DE102006035865B3 - Material placing method for use in integrated circuit, involves positioning transfer plate opposite to target plate, where material is casted out from blind holes to contact with target plate and to place at target plate - Google Patents

Abstract

The method involves immersing a transfer plate (10) in a material bath, in which a material is placed in a fluid condition, where the pressure acts at the bath and another pressure dominates in blind holes (100). A pressure difference is made between the pressures at the bath and in the holes, respectively, such that the holes are partially filled with the fluid material. The transfer plate is extracted from the bath. The transfer plate opposite to the target plate is positioned, where the material is casted out from the holes to contact with the target plate and to place at the target plate. An independent claim is also included for a device for executing a method for placing material.

Description

The The invention relates to a method for placing material a target plate using a transfer plate and a device to carry out a method of placing material on a target plate using a transfer plate and an integrated circuit.

The modern integrated circuit technology often requires the precise and well-defined placement of a material on a target plate. As material often come electrical connection materials, such as metallic solders, or optically or electronically functionalized materials such as phosphors or organic semiconductors in solution, for use. The target plate can also be a substrate, a integrated circuit on a microchip, or about a housing for contacting be the integrated circuit. When placing the material It is a matter of a single portion of the material and the distance of the Material portions with each other (pitch) in the sense of a progressive To shrink integration steadily.

You come in the spatial Dimensions of the material portions in the micrometer range before, so becomes a reliable one and reproducible dense placement of material increasingly difficult. On the one hand must be guaranteed be that a material portion with a sufficient quantity accuracy at a given location. reliably placed, on the other hand Must be a contact between two closely spaced material portions be prevented. The latter can be used, for example from solder materials to a confluence and thus to a short circuit to lead. Precise Methods use a transfer plate in the sense of a die, the Recesses at the given positions of the placement of the material having. In these wells then the material is in portions filed, the correct filling If necessary, the wells are checked with material, and the material portions are then placed on a target plate simultaneously in one step.

It is known, such a transfer plate with a portioning device to fill wherein the portioning device comprises a number of nozzles and the portioning device over the Transfer plate is driven. While the method of the portioning device over the transfer plate the nozzles controlled so that material portions at the right time from the nozzle be driven out and in corresponding wells of the transfer plate be deposited. Such an approach is in terms of precision strong on the accuracy of the positioning of the portioning device across from bound to the transfer plate. Furthermore, the method requires the Portioning time and therefore such methods are in the Usually slow.

They are also from A. Satoh, Jpn. J. Appl. Phys. 40, pages 4774-4780 (2001), the EP 1 655 389 A1 , of the EP 1 329 949 A2 and the US 2002/0094604 A1 Devices or methods for filling blind holes of a substrate with a liquid conductive material known.

It is also from the US 6,812,549 B2 a method for filling through holes of a substrate with a liquid conductive material is known.

It is also from the JP 3-138942 A a device or method for placing portions of a liquid conductive material on a target plate known.

It is therefore an object of the present invention, an improved method to provide material on a target plate. It is a further object of the present invention to provide a substrate for Use in a method according to the invention for placing of material. It is a further object of the present invention Invention to provide an improved integrated circuit. It is about it It is an object of the present invention to provide a device for execution the method according to the invention to provide material placement.

These Objects are integrated by the method according to claim 1 Circuit according to claim 17 and the device according to claim 25 ge triggers. Further advantageous embodiments of the invention are specified in the dependent claims.

According to a first aspect of the present invention, a method of placing material on a target plate by means of a transfer plate is provided. The transfer plate has a plurality of blind holes. The method comprises the steps of immersing the transfer plate in a bath of material in which the material is in a liquid state, wherein a first pressure acts on the material bath and a second pressure prevails in the blind holes, and wherein during the immersion the first pressure in the Is substantially equal to the second pressure; establishing a pressure difference between the first pressure on the material bath and the second pressure in the blind holes after immersion, the second pressure being greater than the first pressure such that the blind holes of the transfer plate are at least partially filled with the liquid material; pulling out the transfer plate from the material bath and positioning the transfer plate with respect to the target plate, wherein the material is expelled from the blind holes to be brought into contact with the target plate.

By the manufacture according to the invention a pressure difference between a first pressure on the material bath and the second pressure in the blind holes after immersing the Transfer plate into a bath of material in which a material in a liquid state is located, the blind holes of the Transfer plate at least partially filled with the liquid material. These filling the blind holes done in an advantageous manner parallel: all blind holes of the transfer plate are filled with material in one step. This reduces the time required for filling the transfer plate considerably. A time-consuming scanning of the transfer plate with a filling device is not necessary. Furthermore, a complex precise positioning of the filling device for Transfer plate not necessary because the position of Sacklö cher simultaneously determines the position of the material to be placed. This reduces the process cost and the error rate considerably.

According to one Second aspect of the present invention is a substrate, in particular for using a method according to one embodiment of the first aspect of the present invention, wherein the substrate has a variety of blind holes and contact surfaces in a range of openings the blind holes on a surface of the substrate.

The inventive substrate can thus carrier a functional group, such as an integrated circuit be, and at the same time means for contacting, for example the integrated circuit. The blind holes can be in an advantageous manner filled with a material which, when expelled, contact the contact surfaces occurs. Furthermore, the substrate, such as an integrated circuit on a semiconductor substrate, by immersion in a solder bath and be filled with solder material by making a pressure difference, which is expelled in a subsequent step and the Wet contact surfaces and apply a soldering material.

According to one third aspect of the present invention is an integrated Circuit having at least one substrate with blind holes according to the second Aspect of the present invention and a further substrate with contact surfaces provided, with contact surfaces of the substrate with the blind holes with the opposite contact surfaces the further substrate by means of expelled from the blind holes Lotmaterial are electrically connected.

The Integrated invention Circuit may advantageously comprise a plurality of substrates, each again may have an integrated circuit. The Substrates can according to the invention be contacted with each other in an advantageous manner by simultaneously the solder material from all blind holes is expelled and simultaneously contacted all the corresponding contact surfaces. this makes possible a particularly gentle contacting of multiple substrates, there, for example when using melting solder material, all substrates just warmed up once Need to become. Further can the integrated invention Circuit an increased Integrate and significantly simplifies the production become.

According to one Fourth aspect of the present invention is a device to carry out a method according to the first Aspect of the present invention. Accordingly, points the device comprises a recipient, a control unit and a pressure point unit on, wherein in the recipient a material bath with liquid material and a positioning unit is provided. Further, on the positioning unit a transfer plate with a plurality of blind holes arranged. The control unit is designed, the pressure point unit in a first step in such a way to control that in the recipient a first recipient pressure prevails, the positioning unit in a second step in such a way to control that they have the transfer plate with the large number of blind holes in the material bath dives, the pressure unit after immersion the transfer plate in a third step in such a way, that in the recipient a second recipient pressure prevails, and to control the positioning unit in a fourth step in such a way that they use the transfer plate with a variety of blind holes pulling out of the material bath.

According to one embodiment The present invention is used in positioning the transfer plate across from the target plate first the material from the blind holes expelled from the transfer plate, wherein beaded portions of the material in a range of openings the blind holes be ausgebil det, and then the transfer plate opposite the Target plate positioned, with the bead-shaped portions of the material be brought into contact with the target plate, leaving the material placed on the target plate.

Thus, there is advantageously a way to control the volume of the material to be placed and also to bring the material portions in a bead shape with the target plate in contact. The substantially rounded bead shape of the material portion allows initial contact of the material with the target plate in as small an area as possible, from which the rest of the material concentrically contacts the target plate brings. This advantageously prevents the formation of gas or vacuum inclusions in the form of bubbles.

According to one another embodiment The present invention is used during positioning of the Transfer plate opposite the target plate first the transfer plate opposite The target plate is positioned and then the material from the blind holes of the Driven out transfer plate, wherein the material in contact with the Target plate is brought.

In order to is advantageously the material directly on the transfer plate expelled and a separate step to expel the material can be omitted before placing on the transfer plate.

According to one another embodiment According to the present invention, the first pressure and the second one correspond Pressure before immersing essentially a vacuum and amount preferably less than 5 mbar.

According to one another embodiment According to the present invention, the pressure difference is increased by increasing the first pressure to atmospheric pressure, essentially at 1 bar, generated.

By the pressure equalization of the pressure on the material bath and the pressure in the blind holes Vacuum is advantageously in a subsequent process step sufficiently driving the material into the blind holes atmospheric pressure allows. The further process steps can so at atmospheric pressure carried out. Further must to carry the method according to the invention only a vacuum can be generated.

According to one another embodiment According to the present invention, the first pressure and the second one correspond Pressure before immersion substantially at atmospheric pressure, preferably substantially 1 bar.

According to one another embodiment In the present invention, the pressure difference is lowered the second pressure in the blind holes to a vacuum, preferably to a pressure lower than 5 mbar, generated.

In Advantageously, the driving of the material in the blind holes at Atmospheric pressure possible. All Process steps can so at atmospheric pressure carried out be, and an elaborate one Arrangement for generating a vacuum or overpressure on the material bath not necessary. The pressure in the blind holes can by a corresponding Connection of the blind holes to a pressure regulating device or pump.

According to one another embodiment the present invention, the pressure difference is regulated, so that the amount of material in the blind holes is set.

The Pressure difference between the first pressure on the material bath and the second pressure in the blind holes determines how much material is pressed into the blind holes. Of the Pressure is generally sufficient with simple technical aids be regulated exactly and easily, so that the otherwise very complex Determining the amount of material in the blind holes according to this embodiment of the present invention can be made simple and efficient. Further can be done advantageously by regulating the pressure difference the amount of material portion can be adjusted in a blind hole. With that you can advantageously all blind holes simultaneously with a Well defined material portion can be efficiently filled in one step.

According to one another embodiment According to the present invention, the transfer plate is prior to dipping heated, preferably to a temperature in a range between 150 and 300 ° C.

is the material in the material bath only at higher temperatures in one liquid Condition, so can by heating the transfer plate on a Temperature that is substantially equal to the temperature of the material, too abrupt temperature transition, and possible damage associated therewith on the transfer plate, can be prevented.

According to one another embodiment In the present invention, the material is withdrawn solidified the transfer plate in the blind holes.

In order to the material is stable in the blind holes anchored in the transfer plate, and the transfer plate can in Advantageously easy to handle and transported. Furthermore is also a change of the process chamber easily possible. The efficiency of the whole Manufacturing process can thus be optimized.

According to one another embodiment The present invention involves the solidification of the liquid material in the blind holes by cooling, preferably to a temperature in a range between 10 and 50 ° C.

According to another embodiment of the present invention, the solidified material may be re-liquefied prior to expulsion by heating. Preferably, the liquefaction is carried out by heating to a temperature in egg in the range between 150 ° C and 300 ° C.

In Advantageously, the material can by appropriate tempering the transfer plate can be solidified and liquefied at will. This increases the flexibility and the possible uses of the inventive method considerably.

According to one another embodiment The present invention is used to expel the material the blind holes the transfer plate another pressure difference between the second Pressure in the blind holes and a third pressure outside the blind holes produced.

In order to can by establishing a further pressure difference between the pressure in the blind holes and the pressure outside the blind holes that Material from the blind holes well defined to be expelled. Thus, overall affects both the pressure difference as well as the endeavor of the material a drop outside the transfer plate to form on the material. Due to the surface tension of the Material will be the formation of a beaded portion of the material outside the blind holes favors. The further pressure difference can this endeavor in an advantageous Support way or, to reduce the portion amount of the material outside of the blind hole, inhibit.

According to one another embodiment The present invention uses a conductive material as the material. preferably a solder material, placed.

By the use of a conductive material, preferably a solder material, can with the method according to the invention in an advantageous and efficient manner parallel portions of solder material be placed to form electrical contacts. This is it is possible To provide a whole target plate with solder balls in one step.

According to one another embodiment of the present invention are the target plate and the transfer plate Substrates with electrical contact surfaces, wherein the blind holes of the Transfer plate in the field of electrical contact surfaces the surface are arranged. Furthermore, the positioning of the transfer plate takes place across from the target plate, so that the contact surfaces of the transfer plate and the contact surfaces substantially face the target plate, and wherein the expelling of the solder material from the blind holes done so that over the Lotmaterial a connection between two facing each other contact surfaces will be produced.

Consequently is the parallel and efficient electrical connection of two Substrates possible in one step.

According to one another embodiment of the present invention the diameter of the blind holes less than 10 μm, the minimum distance of the blind holes less than 50 μm and is the relationship the depth of the blind holes to the diameter of the blind holes greater than Third

In order to let yourself a sufficient one Deposit amount of soldering material in the blind holes, then advantageously contact surfaces can wet and contact in high integration.

According to one another embodiment The present invention features the surface of the substrate at the openings the blind holes Chamfering up.

In order to the placement and the hold of the material expelled from the blind holes stabilized. Furthermore, can beaded Portions of the material well and reliably on the surface of the Substrate are adhered.

According to one another embodiment According to the present invention, the surface of the substrate has wetting wands around the openings the blind holes with solder material wetting the wetting eyelets.

By the wetting eyelets the material that is expelled from the blind holes, in more advantageous Way stable and well defined on the substrate held. In order to may also be an inaccuracy of the positioning of the material and / or a flow two adjacent portions of the solder material can be prevented.

According to others embodiments The present invention is the opening of a blind hole within a contact surface, adjacent to a contact surface or in an environment of a contact surface, where the environment is not wider than the minimum distance between two adjacent contact surfaces the substrate, arranged.

According to one another embodiment The present invention is between the at least one substrate with the blind holes and the further substrate, a bonding layer arranged.

The bonding layer mechanically binds the at least one substrate to the further substrate and has openings in areas of the contact surfaces. Thus, two substrates can be bonded to each other in an advantageous manner and the relative position to each other remains constant. Thus, a plurality of substrates can be arranged one above the other, with an expelling of the material from the blind holes in a final step together done for all substrates with Sacklö Chern can. During the stacking, the position of the already connected substrates advantageously remains constant due to the bonding layer. Through the openings in the connecting layer in the region of the contact surfaces, a volume is formed, which can then be at least partially filled by the expelled solder material from the blind holes.

According to one another embodiment According to the present invention, the control unit is designed which Positioning unit in a fifth Step to control such that they the transfer plate with the Variety of blind holes across from a target plate positioned.

According to one another embodiment The present invention is another positioning and another control unit is provided and the further control unit is designed to control the further positioning unit in such a way that they have the transfer plate with the plurality of blind holes opposite one Target plate positioned. The further positioning unit can also a tempering unit, which is designed, the transfer plate controlled to temper, preferably in a range of 10 ° C to 300 ° C.

In order to can advantageously with the filling of the blind holes the material first using the positioning unit, and positioning the Transfer plate opposite a target plate with the help of the further positioning unit. Since the positioning with the positioning only on the simple dipping and pulling the transfer plate into the material bath limited the positioning unit can as possible simply executed be. Positioning the transfer plate relative to a target plate requires usually a higher one Precision, often in a range below 1 μm, for what further positioning unit can be optimized. Furthermore, a Changing the positioning unit or removing the transfer plate From a positioning niereinheit intermediate steps, such as an optical Inspection for quality assurance.

According to one another embodiment According to the present invention, the control unit is designed which Pressure adjusting unit after removing the transfer plate from the To control material bath such that in the recipient a third Recipient pressure prevails.

According to one another embodiment According to the present invention, the printing unit is designed set the first recipient pressure and the second recipient pressure so that the pressure difference between the first recipient pressure and the second recipient pressure substantially equal to 1 bar. This can be done by adjusting the first recipient pressure below 5 mbar, essentially a vacuum, and adjusting the second recipient pressure at 1 bar, essentially atmospheric pressure. Far the first recipient pressure can be at 1 bar, essentially atmospheric pressure, and the second recipient pressure is set at about 2 bar, to produce a Druckdiffrenz of about 1 bar.

According to one another embodiment According to the present invention, the positioning unit has a tempering unit auf, which is designed to control the transfer plate regulated, preferably in a range of 10 to 300 ° C.

According to one another embodiment According to the present invention, the material bath has a further tempering unit on, which is designed to control the material regulated, preferably in a range of 10 to 300 ° C.

preferred embodiments The present invention will be described below with reference to the accompanying drawings explained in more detail. It demonstrate:

1A to 1F placing material with a transfer plate according to a first embodiment of the present invention;

2A and 2 B expelling the material from a transfer plate according to a second embodiment of the present invention;

3A and 3B expelling the material from a transfer plate according to a third embodiment of the present invention;

4A to 4C placing material on a target plate according to a fourth embodiment of the present invention;

5A to 5C placing material on a target plate according to a fifth embodiment of the present invention;

6A to 6C contacting two substrates with a solder material according to a sixth embodiment of the present invention;

7A to 7C contacting two substrates with a solder material according to a seventh embodiment of the present invention;

8A to 8C contacting two substrates with a solder material according to an eighth embodiment of the present invention;

9A and 9B a schematic representation of a blind hole with a contact surface according to a ninth embodiment of the present invention;

10A and 10B a schematic representation of a blind hole with a contact surface according to a tenth embodiment of the present invention;

11A and 11B a schematic representation of a blind hole with a contact surface according to an eleventh embodiment of the present invention;

12 an apparatus for carrying out a method according to the invention according to a twelfth embodiment of the present invention; and

13 a flowchart of a method according to a thirteenth embodiment of the present invention.

1A shows a transfer plate 10 with blind holes 100 according to a first embodiment of the present invention. The variety of blind holes 100 can be along the entire surface of the transfer plate 10 extend. Generally, the position of a single blind hole 100 chosen so that it corresponds to the position of the material to be placed. To meet modern requirements, the diameter of a blind hole 100 less than 10 microns, and the minimum distance between two adjacent blind holes is less than 50 microns. Furthermore, the ratio of the depth of the blind holes 100 to the diameter of the blind holes 100 Larger than 3. Increased ratio can reduce the depth of the blind holes 100 opposite the diameter of the blind hole 100 be further enlarged, and the blind hole 100 can absorb more material.

As in 1B shown, the transfer plate 10 prepared to put in a material bath 20 with a material 21 , where the material 21 is in a liquid state to be dipped. There is a first pressure 200 on the material bath and a second pressure 201 in the blind holes 100 ,

In this step of the method, the first pressure 200 substantially corresponds to the second pressure 201 ,

In a further process step, as in 1C shown, the transfer plate 10 into the liquid material 21 in the material bath 20 dipped. Because the first pressure 200 the second pressure 201 essentially corresponds to only a negligible amount of material 21 in the blind holes 100 pressed.

By establishing a first pressure difference between the first pressure 200 on the material 21 and the second pressure 201 in the blind holes 100 be like in 1D shown the blind holes 100 with the liquid material 21 filled. The individual blind holes 100 then comprise a residual volume 110 and a portion 210 of the material 21 , The size of the remaining volume 110 is essentially due to the pressure difference between the first pressure 200 and the second pressure 201 established. Furthermore, affect the amount of. Portion of the material 210 Capillary forces, surface forces, and / or wetting forces. The surface of the blind holes 100 in the transfer plate 10 gets from the material 21 not significantly wetted.

In a further process step, as in 1E shown, the transfer plate 10 from the material bath 20 drawn. This will leave portions 210 of the material 21 in the blind holes 100 the transfer plate 10 , In this state, the total pressure difference between the first pressure act 200 and the second pressure 201 in the residual volume 110 a blind hole 100 , Capillary forces and the surface tension of the portion 210 of the material 21 on the portion 210 of the material 21 , Therefore, without changing the external pressures, for example, by the surface tension of the material 21 , the portion 210 of the material 21 already, at least partially, out of the blind hole 100 to be driven. Furthermore, in this state, the material 210 in the blind holes 100 be solidified. This can be done, for example, by cooling, so that the portions 210 of the material 21 in the blind holes 100 solidify. The filled transfer plate 10 is thus in a stable condition and the portions 210 are safe and reliable in the blind holes 100 brought in. Used as material 21 For example, a solder used, the temperatures for the liquid material are above the corresponding melting point, for example at 217 ° C for a common lead-free solder material Sn95.5 / Ag3.8 / Cu0.7. Cooling the transfer plate 10 below this temperature, the solder material leaves in the blind holes 100 solidify. The melting temperature can be used for other materials 21 but also much lower or higher. In the case of placing organic soluble material, solidification may occur at much lower temperatures, for example at temperatures below 0 ° C.

As in 1F shown, the transfer plate 10 towards a target plate 30 positioned. This will be the portions 210 of the material 21 either first out of the blind holes 100 expelled and then the transfer plate 10 so towards the target plate 30 positioned that portions 210 of the material 21 in contact with the target plate 30 kick, and the material 21 on the target plate 30 is placed, or first the transfer plate 10 near the target plate 30 is positioned so that expelling the portions 210 of the material 21 from the blind holes 100 the material directly in contact with the target plate 30 brings.

2A and 2 B show the expulsion of the material from a transfer plate 10 according to a second embodiment of the present invention. 2A shows first the transfer plate 10 , Accordingly, the surface of the transfer plate 10 at the openings of the blind holes 100 chamfers 101 on. Will the portion 210 of the material 21 from the blind holes 100 , at least partially, expelled, so can a pearl-shaped portion 211 of the material 21 in an area of the openings of the blind holes 100 form. The chamfers 101 in the area of the openings of the blind holes 100 can make the perlenför shaped portions 211 favor and / or liability of the beaded portions 211 on the transfer plate 10 favor. Especially with regard to expulsion by means of the surface tension of the portion 210 or pearl-shaped portion 211 of the material 21 can the chamfer 101 favoring effect.

3A and 3B show the expulsion of the material from a transfer plate 10 according to a third embodiment of the present invention. 3A shows first the transfer plate 10 : Thus, the surface of the transfer plate indicates 10 at the openings of the blind holes 100 wetting eyelets 102 on. Will the portion 210 of the material 21 from the blind holes 100 , at least partially, expelled, so can a pearl-shaped portion 211 of the material 21 in an area of the openings of the blind holes 100 form. The wetting eyelets 102 in the area of the openings of the blind holes 100 can make the beaded portions 211 favor and / or liability of the beaded portions 211 on the transfer plate 10 favor. The wetting properties of the wetting eyelets 102 can also exfoliate by means of the surface tension of the portion 210 or pearl-shaped portion 211 of the material 21 favor.

4A to 4C 12 schematically show the placement of material on a target plate according to a fourth embodiment of the present invention. 4A shows first the transfer plate 10 with blind holes 100 and pearl-shaped portions 211 of the material 21 in the area of openings of the blind holes 100 , Further, the target plate 30 with wetting surfaces 310 shown. Preferably, for each to be placed pearl-shaped portion 211 of the material 21 a wetting area 310 on the target plate 30 intended.

As in 4B shown, the transfer plate 10 with the pearl-shaped portions 211 near the target plate 30 brought, so the pearl-shaped portions 211 of matter as 21 in contact with the wetting surfaces 310 the target plate 30 to step. Advantageously, the material wets 21 the wetting surfaces 310 so the material 211 on the wetting surfaces 310 liable.

As in 4C shown, remain the beaded portions 211 of the material 21 on the wetting surfaces 310 the target plate 30 stick, even if the transfer plate 10 Will get removed. The wetting surfaces 310 For example, they may be contact surfaces for contacting functional elements of an integrated circuit.

The 5A to 5C schematically show a placement of material on the target plate 30 with the transfer plate 10 in modification to the in 4A to 4C shown embodiment. In this case, the positioning of the transfer plate 10 opposite the target plate 30 an offset on how best off 5B seen. The inventive provision of wetting surfaces 310 However, even in this case advantageously allows safe and reliable placement of the pearl-shaped portions 211 of the material 21 on the target plate 30 because the material 21 the wetting surfaces 310 wetted, and so lied to by these and sticks. The maximum offset, which can be compensated in an advantageous manner by the method according to the invention, amounts to a maximum of half the width of the bead-shaped portions for reliable compensation 211 of the material 21 , Here, the minimum distance between two to be placed bead-shaped portions 211 of the material 21 the diameter of a beaded portion 211 correspond.

The 6A to 6C show the placement of beaded portions 213 a solder material using a transfer substrate 11 with a variety of blind holes 100 and contact surfaces 140 in an area of the openings of the blind holes 100 , According to this embodiment of the present invention are beaded portions 213 a Lotmaterial already expelled and are in an area of the contact surface 140 the transfer substrate 11 arranged as in 6A shown.

In a further step, as in 6B shown, becomes the transfer substrate 11 near the target substrate 31 brought the appropriate contact surfaces 140 having. Advantageously, initially a mechanical contact of the bead-shaped portions 213 the solder material with the contact surfaces 140 of the target substrate 31 initially only in a punctiform or small area. The curvature of the surface of the pearl-shaped portion according to the invention 213 allows this in an advantageous manner and leads to a reliable first contact in a punctiform area or in an area of only a very small contact area. This can be done for both a solid and liquid solder material.

Is the material of the beaded portions 213 fixed, it is now, for example, by heating, liquefied. As in 6C shown, the pearl-shaped portions flow out 213 , wet the contact surface 140 , thus forming a solder joint 214 , The flow takes place starting from a punctiform or minimal initial contact surface, which is a pearl-shaped portion 213 with a contact surface 140 of the target substrate 31 forms. This ensures that the material expands its contact with the contact surface from the initial contact surface to prevent the inclusion of unwanted bubbles. The solder joints 214 connect electrically and mechanically the opposite contact surfaces 140 the transfer substrate 11 and the target substrate 31 , The liquefying of the solder material is usually carried out by heating. Furthermore, the inventive method for contacting a plurality of transfer substrates 11 find its employment by the other side of the transfer substrate 11 also contact surfaces 140 and another transfer substrate having respective contact surfaces 140 and blind holes 100 on the first transfer substrate 11 is placed. Thus, in principle, the electrical contacting and mechanical attachment of an unlimited number of substrates is possible by first stacking them accordingly, and the beaded portions 213 of the solder material, such as by a single heating of the entire substrate stack, at the same time the electrical and mechanical connection between the contact surfaces 140 produce the substrates.

As in 7A to 7C In accordance with a seventh embodiment of the present invention, stripping of a solder material may be shown 212 in the blind holes 100 a transfer substrate 11 only take place when the transfer substrate 11 near the target substrate 31 was positioned. As in 7A and 7B shown, the portions remain 212 a soldering material still in the blind holes 100 of the transfer substrate 11 , The transfer substrate 11 has contact surfaces 140 in an area of the openings of the blind holes 100 on, and the target substrate has corresponding contact surfaces 140 on. Is the transfer substrate 11 in close proximity to the target substrate 31 positioned, the portions become 212 of the solder material from the blind holes 100 expelled so that the solder material is a solder joint 214 between two opposite contact surfaces 140 the transfer substrate 11 and the target substrate 31 forms.

According to an eighth embodiment of the present invention, as in 8A to 8C In a modification of the method shown above, a connection layer can be shown 40 on the target substrate 31 or on the transfer substrate 11 be arranged. In the area of the contact surface 140 has the tie layer 40 openings 400 on. As in 8B shown, the transfer substrate 11 by means of the bonding layer 40 with the target substrate 31 be mechanically connected. This is particularly advantageous if, prior to expelling the material from the blind holes 100 a stacking of several substrates takes place, since the connecting layer 40 two sub strate reliably binds to each other, and another application of another substrate does not change the already stacked stack, or the relative positions of the corresponding contact surfaces 140 maintained in an advantageous manner. In one step, then the expulsion of the material portions 212 from all blind holes 100 done so that opposite contact surfaces 140 by a solder connection 214 be electrically connected.

The 9A and 9B show an arrangement of a blind hole 100 in a transfer substrate 11 and a contact surface 140 according to a ninth embodiment of the present invention. This is the blind hole 100 within a contact area 140 arranged and with a portion 212 filled a solder material. Will the portion 212 out of the blind hole 100 expelled, it forms, as in 9B shown a pearl-shaped portion 213 of the solder material on the contact surface 140 , The arrangement according to this embodiment of the present invention ensures that the solder material reliably expels the contact surface upon expulsion 140 wetted and on this as a pearl-shaped portion 213 , or as a solder joint, is positioned.

According to a tenth embodiment of the present invention, as in 10A and 10B shown is a blind hole 100 in a transfer substrate 11 at the edge of a contact surface 140 arranged. Because the material is the contact surface 140 wetted, formed in this case, a pearl-shaped portion 213 on the contact surface 140 , According to this embodiment of the present invention, advantageously, the formation of the contact surface 140 and the blind holes 100 independently of each other, and the area just below the contact area 140 in the transfer substrate 11 Can be used for supply lines or other functionalized areas, or is characterized by the presence of a blind hole 100 not limited.

According to an eleventh embodiment of the present invention, as in 11A and 11B shown, the blind hole 100 even in an environment of a contact surface 140 in a transfer substrate 11 be arranged. Advantageously, the blind hole 100 according to this embodiment of the present invention closer to a target contact surface 140 as at an adjacent contact surface 141 arranged so that the portion 212 of the solder material when out of the blind hole 100 expelled, the target contact surface 140 , and not the adjacent contact surface 141 wetted, and thus only on the contact surface 140 a pearl-shaped portion 213 forms, as in 11B shown. In this case, a Lotmaterialrest 220 in the blind hole 100 remain. According to this embodiment, not only the area directly below the contact area 140 in the transfer substrate 11 functionalized, but this arrangement is advantageously particularly insensitive to tolerances in the positioning of the blind holes 100 opposite the contact surfaces 140 in the form of an offset, for example, formed during a lithographic structuring of the contact surfaces 140 and / or the blind holes 100 ,

12 shows an apparatus according to a twelfth embodiment of the present invention for carrying out a method according to the invention. The device has a recipient 500 with a pressure adjusting device 502 on. The pressure adjusting device 502 is designed to be in the recipient 500 controls the recipient pressure and adjusts reproducibly. The pressure adjusting device 502 may consist of a vacuum pump and / or a compressor, or even if vacuum and / or compressed air or compressed gases are provided externally, have only corresponding valves and a pressure measuring device.

In the recipient 500 is also a positioning device 501 for positioning a transfer plate 10 arranged. The positioning device 501 can the transfer plate 10 in a material bath 20 with a liquid material 21 dive and face a target plate 30 position. A control unit 503 controls both the pressure adjusting device 502 , as well as the positioning device 501 for carrying out a method according to the present invention. The positioning device 501 and the bathroom 20 may further comprise tempering means to both the transfer plate 10 and / or the material 21 regulated to temper. This can be used for heating in the sense of melting the material 21 done, or in the sense of cooling, to material 21 in blind holes of the transfer plate 10 to solidify. Further, re-heating may cause the material in the blind holes of the transfer plate 10 liquefy and can be compared to a target plate 30 be positioned so that portions of material 21 in the blind holes of the transfer plate 10 on the target plate 30 to be placed. The material 21 in the blind holes of the transfer plate 10 can be driven out of the blind holes by capillary forces or the surface tension of the material. This process can be achieved by setting a corresponding pressure by the pressure adjusting device 502 favored, inhibited or well-defined.

13 shows a flowchart of an inventive method according to a thirteenth embodiment of the present invention in conjunction with possible advantageous variants. Optionally, in a step S1, a transfer plate can be tempered in order to be exposed to as few stresses as possible during a subsequent immersion in a material bath. In a step S2, a pressure equalization between a first pressure p ₁ on the material bath and a second pressure p ₂ in the blind holes of the transfer plate is produced. Thereafter, the transfer plate is immersed in a step S3 in the material bath. If the openings of the blind holes of the transfer plate are within the material bath, then a pressure difference between the first pressure p ₁ on the material bath and the second pressure p ₂ in the Sacklö Chern the transfer plate in a step S4, wherein the first pressure p _{1 is} greater as the second pressure p ₂ so that the blind holes of the transfer plate are at least partially filled with the material. The pressure difference can be effected both by lowering the second pressure p ₂ in the blind holes of the transfer plate and by increasing the first pressure p ₁ to the material bath. Starting from a pressure equilibrium during the step S2 at substantially vacuum, for example, in step S4, the first pressure p ₁ can be increased to atmospheric pressure. However, when the pressure equilibrium at substantially atmospheric pressure produced at step S2, then in step S4, the first pressure p ₁ in relation to the atmospheric pressure can be increased. If the blind holes of the transfer plate are at least partially filled with the material, then the transfer plate is pulled out of the material bath in a step S5.

In a variant VL, represented by a dotted line, the transfer plate is first optionally cooled in a step S6R. This can cause the material in the blind holes to solidify. Thereafter, the transfer plate is positioned opposite the target plate, whereupon, if the optional cooling has taken place, the transfer plate can be heated to liquefy the material in the blind holes of the transfer plate. In a step S6L, the material is then expelled to place the material on the target plate in a step S7 in order to complete the variant VL. Optionally, in step S6L also a pressure difference between the first pressure p ₁ and the second pressure P2 can be established, so that the first pressure p _{1 is} smaller than the second pressure p ₂ and the material is expelled from the blind holes of the transfer plate.

In a variant VR, shown with a dashed line occurs first the expulsion according to the step S6L and then positioning in a step S6R to the variant VR, again with the step S7 of placing the material on the Target plate to complete. In terms of The options within the variant VR will be based on the options of Variant VL referenced.

10

transfer plate

11

transfer substrate

100

blind

101

phase

102

wetting eyelet

110

first volume

111

second volume

140

contact area

141

adjacent contact area

20

Materialbad

21

material

200

first print

201

second print

210

material in a blind hole

211

beaded material

212

solder in a blind hole

213

bead-shaped solder material

214

solder

220

Lotmaterialrest

30

target plate

31

target substrate

310

wetting area

40

link layer

400

opening

500

recipient

501

positioning

502

Pressure control unit

503

control unit

Claims (33)

Method for placing material ( 21 . 210 . 211 . 212 . 213 . 214 ) on a target plate ( 30 . 31 ) by means of a transfer plate ( 10 . 11 ), which have a variety of blind holes ( 100 ), the method comprising the steps of: (A) dipping the transfer plate ( 10 . 11 ) in a material bath ( 20 ), in which the material ( 21 ) is in a liquid state, wherein the material bath ( 20 ) a first print ( 200 ) and in the blind holes ( 100 ) a second pressure ( 201 ), and wherein during the immersion the first pressure ( 200 ) substantially equal to the second pressure ( 201 ); (B) after immersion establishing a pressure difference between the first pressure ( 200 ) on the material bath ( 20 . 21 ) and the second pressure ( 201 ) in the blind holes ( 100 ), where the first pressure ( 200 ) is greater than the second pressure ( 201 ), so that the blind holes ( 100 ) of the transfer plate ( 10 . 11 ) at least partially with the liquid material ( 210 . 212 ) are filled; (C) pulling out the transfer plate ( 10 . 11 ) from the material bath ( 20 . 21 ); and (D) positioning the transfer plate ( 11 ) opposite the target plate ( 30 . 31 ), the material ( 21 . 210 . 211 . 212 . 213 . 214 ) from the blind holes ( 100 ) in order to be in contact with the target plate ( 30 . 31 ) and on the target plate ( 30 . 31 ) to be placed. The method of claim 1, wherein in step (D) - expelling the material ( 210 . 212 ) from the blind holes ( 100 ) of the transfer plate ( 10 . 11 ), with pearl-shaped portions ( 211 . 213 ) of the material ( 21 ) in a region of the openings of the blind holes ( 100 ), and - positioning the transfer plate ( 10 . 11 ) opposite the target plate ( 30 . 31 ), the pearl-shaped portions ( 211 . 213 ) of the material ( 21 ) in contact with the target plate ( 30 . 31 ), so that the material 21 . 210 . 211 . 212 . 213 . 214 ) on the target plate ( 30 . 31 ) is placed. Method according to claim 1, wherein in step (D) - positioning of the transfer plate ( 10 . 11 ) opposite the target plate ( 30 . 31 ), and - expelling the material ( 210 . 212 ) from the blind holes ( 100 ) of the transfer plate ( 10 . 11 ), the material ( 21 . 210 . 211 . 212 . 213 . 214 ) in contact with the target plate ( 30 . 31 ) is brought. Method according to one of claims 1 to 3, wherein prior to immersion, the first pressure ( 200 ) and the second pressure ( 201 ) substantially equal to a vacuum and preferably less than 5 mbar. Method according to claim 4, wherein the pressure difference is increased by increasing the first pressure ( 200 ) is produced at atmospheric pressure, substantially to 1 bar. Method according to one of claims 1 to 3, wherein prior to immersion, the first pressure ( 200 ) and the second pressure ( 201 ) substantially correspond to the atmospheric pressure and preferably be substantially 1 bar. Method according to claim 6, wherein the pressure difference is achieved by lowering the second pressure ( 201 ) is generated to a vacuum, preferably to less than 5 mbar. Method according to one of claims 1 to 7, wherein the pressure difference is controlled, so that the amount of material ( 210 . 212 ) in the blind holes ( 100 ). Method according to one of claims 1 to 8, wherein the transfer plate ( 10 . 11 ) is heated prior to immersion, preferably to a temperature in a range between 150 ° C and 300 ° C. Method according to one of claims 1 to 9, wherein after pulling out of the transfer plate ( 10 . 11 ) the liquid material ( 210 . 212 ) in the blind holes ( 100 ) is solidified. Process according to claim 10, wherein the solidification of the liquid material ( 210 . 212 ) by cooling, preferably to a temperature in a range between 10 ° C and 50 ° C. A method according to claim 10 or 11, wherein prior to expelling the material ( 210 . 212 ) the material ( 210 . 212 ) is re-liquefied by heating, preferably by heating to a temperature in a range between 150 ° C and 300 ° C. Method according to one of claims 1 to 12, wherein for expelling the material ( 210 . 212 ) from the blind holes ( 100 ) of the transfer plate ( 10 . 11 ) another pressure difference between the second pressure ( 201 ) in the blind holes ( 100 ) and a third pressure outside the blind holes ( 100 ) will be produced. Method according to claim 13, wherein the further pressure difference is regulated so that the volume of expelled material ( 211 . 213 . 214 ) in the region of the openings of the blind holes ( 100 ). Method according to one of claims 1 to 14, wherein a conductive Material, preferably a solder material is placed. Method according to claim 15, wherein the transfer plate ( 11 ) and the target plate ( 31 ) Substrates with electrical contact surfaces ( 140 ), the blind holes ( 100 ) of the transfer plate ( 11 ) in the area of the electrical contact surfaces ( 140 ) are arranged on the surface, wherein the positioning of the transfer plate ( 11 ) opposite the target plate ( 31 ), so that the contact surfaces ( 140 ) of the transfer plate ( 11 ) and the contact surfaces ( 140 ) of the target plate ( 31 ) and wherein the expulsion of the solder material ( 212 ) from the blind holes ( 100 ) so that over the solder material ( 212 ) a connection ( 214 ) between two opposing contact surfaces ( 140 ) will be produced. Integrated circuit with at least one substrate ( 11 ) and another substrate ( 31 ), the substrate ( 11 ) a plurality of blind holes ( 100 ) and contact surfaces ( 140 ) in a region of the openings of the blind holes ( 100 ) on a surface of the substrate ( 11 ) and the further substrate ( 31 ) Contact surfaces ( 140 ), wherein the contact surfaces ( 140 ) of the substrate ( 11 ) with the blind holes ( 100 ) with the opposite contact surfaces ( 140 ) of the further substrate ( 31 ) using blind holes ( 100 ) expelled brazing material ( 214 ) are electrically connected. Integrated circuit according to claim 17, wherein the diameter of the blind holes ( 100 ) is less than 10 microns, the minimum distance of the blind holes ( 100 ) is less than 50 microns and the ratio of the depth of the blind holes ( 100 ) to the diameter of the blind holes ( 100 ) is greater than 3. Integrated circuit according to claim 17 or 18, wherein the surface of the substrate ( 11 ) at the openings of the blind holes ( 100 ) Bevels ( 101 ) having. Integrated circuit according to one of Claims 17 to 19, in which the surface of the substrate ( 11 ) wetting eyelets ( 102 ) around the openings of the blind holes ( 100 ), wherein solder material is the wetting eyelets ( 102 ) wets. An integrated circuit according to any one of claims 17 to 20, wherein the opening of a blind hole ( 100 ) within a contact area ( 140 ) is arranged. An integrated circuit according to any one of claims 17 to 21, wherein the opening of a blind hole ( 100 ) adjacent to a contact surface ( 140 ) is arranged. An integrated circuit according to any one of claims 17 to 22, wherein the opening of a blind hole ( 100 ) in an environment of a contact surface ( 140 ), wherein the environment is not wider than the minimum distance between two adjacent contact surfaces ( 140 ) on the substrate ( 11 . 31 ). An integrated circuit according to any one of claims 17 to 23, wherein between the at least one substrate ( 11 ) with the blind holes ( 100 ) and the further substrate ( 31 ) a connection layer ( 40 ), wherein the connection layer ( 40 ) the at least one substrate ( 11 ) mechanically to the further substrate ( 31 ), and wherein the link layer ( 40 ) in areas of the contact surfaces ( 140 ) Openings ( 400 ) having. Apparatus for carrying out a method according to one of claims 1 to 16, with a recipient ( 500 ), a control unit ( 503 ) and a pressure point unit ( 502 ), wherein in the recipient th ( 500 ) a material bath ( 20 ) with liquid material ( 21 ) and a positioning unit ( 501 ), on which a transfer plate ( 10 . 11 ) with a plurality of blind holes ( 100 ) is provided, and wherein the control unit ( 503 ): - the pressure-adjusting unit ( 502 ) in a first step in such a way that in the recipient ( 500 ) a first recipient pressure prevails, - the positioning unit ( 501 ) in a second step to control the transfer plate ( 10 . 11 ) with the multiplicity of blind holes ( 100 ) in the material bath ( 20 . 21 ), - the pressure unit ( 502 ) after immersing the transfer plate ( 10 . 11 ) in a third step such that in the recipient ( 500 ) a second recipient pressure prevails, - the positioning unit ( 501 ) in a fourth step to control the transfer plate ( 10 . 11 ) with the multiplicity of blind holes ( 100 ) from the material bath ( 20 . 21 ) and - the positioning unit ( 501 ) in a fifth step to control the transfer plate ( 10 . 11 ) with the multiplicity of blind holes ( 100 ) against a target plate ( 30 . 31 ), wherein the material 21 . 210 . 211 . 212 . 213 . 214 ) from the blind holes ( 100 ) in order to be in contact with the target plate ( 30 . 31 ) and on the target plate ( 30 . 31 ) to be placed. Apparatus according to claim 25, wherein a further positioning unit and a further control unit are provided, and the further control unit is designed to control the further positioning unit in such a way that it supports the transfer plate (10). 10 . 11 ) with the multiplicity of blind holes ( 100 ) against a target plate ( 30 . 31 ). Apparatus according to claim 25 or 26, wherein the control unit ( 503 ) is designed the pressure point unit ( 502 ) after pulling out the transfer plate ( 10 . 11 ) from the material bath ( 20 . 21 ) in a further step such that in the recipient ( 500 ) a third recipient pressure prevails. Device according to one of claims 25 to 27, wherein the pressure-adjusting unit ( 502 ) is configured to set the first recipient pressure and the second recipient pressure, so that the pressure difference between the first recipient tendruck and the second recipient pressure is substantially equal to 1 bar. Device according to one of claims 25 to 28, wherein the pressure-adjusting unit ( 502 ) is designed to set the first recipient pressure below 5 mbar, and set the second recipient pressure at 1 bar. Device according to one of claims 25 to 29, wherein the pressure-adjusting unit ( 502 ) designed to set the first recipient pressure at 1 bar, and set the second recipient pressure at 2 bar. Device according to one of claims 25 to 30, wherein the positioning unit ( 501 ) has a tempering unit, which the transfer plate ( 10 . 11 ) controlled temperature, preferably in a range of 10 ° C to 300 ° C. Device according to one of claims 25 to 31, wherein the material bath ( 20 ) has a further tempering unit, the material ( 21 ) controlled temperature, preferably in a range of 10 ° C to 300 ° C. Device according to claim 32, wherein the further positioning unit has a tempering unit which holds the transfer plate ( 10 . 11 ) controlled temperature, preferably in a range of 10 ° C to 300 ° C.