DE102007046430A1 - Holding device for use in wafer arrangement, has coupling area that is formed such that holding device is attached at wafer frame, where electronic components are provided directly on wafer - Google Patents

Abstract

The device has a coupling area that is formed in such a manner that the holding device is attached at a wafer frame (110). A support area is designed in such a manner that a portion of an expansion device is set up. A lowered height level is defined with respect to the height level that is defined by the wafer frame of the support area. The coupling area is a longitudinal recess into which the wafer frame is guided. A projection is formed above the support area. The electronic components are provided directly on the wafer. Independent claims are also included for the following: (1) a wafer arrangement with wafer frame (2) a method for holding an elastic carrier foil.

Description

The The present invention relates to the field of electronic handling Components, which after a wafer dicing process on a adhere elastic carrier film. The present invention particularly relates to a holding device for a through an expansion device expanded elastic carrier film, at which a plurality of semiconductor chips separated from a wafer adheres. The present invention further relates to a wafer arrangement, a wafer frame, the above-mentioned holding devices and an expansion device with a widened carrier film having. Moreover, the present invention relates to a Method of holding one by an expander expanded elastic carrier film on which several Adhesive from a wafer scattered semiconductor chips.

by virtue of the increasing miniaturization of electronic components it will not be economical in the near future, electronic components applied to an electronic circuit substrate or a component carrier to be populated, for the purpose of a secure component feeder for to repack a placement process. Such a repackaging in special component feeding belts becomes common applied to the components individually to the placement process. From modern Surface Mount Technology (SMT) placement systems Rather, it will soon be demanded that they be equipped Components or semiconductor chip directly from a wafer individually remove and place on appropriate points of an electronic circuit substrate.

Around the handling of electronic components, which as so-called To be taken directly from a single wafer, To simplify, the entire wafer before singulation on applied to a sticky carrier film. The isolation for example, by a high-precision mechanical Sawing and / or by a chemical etching process. The singulation typically closes at least a cleaning process, with the residues or Dirt of the dicing process of the entire wafer arrangement reliable be removed.

The cleaned electronic components are then used a component pick-up tool such as a suction pad or a suction pipette removed from the carrier film and fed to a placement process.

To facilitate the detachment process of the electronic components of the sticky carrier film is from the EP 565781 A1 an ejector for separating a chip from a sticky carrier. The ejection device has a pointed ejection needle, which penetrates the carrier film and supports detachment of the respective component by means of a suction gripper.

In connection with the removal of the components by means of a suction gripper, it is also known to stretch the carrier film to selectively increase the distance between the individual components. In this way, the risk can be reduced that a suction gripper acts simultaneously on two adjacent components. This increases process reliability during component removal. For example, from the DE 100 31 983 A1 an expanding ring for stretching a carrier film is known, to which a plurality of unhoused electronic components is attached. The expanding ring comprises outwardly directed latching lugs which engage in a holding frame of the film after the film has been stretched.

The Expansion of a carrier foil by means of an expanding ring However, the result is that the height level of the expanded Carrier film and thus the height level at the Carrier film adhering semiconductor chips changed. In a pick-up operation of the semiconductor chips therefore the movement a placement or transport head, which is a semiconductor chip or alternatively can also accommodate a plurality of semiconductor chips on the new height level will be adjusted. This adaptation is however by the change of the altitude burdened in practice with considerable alterations. As a consequence, that on the corresponding semiconductor chip handling machine no "unexpanded" wafers can be processed anymore.

Of the The present invention is based on the object of providing of electronic components directly from a wafer in view on increased process reliability when picking up the components to improve.

These Task is solved by the objects of independent claims. Advantageous embodiments The present invention is defined in the dependent claims described.

Independent claim 1 describes a holding device for an elastic carrier film expanded by an expansion device for a plurality of semiconductor chips separated from a wafer. The holding device described has (a) a coupling region, which is designed in such a way that the holding device can be attached to a wafer frame, and (b) a support region, which is designed in such a way at least part of the expansion device can be placed on. According to the invention, a lowered height level is defined by the support area with respect to a height level defined by the wafer frame.

Of the described holding device is based on the finding that the expansion device together with the elastic carrier film and the isolated semiconductor chips attached thereto to the wafer frame by a simple lowering mechanism lowered the same height that a wafer without expansion device has can be lowered by a predefined height difference. This height difference may preferably be just the height or the height offset of the carrier film by the Expansion device correspond. This means that the height level the semiconductor chips on the expanded carrier film exactly corresponds to the height level of the semiconductor chips, which before attaching the expansion device on the carrier film as long as they are not originally expanded Condition exists. In this way, the semiconductor chips can after the widening of the carrier film at the same processing level being held. The semiconductor chips can thus be independent a widening of the carrier foil from a component removal device, which one or more, for example, trained as a suction pad Having component-holding devices, under the same conditions especially with regard to the height level of the respective Pick-up position for the semiconductor chip to be added.

The Lowering of the expanded carrier film is preferably carried out after separating the carrier film from the original one Wafer frame. In this way, the expansion device together with the expanded carrier film without much effort be lowered to the desired level.

The described holding device has the advantage that all Components associated with an expansion process Carrier film needed, even after the defined lowering the expanded carrier film on the original Height level can be used. this applies especially for the wafer frame. This can namely Information about the properties of all or at least some of the semiconductor chips containing, for example before expanding the carrier film in the context of a known so-called wafer mapping method were determined.

at a wafer mapping process will be at least some of those at the Carrier film adhering semiconductor chips before further processing tested and the data obtained in a corresponding Record saved. For example, if the semiconductor chips Light emitting diodes, in the record, for example, the expected or the actual brightness of the respective component or semiconductor chips are stored. In a further processing can then be used selectively just the semiconductor chips whose optical specifications are currently meeting the respective requirements enough.

Around the majority of semiconductor chips stuck to a particular record To be able to assign marks to the respective wafer frames are attached, providing a unique assignment guarantee. The markers can be, for example Be barcodes or matrix codes. As a result of the fact that through the holding device according to the invention, as above already explained, the original wafer frame can be used, errors in the assignment the plurality of semiconductor chip to a corresponding record easy way to avoid it. This increases the Process reliability during further processing and / or the other Handling of semiconductor chips.

According to one Embodiment of the invention according to claim 2 is the Ankoppelbereich an elongated recess, in which the Wafer frame is insertable.

The elongated recess, for example, a slot or be an elongated groove. Furthermore, the elongated Recess be dimensioned such that the wafer frame slightly is clamped, so that although a simple attachment of the holding device possible, but that is an undesirable move the holding device on the wafer frame is prevented even if the wafer frame is tilted prior to insertion of the expander or being jerked by a rough handling.

The Use of an elongated recess for coupling the Holding device to a wafer frame has the advantage that the Holding device by an operator in a simple way without the use of a tool can be attached to the wafer frame can. This will handle the described holding device particularly comfortable for an operator, as a special Tool for inserting an expansion device is not required is.

According to a further embodiment of the invention according to claim 3, the support area is a support plane. This has the advantage that the expansion device reliably rest on the support area and so a secure mounting of Ex Pansionseinrichtung can be ensured.

The Support level, for example, through the top of a substantially be realized plan-parallel projection, which projection on the Ankoppelbereich opposite side of the holding device is trained. The projection should be so thick that one accidental bending of the projection even with a slightly rough insertion the expander is excluded. An accidental Bending the projection would have an undesirable Level change of the held expanded carrier film result.

The described holding device can be manufactured as a simple and inexpensive Adapters are considered, which conform to the shape and size of the respective wafer frame and the height of the expansion device is adjusted. Thus, for different sizing wafer frame and expander each a suitable adapter be kept ready. The adaptation to the wafer frame is successful thereby by the special design of the Ankoppelbereiches. The Adaptation to the expansion device and thus to the required Lowering depth is achieved by the vertical distance between the support plane and the coupling area.

The an adapter performing holding device can be different Species are produced. So is suitable, especially if smaller quantities be prepared, a well-known wire EDM. larger Quantities can be effectively through a be produced correspondingly shaped extruded profile, wherein a holding device simply by cutting off a short Part of the respective extruded profile are produced can.

According to claim 4, the holding device additionally has a bulge on, which is formed above the support area.

The described bulge can be dimensioned such that during Inserting an expansion device the bulge only slightly increased effort can be passed. This has the Advantage that the expansion device by means of a snap Movement is engaged, so that the bulge has the function of a Niederhalter has. This leaves the expansion device after an insertion into the holding device in its position. The insertion the expansion device is thus for an operator especially in the case greatly facilitated when to hold the expansion device several holding devices are used.

According to claim 5, the holding device additionally has an anti-slip Element, which is arranged such that it is connected to an inserted expansion device is applied.

The Anti-slip element may for example be a rubber element, which advantageously an accidental rotation of the expansion device and thus the plurality held by the expansion device prevents semiconductor chips relative to the holding device. Thus, in a simple manner, a torsion-resistant holder Ensures expansion device within the wafer frame become.

The Anti-slip element may be preferred on a sidewall in one small recess formed in the side wall of the holding device is, are. A fixation of the anti-slip element, for example by means of adhesive is possible. The anti-slip element may also be parallel to the plane of a wafer frame in a bulbous groove inserted and also fixed, for example by means of adhesive be.

With The claim 6, a wafer arrangement is described. The wafer arrangement has (a) a wafer frame, (b) at least three fixtures of the type described above, which holding devices on a Inside the wafer frame, and (c) an expansion device, at which an expanded carrier film with a plurality is located by adhering semiconductor chips. The expansion device lies at the contact areas of the at least three holding devices on.

Of the described wafer arrangement is based on the finding that by the use of the holding devices described above, which Adapter pieces for defined lowering of the expansion device in relation to the original wafer level, the semiconductor chips even in the stretched state of the carrier film can be provided in the original wafer level. Thus, the semiconductor chips, for example, for an assembly process of a placement machine independently from a possible stretching and regardless of the degree of stretching are always provided in the same picking level. This has the advantage that the collection process of the semiconductor chips, which in a known manner by a single or a multiple placement head can be performed, not to different component-Abholebenen adapted and thus significantly increases process reliability is.

A further advantage of the described wafer arrangement is that the lowering of the expansion device takes place within the original wafer frame. This can be the lowered Expansion device together with the adhering to the corresponding carrier film semiconductor chips in conventional placement machines for the purpose of direct placement of the semiconductor chips of the carrier film can be used on a component carrier to be loaded. An accidental collision by a complex modified wafer frame with clamping or gripping devices of the corresponding wafer feeding device of the placement is then not to get an advantageous way.

The Expansion device is in particular a two-part expansion ring, wherein the two parts are concentric with each other and arranged are. The carrier film can then between the two partial rings be trapped. It can by the choice of material and dimensions the two partial rings, the clamping effect between the two partial rings be dimensioned so that after concentric arranging the two partial rings with carrier foil clamped in between prevents accidental slippage of the carrier film becomes.

One accidental slipping of the clamped carrier foil can also by a on the outer wall of the inner part ring trained circumferential contour and by a complementary contour prevented on the inner wall of the outer part ring become. Here, the two contours in appropriate Interlock manner and so firmly clamp the carrier film.

It It should be noted that the holding devices or the adapter for defined lowering of the expansion device to different dimensions can be adjusted by wafer frame and expander. In view of the simple and inexpensive production possibility the holding devices can thus provide a customer with a whole set of different sized adapters are offered, from which sentence then the customer select the appropriate adapter can.

It is also noted that the holding devices respectively regardless of the diameter of a wafer disk used from which the individual semiconductor chips in known Were produced by a singulation process.

With to claim 7, a method for holding one by a Expansion device expanded elastic carrier film described on which several separated from a wafer semiconductor chips adhere. The described method comprises (a) attachment at least three fixtures of the type described above on the inside of a wafer frame, and (b) inserting the Expansion device, in which an expanded carrier film is located with a plurality of adherent semiconductor chips, in one defined by the bearing areas of the three holders Support plane.

the described method for holding one by an expansion device expanded elastic carrier film is the finding based on that by the use of the holding devices described above or adapter pieces for defined lowering of the expansion device in terms of the original wafer level the semiconductor chips even in the stretched state of the carrier film in the original Wafer level can be provided. In a pickup the semiconductor chips directly from the carrier film changes thus the picking level is not. The pickup of the semiconductor chips can thus independent of the strain state of the carrier film always from the same picking level out and the pickup Thus, the semiconductor chip does not have to go to different device repositioning levels be adjusted.

Further Advantages and features of the present invention will become apparent the following exemplary description of presently preferred embodiments. The individual figures of the drawing of this application are merely to be regarded as schematic and not to scale.

1a shows in a plan view of a wafer arrangement, which has a wafer frame, four fixed to the wafer frame holding devices and an expansion device resting on the holding means with a widened carrier film.

1b shows the in 1a illustrated wafer arrangement in a cross-sectional view.

2a shows a holding device for an expanded by means of an expansion device elastic carrier film according to a first embodiment.

2 B shows a holding device according to a second embodiment.

2c shows a holding device according to a third embodiment.

At It should be noted that in the drawing the Reference signs of identical or corresponding components only in its first digit and / or by an appended one Distinguish letters.

Below is a currently preferred Embodiment of the invention with reference to the 1a and 1b explained in more detail. It shows the 1a a wafer arrangement 100 in a plan view, 1b shows the wafer arrangement 100 in a cross-sectional view. The wafer arrangement 100 has a wafer frame 110 on, on the total of four holding devices 150 are attached. How out 1b As can be seen, the holding devices 150 formed such that an expansion device, which an outer ring 121 and an inner ring 122 has, so can be included that the top of the expansion device 121 . 122 with the original plane of the wafer frame 110 coincides. Thus, there is one through the expansion device 121 . 122 expanded carrier film 130 compared to a non-stretched carrier film in the same plane or the same altitude.

The holding devices 150 can thus each as an adapter 150 to be considered, which conforms to the shape and size of the respective wafer frame 110 and to the height of the expansion device 121 . 122 is adjusted. The adapters 150 then allow provision of the semiconductor chips 132 regardless of the degree of stretching of the carrier film 130 or from the height of the expansion device 121 . 122 in relation to the wafer frame 110 always in the same plane.

It should be noted that the same adapters 150 can be used for different sized wafer slices. The diameter of the wafer slices has the described targeted lowering of the height level of the expansion device 121 . 122 or the expanded carrier film 130 no influence.

The adapters 150 can in the wafer frame 110 be trapped, with the adapters 150 only after inserting the expansion device 121 . 122 firmly against the wafer frame 110 be pressed. How out 1b can be seen, presses the inserted expansion device 121 . 122 the adapters 150 outward against the wafer frame 110 ,

The wafer frame has two areas at its top 112 on, which can be used for markings. These markers may include an identification code. According to the embodiment of the invention illustrated here, the identification code is a bar code 113 ,

The barcode 113 can be used in a known manner in conjunction with a so-called. Wafer-mapping method. This will be the semiconductor chips 132 tested before further processing and the resulting data stored in a corresponding record. These data can then be used in a further processing to individual semiconductor chips 132 according to their individual specifications. In particular, in the context of a larger chip production and chip processing, wherein a plurality of wafer arrangements must be handled simultaneously, the bar code can be used to always uniquely the respective wafer arrangement and the corresponding data set from the wafer mapping process identify and associate with each other.

When using the described adapter 150 for height adjustment of the carrier film 130 can also after the widening of the carrier film 130 through the expansion device 121 . 122 the original wafer frame 110 be used. This can easily errors in the assignment of semiconductor chips 132 be avoided to a corresponding record. This can be a high process reliability in the further processing and / or further handling of the semiconductor chips 132 be guaranteed.

2a shows a holding device 250a for an expanded by means of an expansion device elastic carrier film according to a first embodiment. The holding device 250a is integrally formed of a metallic material, such as aluminum. The holding device 250 has a coupling area formed as an elongated recess or as an elongate slot 252 in which a in 2a not shown wafer frame can be inserted.

On the opposite side, the holding device 250a an elongated footbridge 253 on, which is compared to the recess 252 extends at a lower height level in a horizontal outward direction. The top of the dock 253 represents a support level 254 which an in 2a also not shown expansion device can be placed so that when using at least three adapters 250a the position of the expansion device and thus the plane of the carrier film is clearly defined.

Above the jetty 253 points the adapter 250a an outward bulge 256 on, which serves as a hold-down for an inserted expansion device. It must, as from 1b seen when inserting the expansion device 121 . 122 the bulge 256 be overcome by a slightly increased effort. In this way, slipping out of a correctly inserted expansion device can be reliably prevented.

2 B shows a holding device according to a second embodiment 250b , Which away from the in 2a Darge presented holding device 250a by a trained as a rubber disc anti-slip element 258b different. The anti-slip element 258b is located on an inserted expansion device from the outside, so that an inadvertent rotation of the expansion device and thus held by the expansion device semiconductor chips relative to the holding device 250b or relative to the wafer frame is prevented.

How out 2 B can be seen, there is the anti-slip element 258b on a side wall of the adapter 250b in a small recess 259b , This can be the anti-slip element 258b by means of a suitable adhesive in the recess 259b be fixed.

2c shows a holding device 250c according to a third embodiment, which holding device 250c away from the in 2 B shown holding device 250b only distinguished by the special design of the anti-slip element. According to the in 2c illustrated embodiment is the anti-slip element 258c a short section of a rubber hose or a rubber cord 258c , which are in a belly-like recess 259c located. The belly-like recess 259c is also in a side wall of the adapter 250c educated. The rubber cord 258c can be perpendicular to the plane of the drawing 2c in the bulbous recess 259c inserted and also fixed by means of a suitable adhesive.

It It should be noted that the embodiments described herein only a limited selection of possible Represent variants of the invention. That's the way it is possible, the features of individual embodiments suitably combine with each other, so for the Professional with the explicit embodiments here an Plurality of different embodiments as obvious to be disclosed.

100

Wafer arrangement

110

Wafer frame

112

marking region

113

barcode

121

Expansion device, outer ring

122

Expansion means, inner ring

130

support film

132

Semiconductor chip

150

Holder / Adapter

250a

Holder / Adapter

250b

Holder / Adapter

250c

Holder / Adapter

252

Coupling area / longitudinal recess

253

web

254

Support area / support plane

256

Bulge / down device

258b

Anti-slip Element / rubber disc

258c

Anti-slip Element / rubber hose

259b

recess

259c

belly like recess

QUOTES INCLUDE IN THE DESCRIPTION

This list The documents listed by the applicant have been automated generated and is solely for better information recorded by the reader. The list is not part of the German Patent or utility model application. The DPMA takes over no liability for any errors or omissions.

Cited patent literature

• - EP 565781 A1 [0005]
• - DE 10031983 A1 [0006]

Claims (7)

Holding device for a device by means of an expansion device ( 121 . 122 ) expanded elastic carrier film ( 130 ) for a plurality of semiconductor chips isolated from a wafer ( 132 ), the holding device ( 150 . 250a . 250b . 250c ) comprising • a coupling area ( 252 ), which is designed such that the holding device ( 150 . 250a . 250b . 250c ) on a wafer frame ( 110 ), and • a circulation area ( 254 ), which is designed such that at least a part of the expansion device ( 121 . 122 ), wherein with respect to a through the wafer frame ( 110 ) defined height level of the support area ( 254 ) Defines a lowered height level. Holding device according to Claim 1, in which the coupling region has an elongated recess ( 252 ) into which the wafer frame ( 110 ) is insertable. Holding device according to one of claims 1 to 2, wherein the support area a support plane ( 254 ). Holding device according to one of claims 1 to 3, additionally comprising a bulge ( 256 ), which above the contact area ( 254 ) is trained. Holding device according to one of claims 1 to 3, additionally comprising an anti-slip element ( 258b . 258c ), which is arranged such that it is connected to an inserted expansion device ( 121 . 122 ) is present. Wafer arrangement ( 100 ), comprising • a wafer frame ( 110 ), At least three holding devices ( 150 . 250a . 250b . 250c ) according to one of claims 1 to 5, which on an inner side of the wafer frame ( 110 ), and • an expansion device ( 121 . 122 ), at which an expanded carrier film ( 130 ) with a plurality of adhering semiconductor chips ( 132 ), wherein the expansion device ( 121 . 122 ) at the support areas ( 254 ) of the at least three holding devices ( 150 . 250a . 250b . 250c ) rests. Method for holding one by an expansion device ( 121 . 122 ) expanded elastic carrier film ( 130 ), at which a plurality of semiconductor chips isolated from a wafer ( 132 ), the method comprising • attaching at least three holding devices ( 150 . 250a . 250b . 250c ) according to one of claims 1 to 5 on the inside of a wafer frame ( 110 ), and • inserting the expansion device ( 121 . 122 ), at which an expanded carrier film ( 130 ) with a plurality of adhering semiconductor chips ( 132 ), into one through the support areas ( 254 ) of the three holding devices ( 150 . 250a . 250b . 250c ) defined support level.