DE102006014437B4 - Method and device for the production of RFID smart labels or smart label inlays - Google Patents

Abstract

Method for producing RFID smart labels or smart label inlays, in which a plurality of RFID straps (11) are connected successively to a multiplicity of antennas (20), characterized in that, in a first step, the straps on a strapping Substrate strip (5a) arranged RFID straps (11) isolated (8, 9) and on a substrate strip (1, 1a, 1b, 1c, 10, 10a-c) for the manufactured smart labels or smart label inlays are mounted , and in a subsequent second step, the antennas (20) are mounted on the substrate strip (1, 1a, 1b, 1c; 10, 10a-c) and on first pads (26) of the RFID straps (11) such that the Pads (26) of each RFID strap (11) electrically contact second pads of the RFID strap (11) associated antennas (20) or the first pads (26) are positioned and fixed to the second pads for electrical contact.

Description

The The invention relates to a method and an apparatus for the production from RFID smart labels or Smart label inlays, where a variety of RFID straps with a Variety of antennas are connected sequentially, according to the preambles of the claims 1 and 16.

For the production of smart labels or RFID transponders, the RFID chips are often mounted directly on an antenna arranged on a web or band. Alternatively, the RFID chips are mounted as chip modules, interposers or flip-chip bridges, preassembled as so-called straps, as an entire unit on the antennas, which in turn are already arranged on Webs. This is for example in US 2004/0194876 A1 which describes a method for connecting chip modules to antennas arranged on webs, in which a carrier tape equipped with the antennas and a carrier tape equipped with the chip modules are brought one above the other. Subsequently, detachment of the chip modules from their carrier tape takes place by moving the chip module carrier tape around a sharp edge. The detached chip module, like the subsequent chip modules, is mounted on the antenna carrier tape at positions corresponding to the positions of the antennas on the further carrier tape.

By the assembly of the straps each to their assigned on the Antenna carrier tape arranged antenna creates a so-called RFID inlay, even smart label inlay or RFID transponder inlay called. This RFID inlay usually becomes with conversion machines to self-adhesive smart labels, RFID tickets etc. further processed.

Of the equipped with the RFID chip Strap is made of different substrate materials. For this will be Metal-based, polymer-based or paper-based substrate materials are used. The actual connection surfaces The RFID straps consist for example of silver conductive paste, electrically conductive ink, Copper, aluminum, etc., which are based on strip-like polymer material or paper material and an electrically conductive material represent.

to Production of an electrically conductive connection between the Antennas and the straps applied to the antenna carrier tape can different Types of connection, such as by means of a thermosensitive Conductive adhesive, a soldering process, laser welding or thermocompression can be used. Alternatively, as a mechanical Connection method using a crimping or clinching process.

Become frequent RFID straps made in such a way that on a strap substrate band made of metal or polymer material initially applied electrically conductive enlarged pads on which subsequently the RFID chips are arranged. The RFID chips are here by means of the flip-chip method placed on the connection surfaces and electrically connected to them. The resulting Straps or chip modules with a total of two enlarged pads serve to make it easier to find the contact surfaces of the Antennas arranged on the antenna band during and after the transmission process the straps.

In front the transmission The RFID straps on the antenna band are usually the RFID straps arranged in rows on a strap substrate band, which in Roll form is arranged and by rolling the substrate strip over the Antenna band is brought. Previously, there is a separation of the RFID straps for individual installation of the straps on the antennas and the antenna band by means of a punching or cutting process out of the substrate tape out. This has a time delay the entire assembly process result, since such a singulation step compared to the remaining process steps within one Such device more time-consuming, not least because of consequent short-term stopping of the strap substrate band while a punching process is.

moreover results from the placement of such isolated RFID straps on the antenna band, in particular with respect to the one above the other to be arranged connection surfaces the antenna and the RFID strap the problem of the exact storage of the straps on the antenna band in a continuously moving Antenna band, which due to the desired high throughput of the entire Device is desired.

DE 103 58 422 B3 shows a method for the production of module bridges for smart labels for positioning of chip modules on carriers and for the bridging, conductive connection of connection elements of the chip modules with connection elements of arranged on or in the carriers antenna elements with the steps of forming successively arranged wells, the positioning of in each case a chip module in each recess and the application of band-like contact layers on the connection elements of the chip module.

US 2004/0125040 A1 shows an RFID device and a method for forming a RFID inlays.

US 2003/0136503 relates to an RFID label technique in which different layers are brought together by means of rollers.

US 2004/0154161 A1 also shows by means of roller or roller technology transferable chips, which are then deposited on a support.

all the above-mentioned documents are not indicated that they have a manufacturing process and production devices disclose where the RFID straps chip modules or module bridges on the antenna-carrying substrate tape are mounted.

As a result, The present invention is based on the object, a method and an apparatus for producing RFID smart labels or RFID smart label inlays to disposal to put at the / a higher Throughput of the entire manufacturing plant can be achieved.

These Task is procedurally by the features of claim 1 and device side by the features of claim 16 solved.

One essential point of the invention is that in a method for the production of RFID smart labels or smart label inlays, in which a plurality of RFID straps and a plurality of antennas sequentially in a first step, first on a strap substrate band arranged RFID straps isolated and on a substrate tape for the produced Smart labels or smart label inlays are mounted and then in a subsequent second step, the antennas on the substrate tape and on first pads the RFID straps are mounted such that the first pads of a each RFID strap second pads of the RFID straps associated Contact the antennas electrically. So it will not be the straps an antenna band and the antennas disposed thereon but the antennas a substrate tape on which the straps previously arranged be assigned. This has the consequence that the antennas with their pads be mounted on the RFID straps with their connection surfaces, from which advantageous temporal decoupling of the two processes antenna web feed and Strapping days yields. Because with an automatic production of a huge Number of RFID smart labels or RFID transponders the maximum possible Throughput of a manufacturing device previously limited by the fact that the RFID straps first while of the inline process had to be separated, which is usually a discontinuous operation of the entire device he gave. The is called, even if the antennas so far on the antenna band so tight were placed, the running speed of the previously used Antenna band determined by the singulation process at the straps. In contrast, is now the strap assembly according to the first step the method according to the invention independent of time from the antenna web feed according to the second one Step of the method according to the invention carried out, so no interdependence and thus no time-limiting factor due to a singulation step is available.

Advantageous can the antennas now inline in an upstream process step made by, for example, a main substrate tape supplied Antenna band are applied, and temporally parallel to this Straps are separated and applied to the main substrate band. As a result, the production times per smart label or smart label inlay can be reduced and thus the entire Manufacturing device a higher Throughput.

The Antennas, which before their supply on The main substrate tape is already manufactured, either inline, so continuously with the speed of their feed to the main substrate tape or are as finished antenna products with any feeding speed be fed to the substrate strip.

The pre-assembled on the main substrate belt prior to feeding the antennas Straps are facing ordinary RFID chips increased connection areas, around with the pads of the To be applied antenna in electrical contact during the Storage of the antennas to arrive. Subsequently, an electric finds conductive Connection between the connecting surfaces of the straps on the one hand and the antennas, on the other hand. With such a parallelization from an inline production of the antennas and the strap pre-assembly on the Substrate tape it is possible that both the supplied Antenna band and the substrate strip continuously moved be to the highest possible Throughput of the manufacturing device to obtain. Alternatively it is a discontinuous operation conceivable.

The RFID straps are mounted on the substrate belt at a predeterminable distance from each other, which is synchronized with an intended distance of the antennas to be applied later. This may be due to the running speed of the strap substrate band and / or the main substrate be influenced by bandes.

The Synchronization of the distances is determined by comparing optical pick-up data of the RFID strap positions on the substrate tape and data of the intended positions the antennas are preferably carried out on the substrate strip.

The Substrate strip becomes a subcarrier substrate tape after the assembly of the RFID straps and the antennas of the deducted thereby produced smart labels or smart label inlays. Alternatively you can the smart labels or smart label inlays are punched free and by the Substrate tape as self-adhesive smart labels or smart label inlays subtracted from.

On An overhead side of the RFID strap will fit before mounting Straps applied an adhesive layer, which then attach to the attachment mounting antennas is used. For this, the adhesive layer after or heated before Strapmontage become.

According to one preferred embodiment the RFID straps on its underlying side an adhesive layer for fixing the RFID straps on the substrate tape, wherein applied this adhesive layer before mounting on the substrate tape becomes. This can alternatively or additionally by means of a previously on the substrate tape, places applied adhesive layer Attachment of the straps also carried out or supported.

The Substrate strip can over his entire surface be self-adhesive, so that the antennas under Pressurization without heat can be laminated on this self-adhesive substrate tape.

A Device for producing the RFID smart labels or smart label inlays by sequentially connecting a plurality of the RFID straps with a plurality of antennas has - in the direction of the substrate strip seen - first a device for applying the isolated RFID straps and subsequently a device for feeding and applying the antennas to the substrate tape.

Further advantageous embodiments emerge from the dependent claims.

advantages and expediencies are the following description in conjunction with the drawings refer to. Hereby show:

1 in a schematic representation of a manufacturing apparatus for performing the method according to the invention according to a basic basic structure;

2 in a schematic side view of the structure of a possible RFID strap for use in the inventive method;

3 in a schematic side view of the structure of an apparatus for performing the method according to the invention according to a first embodiment;

4 in a schematic side view, another structure of an RFID strap for its use in a device such as 6 shown;

5 in a schematic side view of a structure of another device for carrying out the method according to the invention according to a second embodiment, and

6 in a schematic side view of the construction of a further apparatus for performing the method according to the invention according to a third embodiment.

In 1 is a schematic side view of a device that reflects the basic principle of the method according to the invention represented. A main substrate tape 1 gets from a roll 2 unwound and on a roll 3 wound. The substrate tape is over a roll 4 diverted.

The device has a device for separating and applying an RFID strap. This device 5 includes a strap substrate band 5a , which over the pulleys 6 and 7 is deflected and by means of a singulator 8th from the tape 5a singulated out and onto a roll for transfer to the substrate tape 1 is applied.

The under reference 10 enlarged illustrated substrate strip 1 indicates as a function of the rotational speed of the roller 9 and the running speed of the substrate tape 1 as well as the distances of the isolated RFID straps on the roll 9 a multitude of consecutive RFID straps 11 with predeterminable intervals.

By means of an optical sensor 12 The distances of the RFID straps on the roll 9 measured and for synchronization with the distances of the antennas to be subsequently applied, with the traveling speed of an antenna web and the distances of antennas previously arranged thereon compared.

From an unwinding roll 13 becomes, as by the reference 14 represented, an antenna band 15 unwound and over a pulley 16 and more roles 17 . 18 the substrate tape 1 supplied, wherein the antennas have either been applied to the antenna band in a previous time-independent manufacturing step or inline depending on the running speed of the antenna band 15 getting produced.

The antennas are now in a pre-assembly of the RFID straps on the substrate tape 1 takes place second step on pads of the RFID straps mounted such that pads of the antennas 20 as shown in enlarged scale, in electrically conductive contact with pads of the RFID straps 11 reach.

Now find in a device section 21 for the production of the electrically conductive connection between the connecting surfaces of the straps and the antennas a permanent contact, for example by means of a hot melt adhesive under pressure by means of bands 22 . 23 and roles 24 instead of.

In 2 is shown in a schematic cross-sectional representation or side view of the possible structure of an RFID strap for use in the inventive method. This RFID strap is suitable for use in an apparatus for realizing the method according to the invention according to a first embodiment of the invention, as shown in FIG 3 is shown to be used.

The RFID strap 11 according to 2 has an electrically insulating substrate band 25 on which two pads 26 are arranged. These electrically conductive connection surfaces are covered with the RFID chip whose connection surfaces 27 in electrical contact with the connection surfaces 26 stand.

A conductive adhesive tape 28 with insulating protective tape arranged thereon 29 is arranged on the upper side of the RFID strap.

In 3 a device for carrying out the method according to the invention according to a first embodiment of the invention is shown in a schematic side view. Identical and equivalent components are provided with the same reference numerals.

The substrate strip is an auxiliary carrier strip 1a , which may be silicone coated, used. The subcarrier strip, which by the reference numeral 10a shown enlarged, has a width 30 which depends on the process requirements for easy processing or the requirements of further processing.

The subcarrier tape will go along the arrow 31 preferably continuously traveling and has the RFID straps with an intermediate distance 11a after passing through the strap assembly and feeding device 5 on.

In a facility 32 for applying adhesive for a strap fixation, the adhesive is applied to the auxiliary carrier tape 1a For example, by means of a dispensing method or a jet process at least in places applied to the intended adhesive positions for the strap.

Before placing the single strap on the subcarrier tape 1a becomes the guard band 29 at the top of the strap 11 peeled off and the underlying layered adhesive applied 28 activated by means of a radiant heater.

The weaning positions of the straps 11 on the subcarrier band 10a correspond to the distances of the attachment positions of the later to be mounted antennas 20 , Thus, the pitch of the straps is identical to the pitch of the antenna port positions. A related synchronization of the distances takes place by means of the optical sensor 12 , such as a camera instead.

After the antenna is placed in the second step on the pre-assembled strap and mounted electrically conductive and mechanically fixing by means of a device, the subcarrier band 1a either withdrawn, as it is after deflecting around a pulley 4a is performed, or punched out by means of a not shown here punching process (die-cutting).

The strap feed 33 again finds with a substrate tape or web, as denoted by the reference numeral 34 is shown instead.

The antenna band 15 is an enlarged view with the reference numeral 35 played. On this antenna band, the left and right sides of the antennas are double row 20 as a dipole antenna to be formed, for example, for contacting with left and right-hand pads of the RFID straps 11 arranged. The antennas are at a distance 36 on.

In 4 is in a side or cross-sectional view another possible up Construction of an RFID strap for its use in a method according to the invention in accordance with a second embodiment of the invention, as described in US Pat 5 is shown. This structure of the RFID strap does not have an adhesive layer arranged on the top side, but an adhesive layer arranged on the underside 37 that is not conductive on. Additionally is a peelable electrically insulating protective tape 38 arranged.

In 5 is shown in a schematic side view of the structure of the apparatus for performing the method according to the invention according to a second embodiment of the invention. Again, the same and equivalent components are given the same reference numerals.

The RFID straps, as in 4 shown schematically, with their underside on a subcarrier band 1b , which may be silicone coated, glued. For this purpose, the adhesive is previously applied to the substrate or the substrate strip 25 the RFID straps applied on the underside. Before putting the straps on the auxiliary carrier tape 1b becomes the guard band 38 removed from the straps and the adhesive activated by means of radiant heater briefly.

The settling positions of the straps on the subcarrier band 1b correspond to the synchronizing distances of the Aufsetzpositionen the later to be mounted antennas, as in the enlarged view of the substrate 10b is reproduced.

In turn finds a synchronization of the distances by means of optical sensors instead of.

Now takes place in an intermediate step before putting on the antennas 20 applying a conductive adhesive on pads of the RFID straps 11 by means of a device 39 instead of. Subsequently, in a further step, the application of the antennas 20 carried out.

In 6 a device for carrying out the method according to the invention according to a third embodiment of the invention is shown in a schematic side view. It is a liner instead of an auxiliary carrier tape 1c . 10c used, which has a self-adhesive surface (for example, after peeling off a protective tape), wherein this adhesive layer can be transferred to another adhered layer. The liner has at least the width 30 the later supplied antenna band. The liner may also be self-adhesive, so that the removal of a protective tape is unnecessary.

The RFID straps 11 are glued with their underside on the liner, whereby before putting on the straps not only the protective tape of the liner but also the protective tape on top of the RFID straps, as shown in 2 are shown, is deducted. Now finds a warming by means of a radiant heater of the adhesive layer 28 instead of.

Again, there is a synchronization of the distances of the straps 11 and the antennas 20 for example, by means of an optical sensor.

The antennas are now in the second step of the method according to the invention after an optional conductive adhesive application 42 in a cold lamination process with the strap and the liner from above by pressurization by means of a roll laminator 17 . 18 connected.

Subsequently, in the connection process, an electrically conductive connection takes place between the antenna and strap connection surfaces (cf. 22 . 23 and 24 ). Here, the material composite of liner, strap and antenna web is compressed with temperature and pressure for a predetermined time.

In a subsequent rotary die cutting process (die-cutting) according to the device 40 The smart labels (antennas and strap) are individually punched and the remaining material as a grid 41 withdrawn and rolled up. The resulting self-adhesive RFID antennas become the rewinder 3 fed.

The RFID straps can either be the top side of the adhesive layer, as in 2 shown, or a subsequent conductive adhesive layer application, as indicated by the reference numeral 42 presented, experienced.

1, 10

substrate web

1a, 1b

Subcarrier band

1c

liner

2

unwinding

3

up roll

4, 4a

idler pulley

5

Facility for feeding and applying RFID straps

5a

Strap-substrate web

6 7

idler pulley

8th

Strap-separation

9

role

10a, 10b

Subcarrier band

10c

liner

11

RFID straps

11a

spacing

12

optical sensor

13

unwinding

14

antenna production or direct antenna feed

15

antenna band

16

idler pulley

17 18

Deflection and pressure rollers

19

Assembly the antennas on the RFID straps

20

antennas

21

station for producing the electrically conductive connection

22 23, 24

Facility for producing an electrically conductive connection

25

substrate strip

26

pads

27

connections

28

conductive adhesive tape

29

insulating protective tape

30

width the subcarrier band

31

movement direction the subcarrier band

32

adhesive application

33

Strap-feed

34

Strap substrate band

35

antenna band

36

antenna spacing

37

adhesive layer

38

electrical insulating protective tape

39

Leitkleberauftrag

40

blanking apparatus

41

Pull off of punched out residual material

42

Leitkleberauftrag

Claims (16)

Method for producing RFID smart labels or smart label inlays, in which a multiplicity of RFID straps ( 11 ) with a plurality of antennas ( 20 ) are connected successively, characterized in that in a first step, the on a strap substrate band ( 5a ) arranged RFID straps ( 11 ) isolated ( 8th . 9 ) and on a substrate tape ( 1 . 1a . 1b . 1c ; 10 . 10a -C) for the smart labels or smart label inlays to be produced, and in a subsequent second step the antennas ( 20 ) on the substrate tape ( 1 . 1a . 1b . 1c ; 10 . 10a -C) and on first pads ( 26 ) of the RFID straps ( 11 ) are mounted such that the connection surfaces ( 26 ) of each RFID strap ( 11 ) second pads of the RFID strap ( 11 ) associated antennas ( 20 ) or the first pads ( 26 ) are positioned and fixed on the second pads for electrical contacting. Method according to Claim 1, characterized in that the antennas ( 20 ) at the same time as the singulation and assembly of the RFID straps ( 11 ) on the substrate tape ( 1 . 1a . 1b . 1c ; 10 . 10a -C) by placing it on an antenna band ( 15 ), which subsequently the substrate tape ( 1 . 1a . 1b . 1c ; 10 . 10a C) are supplied. Method according to Claim 1, characterized in that the antennas ( 20 ) prior to singulation and assembly of the RFID straps ( 11 ) on the substrate tape ( 1 . 1a . 1b . 1c ; 10 . 10a -C) by placing it on an antenna band ( 15 ) and the antenna band ( 15 ) then the substrate tape ( 1 . 1a . 1b . 1c ; 10 . 10a C) is supplied. Method according to one of the preceding claims, characterized in that the RFID straps ( 11 ) on the substrate tape ( 10 . 10a -C) with a predeterminable distance ( 11a ) are mounted to each other. Method according to claim 4, characterized in that the predeterminable distance ( 11a ) with an intended distance of the antennas to be applied later ( 20 ) is synchronized. Method according to claim 5, characterized in that the synchronization of the distances ( 11a ) by comparing optical pick-up data of the RFID strap positions on the substrate tape ( 10 . 10a -C) and data of the intended positions of the antennas ( 20 ) on the substrate tape ( 10 . 10a -C). Method according to one of the preceding claims, characterized in that the substrate strip as subcarrier substrate strip ( 1a . 1b . 10a . 10b ) after assembly of the RFID straps ( 11 ) of the antennas ( 20 ) is subtracted from the Smart Labels or Smart Label inlays produced thereby. Method according to one of the preceding claims 1-6, characterized in that the manufactured smart labels or smart label inlays are punched out and from the substrate strip ( 1c . 10c ) can be removed by self-adhesive. Method according to one of the preceding claims, characterized in that on an upper side of the RFID straps ( 11 ) before its assembly an adhesive layer ( 28 ), which are used for fastening the subsequently to be mounted antennas ( 20 ) serves. Method according to one of the preceding claims, characterized in that on a lower side of the RFID straps ( 11 ) before its assembly an adhesive layer ( 37 ) for fixing the RFID straps on the substrate band ( 1b . 10b ) is applied. Method according to one of claims 1-9, characterized in that on the substrate strip ( 1a . 10a ) before mounting the RFID straps ( 11 ) at least in places an adhesive layer for fixing the RFID straps ( 11 ) is applied ( 32 ). Method according to one of claims 1-9, characterized in that the substrate strip ( 1c . 10c ) is self-adhesive. Method according to claim 12, characterized in that the antennas ( 20 ) under pressurization without heat to the self-adhesive substrate tape ( 1c . 10c ) are laminated ( 17 . 18 ). Method according to one of the preceding claims, characterized in that the substrate strip ( 1 . 1a . 1b . 1c ; 10 . 10a -C) and / or the strap substrate band ( 5a ) and / or the antenna band ( 15 ) is / are continuously moved. Method according to one of claims 1-13, characterized in that the substrate strip ( 1 . 1a . 1b . 1c ; 10 . 10a -C) and / or the strap substrate band ( 5a ) and / or the antenna band ( 15 ) discontinuously, preferably cyclically, is / are moved. Device for producing RFID smart labels or smart label inlays by successively connecting a plurality of RFID straps ( 11 ) with a plurality of antennas ( 20 ), characterized in that in the running direction of a substrate strip ( 1 . 1a . 1b . 1c ; 10 . 10a -C) first saw a facility ( 5 . 5a . 6 . 7 . 8th . 9 ) for applying the isolated RFID straps ( 11 ) and then a facility ( 13 . 14 . 15 . 16 . 17 . 18 ) for feeding and applying the antennas ( 20 ) on the substrate tape ( 1 . 1a . 1b . 1c ; 10 . 10a C) are arranged.