DE102005040900A8 - Gestapeltes piezoelektrisches Element, dessen Herstellungsverfahren und elektrisch leitendes Haftmittel - Google Patents
Gestapeltes piezoelektrisches Element, dessen Herstellungsverfahren und elektrisch leitendes Haftmittel Download PDFInfo
- Publication number
- DE102005040900A8 DE102005040900A8 DE200510040900 DE102005040900A DE102005040900A8 DE 102005040900 A8 DE102005040900 A8 DE 102005040900A8 DE 200510040900 DE200510040900 DE 200510040900 DE 102005040900 A DE102005040900 A DE 102005040900A DE 102005040900 A8 DE102005040900 A8 DE 102005040900A8
- Authority
- DE
- Germany
- Prior art keywords
- manufacturing
- electrically conductive
- piezoelectric element
- conductive adhesive
- stacked piezoelectric
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000853 adhesive Substances 0.000 title 1
- 230000001070 adhesive effect Effects 0.000 title 1
- 238000004519 manufacturing process Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
- H10N30/872—Interconnections, e.g. connection electrodes of multilayer piezoelectric or electrostrictive devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/06—Forming electrodes or interconnections, e.g. leads or terminals
- H10N30/063—Forming interconnections, e.g. connection electrodes of multilayered piezoelectric or electrostrictive parts
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/50—Piezoelectric or electrostrictive devices having a stacked or multilayer structure
- H10N30/503—Piezoelectric or electrostrictive devices having a stacked or multilayer structure having a non-rectangular cross-section in a plane orthogonal to the stacking direction, e.g. polygonal or circular in top view
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
- H10N30/877—Conductive materials
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Fuel-Injection Apparatus (AREA)
- General Electrical Machinery Utilizing Piezoelectricity, Electrostriction Or Magnetostriction (AREA)
- Conductive Materials (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004-250926 | 2004-08-30 | ||
| JP2004250926A JP4706209B2 (ja) | 2004-08-30 | 2004-08-30 | 積層型圧電体素子及びその製造方法並びに導電性接着剤 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| DE102005040900A1 DE102005040900A1 (de) | 2006-03-30 |
| DE102005040900A8 true DE102005040900A8 (de) | 2006-10-05 |
| DE102005040900B4 DE102005040900B4 (de) | 2015-03-12 |
Family
ID=35942096
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE200510040900 Expired - Fee Related DE102005040900B4 (de) | 2004-08-30 | 2005-08-29 | Gestapeltes piezoelektrisches Element, dessen Herstellungsverfahren und elektrisch leitendes Haftmittel |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US7205706B2 (de) |
| JP (1) | JP4706209B2 (de) |
| DE (1) | DE102005040900B4 (de) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4466321B2 (ja) * | 2004-10-28 | 2010-05-26 | Tdk株式会社 | 積層型圧電素子 |
| JP2009527118A (ja) * | 2006-02-14 | 2009-07-23 | デルファイ・テクノロジーズ・インコーポレーテッド | 圧電装置のバリヤ被覆 |
| US7456548B2 (en) * | 2006-05-09 | 2008-11-25 | Canon Kabushiki Kaisha | Piezoelectric element, piezoelectric actuator, and ink jet recording head |
| WO2008017655A1 (en) * | 2006-08-09 | 2008-02-14 | Continental Automotive Gmbh | Piezoceramic multilayer actuator with high reliability |
| DE102006062076A1 (de) * | 2006-12-29 | 2008-07-10 | Siemens Ag | Piezokeramischer Vielschichtaktor und Verfahren zu seiner Herstellung |
| ATE528802T1 (de) * | 2007-02-19 | 2011-10-15 | Siemens Ag | Piezokeramischer vielschichtaktor und herstellungsverfahren dafür |
| EP1978567B1 (de) * | 2007-02-19 | 2014-06-25 | Continental Automotive GmbH | Piezokeramischer Mehrschichtaktor und Verfahren zur Herstellung eines piezokeramischen Mehrschichtaktors |
| EP1978569B1 (de) * | 2007-02-19 | 2011-11-30 | Siemens Aktiengesellschaft | Piezokeramischer Mehrschichtaktor und Verfahren zur Herstellung eines piezokeramischen Mehrschichtaktors |
| DE102007015457B4 (de) * | 2007-03-30 | 2009-07-09 | Siemens Ag | Piezoelektrisches Bauteil mit Sicherheitsschicht, Verfahren zu dessen Herstellung und Verwendung |
| DE102007060167A1 (de) * | 2007-12-13 | 2009-06-25 | Robert Bosch Gmbh | Piezoaktor mit einem Multilagenaufbau von Piezoelementen und ein Verfahren zu dessen Herstellung |
| JP5656352B2 (ja) * | 2008-10-14 | 2015-01-21 | 太陽誘電株式会社 | 積層圧電アクチュエータ |
| DE102010047302B3 (de) * | 2010-10-01 | 2012-03-29 | Epcos Ag | Piezoelektrisches Vielschichtbauelement und Verfahren zu dessen Herstellung |
| WO2012115230A1 (ja) * | 2011-02-24 | 2012-08-30 | 京セラ株式会社 | 積層型圧電素子およびこれを備えた噴射装置ならびに燃料噴射システム |
| DE102012109250B4 (de) * | 2012-09-28 | 2020-07-16 | Tdk Electronics Ag | Elektrisches Bauelement und Verfahren zur Herstellung einer Kontaktierung eines Elektrischen Bauelements |
| WO2014069452A1 (ja) * | 2012-10-29 | 2014-05-08 | 京セラ株式会社 | 積層型圧電素子およびこれを備えた圧電アクチュエータ、噴射装置ならびに燃料噴射システム |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5406164A (en) * | 1993-06-10 | 1995-04-11 | Brother Kogyo Kabushiki Kaisha | Multilayer piezoelectric element |
| JPH10298457A (ja) * | 1997-04-25 | 1998-11-10 | Fukuda Metal Foil & Powder Co Ltd | 焼付型導電塗料 |
| JP3477367B2 (ja) * | 1998-05-12 | 2003-12-10 | ソニーケミカル株式会社 | 異方導電性接着フィルム |
| JP2000077733A (ja) | 1998-08-27 | 2000-03-14 | Hitachi Ltd | 積層型圧電素子 |
| CN1273993C (zh) * | 1998-08-28 | 2006-09-06 | 松下电器产业株式会社 | 导电粘结结构,含该结构的制品及其制造方法 |
| EP1143534B1 (de) * | 2000-03-29 | 2004-05-26 | Nec Tokin Ceramics Corporation | Vielschicht-Piezoaktor mit Elektroden mit verstärkter Leitfähigkeit |
| JP4683689B2 (ja) | 2000-03-29 | 2011-05-18 | 京セラ株式会社 | 積層型圧電素子及び圧電アクチュエータ並びに噴射装置 |
| JP2002052333A (ja) * | 2000-08-09 | 2002-02-19 | Sekisui Chem Co Ltd | 微粒子の被覆方法、被覆微粒子、異方性導電接着剤、異方性導電接合膜及び導電接続構造体 |
| JP2002111088A (ja) * | 2000-09-28 | 2002-04-12 | Kyocera Corp | 積層型圧電アクチュエータ |
| JP2002203999A (ja) * | 2000-11-06 | 2002-07-19 | Denso Corp | 積層型圧電体素子とその製造方法 |
| JP4808915B2 (ja) * | 2003-09-24 | 2011-11-02 | 京セラ株式会社 | 積層型圧電素子及び噴射装置 |
-
2004
- 2004-08-30 JP JP2004250926A patent/JP4706209B2/ja not_active Expired - Lifetime
-
2005
- 2005-08-29 DE DE200510040900 patent/DE102005040900B4/de not_active Expired - Fee Related
- 2005-08-29 US US11/212,563 patent/US7205706B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| US20060043841A1 (en) | 2006-03-02 |
| JP2006066837A (ja) | 2006-03-09 |
| DE102005040900B4 (de) | 2015-03-12 |
| DE102005040900A1 (de) | 2006-03-30 |
| US7205706B2 (en) | 2007-04-17 |
| JP4706209B2 (ja) | 2011-06-22 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8181 | Inventor (new situation) |
Inventor name: KADOTANI, SHIGE, KARIYA, AICHI, JP Inventor name: IWASE, AKIO, KARIYA, AICHI, JP |
|
| 8196 | Reprint of faulty title page (publication) german patentblatt: part 1a6 | ||
| R012 | Request for examination validly filed |
Effective date: 20110630 |
|
| R016 | Response to examination communication | ||
| R016 | Response to examination communication | ||
| R018 | Grant decision by examination section/examining division | ||
| R084 | Declaration of willingness to licence | ||
| R020 | Patent grant now final | ||
| R119 | Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee |