DE102008030816B4 - Method for producing a component with at least one organic material - Google Patents

Abstract

Method for producing a component (10) which has at least one first substrate (1) and a second substrate (2), wherein at least one optoelectronic component (3) is arranged on the first substrate (1) in the component (10) is, which contains at least one organic material, - the first substrate (1) and the second substrate (2) are arranged relative to each other such that the device (3) between the first substrate (1) and the second substrate (2) a connection means (45) comprises at least one insulator region (4) containing a glass and at least one conductor region (5), at least one path of the bonding agent (4, 5) between the first substrate (1) and the second Substrate (2) is arranged, the path of the connecting means (45) surrounds the component (3) in the form of a frame in a closed path, and mechanically guides the first (1) and second substrate (2) over the insulator region (4) and over the conductor region (5). electric mitei are connected so that the at least one conductor region (5) is arranged within the closed path next to the at least one insulator region (4) and connects closely thereto, - the first substrate (1) at least two electrical leads (6) Contacting of the component (3) and the second substrate (2) has at least two electrical conductor tracks (7) and at least one line (6) with at least one conductor track (7) via at least one conductor region (5) is electrically connected, so that the at least one electrically conductive conductor region (5) is in direct physical contact with at least one of the electrical lines (6) and at least one of the conductor tracks (7), and the second substrate (2) has electrical connection regions (8) via which the optoelectronic component (3) is contactable with an external device, the method comprising the following steps: - applying the at least one component s (3) on the at least one first substrate (1), applying the at least one track of the connecting means (45) on the second substrate (2), positioning the first (1) and second substrate (2) relative to each other, so that the line (6) and the conductor track (7), which are subsequently connected to each other by means of the conductor region (5), face each other in places, and then at least locally melting of the connecting means (45) via electromagnetic radiation, wherein also the at least one insulator region (4) is strongly absorbing radiation and is melted by exposure to radiation, whereas the at least one conductor region is melted or fused indirectly via heat transfer.

Description

A method for producing a component with at least one organic material is specified.

The publication US Pat. No. 6,936,963 B2 describes an organic radiation-emitting component which is hermetically sealed by means of a glass solder.

The publication US Pat. No. 6,998,776 B2 describes an organic radiation-emitting component which is hermetically sealed by means of a molten glass frit.

The publication DE 10 2006 060 781 A1 relates to an organic luminous means and a lighting device with such a luminous means, in which there is an organic active region on a substrate, which is electrically connected via a first electrode and a further electrode structure. Side of the active area within a mounting area are electrical leads. The electrical leads are continuations of the further electrode structure on one side of the substrate. A cap for sealing is adhered to the substrate.

The publication DE 10 2006 028 692 A1 relates to a device comprising a first component having a first surface, a second component having a second surface and a connection layer between the first surface and the second surface, wherein the connection layer comprises an electrically insulating adhesive and an electrically conductive contact between the first surface and the second surface exists.

The publication DE 10 2006 015 043 A1 relates to a method for encapsulating organic photoactive devices and an encapsulation of an organic photoactive device with improved degradation protection and optical coupling. It combines organic with inorganic encapsulation layers and it is ensured that the material of the layers in the refractive index is adapted to the photoactive component on the one hand and on the incoming radiation from the outside or scintillator radiation on the other.

The publication DE 103 28 140 A1 relates to an OLED and a method for its production.

The publication DE 103 09 607 A1 relates to a method for encapsulating functional components of an electrical component, in which an encapsulation over the functional components is tightly connected to a substrate by means of ultrasonic welding. Due to the ultrasonic welding, the temperatures are applied only locally, so that the functional components are not exposed to strong thermal stress.

The publication DE 102 19 951 A1 relates to a method for encapsulating organic semiconductors.

An object to be solved is to specify a method for the efficient production of a component with at least one organic material.

According to the invention, the component comprises a first substrate and a second substrate. The materials used for the substrates may be metals, metal alloys, plastics, semiconductor materials, ceramics or glasses. The substrate may be mechanically rigid or mechanically flexible. Preferably, at least the first substrate has a smooth surface. Smooth means here that the surface is suitable for applying thin layers, which are required, for example, in organic light-emitting diodes, OLEDs for short. The thickness of the first and the second substrate is in each case preferably in the range between 0.2 mm and 3 mm, particularly preferably between 0.5 mm and 1.5 mm.

According to the invention, at least one radiation-emitting or receiving component which contains at least one organic material is arranged on the first substrate. The component can be configured, for example, as an organic light-emitting diode, in short OLED, as a detector diode or as a solar cell.

According to the invention, the first and second substrates are arranged relative to each other such that the component with the at least one organic material is arranged between the first and the second substrate. Preferably, the first and second substrate are configured as planar platelets or plates, each with opposite main sides. First and second substrate are preferably arranged or configured such that the mutually facing main sides are aligned parallel to each other.

According to the invention, the component has a connection means which is arranged between the first and the second substrate. About the connecting means first and second substrates are mechanically connected to each other. The connecting means is arranged in a closed path, which encloses the organic material-containing component frame-shaped. The width of the web is preferably in the range between 0.3 mm and 3 mm, in particular between 0.5 mm and 1 mm. The frame-shaped track may be shaped like a rectangle. Depending on the specific But requirements are also different shaped tracks possible, for example, with a round or oval course.

According to the invention, the connecting means has at least one insulator region containing a glass and at least one conductor region. The conductor region is designed with an electrically conductive material, for example with a metallic solder. The insulator region of the connection means can be designed in particular as a glass solder or in the form of glass frits. The insulator area may also contain admixtures. For example, the admixture is a binder or may lower the melting point of the material of the insulator region. An adaptation of the thermal expansion coefficient of the insulator region to the thermal expansion coefficients of the first and second substrate is also possible via the admixture. Likewise, the admixture can act as a spacer, over which a desired distance between the first and second substrate is set, so that the component with the organic material has a sufficient distance from the second substrate. In addition, the insulator region may include substances or mixtures of substances, such as metals or oxides, which may be present in elemental form, ionic form or as particles that allow melting of the bonding agent such as electromagnetic radiation from the ultraviolet, visible or infrared spectral range. Corresponding admixture can also have the material of the conductor region. It is not necessary that all insulator and / or conductor regions consist of the same material or have the same admixture.

In accordance with at least one embodiment of the component, at least one of the components of the first substrate, second substrate or connecting means comprises at least one admixture. The admixture may, for example, be configured as a reflection, conversion, filter, absorption or scattering agent.

According to the invention, the component comprises at least a first substrate and a second substrate, wherein at least one optoelectronic component which contains at least one organic material is arranged on the at least one first substrate. The first substrate and the second substrate are arranged relative to one another such that the component is arranged between the first substrate and the second substrate. Furthermore, the component comprises a connection means with at least one insulator region which contains a glass, and at least one conductor region. The connecting means is arranged in at least one path between the first substrate and the second substrate, wherein the path of the connecting means surrounds the component in the form of a frame and the first and second substrate are electrically connected to one another via the insulator region and electrically and optionally also mechanically to one another via the conductor region.

Such an arrangement protects the device with the at least one organic material well against external influences such as moisture and oxygen and thereby ensures an increased life of the device. Via the conductor regions of the connecting means, an efficient electrical contacting of the optoelectronic component is possible.

In accordance with at least one embodiment of the component, a multiplicity of first substrates are arranged on the second substrate. The first substrates preferably each comprise at least one optoelectronic component with at least one organic material. The different first substrates arranged on the second substrate may also have different optoelectronic components. Thus, light-emitting with light-receiving, for example designed as a detector components can be combined.

The first substrates can be placed in a matrix-like manner, in the form of columns and rows, on the second substrate and form a kind of display. Likewise, it is possible, among other things, that pictogram-like arrangements of first substrates are used on a second substrate, so that patterns, characters or lettering are formed by components on the first substrates. By way of example, areas of a display device emitting different colors may be formed by the first substrates. By using a plurality of first substrates on a second substrate, the design possibilities of the component increase and it is possible to efficiently realize a complex component on a single substrate.

According to the invention, at least two electrical lines for contacting the at least one optoelectronic component are mounted on at least one first substrate. The lines may be in direct contact with the first substrate, or may be separated in places or completely by, for example, at least one electrically insulating layer therefrom. The electrical lines are structured to allow the electrical wiring of the optoelectronic device. Via such electrical lines, an efficient contacting of the optoelectronic component is ensured.

According to the invention, the second substrate has at least two electrical conductor tracks. The tracks can be structured so that a plurality of first substrates on the second substrate is electrically contacted. The interconnects may be in direct contact with the second substrate, or may be separated from it in places or completely by, for example, at least one electrically insulating layer. In particular, the combination of electrical lines on the first substrate and electrical tracks on the second substrate and complex electrical circuits can be integrated with a variety of components in the component.

In accordance with at least one embodiment of the component, electrical lines and conductor tracks are formed with a metal, a metal alloy or a transparent, conductive oxide, TCO for short. Possible materials are in particular aluminum, chromium, molybdenum, copper and / or indium tin oxide. Lines and tracks can be made of a single material, or of multiple layers, which may have different materials. It is possible to evaporate or sputter lines and tracks. By using metallic cables and / or tracks, these can be applied efficiently. Metals also have a high electrical conductivity.

According to the invention, at least one line on a first substrate is electrically connected to at least one conductor track on the second substrate via at least one conductor region of the connection means. Thus, the first substrate and the second substrate are electrically connected to one another via the conductor region of the connection means. The at least one, electrically conductive conductor area is in direct physical contact with at least one electrical line and at least one conductor track. About electrical connections of cables and conductors increase the design options of the component and a compact electrical wiring of the device is also possible.

In accordance with at least one embodiment of the component, the material of the at least one conductor region is wetting. That is, when the conductor region melts or softens, its material wets a surface to which the conductor region is in contact. In particular, the material of the conductor region may be wetting with respect to the electrical leads and the conductive traces, as well as to an insulator region of the bonding agent or to a substrate. Such a conductor region simplifies electrical contacting of the at least one optoelectronic component.

In accordance with the invention, lines and printed conductors are arranged such that they lie at least in places in regions in which lines and printed conductors are connected via a conductor region. In a direction perpendicular to the second substrate and seen from this, so results in a sequence of conductor, conductor region of electrical line and first substrate. About such traces and lines an efficient electrical contact is possible.

According to the invention, the second substrate has electrical connection regions. The optoelectronic component can be electrically contacted with an external device via these connection regions. The connection areas can be designed, for example, flat. A connection between the component and an external device can take place, for example, via gluing, via terminals or via soldering. The electrical contacting of the optoelectronic component thus takes place, for example, via electrical contacting via a connection region, a conductor track on the second substrate, a conductor region of the connection means and an electrical line on the first substrate. About such terminal areas, the component and thus the at least one optoelectronic device can be efficiently and flexibly connected to an external device.

In accordance with at least one embodiment of the component, at least two lines are arranged on a first substrate such that via at least two conductor regions of the connection means in the direction perpendicular to the first substrate, an electrical connection to at least two conductor tracks on the second substrate takes place. Preferably, more than two-thirds, in particular all lines are electrically connected to conductor tracks on the second substrate via conductor areas designed in this way. About such an arrangement of the lines space-saving electrical contacting of the components is possible.

In accordance with at least one embodiment of the component, the insulator region of the connection means is designed with a glass solder or with glass frits, and the conductor region with a metallic, in particular a silver-containing or a silver solder. Such solders or frits are inexpensive and diffusion-resistant materials that have good processability. The combination of insulator regions and conductor regions of the connection means makes it possible to set the electrical properties of the connection means in a targeted manner. In particular short circuits between lines and printed conductors can be prevented via the insulator regions. This makes it possible to use the connecting means beyond encapsulating the element for electrical circuit design.

In accordance with at least one embodiment of the component, the optoelectronic component is designed as an organic light-emitting diode. It is also possible that the optoelectronic component is designed as an organic solar cell. Light-emitting diodes or solar cells based on organic materials can, in particular, be produced over a large area and thus cost-effectively with respect to the surface of the component. Large-area means that the component can have a size of more than ten square centimeters, preferably of more than 100 square centimeters. About the design of the device as a light emitting diode or solar cell can be realized over a large area, and thus over a good space utilization very efficient components.

• - Aufbringen zumindest eines Bauelements auf mindestens einem ersten Substrat,
• - Aufbringen zumindest einer Bahn des Verbindungsmittels auf dem zweiten Substrat,
• - Positionieren von erstem und zweitem Substrat relativ zueinander, und
• - nachfolgend zumindest stellenweises Aufschmelzen des Verbindungsmittels über elektromagnetische Strahlung.

According to the invention, the method comprises the following method steps:

• Applying at least one component to at least one first substrate,
• Applying at least one path of the bonding agent to the second substrate,
• Positioning the first and second substrates relative to one another, and
• - Subsequently at least locally melting of the bonding agent via electromagnetic radiation.

The application of the component on the first substrate can take place in that the component is manufactured separately and subsequently placed on the substrate. It is also possible that the component is manufactured on the first substrate, that is, for example, in subsequent process steps, all necessary layers are applied to the first substrate in order to design the component as an organic light-emitting diode or solar cell.

The step of applying the bonding agent can be carried out by applying paste-like glass solders or glass frits for at least one insulator region and / or metallic solders for at least one conductor region on the second or the first substrate. When applying it is important to ensure that a continuous frame is formed without gaps to ensure that the later located in the interior of the web-like bonding agent and between the two substrates component is well sealed with the organic material. The connecting means is preferably applied to the second substrate before the positioning of the substrates, for example via sintering, so that a mechanically stable connection already results between connecting means and second substrate.

In accordance with at least one embodiment of the method, the melting of the bonding agent is carried out by laser radiation. Laser radiation, especially in the near-infrared spectral range, can be generated efficiently with high light powers. The beam quality of laser radiation is also very high, so that the radiation is well focused in point or line shape. By using lasers, the bonding agent can be efficiently melted.

The step of bonding the first and second substrates is accomplished by softening at least a portion of the bonding agent. The bonding agent is heated by absorption of, for example, infrared or UV radiation. In this case, the connecting means contains, for example, additives which absorb the corresponding electromagnetic radiation. Preferably, the softening of the bonding agent is accomplished via radiation that is not or not substantially absorbed by the first and second substrates. "Not essential" here means that the absorption by the substrate (s) is less than 20%, preferably less than 10%, particularly preferably less than 5%.

According to the invention, the insulator regions are strongly absorbing radiation, and the heat transfer means then causes the connecting means to be fused or fused in the conductor regions. In the latter case, the melting point of the material of the conductor regions is preferably lower than the melting or softening point of the material of the insulator regions.

In the case of using a glass solder or glass frits for the insulator regions and a metallic bonding agent, this is easily realizable.

According to at least one embodiment of the method, the melting of the path of the connecting means takes place by driving off with a radiation source. "Shutdown" here means that the component is moved with the connecting means relative to a radiation source. It can therefore be moved relative to the radiation source, the component, or vice versa. About such a departure can be melted precisely more complex configured webs of the bonding agent.

According to the invention, the electrical contacting between the optoelectronic component takes place on the first substrate and the connection regions on the second substrate by melting at least one conductor region. This means that the first substrate with the optoelectronic component and with the lines is produced separately from the second substrate with the connection means, the conductor tracks and the connection areas. Subsequently, first and second substrates are positioned relative to each other. Then, the path of the connecting means is traversed, for example, with a laser, whereby both conductor regions and insulator regions of the bonding agent melt and thereby on the one hand, the mechanical connection between the first and second substrate takes place and on the other hand at the same time the electrical contacts between conductors and lines, and thus first and second substrate electrically connected to each other. Preferably, the materials of insulator and conductor areas wet surfaces to be contacted during reflow. The electrical contacting via the melting of the connecting means eliminates working steps for a separate electrical contacting of the optoelectronic component.

In the following, a component produced with a method described here with at least one organic material and a method described here will be explained in more detail with reference to figures. The same reference numerals indicate the same elements in the individual figures. However, there are no scale relationships shown, but individual elements can be shown exaggerated for better understanding.

• 1 schematische Draufsichten eines zweiten Substrats (A) sowie eines ersten Substrats (B), und eine schematische Schnittdarstellung eines mit einem hier beschriebenen Verfahren hergestellten Bauteils (C),
• 2 eine schematische Draufsicht eines zweiten Substrats mit mehreren Anschlussbereichen (B) sowie eine schematische Draufsicht eines ersten Substrats (A), und
• 3 eine schematische Illustration eines Ausführungsbeispiels eines hier beschriebenen Herstellungsverfahrens für Bauteile.

Show it:

• 1 schematic plan views of a second substrate (A) and a first substrate (B), and a schematic sectional view of a component (C) produced by a method described herein,
• 2 a schematic plan view of a second substrate having a plurality of terminal regions (B) and a schematic plan view of a first substrate (A), and
• 3 a schematic illustration of an embodiment of a method described herein for components.

In 1C is a component 10 shown. The component 10 consists essentially of a first substrate 1 made of glass with an optoelectronic component 3 , shown in more detail in 1A , and a separately prepared second substrate 2 made of glass, shown in more detail in 1B that have a lanyard 45 connected to each other.

On a mounting side 21 of the second substrate 2 , please refer 1A , are flat electrical connection areas 8th , electrical conductors 7 and the connecting means 45 applied. lands 8th and the tracks 7 are metallic or with a TCO. The connecting means 45 has a frame-like shape. An insulator area 4 , which is decorated with a glass solder, is of two ladder areas 5 interrupted. conductor areas 5 and insulator areas 4 are gas-tight, so that the device 3 that is between the two substrates 1 . 2 is tightly encapsulated. The ladder areas 5 are electrical with the tracks 7 connected.

On the first substrate 1 , shown in 1B , are electrical wires 6 for contacting the optoelectronic component 3 applied. The electrical wires 6 are metallic. Both first substrate 1 as well as second substrate 2 are formed from flat window glass plates. The first substrate 1 has a smaller footprint than the second substrate 2 on. The size of the first substrate 1 essentially corresponds to that of the connecting means 45 frame-like enclosed area on the second substrate 2 ,

When assembling first substrate 1 with the second substrate 2 in which the mounting pages 11 . 21 facing each other, the electrical connection of component 3 via lines 6 and over ladder areas 5 to the tracks 7 and thus to the connection points 8th closed. The connection points 8th are in a direction perpendicular to the mounting side 21 the second substrate freely accessible, so that a contact with an external, not shown device via gluing, soldering or terminals is easily possible.

According to 2A are several frame-like structures of a connecting means 45a . 45b . 45c on the second substrate 2 appropriate. The electrical conductors 7 lead from the two connection points 8th each to ladder areas 5 of the bonding agent 45a . 45b . 45c , The various frame-like, from the lanyard 45a . 45b . 45c formed areas may have the same or as shown, different shapes.

In 2 B is schematically a glass substrate 1a with a designed as an organic light emitting device 3 and two strip-shaped electrical wires 6 shown. The first substrate 1a can, for example, analogous to the representation according to 1C , on the lanyard 45a be applied. The electrical wires 6 are so applied that after joining the substrates 1a . 2 over the ladder areas 5 of the bonding agent 45a in the direction perpendicular to the first substrate 1a an electrical connection to the tracks 7 on the second substrate 2 is realized. The same applies to not subscribed first substrates, via the connecting means 45b . 45c with the second substrate 2 get connected.

It is possible on the second substrate 2 various first substrates, which can be designed both as about different colored emitting LEDs and as detectors or receiving modules designed to apply. By means of this modular construction, similarly designed second substrates can also be used 2 depending on the specific application, each with different first substrates 1a , for example, in the optoelectronic component 3 distinguish, be equipped.

In the 3A to 3G is an inventive manufacturing method for a component 10 illustrated.

In a process step shown in 3A , be on the mounting side 21 of the second substrate 2 the electrical connection areas 8th as well as the electrical conductors 7 applied, for example via vapor deposition or sputtering. lands 8th and tracks 7 can, unlike in 3A shown to be designed in one piece.

In another process step, shown in 3B as a side view and in 3C as a top view, is on the mounting side 21 the connecting means 45 applied. The connecting means has an insulator area 4 on top of two ladder areas 5 is interrupted. The path of the lanyard 45 is closed, that is, conductor areas and insulator areas close together. The thickness of the bonding agent 45 in a direction perpendicular to the mounting side 21 is about 10 microns. The connecting means 45 is in the form of glass frits along with binder on the second substrate 2 applied and mechanically sintered by means of the second substrate 2 firmly and gastight connected. Depending on the process control, the conductor areas 5 simultaneously with the insulator area 4 be applied, or even in a subsequent process step.

In a further process step, shown in the side view according to 3B and in the plan view according to 3E , be on the first substrate 1 an optoelectronic component 3 as well as electrical lines 6 applied. The base of the first substrate 1 is smaller than that of the second substrate 2 ,

In the process step according to 3F become the first substrate 1 and second substrate 2 joined together. Joining or positioning can be carried out under a protective gas atmosphere or under vacuum conditions in order to prevent contamination of the component 3 to prevent it by means of oxygen or moisture. When positioning first 1 and second substrate 2 the ladder areas come to each other 5 in contact with the tracks 7 and the wires 6 , conductor tracks 7 on the second substrate 2 and wires 6 on the first substrate 1 lie in places opposite each other and are in areas to be connected in contact with a ladder area 5 ,

In the process step according to 3G For example, laser radiation L is transmitted through a mirror 9 in the lanyard 45 focused. As a result, the connecting means 45 locally melted. About a slight contact pressure from the first substrate 1 to the second substrate 2 then there is a mechanically stable and hermetically sealed connection between the two substrates 1 . 2 , The laser radiation L drives the complete path of the connecting means 45 from. The laser radiation L can be focused point or line.

Claims (8)

Method for producing a component (10) which has at least one first substrate (1) and a second substrate (2), wherein at least one optoelectronic component (3) is arranged on the first substrate (1) in the component (10) is, which contains at least one organic material, - the first substrate (1) and the second substrate (2) are arranged relative to each other such that the device (3) between the first substrate (1) and the second substrate (2) a connection means (45) comprises at least one insulator region (4) containing a glass and at least one conductor region (5), at least one path of the bonding agent (4, 5) between the first substrate (1) and the second Substrate (2) is arranged, the path of the connecting means (45) surrounds the component (3) in the form of a frame in a closed path, and mechanically guides the first (1) and second substrate (2) over the insulator region (4) and over the conductor region (5). electrically m are connected to each other, so that the at least one conductor region (5) seen in plan view within the closed path next to the at least one insulator region (4) is arranged and close to this, - the first substrate (1) at least two electrical lines (6) Contacting of the component (3) and the second substrate (2) has at least two electrical conductor tracks (7) and at least one line (6) with at least one conductor track (7) via at least one conductor region (5) is electrically connected, so that the at least one electrically conductive conductor region (5) is in direct physical contact with at least one of the electrical lines (6) and at least one of the conductor tracks (7), and - the second substrate (2) has electrical terminal regions (8) via which the optoelectronic component (3) is contactable with an external device, the method comprising the following steps: - applying the at least one construction elements (3) on the at least one first substrate (1), - applying the at least one path of the connecting means (45) on the second substrate (2), Positioning the first (1) and second substrates (2) relative to each other so that the lead (6) and the trace (7), which are subsequently connected to each other by the conductor region (5), face each other in places, and then at least in places Melting of the connecting means (45) via electromagnetic radiation, wherein also the at least one insulator region (4) is strongly absorbing radiation and is melted by exposure to radiation, whereas the at least one conductor region is melted or fused indirectly via heat transfer. Method according to Claim 1 in which a plurality of first substrates (1) is arranged on a second substrate (2). Method according to one of the preceding claims, in which the insulator region (4) of the connecting means (45) is designed with a glass solder or with glass frits, and the conductor region (5) with a metallic solder. Method according to one of the preceding claims, in which the optoelectronic component (3) is designed as an organic light-emitting diode. Method according to one of Claims 1 to 3 in which the optoelectronic component (3) is designed as a solar cell. Method according to one of the preceding claims, wherein the melting of the connecting means (45) takes place via laser radiation. Method according to one of the preceding claims, wherein the melting of the path of the connecting means (45) is done by driving off with a radiation source. Method according to one of the preceding claims, wherein the electrical contacting between the optoelectronic component (3) on the first substrate (1) and the connection regions (8) on the second substrate (2) by melting the at least one conductor region (5).

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