DE102008047426A1 - Temperature sensor module e.g. ambient temperature sensor, for e.g. measurement- and regulation system, has integrated circuit sensor connected with master controller unit and transceiver and supplied with voltage by master controller - Google Patents
Temperature sensor module e.g. ambient temperature sensor, for e.g. measurement- and regulation system, has integrated circuit sensor connected with master controller unit and transceiver and supplied with voltage by master controller Download PDFInfo
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- DE102008047426A1 DE102008047426A1 DE200810047426 DE102008047426A DE102008047426A1 DE 102008047426 A1 DE102008047426 A1 DE 102008047426A1 DE 200810047426 DE200810047426 DE 200810047426 DE 102008047426 A DE102008047426 A DE 102008047426A DE 102008047426 A1 DE102008047426 A1 DE 102008047426A1
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- sensor
- temperature sensor
- master controller
- temperature
- sensor module
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- 238000000034 method Methods 0.000 claims abstract description 10
- 238000005259 measurement Methods 0.000 abstract description 5
- UGFAIRIUMAVXCW-UHFFFAOYSA-N Carbon monoxide Chemical compound [O+]#[C-] UGFAIRIUMAVXCW-UHFFFAOYSA-N 0.000 description 1
- 206010063493 Premature ageing Diseases 0.000 description 1
- 208000032038 Premature aging Diseases 0.000 description 1
- 238000009529 body temperature measurement Methods 0.000 description 1
- 239000003546 flue gas Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K13/00—Thermometers specially adapted for specific purposes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K2215/00—Details concerning sensor power supply
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Arrangements For Transmission Of Measured Signals (AREA)
Abstract
Description
Stand der TechnikState of the art
Die Erfindung geht aus von einem Temperatursensormodul, nach der Gattung des Anspruchs 1, und von einem Verfahren zum Messen von Temperaturen, nach der Gattung des Anspruchs 7.The The invention is based on a temperature sensor module, according to the genus of claim 1, and a method for measuring temperatures, according to the preamble of claim 7.
Im heutigen Energie bzw. Facility Management und in der Mess- und Regelungstechnik sind genaue Referenzwerte erforderlich, um auf diesen aufbauend diese korrekt zu analysieren bzw. diese Daten richtig verwerten zu können. Dabei sind Messwerte, deren Abweichung mehr als 3°C vom tatsächlichen Wert abweichen als Messwerte nicht geeignet.in the today's energy or facility management and in measurement and control technology Exact reference values are required to build on this to analyze these correctly or to use these data correctly to be able to. Here are measured values whose deviation is more than 3 ° C from the actual Value deviate from measured values not suitable.
Die heutigen Systeme, bei denen nicht lineare Temperaturfühler eingesetzt werden, reagieren sehr langsam auf Temperaturschwankungen. Ungenauigkeiten in der Messung sind damit vorprogrammiert. Diese werden noch verstärkt, wenn lange Leitungsstrecken überbrückt werden müssen. Zusätzlich sind sie mit immensen Kosten verbunden, da deren Anzahl an Temperaturfühlern begrenzt ist und daher zusätzliche Verteilerkästen und Leitungen benötigt werden, die zusätzliche Verdrahtungs- und Arbeitskosten nach sich ziehen.The Today's systems where non-linear temperature sensors are used are reacting very slowly to temperature fluctuations. inaccuracies in the measurement are thus preprogrammed. These are reinforced when long lines are bridged have to. additionally they are associated with immense costs because their number of temperature sensors is limited is and therefore additional distribution boxes and Lines needed be that extra Wiring and labor costs.
Die Erfindung und ihre VorteileThe invention and its advantages
Das erfindungsgemäße Temperatursensormodul („Smart-degrees”), mit den kennzeichnenden Merkmalen des Anspruchs 1, und das erfindungsgemäße Verfahren, mit den kennzeichnenden Merkmalen des Anspruchs 7, haben demgegenüber den Vorteil, dass durch die Verbindung eines IC Sensor mit einer Ultra-Low-Power Master Controller Unit (MCU) und einem M-Bus Transceiver eine sehr präzise Temperaturmessung realisierbar ist, bei der auch Strecken von mehr als 10 km mit Leitungen überwunden werden können, ohne Ungenauigkeiten oder Datenverlust zu erleiden. Dabei wird die komplexe Schaltung, durch die ein hochpräzises Messergebnis erzielt wird, direkt am Temperaturfühler (optional könnte dies auch ein Feuchtefühler, CO2-Fühler, odgl. sein) verwirklicht, so dass man wie bei den herkömmlichen Temperaturfühlern (z. B. PT100, PT1000) nur ein Gehäuse und eine Anschlussklemme hat. Dabei ist ein sehr gutes Preis-Leistungsverhältnis gegeben, da weniger Arbeitskosten anfallen und, weil eine Zweidrahtleitung, an die unbegrenzt viele Temperatursensoren anschließbar sind, ausreicht, weniger Leitungen verlegt werden müssen.The temperature sensor module according to the invention ("smart-degrees"), with the characterizing features of claim 1, and the inventive method, with the characterizing features of claim 7, have the advantage that by connecting an IC sensor with an ultra-low Power Master Controller Unit (MCU) and an M-Bus Transceiver a very precise temperature measurement is feasible, in which even distances of more than 10 km can be overcome with lines, without suffering inaccuracies or data loss. The complex circuit, which achieves a high-precision measurement result, is realized directly at the temperature sensor (this could also be a humidity sensor, CO 2 sensor, or the like), so that, as with conventional temperature sensors (eg PT100 , PT1000) has only one housing and one terminal. This is a very good price-performance ratio given because less labor costs incurred and because a two-wire line to which an unlimited number of temperature sensors are connected sufficient, less lines must be laid.
Nach einer vorteilhaften Ausgestaltung des erfindungsgemäßen Temperatursensormoduls ist der Integrated Circuit (IC) Sensor ein hochpräziser IC Sensor.To an advantageous embodiment of the temperature sensor module according to the invention the integrated circuit (IC) sensor is a high-precision IC sensor.
Nach einer zusätzlichen vorteilhaften Ausgestaltung des erfindungsgemäßen Temperatursensormoduls wird der IC Sensor durch die Master Controller Unit (MCU) mit Spannung versorgt. Bevorzugt findet die Spannungsversorgung nur statt, wenn das Messen vom Bus-Master angefordert wurde. Durch diese Art der Spannungsversorgung wird ein vorzeitiges Altern der digitalen Bauteile verhindert.To an additional one advantageous embodiment of the temperature sensor module according to the invention The IC sensor is powered by the Master Controller Unit (MCU) provided. Preferably, the power supply takes place only when the measurement was requested by the bus master. By this kind of Power supply is premature aging of the digital components prevented.
Nach einer diesbezüglichen vorteilhaften Ausgestaltung des erfindungsgemäßen Temperatursensormoduls gibt der mit Spannung versorgte IC Sensor automatisch über eine Zac-Wire-Schnittstelle einen Temperaturwert aus.To one in this regard advantageous embodiment of the temperature sensor module according to the invention The powered IC sensor automatically outputs one Zac-wire interface one Temperature value off.
Nach einer zusätzlichen vorteilhaften Ausgestaltung des erfindungsgemäßen Temperatursensormoduls ist das Modul ein Raumtemperaturfühler, Anlegefühler, Kanalfühler, Abgasfühler, Hülsenfühler oder Außenfühler. Durch die jeweilige Bauform ändert sich selbstverständlich auch die Temperaturspreizung (z. B. Raumtemperaturfühler –10°C bis +60°C; Anlegefühler: 0°C bis +150°C).To an additional one advantageous embodiment of the temperature sensor module according to the invention the module is a room temperature sensor, contact sensor, duct sensor, flue gas sensor, sleeve sensor or Outdoor sensor. By the respective design changes of course also the temperature spread (eg room temperature sensor -10 ° C to + 60 ° C, contact sensor: 0 ° C to + 150 ° C).
Nach einer zusätzlichen vorteilhaften Ausgestaltung des erfindungsgemäßen Temperatursensormoduls weist der IC Sensor eine Genauigkeit auf, die zwischen 0,05°C und 1,00°C liegt.To an additional one advantageous embodiment of the temperature sensor module according to the invention For example, the IC sensor has an accuracy of between 0.05 ° C and 1.00 ° C.
Nach einer vorteilhaften Ausgestaltung des erfindungsgemäßen Verfahrens, bei dem ein IC Sensor mit einer Ultra-Low-Power Master Controller Unit (MCU) und einem M-Bus Transceiver zu einem Temperatursensormodul verbunden wird, wird als Temperatursensormodul ein Temperatursensormodul nach einem der Ansprüche 1 bis 6 eingesetzt.To an advantageous embodiment of the method according to the invention, where an IC sensor with an ultra-low-power master controller Unit (MCU) and an M-Bus transceiver to a temperature sensor module is connected as a temperature sensor module, a temperature sensor module according to one of the claims 1 to 6 used.
Nach einer zusätzlichen vorteilhaften Ausgestaltung des erfindungsgemäßen Verfahrens werden zur Temperaturermittlung folgende Schritte durchgeführt:
- – ein Bus-Master gibt an den M-Bus-Transceiver einen Befehl zum Auslesen der Temperatur,
- – der M-Bus-Transceiver übersetzt diesen Befehl physikalisch und gibt ihn anschließend an die Master Controller Unit weiter,
- – die Master Controller Unit aktiviert den IC Sensor und versorgt diesen mit Spannung,
- – der mit Spannung versorgte IC Sensor gibt automatisch über eine Zac-Wire-Schnittstelle einen Temperaturwert aus,
- – dieser Temperaturwert wird in das M-Bus-Protokoll gewandelt und über den M-Bus-Transceiver zum Bus-Master gesendet.
- A bus master issues a command to read the temperature to the M-Bus transceiver,
- - The M-Bus transceiver physically translates this command and then passes it on to the Master Controller Unit,
- - the master controller unit activates the IC sensor and supplies it with voltage,
- - The powered IC sensor automatically outputs a temperature value via a Zac-Wire interface,
- - This temperature value is converted to the M-Bus protocol and sent via the M-Bus transceiver to the bus master.
Nach einer zusätzlichen vorteilhaften Ausgestaltung des erfindungsgemäßen Verfahrens ist der Bus-Master ein M-Bus Pegelwandler.To an additional one advantageous embodiment of the method according to the invention is the bus master an M-Bus level converter.
Weitere Vorteile und vorteilhafte Ausgestaltungen der Erfindung sind der Zeichnung und den Ansprüchen entnehmbar.Further advantages and advantageous Ausgestal tions of the invention, the drawing and the claims can be removed.
Zeichnungdrawing
Ein Ausführungsbeispiel des Gegenstandes der Erfindung ist in der Zeichnung dargestellt. Es zeigt:One embodiment the subject of the invention is shown in the drawing. It shows:
Alle hier dargestellten Merkmale können sowohl einzeln als auch in beliebiger Kombination miteinander erfindungswesentlich sein.All Features shown here can both individually and in any combination with each other invention essential be.
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE200810047426 DE102008047426A1 (en) | 2008-09-15 | 2008-09-15 | Temperature sensor module e.g. ambient temperature sensor, for e.g. measurement- and regulation system, has integrated circuit sensor connected with master controller unit and transceiver and supplied with voltage by master controller |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE200810047426 DE102008047426A1 (en) | 2008-09-15 | 2008-09-15 | Temperature sensor module e.g. ambient temperature sensor, for e.g. measurement- and regulation system, has integrated circuit sensor connected with master controller unit and transceiver and supplied with voltage by master controller |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE102008047426A1 true DE102008047426A1 (en) | 2010-04-15 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE200810047426 Withdrawn DE102008047426A1 (en) | 2008-09-15 | 2008-09-15 | Temperature sensor module e.g. ambient temperature sensor, for e.g. measurement- and regulation system, has integrated circuit sensor connected with master controller unit and transceiver and supplied with voltage by master controller |
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| DE (1) | DE102008047426A1 (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6662136B2 (en) * | 2001-04-10 | 2003-12-09 | International Business Machines Corporation | Digital temperature sensor (DTS) system to monitor temperature in a memory subsystem |
| DE10114831B4 (en) * | 2001-02-20 | 2005-05-25 | Min-Ying Chen | Integrated circuit for electronic thermometers |
| DE102004055088A1 (en) * | 2004-11-15 | 2006-05-18 | Ennovatis Gmbh | Single circuit board system for measuring and storage of property- related consumption data, e.g. interior and exterior temperatures, electricity, heating and water consumption data |
| DE102006061753A1 (en) * | 2006-04-03 | 2007-10-18 | Hynix Semiconductor Inc., Ichon | Semiconductor memory unit with temperature sensing device and its operation |
-
2008
- 2008-09-15 DE DE200810047426 patent/DE102008047426A1/en not_active Withdrawn
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10114831B4 (en) * | 2001-02-20 | 2005-05-25 | Min-Ying Chen | Integrated circuit for electronic thermometers |
| US6662136B2 (en) * | 2001-04-10 | 2003-12-09 | International Business Machines Corporation | Digital temperature sensor (DTS) system to monitor temperature in a memory subsystem |
| DE102004055088A1 (en) * | 2004-11-15 | 2006-05-18 | Ennovatis Gmbh | Single circuit board system for measuring and storage of property- related consumption data, e.g. interior and exterior temperatures, electricity, heating and water consumption data |
| DE102006061753A1 (en) * | 2006-04-03 | 2007-10-18 | Hynix Semiconductor Inc., Ichon | Semiconductor memory unit with temperature sensing device and its operation |
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| R082 | Change of representative |
Representative=s name: WEHLAN & WEHLAN, PATENTANWAELTE, 10367 BERLIN, DE Representative=s name: WEHLAN & WEHLAN, PATENTANWAELTE, DE |
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Owner name: ZAWADZKY, PETER, DE Free format text: FORMER OWNER: ENNOVATIS GMBH, 04463 GROSSPOESNA, DE Effective date: 20120523 |
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