DE102007001411A1 - Method for manufacturing electronic data carrier, involves arranging electronic component module exchange areas to exchange areas of wire or thread - Google Patents

Abstract

The method involves arranging, pressurizing and heating an adhesive film (5) with solder particles (6) between exchange areas (1b) of the electronic component module (1). The electronics component module exchange areas is assigned to exchange areas (2C) of the wire or thread (2a), until a permanent electrical solder joint is developed between the electronic component module exchange areas and the exchange areas, and a permanent adjustment of the electronic construction unit module is developed on the textile substrate. An independent claim is also included for an electronic data carrier for textile fabric.

Description

The The invention relates to a method for producing an electronic Disk, the at least one textile substrate and at least one electronic component module arranged thereon, wherein the textile substrate as miteingewebte, sewn or embroidered antenna at least one electrically conductive Having wire or thread, according to the preamble of claim 1. Furthermore, the invention relates to an electronic Data carrier with such an electronic component module and a textile substrate according to the preamble of claim 12.

So far are used to furnish textile fabrics, such as garments with transponders, especially smart labels, their operation based on RFID technology, smart labels as inlets on a film substrate built, prefabricated and then as a whole unit glued on textile fabric. This can be done, for example, by that the film substrate on the underside with an adhesive surface is provided, which is a permanent connection with a surface to enter the textile fabric.

such Textiles provided with RFID technology are advantageous the tracking of these textile products from their place of manufacture to to the shop. In addition, in the shop on simple Do an "online inventory" to determine availability of frequently sold garments with certain Sizes are performed. Also one Anti-theft device in the form of a triggered alarm signal when leaving the premises with unapproved Textiles equipped with RFID technology are conceivable. Furthermore, in such an RFID chip product manufacturing data, Guarantee data etc. are stored.

such However, textiles equipped with smart labels are not permanent associated with the smart label unit, as these textile smart labels - too due to the mandatory minimum size of the antenna - one in itself stiff and relatively inflexible, too large footprint exhibit the elastic movements that a fabric can perform, to follow. As a result, the adhesive surfaces at least partially from the surface of the fabric solve again and the danger of complete Replacement of the smart label of the fabric consists.

moreover exists with such inflexible smart labels the risk that the antenna is interrupted by the movement of the textile material and is destroyed, so that the permanent functioning the antenna is not ensured.

It It is known that metallic wires in textile materials co-woven or sewn during or after their manufacture can be to thereby electrical, for example To create conductive paths within the textile fabric. This can be, for example during a weaving process of the fabric material or by subsequent sewing or sewing of the wire done on or in the fabric. This can be done in a variety of ways Textile fabrics also automated in a continuous process respectively.

It is off DE 100 47 972 A1 a method for producing a transponder coil, in which the transponder coil is generated by using a sewing process directly on the data carrier or a carrier layer of the data carrier using one or more electrically conductive threads. In this case, at least one of the electrically conductive threads is used as sewing thread. Such sewing operations are time consuming and expensive. In addition, the transponder coil can be used as sewing thread.

Out US 6,523,734 B1 For example, a method for connecting printed conductors arranged on circuit boards is known. In this process, a hot melt adhesive is used to fix the resin boards and an ultrasonic welding process to electrically contact pads on the boards. Such a joining of the plates does not allow the production of an electronic data carrier consisting of an electronic component module and a textile substrate, as this would lead to the breaking of the ultrasonic welded connections due to the flexible nature of the textile substrate, if such an ultrasonic welding process would be technically feasible. Because for such an ultrasonic welding process, the non-locally defined metal filaments would have to be located in the textile substrate and be connected to the smallest electronics module connection areas by means of an ultrasonic sonotrode. This is time consuming and costly in mass production.

Out WO 02/49093 A1 a method is known in which an interposer (chip module) is mounted by means of hot melt adhesive on a per se inflexible substrate and permanently attached thereto. A transponder produced in this way has an electrical contact between an antenna arranged on the substrate and the interposer connection region or contact surfaces in that conductive particles are added to the hot-melt adhesive, which are arranged between the connection regions of the interposer and on the textile substrate during assembly Antenna are compressed and thus one creates electrical contact between the two connection areas. However, due to the flexible properties of the textile substrate, there is no permanent electrical contact between the connection regions of the interposer and the connection regions of the antenna, since the compressed hot melt adhesive with the electrically conductive particles contained therein is dissolved by the movement of the textile substrate or the electrically conductive particles themselves lose contact with the connection areas. This is particularly true in the case of a strong buckling load of the textile substrate, which may be a garment, for example, in the area of the interposer or with frequent washing of the item of clothing.

Farther It is known that in connection with textile substrates for the production of transponders having a chip module applied to the textile substrate include, hot melt adhesive films for between the connection areas of the chip module and the connection areas the thread-like arranged in the textile substrate antenna which do not contain conductive particles. By a mechanical fixation by means of pressurization and heat input penetrates such a hot melt adhesive into the tissue of the textile substrate and leaves a direct electrical Contact between the wire or the thread of the antenna in the textile substrate and the metallized connection areas of the Chip modules or the interposer too. The functional thus obtained However, textile labels also have the disadvantage that they for frequently performed washings of the textile substrate, which is a piece of clothing can, a growing contact resistance between the wires or filaments and the metallized Have connection areas of the chip module, which undesirable is. This is primarily on the electrical connection frictional Kind attributed. The used hot glue can reduce the penetration of moisture during frequent washing do not prevent so swelling of the hot melt adhesive and thus a loss of electrical contact between the terminal areas and also corrosion of the contacting metal surfaces of the Wire or antenna thread and the chip module connection areas or metallized surfaces takes place.

As a result, It is the object of the invention to provide an electronic data carrier and a method for its production, wherein the electronic Disk an electronic component module and a textile substrate, in which the antenna is woven, stitched or embroidered is to provide, in which a permanent Reliable electrical contact between connection areas of the Antenna wire or antenna thread in the textile substrate and Connection areas of the electronic module module at the same time mechanical fixing of the electronic component module on the textile Substrate is possible.

These Task is procedurally by the features of claim 1 and product side by the features of claim 12th solved.

One essential point of the connection lies in the fact that in a procedure for producing an electronic data carrier, the at least one textile substrate and at least one arranged thereon Electronic component module, wherein the textile substrate as miteingewebte, sewn or embroidered antenna at least one electrical having conductive wire or thread, an adhesive film with solder particles between connection areas of the electronic module module and the electronic component module pads associated Terminal areas of the wire or thread arranged and as long pressurized and heated until a permanent electrical solder connection between the electronic component module connection areas and the connection areas of the antenna wire or antenna thread and a permanent fixation of the electronic component module originated the textile substrate. Due to the arrangement of solder particles in the hot-melt adhesive film is heated during a heating process the simultaneous fusion of the hot-melt adhesive film for the mechanical fixing of the electronic component module on the textile substrate and the melting of the solder particles for the production get the electrically conductive solder joint. This allows a simple and fast manufacturing process for a large series of such made electronic data carriers. In addition, by the solder joint a durable and reliable electrical contact between the antenna wires or antenna threads in the textile substrate, which is a garment can be, and the connection areas of the electronic component module, the metallized pads represent possible.

Preferably For example, the electronic component module is a chip module as an interposer or strap, and the electronic data carrier thus formed as a transponder. In the textile substrate can It is about any type of flexible fabric, but also one Paper or plastic substrate act.

The solder particles are preferably formed as solder balls and the adhesive film as a hot melt adhesive film. In this case, the chip module or the interposer with the chip arranged thereon is reversed, that is, with the chip down to the clothing turned around, arranged on the garment, so that the interposer has turned away from the chip facing enlarged pads down to the garment out. This allows a chip-protecting arrangement of the interposer on the garment.

According to one preferred embodiment solder balls are used whose diameter is greater than the thickness of the Adhesive film in which the solder balls are embedded. Therefor the solder balls are preferably adjacent to each other in the adhesive film arranged and thus protrude from the adhesive film surface out. This ensures that in terms of electrical contact not only a positive connection between the connection areas but also a cohesive or direct contact connection arises by means of the soldering process.

Around to promote the process of simultaneous gluing and soldering, without that z. B. the adhesive film, the wetting of the metallized Terminal area surfaces of the interposer and the antenna wires or antenna threads with the solder material prevented or aggravates, can be for the alignment of the adhesive film and the solder balls not only a larger diameter the solder balls compared to the thickness of the hot melt adhesive, but also close melting temperatures for the adhesive and the solder material are used. Is preferred the melting temperature of the solder material slightly higher than the melting temperature of the hot melt adhesive. This not only allows the use of previously known machines for the connection of interposers with textile substrates on the application of hot melt adhesives are aligned, but also a reliable electrical solder joint between the connection areas.

The Solder balls in this case preferably have a diameter of one Range of 10 μm-100 μm, preferably thereof 50 μm-60 μm and are at a distance from a range of 45 μm-55 μm, preferably of 50 μm, from each other in the hot-melt adhesive or arranged next to each other on it.

The Materials for the hot-melt adhesives and for the Solder balls are selected such that the melting temperature the hot melt adhesive at about 100 ° C-200 ° C, preferably at 130 ° C, and the melting temperature of the solder balls at about 130 ° C-230 ° C, preferably at 178 ° C, lies.

Of the Adhesive film with the solder particles contained therein is before Arranging the electronic component module on the textile substrate preferably on the electronic component module connection areas and / or on at least the connection areas of the wire or the thread applied. Here, first, the adhesive film and then applied to the adhesive film, the solder particles become. Thus, a layer structure of, for example, the metallized Connecting surfaces of the interposer arranged thereon Hot glue films and in turn arranged on it areal distributed solder balls. alternative The solder particles can be a hot melt adhesive be mixed after it has been heated. Subsequently finds a common application of the hot melt adhesive along with the solder particles on the connecting areas of the wire or of the thread or / and on the electronic component module connection areas instead of. Further alternatives to the method of application described here the adhesive film are also conceivable.

Of the Adhesive film has an adhesive, preferably under Energy input, such as heat transfer, UV, electron or laser irradiation, initially in liquid and then in cured form. In particular, a heat-activatable, i. H. a meltdown and recrystallizable hot melt adhesive can be used. This one has the property that he liquefies again and again bar is. Alternatively, in particular a crosslinkable hot melt adhesive, the heat-activatable and cross-linked, d. H. thermoset hardening is used. Therefor is first through heat transfer the glue liquefies and subsequently or during that crosslinked by UV, electron or laser irradiation. This Adhesive has the property that it does not liquefy again can.

One electronic data carrier, in particular a transponder with the textile substrate in which the antenna wire or the Antenna thread woven, stitched or embroidered on it is, and with an electronic component module, such as a chip module, Advantageously, in each case at least one adhesive film with solder particles between the connection areas of the electronic component module and the associated with them connection areas of the antenna wire or antenna thread on, this film under pressurization and heat to a permanent electrical solder connection between the connection areas the electronic component module and the antenna wires or antenna threads and to a permanent fixation of the electronic component the textile substrate in the same manufacturing process leads.

Further advantageous embodiments will become apparent from the dependent claims.

Advantages and expediency are then on the following descriptions in conjunction with the drawing. Hereby show:

1 in a first schematic sectional view of an electronic data carrier prior to assembly of an electronic component module with a textile substrate;

2 in a schematic sectional view of the electronic disk according to 1 after assembling the electronic component module with the textile substrate;

3 a textile with an interposer arranged thereon for forming an electronic data carrier, and

4 an enlarged view of a solder-providing Heizschmelzklebstofffilmes on a pad of an interposer according to an embodiment of the invention.

In the 1 is in a schematic sectional view of an electronic data carrier, which is designed as a transponder, prior to joining a textile substrate, which may be a garment, with an electronic component module, which is designed as a chip module is shown.

The chip module, which is an interposer 1 is, shows in its section shown here part of a carrier film or a carrier paper 1a and a pad arranged thereon 1b which is to be electrically connected to terminal portions of the garment.

A chip 3 is underside of the carrier film or the carrier paper 1a arranged facing the garment and stands with the pad 1b by means of bumps arranged on the chip 4 in electrical contact.

The formed as a garment textile substrate 2 does not have electrically conductive threads 2 B and electrically conductive threads woven therein 2a on, with the electrically conductive threads 2a formed into an antenna according woven into the textile substrate to form a functional antenna structure.

The fragmentary illustrated textile substrate 2 has a connection area 2c on top of that with the pad 1b the interposer is to be brought into electrical and mechanical contact.

On the connection surface 1b is a hot-melt adhesive film 5 with a thickness 9 applied. The hot melt adhesive film 5 includes solder balls 6 that have a diameter 10 exhibit and with a distance 11 spaced apart from each other.

As a typical diameter of the solder balls 6 preferably values of 50 microns to 60 microns are used. A typical thickness value of the hot-melt adhesive film 5 is for example 40 microns. A typical value for the distance 11 between the solder balls, for example, 50 microns.

in the In this case, the hot-melt adhesive has a melting temperature of preferably 130 ° C-140 ° C and the Solder balls have a melting temperature or soldering temperature of preferably 178 ° C.

In 2 will the in 1 transponder shown in detail after the joining of the textile substrate 2 with the interposer 1 by means of the hot-melt adhesive film containing the solder balls. Such an assembly of the formed as a garment textile substrate 2 with the interposer 1 takes place by a compression by means not shown here devices with simultaneous heating of, for example, both sides, ie from above and from below instead. In this case, temperatures of, for example, 178 ° C or more are used to simultaneously heat the hot melt adhesive, which melts at 130 ° C-140 ° C, and the solder balls, which melt at 178 ° C, sufficient for mechanical and electrical connection.

The compression causes penetration of the hot melt adhesive 5a in the textile fabric, so that the hot melt adhesive, the electrically conductive antenna threads 2a and the non-electrically conductive textile threads 2 B surrounds after its curing. At the same time the solder balls 6a melted and form a Lötmaterialschicht between the electrically conductive antenna threads 2a and the actual pad 1b the interposer 1 , This allows a permanent and reliable electrical connection between the antenna threads 2a and the pad 1b ,

After having been measured, electrical connections formed in this way have a contact resistance in the range of a few milliohms, which does not change even after heavy mechanical stress, for example due to slippage of the textile fabric in the interposer region over a table edge. This proves that the introduced solder material is not isolated from the actual hot melt adhesive, but both the antenna wire and the antenna thread 2a within the textile fabric as well as the metallized pad 1b wetted by the interposer.

In 3 is a Textilge in a plan view webe with an interposer attached to it. The textile fabric 2 essentially has an existing in the form of two juxtaposed rectangles antenna structure of the antenna wire 2a on which in the textile fabric 2 woven in.

An interposer 1 is in the connection area of the antenna wires 2a on the upper side by means of the hot melt adhesive containing the solder balls, mounted according to the invention under pressure and heat.

In 4 is a sectional view of a pad of an interposer with inventively designed hot melt adhesive containing the solder balls, shown. The of the substrate 1a surrounded connecting surface of the interposer according to the invention has a layer structure of the actual metallized pad, a hot melt adhesive film disposed thereon and enclosing embedded therein and planar juxtaposed solder balls 6 on.

In the illustration according to 4 are clearly the individual solder balls 6 to see with interposed hot melt adhesive film. The connection surface of the interposer reproduced in this illustration points upwards and, in the case of a connection to the textile substrate, would be pressed in reverse onto the textile substrate, namely pointing downwards.

All Features disclosed in the application documents are considered to be essential to the invention as far as they are individually or in combination the prior art are new.

1

interposer

1a

support film

1b

terminal area

2

textiles substratum

2a

electrical conductive antenna wire

2 B

Not electrically conductive thread

2c

terminal area of the textile substrate

3

chip

4

bumps

5

Hot melt adhesive film

6 6a

solder balls

7, 8th

For the flip-chip mounting required Chipbond adhesive

9

Strength of the hot melt adhesive film

10

diameter the solder balls

11

distance between the solder balls

QUOTES INCLUDE IN THE DESCRIPTION

This list The documents listed by the applicant have been automated generated and is solely for better information recorded by the reader. The list is not part of the German Patent or utility model application. The DPMA takes over no liability for any errors or omissions.

Cited patent literature

• DE 10047972 A1 [0007]
• - US 6523734 B1 [0008]
• WO 02/49093 A1 [0009]

Claims (19)

Method for producing an electronic data carrier which comprises at least one textile substrate ( 2 ) and at least one electronic component module ( 1 ), wherein the textile substrate ( 2 ) as at least one electrically conductive wire or thread (as a co-woven, sewn or embroidered antenna) ( 2a ), characterized in that an adhesive film ( 5 ) with solder particles ( 6 ) between connection areas ( 1b ) of the electronic component module ( 1 ) and the electronic component module connection areas ( 1b ) associated connection areas ( 2c ) of the wire or thread ( 2a ) and is pressurized and heated until a permanent electrical solder joint between the electronic component module connection areas ( 1b ) and the connection areas ( 2c ) as well as a permanent fixation of the electronic component module ( 1 ) on the textile substrate ( 2 ) has arisen. A method according to claim 1, characterized in that as electronic component module ( 1 ) a chip module ( 1 ) is used and the electronic data carrier is a transponder. A method according to claim 1 or 2, characterized in that for the production of the adhesive films ( 5 ) Hot melt adhesives and as solder particles solder balls ( 6 ) be used. Method according to claim 3, characterized in that the diameter ( 10 ) of the juxtaposed solder balls ( 6 ) greater than the thickness ( 9 ) of the adhesive film ( 5 ), in which the solder balls ( 6 ) is embedded. Method according to claim 4, characterized in that the solder ball ( 6 ) a diameter ( 10 ) from a range of 10 microns to 100 microns, preferably from 50 microns to 60 microns and with a distance ( 11 ) are spaced apart from a range of 45 μm-55 μm, preferably 50 μm. Method according to one of claims 3-4, characterized in that the materials for the hot-melt adhesives and for the solder balls ( 6 ) are selected such that the melting temperature of the solder balls ( 6 ) is higher than that of the hot-melt adhesives. A method according to claim 6, characterized in that the melting temperature of the hot melt adhesive at 100 ° C-200 ° C, preferably at 130 ° C, and the melting temperature of the solder balls ( 6 ) at 130 ° C-230 ° C, preferably at 178 ° C. Method according to one of the preceding claims, characterized in that the adhesive films ( 5 ) with the solder particles contained therein before arranging the electronic component module ( 1 ) on the textile substrate ( 2 ) to the electronic component module connection areas ( 1b ) and / or at least the connection areas ( 2c ) of the wire or thread ( 2a ) are applied. Method according to claim 8, characterized in that first the adhesive film ( 5 ) and then on the adhesive film ( 5 ) the solder particles ( 6 ) are applied. Method according to one of the preceding claims, characterized in that as an adhesive film ( 5 ) is used under the action of energy, such as heat transfer, UV, electron or laser irradiation, first liquid, quick-crosslinking adhesive. Method according to one of the preceding claims, characterized in that instead of the textile substrate ( 2 ) a tracked paper or plastic substrate is used. Electronic data carrier for textile fabrics, the electronic data carrier comprising at least one conductive wire or thread (as a co-woven, sewn or embroidered antenna) ( 2a ) and at least one electronic component module ( 1 ), characterized in that an adhesive film ( 5 ) with solder particles ( 6 ) between connection areas ( 1b ) of the electronic component module ( 1 ) and the electronic component module connection areas ( 1b ) associated connection areas ( 2c ) of the wire or thread ( 2a ) is arranged and under pressure and heat, a permanent electrical solder joint between the electronic component module connection areas ( 1b ) and the connection areas ( 2c ) as well as a permanent fixation of the electronic component module ( 1 ) on the textile substrate ( 2 ). Electronic data carrier according to claim 12, characterized in that the electronic component module is a chip module ( 1 ) and the electronic data carrier is a transponder. Electronic data carrier according to claim 12 or 13, characterized in that the adhesive film ( 5 ) consists of a hot melt adhesive and the solder particles solder balls ( 6 ) are. Electronic data carrier according to claim 13, characterized in that the diameter ( 10 ) of the juxtaposed solder balls ( 6 ) greater than the thickness ( 9 ) of the adhesive film ( 5 ), in which the solder balls ( 6 ) are embedded. Electronic data carrier according to claim 15, characterized in that the solder balls ( 6 ) a diameter ( 10 ) from a range of 10 microns to 100 microns, preferably from 50 microns to 60 microns and with a distance ( 11 ) are spaced apart from a range of 45 μm-55 μm, preferably 50 μm. Electronic data carrier according to one of Claims 13-16, characterized in that the materials for the hot-melt adhesives and for the solder balls ( 6 ) are selected such that the melting temperature of the solder balls ( 6 ) are higher than that of the hot-melt adhesives. Electronic data carrier according to one of claims 12-17, characterized in that the adhesive film ( 5 ) with the solder particles contained therein before arranging the electronic component module ( 1 ) on the textile substrate ( 2 ) to the electronic component module connection areas ( 1b ) and / or at least the connection areas ( 2c ) of the wire or thread ( 2a ) are applied. Electronic data carrier according to claim 18, characterized by a layer structure consisting of the electronic component module connection areas ( 1b ), the adhesive films arranged thereon ( 5 ) and on the adhesive films ( 5 ) applied solder particles ( 6 ).