DE10196082T1 - FLIP-CHIP-Montageverfahren - Google Patents

FLIP-CHIP-Montageverfahren

Info

Publication number: DE10196082T1
Authority: DE; Germany
Prior art keywords: flip; chip; assembly process; assembly
Prior art date: 2000-04-14
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Granted

Application number

DE10196082T

Other languages

English (en)

Other versions

DE10196082B4 (de

Inventor

Osamu Suzuki

Haruyuki Yoshii

Kenichi Suzuki

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Namics Corp

Original Assignee

Namics Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2000-04-14

Filing date

2001-04-13

Publication date

2003-03-13

2001-04-13 Application filed by Namics Corp filed Critical Namics Corp

2003-03-13 Publication of DE10196082T1 publication Critical patent/DE10196082T1/de

2007-06-14 Application granted granted Critical

2007-06-14 Publication of DE10196082B4 publication Critical patent/DE10196082B4/de

2021-04-14 Anticipated expiration legal-status Critical

Status Expired - Fee Related legal-status Critical Current

Classifications

- H10W74/012—
- H10W74/15—
- H10W72/073—
- H10W72/252—
- H10W72/321—
- H10W72/352—
- H10W72/354—
- H10W72/856—
- H10W90/724—
- H10W90/734—

DE10196082T 2000-04-14 2001-04-13 FLIP-CHIP-Montageverfahren Expired - Fee Related DE10196082B4 (de)

Applications Claiming Priority (3)

Application Number	Priority Date	Filing Date	Title
JP2000-113081		2000-04-14
JP2000113081A JP2002313841A (ja)	2000-04-14	2000-04-14	フリップチップ実装方法
PCT/JP2001/003183 WO2001080302A1 (fr)	2000-04-14	2001-04-13	Procede d'assemblage d'une puce a protuberances

Publications (2)

Publication Number	Publication Date
DE10196082T1 true DE10196082T1 (de)	2003-03-13
DE10196082B4 DE10196082B4 (de)	2007-06-14

Family

ID=18625119

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
DE10196082T Expired - Fee Related DE10196082B4 (de)	2000-04-14	2001-04-13	FLIP-CHIP-Montageverfahren

Country Status (4)

Country	Link
US (1)	US6841415B2 (de)
JP (1)	JP2002313841A (de)
DE (1)	DE10196082B4 (de)
WO (1)	WO2001080302A1 (de)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US7470564B2 (en) *	2002-10-28	2008-12-30	Intel Corporation	Flip-chip system and method of making same
KR100982708B1 (ko)	2003-03-28	2010-09-16	신닛테츠가가쿠 가부시키가이샤	전자장치의 제조방법
TW594955B (en) *	2003-06-30	2004-06-21	Advanced Semiconductor Eng	Flip chip package process
JP4514418B2 (ja) *	2003-07-24	2010-07-28	株式会社Adeka	ビニルエーテル硬化性組成物
JP2008177350A (ja) *	2007-01-18	2008-07-31	Fujitsu Ltd	電子装置の製造方法および製造装置
JP2008274080A (ja) *	2007-04-27	2008-11-13	Shin Etsu Chem Co Ltd	液状エポキシ樹脂組成物及び半導体装置
JP2009252869A (ja) *	2008-04-03	2009-10-29	Nec Electronics Corp	半導体装置の製造方法およびこの方法により製造された半導体装置
JP5329150B2 (ja) *	2008-08-12	2013-10-30	キヤノンマシナリー株式会社	ダイボンダ
US8895359B2 (en) *	2008-12-16	2014-11-25	Panasonic Corporation	Semiconductor device, flip-chip mounting method and flip-chip mounting apparatus
US8674502B2 (en) *	2010-07-16	2014-03-18	Hitachi Chemical Company, Ltd.	Semiconductor-encapsulating adhesive, semiconductor-encapsulating film-form adhesive, method for producing semiconductor device, and semiconductor device
EP2416633A1 (de) *	2010-08-04	2012-02-08	AT & S Austria Technologie & Systemtechnik Aktiengesellschaft	Verfahren ur Festlegung und/oder Einbettung eines elektronischen Bauteils sowie Kleber zur Verwendung in einem derartigen Verfahren
CN104170070B (zh) *	2012-08-06	2017-11-10	积水化学工业株式会社	半导体装置的制造方法及倒装片安装用粘接剂
JP5700186B1 (ja)	2013-07-08	2015-04-15	ソニー株式会社	硬化条件の決定方法、回路デバイスの製造方法及び回路デバイス
CN105051898B (zh) *	2013-08-23	2018-01-16	富士电机株式会社	半导体装置
WO2015131185A1 (en) *	2014-02-28	2015-09-03	Intellipaper, Llc	Integrated circuitry and methods for manufacturing same
US12476213B2 (en) *	2022-06-10	2025-11-18	Taiwan Semiconductor Manufacturing Company, Ltd.	Semiconductor package and method of manufacturing

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP2833111B2 (ja) *	1989-03-09	1998-12-09	日立化成工業株式会社	回路の接続方法及びそれに用いる接着剤フィルム
JP2532720B2 (ja) *	1990-05-21	1996-09-11	松下電器産業株式会社	回路基板及び半導体装置
US5128746A (en) *	1990-09-27	1992-07-07	Motorola, Inc.	Adhesive and encapsulant material with fluxing properties
JP2827522B2 (ja) *	1991-02-06	1998-11-25	松下電器産業株式会社	半導体素子の取り外し方法及び取り外し治具
JPH07312377A (ja) *	1994-05-19	1995-11-28	Fujitsu Ltd	半導体チップの実装方法と実装装置
JPH08337635A (ja) *	1995-06-12	1996-12-24	Sumitomo Bakelite Co Ltd	半導体封止用エポキシ樹脂組成物
KR100384314B1 (ko) *	1996-12-27	2003-05-16	마츠시타 덴끼 산교 가부시키가이샤	회로기판에의 전자부품 실장방법 및 장치
JP2850894B2 (ja) *	1997-02-05	1999-01-27	日本電気株式会社	半導体実装方法
JPH1167836A (ja) *	1997-08-21	1999-03-09	Fujitsu Ltd	半導体チップ実装方法
JP3564980B2 (ja) *	1997-11-28	2004-09-15	松下電工株式会社	半導体チップの実装方法
JP3092587B2 (ja) *	1998-04-22	2000-09-25	日本電気株式会社	半導体装置の製造方法
JP3951462B2 (ja) *	1998-06-30	2007-08-01	カシオ計算機株式会社	電子部品実装体及びその製造方法
JP2000156560A (ja) *	1998-11-20	2000-06-06	Toshiba Corp	電子部品の実装装置及びその実装方法
US6410415B1 (en) *	1999-03-23	2002-06-25	Polymer Flip Chip Corporation	Flip chip mounting technique
JP3625268B2 (ja) *	2000-02-23	2005-03-02	富士通株式会社	半導体装置の実装方法

2000
- 2000-04-14 JP JP2000113081A patent/JP2002313841A/ja active Pending
2001
- 2001-04-13 DE DE10196082T patent/DE10196082B4/de not_active Expired - Fee Related
- 2001-04-13 US US10/240,806 patent/US6841415B2/en not_active Expired - Lifetime
- 2001-04-13 WO PCT/JP2001/003183 patent/WO2001080302A1/ja not_active Ceased

Also Published As

Publication number	Publication date
DE10196082B4 (de)	2007-06-14
US20030059978A1 (en)	2003-03-27
US6841415B2 (en)	2005-01-11
JP2002313841A (ja)	2002-10-25
WO2001080302A1 (fr)	2001-10-25

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AR027931A1 (es)	2003-04-16	Antitranspirantes
DE10052925B4 (de)	2005-03-10	Schaukelbett
DE50007634D1 (de)	2004-10-07	Kardioplegieballonkatheter
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Legal Events

Date	Code	Title	Description
2005-02-24	8110	Request for examination paragraph 44
2007-12-06	8364	No opposition during term of opposition
2014-11-01	R119	Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee
2015-01-22	R119	Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee	Effective date: 20141101