DE102004001949A1 - Laser machining system has a multi segment lens unit that focuses the laser output onto a parallel axis - Google Patents
Laser machining system has a multi segment lens unit that focuses the laser output onto a parallel axis Download PDFInfo
- Publication number
- DE102004001949A1 DE102004001949A1 DE200410001949 DE102004001949A DE102004001949A1 DE 102004001949 A1 DE102004001949 A1 DE 102004001949A1 DE 200410001949 DE200410001949 DE 200410001949 DE 102004001949 A DE102004001949 A DE 102004001949A DE 102004001949 A1 DE102004001949 A1 DE 102004001949A1
- Authority
- DE
- Germany
- Prior art keywords
- laser
- focuses
- lens unit
- machining system
- parallel axis
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000003754 machining Methods 0.000 title claims 2
- 150000001875 compounds Chemical class 0.000 claims 1
- 239000000835 fiber Substances 0.000 abstract 1
- 239000000463 material Substances 0.000 description 3
- 230000003628 erosive effect Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 239000012510 hollow fiber Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 230000033764 rhythmic process Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
- B23K26/0608—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams in the same heat affected zone [HAZ]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P25/00—Auxiliary treatment of workpieces, before or during machining operations, to facilitate the action of the tool or the attainment of a desired final condition of the work, e.g. relief of internal stress
- B23P25/003—Auxiliary treatment of workpieces, before or during machining operations, to facilitate the action of the tool or the attainment of a desired final condition of the work, e.g. relief of internal stress immediately preceding a cutting tool
- B23P25/006—Heating the workpiece by laser during machining
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Laser Beam Processing (AREA)
Abstract
Description
Schonender Materialabtrag erfolgt wenn Tiefenrissbildung bei Spanbildung durch mechanischen Abtrag vermieden wird in dem Abzutragendes durch thermisches Vorbereiten weich gemacht wird und duktil entfernt wird wobei die Kristallverschiebung unterbleibt und sozusagen in Polierqualität abgetragen wird.gentle Material removal occurs when depth cracking during chip formation mechanical erosion is avoided in the Abzutragendes by thermal Preparing is softened and ductile is removed while the Crystal displacement is omitted and so to speak removed in polishing quality.
In der PCT-Anmeldung 03/00400 sind bereits Lasereinführungsmethoden beschrieben die auf Grinlinsen-, Trichter- und Freistrahl-Einführungen beruhen.In PCT Application 03/00400 are already laser introduction methods described the on grin lens, funnel and free jet introductions based.
Direkt vor weiterführende Elemente gesetzte Grinlinsen haben den Nachteil das viele Schnittstellen zwischen den Linsen entstehen, die problematisch sind, Trichter sind nur in einem sehr begrenzten Umfang verwendbar da nur max 2-3 Trichterwandberührungen möglich sind um eine Rückleitung des Laserstrahls zu vermeiden, Freistrahl-Einführungen sind nur bei sehr großen Werkzeugen möglich die Priorität duktilen Abtrags liegt jedoch bei kleinen Werkzeugen.Directly before continuing Elements set grin lenses have the disadvantage that many interfaces arise between the lenses that are problematic, funnels are usable only to a very limited extent since only max 2-3 Hopper wall touches possible are a return of the laser beam, free-jet entries are only possible with very large tools possible the priority ductile erosion is, however, in small tools.
Diese Einschränkungen sind mit vorliegender Erfindung zu umgehen.These restrictions are to be circumvented by the present invention.
Beschreibung
nach Anwendungsbeispiel
Es
werden z.B. fünf
Sammellinsen
Bei
der Drehung des Werkzeuges im Uhrzeigersinn bewegt sich das Linsensegment
Ein weitere Vorteil dieser Einführung ist das Spektrum von einem relativ großem Winkel hier 72 Grad auf dem der Laserstrahl wirkt dieser kann ohne Probleme auch noch größer oder bei Bedarf auch kleiner gewählt werden durch Änderung der Segmente Anzahl.One further advantage of this introduction is the spectrum from a relatively large angle here 72 degrees the laser beam works this can be larger or larger without problems if required also smaller be through change of the segments number.
Durch die genaue Focuszierung auf den Brennpunkt bietet sich eine Trennung des Werkzeugteils von der Optik der Einführung an genau dieser Stelle an.By the exact Focuszierung on the focal point offers a separation the tool part of the optics of the introduction at exactly this point at.
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE200410001949 DE102004001949A1 (en) | 2004-01-13 | 2004-01-13 | Laser machining system has a multi segment lens unit that focuses the laser output onto a parallel axis |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE200410001949 DE102004001949A1 (en) | 2004-01-13 | 2004-01-13 | Laser machining system has a multi segment lens unit that focuses the laser output onto a parallel axis |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE102004001949A1 true DE102004001949A1 (en) | 2005-08-11 |
Family
ID=34744716
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE200410001949 Withdrawn DE102004001949A1 (en) | 2004-01-13 | 2004-01-13 | Laser machining system has a multi segment lens unit that focuses the laser output onto a parallel axis |
Country Status (1)
| Country | Link |
|---|---|
| DE (1) | DE102004001949A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017216603A1 (en) | 2016-06-14 | 2017-12-21 | Evana Technologies, Uab | Laser processing method and a system for wafer dicing or cutting by use of a multi-segment focusing lens |
-
2004
- 2004-01-13 DE DE200410001949 patent/DE102004001949A1/en not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017216603A1 (en) | 2016-06-14 | 2017-12-21 | Evana Technologies, Uab | Laser processing method and a system for wafer dicing or cutting by use of a multi-segment focusing lens |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8122 | Nonbinding interest in granting licenses declared | ||
| 8139 | Disposal/non-payment of the annual fee |