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DE102004047977A1 - Verfahren zur Zerkleinerung von Siliciumblöcken - Google Patents

Verfahren zur Zerkleinerung von Siliciumblöcken Download PDF

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Publication number
DE102004047977A1
DE102004047977A1 DE102004047977A DE102004047977A DE102004047977A1 DE 102004047977 A1 DE102004047977 A1 DE 102004047977A1 DE 102004047977 A DE102004047977 A DE 102004047977A DE 102004047977 A DE102004047977 A DE 102004047977A DE 102004047977 A1 DE102004047977 A1 DE 102004047977A1
Authority
DE
Germany
Prior art keywords
block
silicon
crush
crushed
force
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE102004047977A
Other languages
English (en)
Inventor
Norichika Yamauchi
Takehiko Shimada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
IIS Materials Corp Ltd
Original Assignee
IIS Materials Corp Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by IIS Materials Corp Ltd filed Critical IIS Materials Corp Ltd
Publication of DE102004047977A1 publication Critical patent/DE102004047977A1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B02—CRUSHING, PULVERISING, OR DISINTEGRATING; PREPARATORY TREATMENT OF GRAIN FOR MILLING
    • B02C—CRUSHING, PULVERISING, OR DISINTEGRATING IN GENERAL; MILLING GRAIN
    • B02C1/00—Crushing or disintegrating by reciprocating members
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B02—CRUSHING, PULVERISING, OR DISINTEGRATING; PREPARATORY TREATMENT OF GRAIN FOR MILLING
    • B02C—CRUSHING, PULVERISING, OR DISINTEGRATING IN GENERAL; MILLING GRAIN
    • B02C19/00—Other disintegrating devices or methods
    • B02C19/18—Use of auxiliary physical effects, e.g. ultrasonics, irradiation, for disintegrating
    • B02C19/186—Use of cold or heat for disintegrating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0064—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by temperature changes
    • B08B7/0092—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by temperature changes by cooling
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B33/00—Silicon; Compounds thereof
    • C01B33/02—Silicon

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Food Science & Technology (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Silicon Compounds (AREA)
  • Disintegrating Or Milling (AREA)
  • Processing Of Solid Wastes (AREA)

Abstract

Es wird ein Verfahren zur Zerkleinerung von Siliciumblöcken beschrieben, bei dem ein zu zerkleinernder Siliciumblock erhitzt und anschließend erzwungen abgekühlt wird. Anschließend wird ein Zerkleinerungselement, das zumindest an einer Oberfläche keine Metallbestandteile enthält, gegen den abgekühlten Siliciumblock geschlagen, um diesen dadurch zu zerkleinern. Alternativ werden zwei zu zerkleinernde Siliciumblöcke erhitzt und danach erzwungen abgekühlt. Anschließend werden die abgekühlten Siliciumblöcke gegeneinander geschlagen, wodurch diese zerkleinert werden.
DE102004047977A 2003-10-01 2004-10-01 Verfahren zur Zerkleinerung von Siliciumblöcken Withdrawn DE102004047977A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003377554A JP4340963B2 (ja) 2003-10-01 2003-10-01 スクラップシリコン塊の破砕方法

Publications (1)

Publication Number Publication Date
DE102004047977A1 true DE102004047977A1 (de) 2005-04-21

Family

ID=34373652

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102004047977A Withdrawn DE102004047977A1 (de) 2003-10-01 2004-10-01 Verfahren zur Zerkleinerung von Siliciumblöcken

Country Status (3)

Country Link
US (1) US7195184B2 (de)
JP (1) JP4340963B2 (de)
DE (1) DE102004047977A1 (de)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111468219A (zh) * 2020-03-19 2020-07-31 江苏鑫华半导体材料科技有限公司 预处理-声波联用硅块破碎装置和方法
CN111468261A (zh) * 2020-03-19 2020-07-31 江苏鑫华半导体材料科技有限公司 制热-冷冻-重锤联用硅块破碎装置和方法
CN113908955A (zh) * 2021-09-02 2022-01-11 杨国秀 一种光学玻璃用稀土材料的处理方法

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* Cited by examiner, † Cited by third party
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US20100199909A1 (en) * 2007-01-25 2010-08-12 University Of Utah Research Foundation Systems and methods for recycling semiconductor material removed from a raw semiconductor boule
KR101061398B1 (ko) * 2007-08-03 2011-09-02 테오스 가부시키가이샤 실리콘 지지 장치 및 이것을 사용한 실리콘 가열 급냉 장치
JP4465041B1 (ja) * 2009-08-20 2010-05-19 株式会社テオス 原料シリコン破砕装置
KR20140071381A (ko) * 2011-09-29 2014-06-11 쵸슈 산교 가부시키가이샤 원료 실리콘 파쇄 장치
CN102489372B (zh) * 2011-12-12 2013-09-04 湖南顶立科技有限公司 多晶硅棒破碎方法及设备
DE102012213565A1 (de) 2012-08-01 2014-02-06 Wacker Chemie Ag Vorrichtung und Verfahren zum Zerkleinern eines polykristallinen Siliciumstabs
CN103599835B (zh) * 2013-11-20 2016-06-15 宁夏宁电光伏材料有限公司 一种硅块破碎方法
CN103816973A (zh) * 2014-02-20 2014-05-28 亚洲硅业（青海）有限公司 一种无接触破碎多晶硅的方法
CN104624338B (zh) * 2015-03-13 2017-11-10 苏州圣谱拉新材料科技有限公司 一种冷热受激粉碎装置
GB2553051B (en) * 2015-03-26 2020-08-26 Gyrus Acmi Inc Variable stiffness medical device
FR3075776B1 (fr) * 2017-12-21 2020-10-02 Rosi Granules de silicium pour la preparation de trichlorosilane et procede de fabrication associe
CN110605176A (zh) * 2019-10-23 2019-12-24 西安华晶电子技术股份有限公司 一种水爆破碎多晶硅料的方法
JP7299579B2 (ja) * 2020-07-10 2023-06-28 Ｋｉテック株式会社 高純度シリコンパウダの製造方法、高純度シリコンパウダおよび高純度シリコンパウダ製造システム
RU2756998C1 (ru) * 2020-10-15 2021-10-08 Сергей Константинович Есаулов Способ разрушения материального твердого тела при локальном высокоинтенсивном тепловом воздействии на его поверхность
RU2756936C1 (ru) * 2020-10-15 2021-10-07 Сергей Константинович Есаулов Способ разрушения материального твердого тела при локальном высокоинтенсивном тепловом воздействии на его поверхность
RU2756935C1 (ru) * 2020-10-15 2021-10-07 Сергей Константинович Есаулов Способ разрушения материального твердого тела при локальном высокоинтенсивном тепловом воздействии на его поверхность
CN114345511A (zh) * 2022-02-14 2022-04-15 江苏鑫华半导体材料科技有限公司 电子级多晶硅棒热破碎方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6033210A (ja) * 1983-08-02 1985-02-20 Komatsu Denshi Kinzoku Kk 半導体用シリコンの破砕方法
JPS6414109A (en) * 1987-07-06 1989-01-18 Mitsui Toatsu Chemicals Method for crushing high purity silicon
DE3811091A1 (de) * 1988-03-31 1989-10-12 Heliotronic Gmbh Verfahren zum kontaminationsarmen zerkleinern von massivem stueckigem silicium
JP2565759B2 (ja) 1988-12-02 1996-12-18 高純度シリコン株式会社 多結晶シリコンの破砕装置
JPH1015422A (ja) 1996-07-03 1998-01-20 Sumitomo Sitix Corp 多結晶シリコンの破砕方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111468219A (zh) * 2020-03-19 2020-07-31 江苏鑫华半导体材料科技有限公司 预处理-声波联用硅块破碎装置和方法
CN111468261A (zh) * 2020-03-19 2020-07-31 江苏鑫华半导体材料科技有限公司 制热-冷冻-重锤联用硅块破碎装置和方法
CN113908955A (zh) * 2021-09-02 2022-01-11 杨国秀 一种光学玻璃用稀土材料的处理方法
CN113908955B (zh) * 2021-09-02 2023-09-08 杨国秀 一种光学玻璃用稀土材料的处理方法

Also Published As

Publication number Publication date
JP2005103529A (ja) 2005-04-21
US7195184B2 (en) 2007-03-27
JP4340963B2 (ja) 2009-10-07
US20050082400A1 (en) 2005-04-21

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Legal Events

Date Code Title Description
R012 Request for examination validly filed

Effective date: 20110929

R119 Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee

Effective date: 20130501