DE102005002726A1 - Portable data carrier e.g. smart card, for cashless payment transaction area, has electrical conducting connection formed between module and components of carrier body by electrical contact device of body injected with casting material - Google Patents

Abstract

The carrier has a data carrier body (2) with an electrical component and an electrical module. An electrical conducting connection is formed between the module and electrical components of the body by an electrical contact device of the module and an electrical contact device of the body. The contact device of the body is partially injected with a casting material of the body such that it protrudes from a surface bordering the body.

Description

The The invention relates to a portable data carrier. Furthermore, the concerns Invention a volume body of a portable data carrier, an electronic module for a portable data carrier and a method of manufacturing a portable data carrier.

portable disk, In particular chip cards are used in many areas, for example as identity documents, as proof of an access authorization a mobile network or to carry out transactions of cashless payment transactions. A chip card has a data carrier body and a embedded in the volume body integrated circuit. In order to efficiently manufacture the Enable smart card The integrated circuit is used in a variety of manufacturing processes first packed in a chip module and then the chip module installed in the disk body. In particular, the chip module is glued into a recess of the data carrier body.

A Communication with the integrated circuit can be over Contact field of the chip card are handled, the purpose of this Touching contact unit will be contacted. The contact field is usually part of the Chip module. Alternatively or in addition for communication about the contact field may be provided a contactless communication. For this purpose, the card body have an antenna which, when installing the chip module with the integrated Circuit is electrically connected. Depending on Field of application for which the chip card is provided, the card body except the antenna and others or have other electrical components during installation of the chip module with the integrated circuit electrically conductive get connected.

at the predominant Number of for the incorporation of a chip module into a card body techniques used are the areas where the electrically conductive connections between the integrated circuit of the chip module and the electrical Component of the card body be formed, not directly accessible by means of a tool. There are therefore contacting required, despite this lack of access one Forming an electrically conductive connection between the integrated Circuit and the electrical component allow.

In this regard disclosed WO 97/05569 A1 discloses a data carrier, in the example by means of an electrically conductive adhesive an electrical connection between one module connection contact and a coil terminal contact is formed. The adhesive is contained in a channel, which is between each one Module connection contact and a coil terminal contact extends.

Furthermore, from the DE 197 49 650 C2 a method for making an electrical connection of a module with an antenna layer or an antenna coil known. The module has an electronic component and is inserted into a cavity of a card body of a chip card. At least one recess per contact is introduced into the card body in the area of the contact surfaces for the antenna layer or antenna coil. The recess fixes an elastic contact element, in particular a helical spring, so that the ends of the contact element touch the contact surfaces for the antenna layer or antenna coil on the one hand and the mating contact surfaces of the module on the other hand. Instead of the elastic contact element, a conductive metallic bolt can be introduced into the recess. The bolt can be connected by conductive adhesive or by soldering to the contact surfaces for the antenna layer or antenna coil and the mating contact surfaces of the module.

Of the Invention is based on the object in a portable data carrier a electrically conductive connection between an electronic module and form an electrical component of a card body in the best possible way.

These Task is by a portable data carrier with the feature combination of claim 1.

Of the portable according to the invention Disk has a manufactured in injection molding from an injection molding material Disk body with at least an electrical component and an electronic module, which is at least partially embedded in the data carrier body and at least over an electrically conductive connection with the electrical component the volume body connected is. The electrically conductive connection between the electronic Module and the electrical component of the disk body is over at least an electrical contact device of the electronic module and at least one electrical contact device of the data carrier body is formed. The special feature of the portable data carrier according to the invention consists in that the electrical contact device of the data carrier body partially is encapsulated with the injection molding material such that it consists of a limiting the volume body area protrudes.

The Invention has the advantage that with little effort a reliable electrical conductive connection between the electronic module and the electrical Component of the disk body formed is that durable a high mechanical stress of the portable disk withstand.

Of the Inventive disk body is manufactured in injection molding from an injection molding material and has at least one electrical contact device to which an electrical component is connected. The electrical contact device is partially encapsulated with the injection molding material such that they from one of the volume body limiting area protrudes.

The electronic according to the invention Module has a contact field for contacting by means of contact an external device on. The contact field is arranged on a support which at least an accessible one Breakthrough to the subsequent Forming an electrically conductive connection between a having electrical contact means of the disk body and the contact pad. Alternatively or in addition the contact field has at least one accessible through hole for subsequent retrieval introduction the electrical contact device of the disk body.

Of the portable data carriers can be a card-shaped one disk, in particular in the form of a chip card within the meaning of ISO 7816 or a SIM card, a data carrier with a USB port (USB token) or similar, on one Person related media be.

At the inventive method for producing a portable data carrier, a data carrier body by means of Injection molding technology made from an injection molding material and a electronic module inserted into a recess of the disk body. At least an electrical contact device of the electronic module and at least an electrical cal contact device of the disk body is an electrical conductive connection between the electronic module and a formed electrical component of the disk body. The electric Contact device of the disk body is in the production of the disk body partially Injected with injection molding material such that it consists of a Volume body limiting area protrudes.

The Invention will be described below with reference to the drawing Embodiments explained, the yourself on a portable disk in the form of a chip card.

It demonstrate:

1 An embodiment of an inventively designed chip card in a schematic plan view,

2 an embodiment of the card body according to the invention before the onset of the chip module fragmentary in a schematic sectional view,

3 an embodiment of the chip module according to the invention prior to installation in the card body of the chip card in a schematic plan view,

4 this in 1 illustrated embodiment of the smart card according to the invention in a schematic fragmentary sectional view and

5 a further embodiment of the chip card according to the invention in one 4 corresponding representation.

1 shows an embodiment of an inventively designed chip card 1 in a schematic plan. The chip card 1 has a card body 2 in which a chip module 3 is used. The chip module 3 has an integrated circuit 4 for storing and / or processing data. Furthermore, the chip module has 3 via a contact field 5 on the outside of the card body 2 is arranged and the inside of the card body 2 arranged integrated circuit 4 covered. Between the integrated circuit 4 and the contact field 5 are formed a plurality of electrically conductive connections, so that the integrated circuit 4 over the contact field 5 various electrical signals can be supplied and the integrated circuit 4 over the contact field 5 Can output signals. For this, the contact field 5 be touching contacted by a non-figuratively illustrated read / write device.

The card body 2 has in its interior further an antenna coil 6 which is preferably formed as a wire coil and, as well as the integrated circuit 4 , not visible from the outside and therefore represented by dashed lines. The antenna coil 6 is electrically conductive with the integrated circuit 4 connected and allows analogous to the contact field 5 a transmission of signals from the integrated circuit 4 be sent or received. In contrast to the contact field 5 is the signal transmission through the antenna coil 6 however, run contactless, so that the smart card 1 for this signal transmission at a distance to a designated write / Le is arranged.

In the 1 illustrated chip card 1 is thus able to transmit signals both via a contacting contact and contactless.

Alternatively or in addition to the antenna coil 6 can the card body 2 the chip card 1 have other non-figured electrical components, such as a display, a switch, a sensor, a battery, etc. These electrical components can each with the integrated circuit 4 be electrically connected.

2 shows an embodiment of the card body according to the invention 2 before inserting the chip module 3 partially in a schematic sectional view. The card body 2 is in the area of a recess 7 represented in which the chip module 3 is used. The recess 7 is formed in two stages and has a border area 8th and a central area 9 on. The central area 9 is within the border area 8th trained and extends deeper into the card body 2 in as the border area 8th ,

The card body 2 is made by injection molding of plastic, such as acrylonitrile-butadiene-styrene (ABS), polycarbonate (PC), polyvinyl chloride (PVC) or a modified polyester referred to as PETG. As part of the injection molding process, the recess 7 trained and the antenna coil 6 in the card body 2 embedded. The embedding of the antenna coil 6 in the card body 2 is done so that two angled ends 10 the antenna coil 6 at the edge 8th the recess 7 from the card body 2 protrude. This can be achieved by using the ends 10 the antenna coil 6 be fixed during the injection molding operation by means of a suitable tool in a desired position, wherein the injection molding material is prevented from the ends 10 the antenna coil 6 fully embedded. For example, the ends become 10 the antenna coil 6 partially introduced into holes provided for the tool. After the injection molding process, the ends become 10 the antenna coil 6 fixed by the solidified injection molding material so that they retain their position even after removal of the tool.

In the illustrated embodiment, the ends protrude 10 the antenna coil 6 substantially perpendicular to the surface of the card body 2 while remaining slightly behind a plane passing through the surface of the card body 2 outside the recess 7 is spanned. The ends 10 the antenna coil 6 are thus accessible from the outside and do not have to be exposed to an electrically conductive connection to the antenna coil 6 manufacture. An optionally existing electrically insulating sheathing of the coil 6 Already before the injection molding process in the area of the ends 10 be removed. The ends 10 the antenna coil 6 can be so bent before or during the production of the electrically conductive connection, they sat at least partially no longer perpendicular to the surface of the card body 2 are arranged.

3 shows an embodiment of the chip module according to the invention 3 before installation in the card body 2 the chip card 1 in a schematic plan. Shown is the side of the chip module 3 when installed, the interior of the card body 2 the chip card 1 is facing. This page is hereafter referred to as the back of the chip module 3 designated. In a similar way, the side of the chip module 3 on which the contact field 5 is arranged, hereinafter referred to as the front.

The chip module 3 is smaller than the outer dimensions of the edge area with respect to its lateral dimensions, which are illustrated by a dot-dash line 8th the recess 7 of the card body 2 and has a carrier sheet 11 on, on the front of the chip module 3 towards the contact field 5 is arranged. The carrier foil 11 consists of an electrically insulating material, such as epoxy. In the illustrated embodiment, the carrier film 11 formed as a band and constitutes a common part of a plurality of chip modules 3 dar. The chip modules 3 For example, they are arranged in two rows and are only in the card body immediately before installation 2 from the carrier film 11 punched out.

With every chip module 3 has the carrier film 11 two openings 12 on, over the the contact field 5 from the back of the chip module 3 is accessible from. The breakthroughs 12 are matched to the location of the ends 10 the antenna coil 6 in the card body 2 arranged and preferably adjacent to a potting 13 arranged in the the integrated circuit 4 is embedded. The external dimensions of the potting body 13 are so on the recess 7 of the card body 2 matched that of the potting body 13 from the central area 9 the recess 7 can be included.

On the back of each chip module 3 is a thermally activated adhesive 14 applied in the form of a thin film, which in the region of the potting 13 a central punched out 15 and optionally in the area of the openings 12 one peripheral punch each 16 having. With the help of thermally activated adhesive 14 becomes the chip module 3 permanently with the card body 2 connected.

4 shows that in 1 illustrated embodiment of the smart card according to the invention 1 in a schematic fragmentary Schnittdar position. The section shown shows the card body 2 in the area of one of the two ends 10 the antenna coil 6 , The chip module 3 is in the range of one of the two openings 12 shown. In this case, in particular, one of several bonding wires 17 outlined within the potting body 13 run and the contact field 5 electrically conductive with contacts 18 of the integrated circuit 4 connect. To the contact field 5 for those on the back of the chip module 3 arranged bonding wires 17 To make accessible, has the carrier film 11 several openings 19 on.

For the production of the chip card 1 from the prefabricated card body 2 and the prefabricated chip module 3 becomes the chip module 3 in the recess 7 of the card body 2 used. Previously, in the area of the ends 10 the antenna coil 6 a pasty conductive adhesive 20 , z. B. a silver conductive adhesive on the card body 2 applied. Alternatively or additionally, the conductive adhesive 20 also in the openings 12 of the chip module 3 be introduced. It is also possible, instead of the conductive adhesive 20 to use another conductive material, for example a solder. During or after insertion of the chip module 3 in the recess 7 of the card body 2 becomes the glue 14 heated and thereby activated, leaving the chip module 3 firm and permanent with the card body 2 bonded. If necessary, the conductive adhesive will also be used 20 or the material used instead heated. The required heat energy is supplied by means of a hot stamp. Likewise, it is also possible to locally supply the heat energy by means of an induced eddy current, by means of ultrasound or by means of a laser.

Due to the pasty state of the conductive adhesive 20 dip the ends 10 the coil 6 in the conductive adhesive 20 so that with the solidification of the conductive adhesive 20 a reliable electrically conductive connection between the ends 10 the coil 6 and the conductive adhesive 20 is trained. Furthermore, there is the solidification of the conductive adhesive 20 an electrically conductive connection between the conductive adhesive 20 and the contact field 5 of the chip module 3 that of the conductive adhesive 20 in the area of the openings 12 is wetted. Thus, by the conductive adhesive 20 electrically conductive connections between the ends 10 the antenna coil 6 and the contact field 5 educated. Because the contact field 5 over the bonding wires 17 with the integrated circuit 4 is electrically connected, in this way, the antenna coil 6 to the chip module 3 connected. Thus, a very reliable electrically conductive connection is formed on the whole, which also a strong mechanical stress of the chip card 1 permanently withstand.

As a result of the central punching 15 in which as a foil on the chip module 3 applied glue 14 stay with the sticking of the chip module 3 with the card body 2 wide parts of the potting body 13 free of glue 14 , By the peripheral punching 16 is guaranteed that also in the area of openings 12 no glue 14 so that when installing the chip module 3 in the recess 7 of the card body 2 the conductive adhesive 20 the contact field 5 of the chip module 3 can moisten unhindered.

5 shows a further embodiment of the chip card according to the invention 1 in a 4 corresponding representation. This embodiment is characterized in that the contact field 5 of the chip module 3 Through holes 21 having. The through holes 21 are from the back of the chip module 3 over the openings 12 in the carrier film 11 accessible. In the through holes 21 are the ends 10 the antenna coil 6 introduced. To facilitate insertion, the apertures widen 12 in this embodiment conical to the back of the chip module 3 out. On the front of the chip module 3 is in the area of through holes 21 conductive adhesive 20 on the contact field 5 applied by an electrically conductive connection between the ends 10 the antenna coil 6 and the contact field 5 will be produced. The contact field 5 is in turn over the bonding wires 17 with the integrated circuit 4 connected.

Notwithstanding the in 5 embodiment shown following modifications are possible individually or in combination with each other.

The breakthroughs 12 can as punched out the carrier foil 11 be realized. The breakthroughs 12 So you can also just to the back of the chip module 3 run out.

The diameter of the through holes 21 and the breakthroughs 12 can touch each other and the thickness of the ends 10 the antenna coil 6 be adjusted. So in particular the diameter of the through hole 21 be chosen larger than the diameter of the ends 10 the antenna coil 6 , In this way, for example, a - as in 5 represented - over the surface of the contact field 5 sticking out adhesive 20 be avoided. Optionally, such a protruding adhesive 20 subsequently with a stamp on the plane of the contact field 5 be pressed.

The ends 10 the antenna coils 6 may be arranged so that they only at least partially in the region of the through holes 21 or in the area of the openings 12 protrude. The size of the openings 12 may optionally depending on the diameter of the En 10 the antenna coils 6 be chosen so that sufficient conductive adhesive 20 into the area of the openings 12 can penetrate. A good electrically conductive connection is achieved in particular when the conductive adhesive 20 the end 10 the antenna coil 6 encloses and the through holes 21 are sufficiently large to form a suitable contact surface.

Analogous to the embodiment according to 4 is also at the in 5 illustrated embodiment of the smart card 1 only a one-sided metallization of the carrier film 11 required.

In a modification of the invention is for the bonding of the chip module 3 with the card body 2 instead of a thermally activated adhesive film another adhesive 14 , For example, a liquid adhesive used.

In a further modification of the invention is the chip module 3 designed in a different manner than in the embodiment described above. Also in this case are for the training of the chip module 3 in each case preferably used standard methods of chip module production.

Claims (16)

Portable data carrier with a data carrier body produced by injection molding from an injection molding material ( 2 ) comprising at least one electrical component ( 6 ) and with an electronic module ( 3 ) which at least partially enters the data carrier body ( 2 ) is embedded and at least one electrically conductive connection with the electrical component ( 6 ) of the data carrier body ( 2 ), wherein the electrically conductive connection between the electronic module ( 3 ) and the electrical component ( 6 ) of the data carrier body ( 2 ) via at least one electrical contact device ( 5 ) of the electronic module ( 3 ) and at least one electrical contact device ( 10 ) of the data carrier body ( 2 ), characterized in that the electrical contact device ( 10 ) of the data carrier body ( 2 ) is partially encapsulated with the injection molding material in such a way that it comes from a data carrier body ( 2 ) protruding surface. Portable data carrier according to claim 1, characterized in that the data carrier body ( 2 ) a two-step recess ( 7 ) having a first area ( 8th ) and a second area ( 9 ), which is deeper than the first area ( 8th ) in the volume body ( 2 ), and the electrical contact device ( 10 ) of the data carrier body ( 2 ) in the first area ( 8th ) of the two-step recess ( 7 ) from the volume body ( 2 ) stands out. Portable data carrier according to one of the preceding claims, characterized in that the electrical contact devices ( 5 . 10 ) of the electronic module ( 3 ) and the volume body ( 2 ) by means of an electrically conductive connecting material ( 20 ) are connected. Portable data carrier according to claim 3, characterized in that by means of the connecting material ( 20 ) A cohesive connection is formed. Portable data carrier according to one of the preceding claims, characterized in that the electrical contact device ( 10 ) of the data carrier body ( 2 ) in one piece with the electrical component ( 6 ) is trained. Portable data carrier according to one of the preceding claims, characterized in that the electrical contact device ( 10 ) of the data carrier body ( 2 ) is formed in the form of a wire. Portable data carrier according to one of the preceding claims, characterized in that the electrical component ( 6 ) of the data carrier body ( 2 ) is formed as an antenna device, in particular in the form of a wire coil. Portable data carrier according to one of the preceding claims, characterized in that the electrical contact device ( 5 ) of the electronic module ( 3 ) is formed as a contact field for contacting by an external device. Portable data carrier according to one of the preceding claims, characterized in that the electronic module ( 3 ) by means of an adhesive ( 14 ) on the data carrier body ( 2 ) is fixed. Portable data carrier according to one of the preceding claims, characterized in that the electronic module ( 3 ) one on a support ( 11 ) arranged integrated circuit ( 4 ) having. Portable data carrier according to one of the preceding claims, characterized in that the electrical contact device ( 10 ) of the data carrier body ( 2 ) in a through hole ( 21 ) of the electrical contact device ( 5 ) of the electronic module ( 3 ) is introduced. Portable data carrier according to claim 11, characterized in that the Verbindungsmateri al ( 20 ) on one side of the electrical contact device ( 5 ) of the electronic module ( 3 ), towards which the electrical contact device ( 10 ) of the data carrier body ( 2 ) in the through hole ( 21 ) is introduced. Portable data carrier according to one of the preceding Claims, characterized in that it is designed as a chip card. Injection molding from an injection molding material produced data carrier body for a portable data carrier ( 1 ), with at least one electrical contact device ( 10 ) to which an electrical component ( 6 ), characterized in that the electrical contact device ( 10 ) is partially encapsulated with the injection molding material in such a way that it comes from a data carrier body ( 2 ) protruding surface. Electronic module for installation in a data carrier body ( 2 ) of a portable data carrier ( 1 ), with a contact field ( 5 ) for contacting by means of an external device, characterized in that the contact field ( 5 ) on a support ( 11 ) is arranged, the at least one accessible opening ( 12 ) for the subsequent formation of an electrically conductive connection between an electrical contact device ( 10 ) of the data carrier body ( 2 ) and the contact field ( 5 ) and / or the contact field ( 5 ) at least one accessible through-hole ( 21 ) for the subsequent introduction of the electrical contact device ( 10 ) of the data carrier body ( 2 ) having. Method of manufacturing a portable data carrier ( 1 ), wherein a data carrier body ( 2 ) is produced by injection molding from an injection molding material, an electronic module ( 3 ) in a recess ( 7 ) of the data carrier body ( 2 ) is used and at least one electrical contact device ( 5 ) of the electronic module ( 3 ) and at least one electrical contact device ( 10 ) of the data carrier body ( 2 ) an electrically conductive connection between the electronic module ( 3 ) and an electrical component ( 6 ) of the data carrier body ( 2 ), characterized in that the electrical contact device ( 10 ) of the data carrier body ( 2 ) in the production of the data carrier body ( 2 ) is partially encapsulated with injection molding material such that it from a the disk body ( 2 ) protruding surface.