, which are different May have dimensions of conductive plates. The senior Plates can also be on the same flat surface be placed.

One characterized another aspect of the present invention a printed circuit board containing two electronic circuits includes, which have different operating frequencies; and an electromagnetic band gap structure thus constructed is that they are a dielectric layer, a variety of conductive Has plates and a branch path which the conductive plates electrically interconnects and which between the two electronic Circuits is arranged. At this point, the culvert can pass through lead the dielectric layer, and part of the Stichweges can be placed in a flat surface which is different from a flat surface in which the conductive plates are placed.

Here, the branch path may include: a first path through which the dielectric layer leads, and have an end portion which is connected to one of the two adjacent conductive boards; a second path leading through the dielectric layer and having an end portion connected to the other of the two adjacent conductive plates; and a terminal grid, one end portion of which is connected to the other end portion of the first path and the other end portion is connected to the other end portion of the second path.

The printed circuit board may further include a conductive layer, the dielectric layer between the conductive plates and the conductive layer is placed. At this point, the senior Layer include a void opening, and the connection grid can be housed in the void opening.

The conductive layer may be one of an earth layer and a power supply layer, and the conductive plates can level on the same Surface connected as a separate layer be. At this point, the conductive plates can the different layer connected via the Stichweg be.

Here the conductive plate may be a polygonal, circular or elliptical shape. The conductive plates can have the same size. Alternatively, the senior Plates can be divided into a variety of groups, which are different Have dimensions of conductive plates. The conductive plates can also be placed on the same flat surface.

One characterized another aspect of the present invention a printed circuit board including: a signal layer; an earth layer; and an electromagnetic band gap structure, which is constructed to include a dielectric layer, a plurality of conductive plates and a branch path, which electrically interconnects the conductive plates. At this Place the trickle path can lead through the dielectric layer, and part of the cusp path may be in a flat surface be placed, which is different from a flat surface is in which the conductive plates are placed, and the conductive Plates can be on a same level surface be placed like a flat surface in which the signal layer is placed.

Here the conductive plate can be connected to the signal layer via the Stichweg be connected.

Of the Stichweg may include: a first path, which through the dielectric Layer leads, and have an end portion, which with a the two adjacent conductive plates are connected; a second Path, which leads through the dielectric layer and which has an end portion which is adjacent to the other of the two adjacent ones connected to conductive plates; and a connection grid, which one End part which is connected to the other end part of the first path is, and the other end part has, which with the other end part the second way is connected.

The printed circuit board may further include a conductive layer, the dielectric layer between the conductive plates and the conductive layer is placed. At this point, the senior Layer include a void opening, and the connection pattern can be accommodated in the void opening. Here can the conductive layer is an earth layer.

The conductive plate can be a polygonal, circular or elliptical shape. The conductive plates can have the same size. Alternatively, the senior Plates can be divided into a variety of groups, which are different Have dimensions of conductive plates. The conductive plates can be placed on the same flat surface. The conductive plates may also travel along a signal transmission path be arranged in a row or in two rows.

BRIEF DESCRIPTION OF THE DRAWINGS

1 Fig. 10 is a cross-sectional view showing a printed circuit board including an analog circuit and a digital circuit;

2 Fig. 10 is a 3-D perspective view showing an electromagnetic bandgap structure according to an embodiment of the present invention;

3A FIG. 15 is a cross-sectional view illustrating the electromagnetic band gap structure of FIG 2 shows;

3B FIG. 11 is a plan view showing a configuration of the electromagnetic band gap structure of FIG 2 shows;

3C FIG. 12 shows an equivalent circuit of the electromagnetic band gap structure of FIG 2 ;

4A Fig. 10 is a 3-D perspective view showing an electromagnetic bandgap structure according to another embodiment of the present invention;

4B is a 3-D perspective view showing an electromagnetic Bandabstandsstruk shows a structure according to another embodiment of the present invention;

4C Fig. 10 is a 3-D perspective view showing an electromagnetic bandgap structure according to another embodiment of the present invention;

5 FIG. 10 is a plan view showing a configuration of an electromagnetic band gap structure including a rectangular metal plate; FIG.

6 FIG. 10 is a plan view showing a configuration of an electromagnetic band gap structure including a triangular shaped metal plate; FIG.

7 Fig. 10 is a plan view showing a band-shaped configuration of an electromagnetic band gap structure;

8th and 9 10 are plan views showing a configuration of an electromagnetic band gap structure including a plurality of groups including metal plates of different dimensions; and

10 FIG. 12 is a graph showing a frequency characteristic of an electromagnetic band gap structure according to an embodiment of the present invention. FIG.

DETAILED DESCRIPTION

There There are a variety of permutations and embodiments of the present invention will become particular embodiments illustrated with reference to the accompanying drawings and described. However, this is by no means intended to be the present Restrict the invention to certain embodiments and is intended to serve with all permutations, equivalents and substitutions by the spirit and scope of the present invention be covered. Inside the drawings are similar Elements similar reference numbers given. Within the Description of the present invention, when describing a certain technology is determined, the point of the present To circumvent the invention, the pertinent detailed description omitted.

Terme such as "first" and "second" can for Describing various elements are used, but should the above elements are not limited to these above terms be. The above terms are only used to describe an element of the to distinguish others. For example, the first element be referred to as the second element and vice versa, without the Scope of the claims of the present invention. The term "and / or" is intended to be the combination of a variety of Points or any of the multitude of listed points include.

If An element is described as having another element "connected" or "accessed", it should be interpreted that way be that it is directly connected to the other element or this is accessed, but possibly also can have another element in between. On the other hand, if one element is described that it is with another element is "directly" connected or "directly accessed" this can be interpreted so that there is no other element in between gives.

The Terms used in the description are intended to be specific embodiments only describe and should by no means the present invention limit. If not used clearly in a different way, Expressions in the singular include multiple meanings. In the present description, an expression such as. B. "having" or "consisting of" a characteristic, a number, a step, an operation or workflow, part or combinations of it denote and should not be interpreted, a presence or a possibility of one or more other characteristics, Numbers, steps, operations, elements, parts or combinations exclude it.

If not defined in any other way, use all terms where technical terms and scientific terms are included, which used here, the same meaning as they in general understood by those skilled in the art to which the invention pertains refers. Any term, which in a general dictionary is defined, it should be interpreted that he has the same meaning in the context of the prior art, and if not in one otherwise defined explicitly, it should not be interpreted an idealistic or very formalistic meaning to own.

following Here are some embodiments of the present invention described in detail with reference to the accompanying drawings.

2 FIG. 10 is a 3-D perspective view showing an electromagnetic bandgap structure according to an embodiment of the present invention. FIG. 3A FIG. 15 is a cross-sectional view illustrating the electromagnetic band gap structure of FIG 2 shows, and 3B is a plan view showing a configuration of the electroma magnetic bandgap structure of the 2 shows. Specially shows 3A a cross section which along the line AA of 2 is looked at.

Even though a metal layer and a metal plate during the description the structure of an electromagnetic band gap structure of The present invention should be apparent to those skilled in the art be understood that the metal layer and the metal plate by any other conductive layers and plates substituted or can be replaced.

As in 2 to 3B 1, the electromagnetic bandgap structure according to an embodiment of the present invention may include: a plurality of metal plates 210a . 210b and 210c a metal layer 220 which is placed on a flat surface which is different from a flat surface in which the metal plates 210a . 210b and 210c are placed, and a cusp way 230 which electrically connects two adjacent metal plates within the metal plates.

In other words, the electromagnetic band gap structure 200. , what a 2 to 3B can basically include a two-layered planar structure having a first layer in which the metal layer 220 is placed, and a second layer in which the plurality of metal plates 210a . 210b and 210c is placed. A dielectric layer may be between the metal layer 220 and the variety of metal plates 210a . 210b and 210c be arranged.

Show here 2 to 3B only elements showing the electromagnetic band gap structure (ie, a part constituting the two-layered electromagnetic band gap structure including the branch path) for convenience of illustration (also in the case of FIG 4A to 4C ). Accordingly, the first layer, in which the metal layer 220 , what a 2 to 3B is shown, and the second layer, in which the plurality of metal plates 210a . 210b and 210c , what a 2 to 3B can be shown to be any two layers of a multi-layered printed circuit board.

In other words, it should be apparent that there is at least one additional metal layer below the metal layer 220 , above the metal plates 210a . 210b and 210c and / or between the metal layer 220 and the metal plates 210a . 210b and 210c can give.

For example, the electromagnetic band gap structure 200. which in the 2 to 3B is placed between any two metal layers which function as a power layer in a multilayer printed circuit board to block line noise (the same can be applied to electromagnetic bandgap structures disclosed in U.S. Pat 4A to 4B shown in accordance with other embodiments of the present invention).

Since the line noise problem is not limited to the distance between the power supply layer and the ground layer, the electromagnetic bandgap structure used in FIG 2 to 4C is placed between any two ground layers or power layers on different layers of each other in a multilayer printed circuit board.

The metal plates 210a . 210b and 210c may be spaced apart from each other over a predetermined distance on the same flat surface. Here you can see the metal layer 220 and the metal plates 210a . 210b and 210c of a material (such as copper (Cu)) to which power can be supplied, and a signal can be transmitted.

The Stichweg 230 can electrically two adjacent metal plates (eg, the metal plates 210b and 210c in 2 ) connect. However, the two metal plates 210b and 210c not connected to each other on the same layer in which the metal plates 210b and 210c but over another layer (eg the metal layer 220 ), which is different from the layer in which the metal plates 210b and 210c are placed.

The Stichweg 230 can be formed so that he has a first way 232 , a connection grid 234 and a second way 236 includes. The first way 232 may include: an end part attached to the first metal plate 210b is connected, and another end part, which at an end portion of the connection grid 234 connected. The second way 236 may include: an end part attached to the second metal plate 210c is connected, and another end part, which at the other end part of the terminal grid 234 connected. A pad to get on the first way 232 and / or on the second way 236 can be connected to each end part of the connection grid 234 be formed.

It should be obvious here that in order to allow the metal plates to be electrically connected to each other, it is necessary that a plating layer on an inner wall only of the first path 232 and the second way 236 of the Stichweges 230 is formed or that the inside of the Stichweges 230 filled with a conductive material (eg, a conductive paste) and the terminal grid 234 a conductive material is such. B. a metal.

The two adjacent metal plates 210b and 210c can in series over the cuspble 230 be connected. Specifically, the two adjacent metal plates 210b and 210c electrically connected in series, in the order of the first metal plate 210b → the branch path 230 (the first way 232 → the connection grid 234 → the second way 236 ) → the second metal plate 210b ,

The first metal plate 210b can be attached to the other metal plate 210a over the Stichweg 230 be connected. The second metal plate 210c can also be attached to another metal plate (not shown) via the branch path 230 be connected. As a result, all the metal plates placed on the second layer can pass in series across the stitch path 230 be connected.

The metal layer 220 can with a void opening or a clearance hole 225 be formed, in which the connection grid 234 is housed. The white space opening 225 can also be the way-off point for easy connection with the first way 232 and / or the second way 236 as well as the connection grid 234 take up. The white space opening 225 can allow that the culvert 230 and the metal layer 220 are electrically isolated from each other.

The joining of the metal plates 210a . 210b and 210c over the Stichweg 230 can make it redundant, a grid for joining the metal plates 210a . 210b and 210c to form on the second layer. This allows the metal plates 210a . 210b and 210c be made smaller and the gap between the metal plates 210a . 210b and 210c can be made tighter, thereby increasing the capacity in the gaps between the metal plates 210a . 210b and 210c is increased.

3C shows an equivalent circuit of an electromagnetic band gap structure having the above structure.

Comparing the equivalent circuit of 3 with the electromagnetic band gap structure of the 2 , an inductance component L1 may be the first way 232 and an inductance component L2 may be the second way 236 correspond. An inductance component L3 can be the connection grid 234 correspond. C1 can be a capacity component through the metal plates 210a and 210b and another dielectric layer and another metal layer which are above the metal plates 210a and 210b to place. C2 and C3 can capacitance components through the metal layer 220 which are on the same flat surface as the terminal grid 234 is placed, and another dielectric layer and another metal layer, which below the flat surface of the terminal grid 234 to place.

The electromagnetic bandgap structure used in 2 to 3B may function as a bandstop filter which blocks a signal of a particular frequency band according to the above equivalent circuit. In other words, as in the equivalent circuit of 3 can be seen, a signal x of a low frequency band (with reference to 3C ) and a signal y of a high frequency band (refer to FIG 3C ) through the electromagnetic band gap structure, and signals z1, z2 and z3 of a particular frequency band (refer to FIG 3C ), which is between the low frequency band and the high frequency band, is blocked by the electromagnetic band gap structure.

According to an embodiment of the present invention, the metal plates 210a . 210b and 210c placed on a flat surface, in which another metal layer, which is different from the metal layer 220 is, is placed. The metal plate 210a Therefore, according to the present invention, which is placed on a far left side can be connected via a branch path with the other metal layer, which is different from the metal layer 220 is.

If the metal layer 220 is a power supply layer, the different metal layer may be an earth layer, and if the metal layer 220 is an earth layer, the different metal layer may be a power supply layer.

Alternatively, a signal may be transmitted in a predetermined direction by the metal layer 220 is allowed to be the earth layer and the other metal layer to be a signal layer, and the noise at a certain frequency of the signal can be reduced by the aforementioned metal plates 210a . 210b and 210c and the Stichweg 230 is allowed to be arranged on some areas of a signal transmission path of the signal layer.

As in the 2 to 3B can be shown, the metal plates 210a . 210b and 210c can be arranged in a row, and two stitch paths can with each of the metal plates 210a . 210b and 210c be connected. However, according to another embodiment of the present invention, a metal plate may be arranged in an m × n matrix, where m and n are natural numbers, and their adjacent metal plates may be connected using the branch path. In this case, each metal plate may function as a path connecting its adjacent other metal plates, and may be connected to at least two stitch paths.

In other words, the connection form used in 2 to 3B is just one example, and as long as all the metal plates can form a closed loop by being electrically connected to each other, any method of connecting the metal plates via the branch path can be used. Hereinafter, various embodiments of the present invention will be described according to the configuration and arrangement of a metal plate with reference to the drawings.

5 FIG. 10 is a plan view showing a configuration of an electromagnetic band gap structure including a rectangular metal plate, and FIG 6 FIG. 10 is a plan view showing a configuration of an electromagnetic band gap structure including a triangular metal plate. FIG. 7 FIG. 10 is a plan view showing a band-shaped configuration of an electromagnetic band gap structure. FIG.

The metal plate may be a polygon shape, such as. B. a triangle (with reference to 6 ), or have a hexagonal shape or various other shapes, such as. B. a circle or an ellipse, as well as a rectangle (with reference to 5 ).

In addition, the metal plates, which are connected via the branch path, on a whole board (with respect to 5 and 6 ) or on a part of the board (with reference to 7 ) to be ordered.

The metal plate may be connected to two adjacent different metal plates, which are connected to two branch paths, as in 2 or to four adjacent different metal plates by connecting them to four branch paths, as shown in FIG 5 is described. Similarly, the metal plate, as in 6 described, be connected to three adjacent different metal plates, which are connected to three branch paths.

In In this case, the metal plates, which are in the path are arranged between a signal source and a signal target, can not be separated by the Stichweg. In other words, the Metal plates are arranged in two rows, and all adjacent ones Metal plates of any metal plate can over the Be connected Stichwege. Alternatively, any metal plate be connected in a zigzag shape.

8th and 9 FIG. 10 is plan views showing a configuration of an electromagnetic band gap structure including a plurality of groups including metal plates of different dimensions.

All metal plates which are connected by the branch path can have the same dimension as described above, or different dimensions, as in the 8th and 9 shown. In other words, the metal plates may be divided into a plurality of groups having different dimensions.

Regarding 8th For example, metal plates B having a relatively larger dimension and metal plates C having a relatively smaller dimension may alternatively be disposed, and each metal plate may be connected to their adjacent metal plates via the branch paths, respectively. In other words, each of the large metal plates B and the small metal plates C may be connected to their adjacent metal plates C or B via four branch paths, respectively.

In case of 9 For example, metal plates D having a relatively larger dimension and metal plates E1, E2, E3 and E4 having a relatively smaller dimension may be arranged. The small metal plates E1, E2, E3 and E4 may be grouped in a 2 × 2 shape. Each group consisting of the four small metal plates E1, E2, E3 and E4 may occupy an area similar to the large metal plate D. Each of the small metal plates E1, E2, E3 and E4 may each be connected to their adjacent metal plates via four branch paths. Also, since there are 8 small metal plates around the large metal plate D, the large metal plate D can be electrically connected to the adjacent small metal plates via 8 branch paths.

As As described above, the arrangements can be used together with the Metal plates of different dimensions that transfer interrupt a signal corresponding to a certain frequency or intercept or reduce the corresponding noise.

Hereinafter, some electromagnetic bandgap structures according to other embodiments of the present invention will be described together with the reference to 4A to 4C described. Any facts already in 2 to 3B is not described redundantly, and the electromagnetic bandgap structures are briefly described based on the features of each embodiment of the present invention. This is due to the fact that the same technological principle as in the 2 to 3B is described at the electromagnetic bandgap structures of 4A to 4C is used in accordance with other embodiments of the present invention, except for some differences.

Accordingly, in 4A to 4C each item has the same reference number as in 2 to 3B , for the sake of comparison.

As in 4A 1, the electromagnetic bandgap structure according to another embodiment of the present invention may include a plurality of metal plates 210a . 210b and 210c and a shortcut 230 which electrically two adjacent metal plates of the metal plates 210a . 210b and 210c connects with each other. In other words, the electromagnetic band gap structure of 4A does not have a metal layer corresponding to the metal layer 220 , what a 2 to 3a will be shown.

Thus, it is not always necessary that the electromagnetic band gap structure having a branch path according to an embodiment of the present invention include a metal layer below a surface in which the branch path and the metal plates are arranged. This is so because it is not necessary for the port grid 234 of the Stichweges 230 is formed on a surface in which the metal layer is placed.

In other words, if there is a metal layer on the same flat surface to correspond to a surface in which the terminal grid 234 can be placed, the connection grid 234 be made in the mold that it is in the void space 225 which is in the metal layer 220 formed on the same flat surface, is housed, as in 2 to 3B will be shown. However, no additional metal layer may be placed in the area in which the connection grid 234 will be placed, as in 4A will be shown. Of course, there may be a dielectric layer below the metal plates in 4A give.

As in 4B 4, the electromagnetic bandgap structure according to an embodiment of the present invention may have a stacked structure, wherein the position of the upper layer and the lower layer is inversely opposite to that of the 2 to 3B is.

In other words, while the electromagnetic band gap structure used in 2 to 3B the metal layer is shown 220 Making a lower layer, the metal plates 210a . 210b and 210c forming an upper layer and having the dielectric layer interposed between the lower layer and the upper layer, the electromagnetic band gap structure used in FIG 4B is shown, conversely, the metal layer 220 forming the upper layer, the metal plates 210a . 210b and 210c which form the lower layer and have the dielectric layer disposed between the lower layer and the upper layer. Of course, it can be expected that the electromagnetic band gap structure, which in 4B is shown, the identical or similar noise blocking effect to that of 2 to 3B has.

As in 4C 12, the electromagnetic bandgap structure according to another embodiment of the present invention may have the same structure of the electromagnetic bandgap structure as shown in FIG 4b is shown without the metal layer 220 , The reason, which already above with respect to 4A is omitted is omitted.

Therefore For example, the electromagnetic bandgap structure can be made according to the present invention various types of stacked structures have. Although all previously listed drawings show that all metal plates in the same flat surface Stacked, it is not always necessary that all metal plates stacked in the same flat surface.

in the Trap, that at least one of the metal plates in a flat surface is stacked, which is different from the flat surface is, in which the other metal plates are stacked, the electromagnetic band gap structure two or more layers have. However, this increased number of layers allowed have no harmful effect on the design, when the electromagnetic bandgap structure of the present invention applied to a printed circuit board with many layers becomes.

The Drawings mentioned above also show that each culvert connecting two adjacent metal plates. However, you can It may be unnecessary for two plates to pass through the culvert are connected, adjacent to each other.

Even if a metal plate is shown to be over a It is obviously not necessary that the electromagnetic bandgap structure has a limitation with respect to has the number of branch paths, which any two metal plates combines.

Because of the ease of illustration and understanding of the invention, it will be appreciated in 2 to 4C only three metal plates are shown, and one metal plate is electrically connected to another adjacent metal plate, and another adjacent metal plate is connected via a branch path (ie, two adjacent cells around a cell are connected).

In other words, the electromagnetic bandgap structure according to each embodiment of the present invention may be arranged to have various shapes, dimensions, and configurations in some (particularly with reference to FIGS 7 ) or all parts of the board. This may be clearly understood by one of ordinary skill in the art to the full purpose of the present invention.

10 FIG. 12 is a graph showing a frequency characteristic of an electromagnetic band gap structure according to an embodiment of the present invention. FIG. 10 illustrates the result wherein a simulation model for the electromagnetic bandgap structure is formed, including the branch path, and then analyzed by using the scattering parameters.

On a base of -50 db can be recognized that a stopband, which intercepts a signal transmitted via the electromagnetic Bandgap structure is transmitted, in one area formed over the frequency band between about 2,8 and 7,5 GHz is enough.

Naturally For example, the frequency band of the stop band may be designed to be has a desired frequency band, by in appropriate Way different properties, such as the size the electromagnetic bandgap structure, the dielectric Constant and the configuration of the dielectric layer and the shape, the size and number of metal plates set become.

A printed circuit board according to one embodiment The present invention can be a system in a housing Be (SIP).

The printed circuit board can be a signal layer and an earth layer include. A signal along with the signal along the signal layer is transmitted, noise due to a generate high operating frequency. In this case, the previous one electromagnetic bandgap structure can be applied to the Noise, which has a certain frequency, to lower.

The Earth layer can be a metal layer, and the metal layers can be arranged so that they are uniform Intervals to each other on the same flat surface how the signal layer is spaced. Every metal plate can over be connected to the Stichweg. A first way and a second Way of the Stichweges can be connected to a connection grid which is formed on the earth layer. The connection grid may be arranged in a void opening to be in no one Contact with the connection grid to stand.

The Metal plates can along a signal transmission path arranged in a row or in two rows on the signal layer be. Each of the metal plates can be connected via branch paths be such that a signal from a signal source to a signal destination can be transmitted without interruption.

Corresponding another embodiment of the present invention The printed circuit board can have two electronic circuits (Assume a digital circuit and an analog circuit in this Embodiment) include which operating frequencies own, which are different from each other. At this point can the aforementioned electromagnetic band gap structure between the digital circuit and the analog circuit may be arranged.

The Electromagnetic bandgap structure may be partially arranged be that an electromagnetic wave, which from the digital Circuit is transferred to the analog circuit, necessary wise about the electromagnetic band gap structure to be led. In this case, the electromagnetic Bandgap structure around the analog circuit and the digital circuit be arranged in a form of a closed loop. Alternatively, the electromagnetic band spacing structure in some or arranged in all internal parts of the printed circuit board be ranging from the digital circuit to the analog circuit.

The Electromagnetic bandgap structure may be between a power supply layer and an earth layer within the layers, which represent the printed circuit board.

A the earth layer and the voltage supplying layer can the Be metal layer. Also, the metal plates can be separated at regular intervals on the same flat surface as the flat surface be arranged, in which the other layer is arranged. each The metal plates can be connected via the branch path be. Here can be a first way and a second way of the Stichweges be connected to a connection grid, which in the metal layer is formed. The connection grid can be in a void opening be housed so as to be in no contact with the terminal grid to stand.

There the aforementioned electromagnetic band gap structure is disposed within the printed circuit board, which the digital circuit and the analog circuit has, together in the same Realized, the printed circuit board can prevent a electromagnetic wave is transmitted, which is a specific Frequency band, within the electromagnetic waves, has, which from the digital circuit to the analog circuit is.

With In other words, despite the small size, it is possible, the previously mentioned mixed signal problem to solve by keeping an electromagnetic wave from it which ranges into a certain frequency band, accordingly the noise in the analog circuit to be transmitted.

Even though some embodiments of the present invention are described should any person skilled in the art to which the invention relates to be able to understand that a very large number of permutations is possible, without mind and scope to deviate from the present invention and its equivalents, which only by the appended claims below are defined.

QUOTES INCLUDE IN THE DESCRIPTION

This list The documents listed by the applicant have been automated generated and is solely for better information recorded by the reader. The list is not part of the German Patent or utility model application. The DPMA takes over no liability for any errors or omissions.

Cited patent literature

• - KR 10-2007-0079261 [0001]
• - KR 10-2008-0057462 [0001]

Claims (29)

Electromagnetic bandgap structure, which having: a dielectric layer; a variety of conductive plates; and a stitch or stitch path, which is constructed such that it electrically connects the conductive plates with each other connects, the branch path leading through the dielectric layer, and part of the branch path in a flat surface which is different from a flat surface is in which the conductive plates are placed. Electromagnetic bandgap structure after 1 wherein the branch path comprises: a first path leading through the dielectric layer and having an end portion connected to one of the two adjacent conductive plates; a second path leading through the dielectric layer and having an end portion connected to the other of the two adjacent conductive plates; and a terminal grid having an end portion connected to the other end portion of the first path and the other end portion connected to the other end portion of the second path. Electromagnetic bandgap structure according to claim 2, further comprising: a conductive layer, wherein the dielectric Layer between the conductive plates and the conductive layer is placed. Electromagnetic bandgap structure according to claim 3, wherein the conductive layer has a void opening, and the terminal grid housed in the void opening is. Electromagnetic bandgap structure according to claim 1, wherein the conductive plate is a polygonal, circular or elliptical shape. Electromagnetic bandgap structure according to claim 1, wherein the conductive plates have the same size. Electromagnetic bandgap structure according to claim 1, wherein the conductive plates are divided into a plurality of groups are what different dimensions of the conductive plates have. Electromagnetic bandgap structure according to claim 1, wherein the conductive plates on the same flat surface are placed. Printed circuit board, comprising: two electronic circuits, which have different operating frequencies have; and an electromagnetic band gap structure, which is constructed to comprise a dielectric layer, a Has a plurality of conductive plates and a branch path which electrically interconnects the conductive plates and which arranged between the two electronic circuits, in which the leakage path through the dielectric layer leads and a part of the Stichweges placed in a flat surface which is different from a flat surface is in which the conductive plates are placed. A printed circuit board according to claim 9, wherein said Stichweg has: a first path through which the dielectric layer leads and which has an end part, which with a the two adjacent conductive plates are connected; one second path, which leads through the dielectric layer and which has an end part which coincides with the other of the two connected to adjacent conductive plates; and a connection grid, which has an end part, which at the other end part of the first Way is connected and where the other end part to the other End part of the second path is connected. A printed circuit board according to claim 10, which further comprising a conductive layer, wherein the dielectric layer placed between the conductive plates and the conductive layer is. A printed circuit board according to claim 11, wherein the conductive layer has a void opening and the connection grid housed in the void opening is. A printed circuit board according to claim 11, wherein the conductive layer is one of an earth layer and a voltage supplying one Layer is and the conductive plates on the same flat surface how a different layer are connected. A printed circuit board according to claim 13, wherein transfer the conductive plates to the different layer the Stichweg are connected. A printed circuit board according to claim 9, wherein said conductive plate a polygonal, a circular or has an elliptical shape. A printed circuit board according to claim 9, wherein said conductive plates have the same size. A printed circuit board according to claim 9, wherein said conductive plates are divided into a plurality of groups, which have different dimensions of the conductive plates. A printed circuit board according to claim 9, wherein said conductive plates placed on the same flat surface are. Printed circuit board, comprising: a Signal layer; an earth layer; and an electromagnetic Bandgap structure which is constructed to be a dielectric layer, has a plurality of conductive plates and a branch path, which electrically connects the conductive plates, wherein the branch path leads through the dielectric layer and part of the branch path in a flat surface which is different from a flat surface, in which the conductive plates are placed, and the conductive ones Plates connected on a same flat surface are like a flat surface in which the signal layer is placed. A printed circuit board according to claim 19, wherein the conductive plates to the signal layer via the Stichweg are connected. A printed circuit board according to claim 19, wherein the branch path has: a first way, which through the dielectric layer leads and which has an end portion, which is connected to one of the two adjacent conductive plates is; a second path through which the dielectric layer leads and which has an end part, which to the other the two adjacent conductive plates is connected; and one Connection grid, which has an end part, which to the other End part of the first path is connected, and where the other End part is connected to the other end part of the second path. A printed circuit board according to claim 21, which further comprising a conductive layer, wherein the dielectric layer placed between the conductive plates and the conductive layer is. A printed circuit board according to claim 22, wherein the conductive layer has a void opening and the connection grid housed in the void opening is. A printed circuit board according to claim 22, wherein the conductive layer is an earth layer. A printed circuit board according to claim 19, wherein the conductive plate is a polygonal, a circular or has an elliptical shape. A printed circuit board according to claim 19, wherein the conductive plates along a signal transmission path arranged in a row or two rows. A printed circuit board according to claim 19, wherein the conductive plates have the same dimension. A printed circuit board according to claim 19, wherein the conductive plates are divided into a plurality of groups, which have different dimensions of the conductive plates. A printed circuit board according to claim 19, wherein the conductive plates on the same flat surface are arranged.