DE102004023989C5 - Elektronischer Heizkostenverteiler - Google Patents

Elektronischer Heizkostenverteiler Download PDF

Info

Publication number: DE102004023989C5
Authority: DE; Germany
Prior art keywords: temperature sensor; circuit board; heat cost; radiator; room air
Prior art date: 2004-05-14
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired - Fee Related

Application number

DE102004023989A

Other languages

German (de)

English (en)

Other versions

DE102004023989B3 (de

Inventor

Wolfgang Werner

Marc Sebald

Gerhard Becke

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Diehl Metering Systems GmbH

Original Assignee

Hydrometer Electronic GmbH

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2004-05-14

Filing date

2004-05-14

Publication date

2012-03-08

Family has litigation

First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=35033298&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE102004023989(C5) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.

2004-05-14 Application filed by Hydrometer Electronic GmbH filed Critical Hydrometer Electronic GmbH

2004-05-14 Priority to DE102004023989A priority Critical patent/DE102004023989C5/de

2005-04-21 Priority to CNB2005100656863A priority patent/CN100465597C/zh

2005-05-03 Priority to ES05009634T priority patent/ES2380366T3/es

2005-05-03 Priority to DK05009634.6T priority patent/DK1605238T3/da

2005-05-03 Priority to AT05009634T priority patent/ATE540298T1/de

2005-05-03 Priority to EP05009634A priority patent/EP1605238B1/de

2006-02-02 Publication of DE102004023989B3 publication Critical patent/DE102004023989B3/de

2012-03-08 Publication of DE102004023989C5 publication Critical patent/DE102004023989C5/de

2012-03-08 Application granted granted Critical

2024-05-15 Anticipated expiration legal-status Critical

Status Expired - Fee Related legal-status Critical Current

Links

238000010438 heat treatment Methods 0.000 claims abstract description 3
239000004020 conductor Substances 0.000 claims description 15
229920002379 silicone rubber Polymers 0.000 claims description 2
239000004945 silicone rubber Substances 0.000 claims description 2
239000002131 composite material Substances 0.000 claims 1
238000000034 method Methods 0.000 description 7
238000011156 evaluation Methods 0.000 description 6
238000004519 manufacturing process Methods 0.000 description 5
125000006850 spacer group Chemical group 0.000 description 3
MVXIJRBBCDLNLX-UHFFFAOYSA-N 1,3-dichloro-2-(2-chlorophenyl)benzene Chemical compound ClC1=CC=CC=C1C1=C(Cl)C=CC=C1Cl MVXIJRBBCDLNLX-UHFFFAOYSA-N 0.000 description 2
238000005452 bending Methods 0.000 description 2
230000008878 coupling Effects 0.000 description 2
238000010168 coupling process Methods 0.000 description 2
238000005859 coupling reaction Methods 0.000 description 2
230000000694 effects Effects 0.000 description 2
238000005259 measurement Methods 0.000 description 2
239000004033 plastic Substances 0.000 description 2
230000005855 radiation Effects 0.000 description 2
238000005476 soldering Methods 0.000 description 2
OPFJDXRVMFKJJO-ZHHKINOHSA-N N-{[3-(2-benzamido-4-methyl-1,3-thiazol-5-yl)-pyrazol-5-yl]carbonyl}-G-dR-G-dD-dD-dD-NH2 Chemical compound S1C(C=2NN=C(C=2)C(=O)NCC(=O)N[C@H](CCCN=C(N)N)C(=O)NCC(=O)N[C@H](CC(O)=O)C(=O)N[C@H](CC(O)=O)C(=O)N[C@H](CC(O)=O)C(N)=O)=C(C)N=C1NC(=O)C1=CC=CC=C1 OPFJDXRVMFKJJO-ZHHKINOHSA-N 0.000 description 1
239000004793 Polystyrene Substances 0.000 description 1
238000004026 adhesive bonding Methods 0.000 description 1
230000005540 biological transmission Effects 0.000 description 1
230000036760 body temperature Effects 0.000 description 1
229940126086 compound 21 Drugs 0.000 description 1
230000000994 depressogenic effect Effects 0.000 description 1
239000011810 insulating material Substances 0.000 description 1
239000004973 liquid crystal related substance Substances 0.000 description 1
229920002223 polystyrene Polymers 0.000 description 1
238000003825 pressing Methods 0.000 description 1
230000001681 protective effect Effects 0.000 description 1
229910000679 solder Inorganic materials 0.000 description 1

Images

Classifications

- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K17/00—Measuring quantity of heat
- G01K17/06—Measuring quantity of heat conveyed by flowing media, e.g. in heating systems e.g. the quantity of heat in a transporting medium, delivered to or consumed in an expenditure device
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K17/00—Measuring quantity of heat
- G01K17/06—Measuring quantity of heat conveyed by flowing media, e.g. in heating systems e.g. the quantity of heat in a transporting medium, delivered to or consumed in an expenditure device
- G01K17/08—Measuring quantity of heat conveyed by flowing media, e.g. in heating systems e.g. the quantity of heat in a transporting medium, delivered to or consumed in an expenditure device based upon measurement of temperature difference or of a temperature
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
- H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0133—Elastomeric or compliant polymer
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/062—Means for thermal insulation, e.g. for protection of parts
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
- H05K2201/09263—Meander
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10151—Sensor

Landscapes

Engineering & Computer Science (AREA)
Chemical & Material Sciences (AREA)
Combustion & Propulsion (AREA)
Physics & Mathematics (AREA)
General Physics & Mathematics (AREA)
Microelectronics & Electronic Packaging (AREA)
Cooling Or The Like Of Electrical Apparatus (AREA)
Fire-Detection Mechanisms (AREA)
Central Heating Systems (AREA)
Combinations Of Printed Boards (AREA)
Investigating Or Analyzing Materials Using Thermal Means (AREA)

DE102004023989A 2004-05-14 2004-05-14 Elektronischer Heizkostenverteiler Expired - Fee Related DE102004023989C5 (de)

Priority Applications (6)

Application Number	Priority Date	Filing Date	Title
DE102004023989A DE102004023989C5 (de)	2004-05-14	2004-05-14	Elektronischer Heizkostenverteiler
CNB2005100656863A CN100465597C (zh)	2004-05-14	2005-04-21	电子加热成本分配器
AT05009634T ATE540298T1 (de)	2004-05-14	2005-05-03	Elektronischer heizkostenverteiler
DK05009634.6T DK1605238T3 (da)	2004-05-14	2005-05-03	Elektronisk varmefordelingsmåler
ES05009634T ES2380366T3 (es)	2004-05-14	2005-05-03	Distribuidor electrónico de costes de calefacción
EP05009634A EP1605238B1 (de)	2004-05-14	2005-05-03	Elektronischer Heizkostenverteiler

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
DE102004023989A DE102004023989C5 (de)	2004-05-14	2004-05-14	Elektronischer Heizkostenverteiler

Publications (2)

Publication Number	Publication Date
DE102004023989B3 DE102004023989B3 (de)	2006-02-02
DE102004023989C5 true DE102004023989C5 (de)	2012-03-08

Family

ID=35033298

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
DE102004023989A Expired - Fee Related DE102004023989C5 (de)	2004-05-14	2004-05-14	Elektronischer Heizkostenverteiler

Country Status (6)

Country	Link
EP (1)	EP1605238B1 (da)
CN (1)	CN100465597C (da)
AT (1)	ATE540298T1 (da)
DE (1)	DE102004023989C5 (da)
DK (1)	DK1605238T3 (da)
ES (1)	ES2380366T3 (da)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
PL1925924T3 (pl) *	2006-11-21	2009-12-31	Qundis Gmbh	Niskokosztowy podzielnik kosztów ogrzewania
DE102009005490B3 (de) *	2009-01-21	2010-07-08	Qundis Gmbh	Elektronischer Heizkostenverteiler
ATE522796T1 (de) *	2009-03-16	2011-09-15	Bfw Werner Voelk Gmbh	Heizkostenverteiler mit infrarot-temperatursensor
FR2943416B1 (fr) *	2009-03-23	2012-10-19	Ijinus	Capteur de temperature
DE102009048940B3 (de) *	2009-10-10	2010-10-14	Qundis Gmbh	Heizkostenverteiler
EP2511616B1 (fr) *	2011-04-14	2016-07-06	Itron France	Repartiteur de cout de chauffage
DE102012014568A1 (de)	2012-07-23	2014-01-23	Metrona Wärmemesser Union Gmbh	Elektronischer Heizkostenverteiler mit Raumtemperatursensor
DE102015001585B4 (de)	2015-02-11	2017-09-28	Kundo Xt Gmbh	Heizkostenverteiler und Heizkostenerfassungseinrichtung
DE202017106413U1 (de) *	2017-10-23	2017-10-30	Sensirion Ag	Sensormodul, insbesondere zur Messung der Umgebungstemperatur, der relativen Luftfeuchtigkeit und einer Gaskonzentration in der Umgebung des Sensormoduls
EP3660475B1 (en) *	2018-11-28	2022-08-10	General Electric Company	Systems and methods for thermal monitoring
DE102019106096C5 (de)	2019-03-11	2023-03-09	Qundis Gmbh	Verfahren zum Betrieb eines elektronischen Heizkostenverteilers
DE102019205953A1 (de) *	2019-04-25	2020-10-29	Robert Bosch Gmbh	Temperaturmessvorrichtung für einen elektrischen Energiespeicher
CN110398295A (zh) *	2019-07-05	2019-11-01	宁波均胜新能源汽车技术有限公司	具有温度检测装置的连接组件
RU198666U1 (ru) *	2020-04-25	2020-07-21	Общество с ограниченной ответственностью "Данфосс"	Беспроводной счётчик-распределитель тепла
US12457680B2 (en)	2023-03-13	2025-10-28	Microsoft Technology Licensing, Llc	Circuit board cooling configurations

Citations (5)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
DE4031161A1 (de) *	1990-10-03	1992-04-09	Karl Stegmeier	Befestigungsvorrichtung fuer einen heizkostenverteiler
DE29515173U1 (de) *	1995-09-22	1995-11-30	Raab Karcher Energieservice GmbH, 48147 Münster	Elektronischer Heizkostenverteiler
DE19938812A1 (de) *	1999-08-19	2001-02-22	Diehl Stiftung & Co	Elektronischer Heizkostenverteiler
DE10146207C1 (de) *	2001-09-19	2003-02-20	Kundo Systemtechnik Gmbh	Vorrichtung zum Messen der abgegebenen Wärmemenge eines Heizkörpers
DE20319708U1 (de) *	2003-12-19	2004-03-04	Kundo Systemtechnik Gmbh	Vorrichtung zum Messen der abgegebenen Wärmemenge eines Heizkörpers

2004
- 2004-05-14 DE DE102004023989A patent/DE102004023989C5/de not_active Expired - Fee Related
2005
- 2005-04-21 CN CNB2005100656863A patent/CN100465597C/zh not_active Expired - Fee Related
- 2005-05-03 AT AT05009634T patent/ATE540298T1/de active
- 2005-05-03 ES ES05009634T patent/ES2380366T3/es not_active Expired - Lifetime
- 2005-05-03 DK DK05009634.6T patent/DK1605238T3/da active
- 2005-05-03 EP EP05009634A patent/EP1605238B1/de not_active Expired - Lifetime

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
DE4031161A1 (de) *	1990-10-03	1992-04-09	Karl Stegmeier	Befestigungsvorrichtung fuer einen heizkostenverteiler
DE29515173U1 (de) *	1995-09-22	1995-11-30	Raab Karcher Energieservice GmbH, 48147 Münster	Elektronischer Heizkostenverteiler
DE19938812A1 (de) *	1999-08-19	2001-02-22	Diehl Stiftung & Co	Elektronischer Heizkostenverteiler
DE10146207C1 (de) *	2001-09-19	2003-02-20	Kundo Systemtechnik Gmbh	Vorrichtung zum Messen der abgegebenen Wärmemenge eines Heizkörpers
DE20319708U1 (de) *	2003-12-19	2004-03-04	Kundo Systemtechnik Gmbh	Vorrichtung zum Messen der abgegebenen Wärmemenge eines Heizkörpers

Non-Patent Citations (8)

* Cited by examiner, † Cited by third party
Title
Digital Temperature Sensor with SPI Interface; Application Note TC72 derFirma Microchip Technology Inc., 2002
Digital Temperature Sensor with SPI Interface; Application Note TC72 derFirma Microchip Technology Inc., 2002 *
HUBER, Rainer: Thermal Management of Golden Dragon LED. Application Note der Firma OSRAM, 7. August 2002
HUBER, Rainer: Thermal Management of Golden Dragon LED. Application Note der Firma OSRAM, 7. August 2002 *
Thermal Considerations of QFN and Other Exposed-Paddle Packages;Application Note HFAN-08.1, Rev. 0 der Firma MAXIM Integrated Products, November 2001
Thermal Clad® Selection Guide; Firmenprospekt der Berquist Company;Januar 2002
Thermal Clad® Selection Guide; Firmenprospekt der Berquist Company;Januar 2002 *
Thermal Considerations of QFN and Other Exposed-Paddle Packages;Application Note HFAN-08.1, Rev. 0 der Firma MAXIM Integrated Products, November 2001 *

Also Published As

Publication number	Publication date
CN100465597C (zh)	2009-03-04
DE102004023989B3 (de)	2006-02-02
EP1605238B1 (de)	2012-01-04
ES2380366T3 (es)	2012-05-11
DK1605238T3 (da)	2012-04-23
CN1696625A (zh)	2005-11-16
ATE540298T1 (de)	2012-01-15
EP1605238A1 (de)	2005-12-14

Publication	Publication Date	Title
DE102004023989C5 (de)	2012-03-08	Elektronischer Heizkostenverteiler
EP1457365B1 (de)	2007-05-16	Vorrichtung zur Erfassung der Temperatur im Innenraum eines Fahrzeuges
EP1152639B1 (de)	2005-11-30	Elektrische Heizeinheit, insbesondere für flüssige Medien
DE102019000919B4 (de)	2025-07-10	Berührungs- und/oder annäherungsempfindliche Eingabevorrichtung
DE202013012074U1 (de)	2015-06-03	Steuerplatine für einen Durchlauferhitzer
DE202013011528U1 (de)	2014-11-03	Berührungs- und/oder annäherungsempfindliche Eingabevorrichtung
EP1936342A1 (de)	2008-06-25	Sensoranordnung zur Temperaturmessung
EP1915599B1 (de)	2016-11-23	Sensoranordnung zur temperaturmessung
DE102018122940A1 (de)	2020-03-19	Sensoranordnung zur Messung der Temperatur einer Scheibe
BE1025734A9 (de)	2019-07-03	Modularer Steckverbinder austauschbarer Modul-Leiterplatte
DE19938812A1 (de)	2001-02-22	Elektronischer Heizkostenverteiler
DE102009048940B3 (de)	2010-10-14	Heizkostenverteiler
EP1598224B1 (de)	2015-04-15	Vorrichtung zur Ermittlung von Beschlag auf einer Fläche eines Fahrzeuges
DE102004023990B3 (de)	2005-09-08	Elektronischer Heizkostenverteiler
DE202004007802U1 (de)	2005-09-22	Elektronischer Heizkostenverteiler
EP1925924B1 (de)	2009-07-22	Low-cost-Heizkostenverteiler
EP0619620A2 (de)	1994-10-12	Verbrauchsverteiler, insbesondere Heizkosten- oder Warmwasserkostenverteiler
DE102018113230A1 (de)	2019-12-05	Sensormodul
EP1683665A1 (de)	2006-07-26	Sensoranordnung
DE102005005908B3 (de)	2006-10-05	Kollisionssensor
DE102019000295A1 (de)	2020-07-16	Kapazitiver Berührungsschalter
DE212012000217U1 (de)	2014-06-25	Steuergerät zur Steuerung der Dimensionierung eines Teils
DE102005011152B4 (de)	2008-04-10	Kontaktierungseinrichtung mit kontrollierter Impedanz
DE19627414A1 (de)	1998-01-15	Klimagerät für Fahrzeuge
EP1830621B1 (de)	2011-07-20	Vorrichtung zum Befestigen und Kontaktieren von elektronischen Baugruppen auf Leiterplatten

Legal Events

Date	Code	Title	Description
2006-02-02	8100	Publication of patent without earlier publication of application
2006-03-16	8327	Change in the person/name/address of the patent owner	Owner name: HYDROMETER ELECTRONIC GMBH, 90451 NUERNBERG, DE
2006-07-13	8363	Opposition against the patent
2012-02-23	R034	Decision of examining division/federal patent court maintaining patent in limited form now final	Effective date: 20110527
2012-03-08	R206	Amended patent specification	Effective date: 20120308
2014-05-15	R081	Change of applicant/patentee	Owner name: DIEHL METERING SYSTEMS GMBH, DE Free format text: FORMER OWNER: HYDROMETER ELECTRONIC GMBH, 90451 NUERNBERG, DE Effective date: 20140409
2017-12-01	R119	Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee