DE102006044016A1 - Stackable functional layer for a modular microelectronic system - Google Patents

Abstract

The invention relates to a functional layer which is suitable for vertical stacking with further functional layers, and to a modular microelectronic system which contains a plurality of stacked functional layers. According to the invention, the functional layer (1) contains a conductor structure (3) which electrically contacts the at least one electronic component (2) and a carrier (4) which carries the at least one electronic component (2) and conductor structure (3), wherein the conductor structure (3) connection contacts (5) for the electrical vertical connection of the at least one electronic component (2) having at least one further functional layer, wherein the conductor structure includes at least two alternative wiring for different assignment of the terminal contacts (5) by the electronic components, wherein the alternative wiring at least one wiring is selectable. The invention makes it possible to reduce the complexity and space requirements of vertical electrical wiring of stacked functional layers.

Description

The The invention relates to a functional layer which is particularly suitable for use as a functional layer within a modular microelectronic structure Systems containing several superimposed stacked functional layers, is suitable, as well as such modular microelectronic system.

modular Microelectronic systems are known in principle. Such are, for example modular embedded systems known which digital circuits for data processing and sequential control and depending on the application further subsystems with sensors and circuits for measuring data processing, Actuators with control for positioning the sensors, antenna and electronics for high frequency generation / evaluation and control communication, and energy supply and components for energy management.

One known concept is that microelectronic system cost-effective with as small as possible Number of components to realize. One possibility for this is the biggest part to integrate the necessary components on a semiconductor chip as a "system-on-a-chip". For example, 3D IC technologies are known for the realization of several transistor layers on one chip. The advantage the smaller chip dimensions However, there are strong yield problems and significantly worse characteristics in comparison to 2D-IC's across from.

One another concept is to design modular microelectronic systems, which on the stack of semiconductor chips and other electronic Components are based in the form of planar layers. The electric Connection of the individual layers, for example of data and Control cables and supply lines are vertical. With such a structure of one above the other stacked "functional layers" can be high Achieve integration densities and degrees of miniaturization.

The publication WO 03/005782 A2 discloses, for example, a modular microelectronic system having a plurality of functional layers stacked vertically one above the other. A functional layer contains in each case electronic components, an electrical conductor structure which electrically contacts the microelectronic components and a carrier in which microelectronic components and conductor structure are embedded. Furthermore, the conductor structure has connection contacts for the microelectronic components, wherein the connection contacts are arranged outside on the end face of the carrier. Several such functional layers are stacked on top of each other and electrically connected to each other via the respective outer terminal contacts of the respective conductor structure via a metallization.

Opposite the Wiring density of horizontally arranged wiring is the Effort to achieve high wiring densities in the field of vertical contacts significantly higher. This is especially noticeable when a variety of functional layers with each other electrically via vertical connections need to be connected to each other.

task Thus, it is the object of the present invention to provide a functional layer create, which makes it possible the vertical wiring complexity and especially the space requirements to significantly reduce such wiring. Another task The invention is to provide a modular microelectronic system create.

These Tasks are accomplished through a functional layer and a modular microelectronic system after the independent claims solved.

advantageous Further developments are described in the dependent claims.

The Invention provides a functional layer which is suitable for vertical Stacking with further functional layers, containing at least one electronic component, one which is at least one electronic Component electrically contacting conductor structure and a carrier, the which carries at least one electrical component and conductor structure, wherein the conductor structure connecting contacts for the electrical vertical Connection of the at least one electronic component with at least having a further functional layer.

Included in the invention the conductor structure at least two alternative wiring to different assignment of the connection contacts by the electronic Components, wherein of the alternative wiring at least a wiring selectable is.

by virtue of that's to choose between multiple, alternative wirings can, it is possible in the structure of several functional layers, the to select the most suitable wiring to a beneficial to allow vertical wiring. In particular, the space required for the vertical wiring of the functional layers can be minimized hereby.

The invention is particularly advantageous when the functional layers are modular in shape, ie, functionally connected electroni components are preferably combined on a functional layer, and can be built up in various combinations to form a microelectronic modular system. Depending on the combination of the individual functional layers to such or such a microelectronic system, another electrical vertical wiring of the functional layers may be better suited. According to the invention, it is possible to select a vertical wiring between different alternatives and to set a suitable assignment of the vertical connection contacts via the choice of the wiring. This simplifies example production concepts with very different suppliers, since the need for coordination, which concerns at least the interpretation of the vertical connection contacts, is reduced, if not even no longer necessary.

It is possible, form the terminal contacts in various forms, for example galvanic in the form of feedthroughs or vias, so a galvanic connection by the carrier passes, or side contacts, or wirelessly via capacitive, inductively or electromagnetically (antennas) coupling elements. to support the wireless coupling elements may be dielectric and / or soft magnetic materials are used.

The Functional layer may be constructed such that various such Supported connection technologies become dependent of the requirements, for example in terms of reliability and costs, to allow a suitable vertical wiring.

Thereby, that the unbundling effort of the vertical wiring by choice the assignment of the connection contacts on the functional layer reducible is, is it possible to realize extremely small and therefore lightweight modules. such Modules can a much higher one Robustness, even a safe operation in rough Environments, for example, in environments where the component allow high accelerations.

It is possible in particular Provide more terminals than required by the electronic components.

When vertical wirings, which are laterally of the stack of functional layers are suitable, for example, thin film substrates based on a ceramic or silicon, thick film substrates based on a Ceramics, laminated substrates, in particular printed circuit boards, metal wires (soldered or Bonded), conductive paste or a laser-structured metallization.

electronic Components can in particular microelectronic components, for example SMD components or semiconductor chips, or even components such as Antennas, batteries, sensors, quartz crystals, actuators, signal generators, resonators and EMC filters.

When carrier especially rigid materials are considered, for example made of ceramic, silicon or epoxy resin, whereby the carrier for mechanical stability the functional layer contributes. Basically also flexible carriers, For example, polymer films, possible. The electronic components can while on the carrier be arranged, or even be embedded in this. The latter For example, by potting with a resin, for example an epoxy resin. For a casting has the Carrier preferably a rigid base plate, for example from one of the above Materials.

The electrical connection lines of the conductor structure can on different ways are realized, for example by Vapor deposition of a metal structure or by an etching process of a already existing metal layer. Depending on requirements, the conductor structure also be multilayered.

The Form of the functional layer is preferably planar, whereby a stack the functional layer is facilitated with further functional layers. Preferably, the shape of the functional layer is cuboid. This can be achieved for example by potting.

It is according to the invention especially possible after the arrangement of the electronic components on the support and their contact with the conductor structure, the assignment of the connection contacts by choosing one of the alternative wirings.

modular microelectronic systems with a functional layer according to the invention are suitable for diverse Applications, especially for applications with integrated sensors and radio communication, for example for recording environmental conditions, tracking the movement of moving objects, warning of material fatigue in rotating parts, Inventory extension and control, realization of virtual keyboards, determination of product quality and support from Disabled.

A advantageous development of the invention provides that the conductor structure at least partially designed such that the choice of wiring by the separation of parts of the conductor structure can take place.

One Such separation is, depending on the design of the conductor structure, for example, by ablation or partial melting of a Part of the ladder possible.

A Further advantageous embodiment provides that the conductor structure is designed such that a multiple change of the wiring is possible.

Preferably the conductor structure is designed such that a change back on already chosen Wiring possible is. Preferably, any back and forth between at least some of the wiring possible.

By Such a configuration of the conductor structure becomes, for example allows the functional layer several times to build different systems use.

A advantageous development of the invention provides that the conductor structure has a controllable switching unit through which the wiring several times is changeable.

One example for Such a switching unit is an arrangement of relays, through the different the electrical connection lines of the conductor structure can be combined with each other to different wiring. Preferably the switching unit is an electronically controllable microelectronic Component. It is particularly preferred if the switching unit is programmable is.

Thereby, that a multiple change of the wiring is possible, it is possible that the Connections, preferably by the electronic components of the functional layer, prove several times. Depending on requirements, in this case, the one or the other electronic component with a part of the connection contacts over a Change the wiring to be electrically connected to each other. Electronic components of different functional layers can be connected via one reduced number of connection contacts communicate with each other, in which the connection contacts functionally differently occupied become.

A Further advantageous development provides that the switching unit over at least an electronic component of the functional layer is controllable.

This allows it, that the functional layer automatically as needed, at least can change part of the wiring.

A Further advantageous development provides that the switching unit over at least a connection contact is controllable.

A Such development is for example for a one-time determination the wiring during the integration of the functional layer in a microelectronic modular system suitable. This is sufficient in many cases. The connections for programming the switching unit need not be wired in this case too become.

A Further advantageous development of the invention provides that the conductor structure is designed such that a multiple change the wiring in the operating state of the functional layer is possible.

This For example, by a switchover unit already described above will be realized.

For example the switching unit can be programmed in such a way that they are in one fixed time sequence the wiring changes. It is the same possible, that the switching unit is designed such that it due to of signals from electronic components connected to the switching unit the wiring during of the operating state changes. The electronic components can do this lie on the functional layer on which the switching unit or be electronic components, in particular are arranged on other functional layers and over a vertical electrical connection via one of the connection contacts can be connected to the switching unit.

These advantageous development allows in particular a multiple assignment of the connection contacts. This is a significant Reduction of complexity and the effort for the vertical wiring possible.

A Further advantageous embodiment provides that the connection contacts for controlling the switching unit at least partially exclusively by the switching unit are simply occupied.

The Connection contacts for controlling the switching unit have at least partially, preferably completely, no further functionality.

A Further advantageous development of the invention provides that the connection contacts for controlling the switching unit at least partially occupied several times.

This is useful, for example, if with various means the switching unit to be controlled, for example, with several electronic components.

A Another advantageous embodiment provides that at least between a connection contact and an electronic component by choice Wiring a driver stage is zwischenschaltbar.

Under a driver circuits designed as an input and / or output stage Device are understood, for example, a device, via which an impedance matching of signal inputs and outputs is possible, signal conditioning stages for support wireless vertical connections based on capacitive, inductive and / or electromagnetic coupling, or bus drivers, the data bus systems for serial data transmission support. In the case of Bautreiberstufen here is a supplementary control unit for implementation a bus protocol as part of the driver stage.

Of course, such Driver stages also known as part of an unchangeable wiring be integrated in the ladder structure.

Of Furthermore, the invention provides a modular microelectronic System comprising a plurality of functional layers stacked vertically above one another, wherein a functional layer comprises at least one electronic component, at least one vertical terminal contact and a conductor structure, the the at least one electronic component with the at least electrically connects a vertical terminal contact contains, and the functional layers over their respective terminal contacts vertically to each other electrically are connected. According to the invention, at least one Functional layer, a functional layer according to one of claims 1 to 11th

Preferably are several functional layers according to the invention integrated in such a modular system.

The Invention will now be described with reference to embodiments, which several figures are shown, explained in more detail.

there shows

1 a schematic representation of an embodiment of a functional layer according to the invention,

2 A first embodiment of a carrier of a functional layer having a conductor structure according to the invention includes connecting lines and connecting contacts.

3 A second embodiment of a carrier and a conductor structure belonging to connecting lines and terminals,

4 A third embodiment of a carrier and connecting lines and connecting contacts belonging to a conductor structure,

5 4 shows a fourth embodiment of a carrier and connecting lines belonging to a conductor structure and terminal contacts,

6 5 shows a fifth embodiment of a carrier with connection contacts belonging to a conductor structure,

7 a first embodiment of a modular microelectronic system according to the invention, and

8th A second embodiment of a modular microelectronic system according to the invention.

The 1 shows a schematic representation of a functional layer according to the invention 1 ,

The functional layer 1 contains several electronic components 2 , In this case, electronic components, which realize a memory, a controller or a radio transmitter, a the electronic components electrically contacting conductor structure 3 and a carrier (not shown) 4 that the electronic components 2 and the ladder structure 3 wearing. The ladder structure 3 has connection contacts 5 for the electrical vertical connection of the electronic components 2 with at least one further functional layer (not shown here).

The conductor structure shown here 3 has four types of connection lines: Sensitive signal lines 3a For example, for the transmission of high-frequency signals, supply lines 3b for the power supply, control cables 3c and data lines 3d , The supply lines 3b and sensitive signal lines 3a are thereby unveränder bar with vertical connection contacts 5 connected. The data lines 3d and control lines 3c are via a programmable switching unit 7 , which is designed as an SMD component, with further connection contacts 5 connected.

The switching unit 7 is designed such that the assignment of the connection contacts 5 through the data lines 3d and control lines 3c can be changed. This is achieved by that the controllable switching unit 7 Relay different interconnections of the conductor structure can interconnect by means of relays. This makes it possible, by means of the controllable switching unit 7 several alternative wiring for different assignment of the connection contacts 5 through the electronic components 2 to choose.

Through the switching unit 7 Relay, the wiring is interchangeable as often as desired. In particular, an arbitrary often repeatable switching back and forth between different wiring is possible.

The switching unit 7 is about an electronic component 2 the functional layer controllable. This is de switching unit 7 via an electrical connection line 8th with the electronic component 2 connected.

Furthermore, the switching unit 7 via a connection contact 9 controllable. In this case, the connection contact 9 to control the switching unit simple occupied. Alternatively, it is also possible to occupy several times such a connection contact.

Furthermore, the programmable switching unit 7 designed such that a change of the wiring during the operating state of the functional layer is possible. In particular, via the electrical connection line 8th at least part of the electronic components 2 in the operating state of the functional layer independently the wiring and thus the assignment of the connection contacts 5 switch.

Between the control lines 3c and data lines 3d and the connection contacts 5 that is, between the electronic components 2 and the connection contacts 5 , are by means of the switching unit 7 driver stages 10 zwischenschaltbar.

In particular, between control lines 3c and data lines 3d driver stages 10 for the impedance matching of signal inputs and outputs, signal conditioning stages to support wireless vertical connections based on capacitive, inductive or electromagnetic coupling or bus driver for serial data transfer between switched.

Furthermore, the switching unit 7 via a multiplexer 11 electrically directly with the connection contacts 5 connected. In this way, the connections can be reconfigured during production or by external, but intrinsic other electronic components using appropriate signal sequences.

The 2 to 6 show several embodiments of a carrier 4 with connecting cables and connection contacts 5 a ladder structure 3 ,

2 shows an embodiment in which the verti cal terminal contacts 5 as a page edge contacts 5a are formed, and this at an outer edge of the carrier 4a are located.

The page edge contacts 5a are over interconnections 3e a conductor structure with horizontal connection contacts 30a contacted. The horizontal connection contacts 30a are intended for the connection of electronic components or other connecting lines. The connecting lines will pass through one on the surface of the carrier 4a formed formed metallic layer.

3 shows an embodiment in which the terminal contacts 5 as vias 5b which by the carrier 4b completely pass through, are formed.

The Through holes are filled with a metal. The horizontal outer surfaces of the vias are planar.

4 shows an embodiment in which the terminals for the vertical wiring as side edge contacts 5c are formed, which are located on the outer edge of the carrier 4c are located. The connection contacts 5c are formed as cup-shaped metallic elements, which in the outer edge of the carrier 4c are embedded. On the outer surfaces, ie, on the top and bottom of the carrier 4c , the side edge contacts are planar.

5 shows an embodiment in which the connection contacts for the vertical connection as a via 5d and margin contacts 5f on a carrier 4d are formed. Alternatively, a reservation of areas is possible, which can be used later for the realization of vias.

Several horizontal connection contacts 30b , which may be provided for the connection of electronic components or other connecting lines, and the vertical connection contacts 5f and 5d are through a grid of interconnections 3f , here on the surface of the carrier 4d extending conductor tracks made of copper, electrically interconnected. By disconnecting the connecting lines 3f Here, for example, via an etching process, it is possible to change the wiring, for example, the horizontal terminals 30b clearly the connection contacts 5f and or 5g assigned.

6 shows a fifth embodiment of a carrier with connection contacts 5 , The connection contacts are on the one hand as electrodes 5g for the formation of capacitive elements, as well as inductive elements 5h educated. The inductive elements 5h are formed in this case by interconnects. To clarify the function of the capacitive or inductive terminal contacts shows 6 an identically designed carrier 4e ' with identically designed connection contacts 5g ' and 5h ' , carrier 4 and 4e ' are stacked on top of each other, making the connection contacts 5g and 5g ' form a capacitive element, and the fields of the inductive elements 5h and 5h ' can mesh.

The electrodes 5g and 5g ' are coated in this embodiment with a dielectric material. Furthermore, in the field of inductive ele ments 5h and 5h ' a soft magnetic material arranged to reinforce the inductive coupling.

7 shows a first embodiment of a microelectronic system, here a modular radio sensor.

The radio sensor contains several functional layers stacked vertically one above the other. The basis is an energy supply 20 , followed by a first memory 21a , a second memory 21b , a logic 22 , a micro antenna 23 and a radio transmitter 24 , Said elements are designed as functional layers, ie they each have at least one electronic component, at least one vertical connection contact and a conductor structure which connects the at least one electronic component to the at least one vertical connection contact.

The functional layers 20 to 24 are formed parallelepiped with identical base. This is achieved in this case by carriers with identical, square bases having rigid substrates which have been topped with epoxy resin.

The functional layers are through a resin 28 glued together.

On the top of the radio transmitter 24 there is also a temperature sensor 25 , a buffer capacitor 26 and a quartz 27 , These are also by an adhesive bond with resin on the functional layer of the radio transmitter 24 attached.

The functional layers 20 to 24 are connected to each other via vertical connection contacts 5 electrically connected to each other. Apart from the galvanically coupled supply lines and the sensitive analog lines, in this embodiment capacitive connection contacts are produced 5 (see this 6 ), which allows reliable larger contacts or the use of less expensive vertical connection technologies (not described here) due to a lower vertical contact density.

The edge lengths of the cube-shaped radio module shown here are about 4.8 mm. Depending on the structure, however, these can be strong vary.

The functional layers of the radio module are similar to the functional layer described above 1 , please refer 1 , executed. The following therefore refers to the elements of 1 taken.

The logic functional layer 22 has 35 digital inputs and outputs via an SPI bus as driver stage 10 from a switching unit 7 optionally on three connection contacts 5 can be occupied by changing the wiring. The switching unit is designed in this case as a programmable switching unit, which via a connection contact 9 can be controlled from the outside.

logic 22 and memory 21a and 21b each have two power supply lines 3a on which permanently with vertical connection contacts 5 are connected. For data exchange between the logic functional layer 22 and the two memory chips 21a and 21b There are three data lines each 3d that are configured as SPI bus.

The microantenna functional layer 23 is with the radio transmitter 24 also via unchangeable designed for the transmission of RF signals connecting lines 3a with associated connection contacts 5 electrically connected to each other.

The connection from the logic functional layer 22 and the radio transmitter functional layer 24 via a proprietary bus driver 10 with four digital lines and two analog lines for field strength measurement for media access "per listen before talk". In addition to the two lines for the power supply, there are a total of eight lines. The four digital connections on the radio transmitter 24 , see. control lines 3c in 1 , are via a programmable switching unit 7 , which analogous to the switching unit described above 7 , is constructed in their assignment of the connection contacts 5 selectable by changing the wiring.

In this case, via the programming of the switching unit, the connection contacts 5 the respective functional layers are assigned such that a vertical connection of the individual functional layers is possible with each other.

8th shows a second embodiment of a modular microelectronic system according to the invention.

The microelectronic system is analogous to the microelectronic system according to the first embodiment built up.

In contrast to the first embodiment, the functional layers 20 - 24 However, no connection contacts on, which allow a capacitive coupling, but side edge contacts 5c , see. 4 , which allow a galvanic connection on the side surfaces of the functional layers.

For the vertical wiring of the functional layers, the microelectronic system has an FR4 printed circuit board substrate 29 on. On the surface of this substrate 29 are in this embodiment, 50 micron interconnects with a thickness of 18 microns of copper. By the arrangement of the substrate 29 On the side surface of the cube resulting from the vertical stacking of the functional layers, the functional layers are connected via the connection contacts 5c electrically connected to each other.

The conductor structures of the functional layers are designed such that it is possible to occupy the terminal contacts by programming the switching unit 7 to be chosen such that crossing-free vertical connections are possible. Accordingly, the tracks of the vertical electrical connection are crossing free on the printed circuit board substrate 29 applied.

Claims (12)

Functional layer ( 1 ), suitable for vertical stacking with further functional layers, comprising at least one electronic component ( 2 ), a the at least one electronic component electrically contacting conductor structure ( 3 ) and a carrier ( 4 ), which carries the at least one electronic component and conductor structure, wherein the conductor structure connection contacts ( 5 ) for the electrical vertical connection of the at least one electronic component with at least one further functional layer, characterized in that the conductor structure includes at least two alternative wirings for different assignment of the connection contacts by the electronic components, wherein at least one of the alternative wirings is selectable. Functional layer according to claim 1, characterized in that the conductor structure ( 3f ) is at least partially formed such that the choice of the wiring can be made by the separation of parts of the conductor structure. Functional layer according to one of the preceding claims, characterized characterized in that the conductor structure is designed such that a multiple change of the wiring is possible. Functional layer according to Claim 3, characterized in that the conductor structure has a controllable switching unit ( 7 ), through which the wiring is repeatedly exchangeable. Functional layer according to claim 4, characterized in that the switching unit via at least one electronic component ( 7 ) the functional layer ( 8th ) is controllable. Functional layer according to one of claims 4 or 5, characterized in that the switching unit via at least one terminal contact ( 9 ) is controllable. Functional layer according to one of claims 3 to 6, characterized in that the conductor structure is formed is that a multiple change of wiring in the operating state the functional layer possible is. Functional layer according to one of claims 6 to 7, that the connection contacts ( 9 ) are at least partially occupied exclusively by the switching unit for controlling the switching unit. Functional layer according to one of claims 6 to 7, that the connection contacts to control the switching unit at least partially proven multiple times. Functional layer according to one of claims 1 to 9, characterized in that a connection contact as a via ( 5b ) or as a page edge contact ( 5a . 5b . 5c ) is trained. Functional layer according to one of claims 1 to 10, characterized in that at least between a terminal contact and an electronic component by selecting the wiring, a driver stage ( 10 ) is switchable. Modular microelectronic system comprising a plurality of functional layers stacked vertically above one another ( 20 . 21a . 21b . 22 . 23 . 24 ), wherein a functional layer at least one electronic component, at least one vertical terminal contact and a conductor structure, which electrically connects the at least one electronic component with the at least one vertical terminal contact, containing, and the functional layers via their respective terminal contacts vertically with electrically connected to each other, characterized in that at least one functional layer is a functional layer according to one of claims 1 to 11.