DE10140670A1 - Solder paste, used for soft soldering electrical and/or electronic components, comprises a mixture of solder powder and a fluxing agent with a formic acid derivative as activator - Google Patents
Solder paste, used for soft soldering electrical and/or electronic components, comprises a mixture of solder powder and a fluxing agent with a formic acid derivative as activatorInfo
- Publication number
- DE10140670A1 DE10140670A1 DE2001140670 DE10140670A DE10140670A1 DE 10140670 A1 DE10140670 A1 DE 10140670A1 DE 2001140670 DE2001140670 DE 2001140670 DE 10140670 A DE10140670 A DE 10140670A DE 10140670 A1 DE10140670 A1 DE 10140670A1
- Authority
- DE
- Germany
- Prior art keywords
- activator
- solder
- solder paste
- formic acid
- mixture
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 34
- 239000012190 activator Substances 0.000 title claims abstract description 21
- 239000000843 powder Substances 0.000 title claims abstract description 11
- 239000000203 mixture Substances 0.000 title claims abstract description 5
- 238000005476 soldering Methods 0.000 title claims description 30
- 239000003795 chemical substances by application Substances 0.000 title abstract 3
- 150000004675 formic acid derivatives Chemical class 0.000 title abstract 2
- 238000000034 method Methods 0.000 claims abstract description 21
- 230000008569 process Effects 0.000 claims abstract description 18
- 230000004907 flux Effects 0.000 claims description 15
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 claims description 14
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 claims description 5
- 150000001875 compounds Chemical group 0.000 claims description 5
- 235000019253 formic acid Nutrition 0.000 claims description 5
- VZTDIZULWFCMLS-UHFFFAOYSA-N ammonium formate Chemical group [NH4+].[O-]C=O VZTDIZULWFCMLS-UHFFFAOYSA-N 0.000 claims description 4
- XZBIXDPGRMLSTC-UHFFFAOYSA-N formohydrazide Chemical group NNC=O XZBIXDPGRMLSTC-UHFFFAOYSA-N 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 239000012298 atmosphere Substances 0.000 description 4
- 239000011230 binding agent Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229910044991 metal oxide Inorganic materials 0.000 description 4
- 150000004706 metal oxides Chemical class 0.000 description 4
- SVTBMSDMJJWYQN-UHFFFAOYSA-N 2-methylpentane-2,4-diol Chemical compound CC(O)CC(C)(C)O SVTBMSDMJJWYQN-UHFFFAOYSA-N 0.000 description 2
- 206010013710 Drug interaction Diseases 0.000 description 2
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 2
- 230000004913 activation Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000003993 interaction Effects 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 238000010405 reoxidation reaction Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000013008 thixotropic agent Substances 0.000 description 2
- 239000002253 acid Substances 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000004359 castor oil Substances 0.000 description 1
- 235000019438 castor oil Nutrition 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010828 elution Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- ZEMPKEQAKRGZGQ-XOQCFJPHSA-N glycerol triricinoleate Natural products CCCCCC[C@@H](O)CC=CCCCCCCCC(=O)OC[C@@H](COC(=O)CCCCCCCC=CC[C@@H](O)CCCCCC)OC(=O)CCCCCCCC=CC[C@H](O)CCCCCC ZEMPKEQAKRGZGQ-XOQCFJPHSA-N 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- 150000007530 organic bases Chemical class 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 230000005070 ripening Effects 0.000 description 1
- 239000011780 sodium chloride Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3615—N-compounds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3618—Carboxylic acids or salts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
- B23K35/025—Pastes, creams, slurries
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
Die Erfindung betrifft eine Lotpaste und ein Verfahren zu ihrer Herstellung, mit der Weichlötungen an elektrischen und/oder elektronischen Bauteilen ausgeführt werden können, ohne ionogene Rückstände zu hinterlassen. The invention relates to a solder paste and a method for its production, with the Soft soldering on electrical and / or electronic components can be carried out can without leaving ionic residues.
Zur Herstellung einwandfreier Weichlotverbindungen und zur Vermeidung von Lötfehlern ist es erforderlich, sowohl von den Lotpulverteilchen als auch von den zu verbindenden Oberflächen die störenden Metalloxidschichten im Laufe des Lötprozesses zu entfernen und eine Reoxydation zu vermeiden. Dies wird in bekannter Weise durch den Einsatz von sogenannten Aktivatoren gelöst, die die Metalloxide in Metallverbindungen überführen. Üblicherweise werden hierzu organische Säuren oder Basen eingesetzt. Der Nachteil dieser Arbeitsweise besteht darin, daß nach dem Lötprozeß sowohl Reste der Aktivatoren als auch die bei der Aktivierung entstandenen Metallverbindungen vorhanden sind. Diese ionogenen Rückstände können einmal in Folge der Senkung des Oberflächenwiderstandes Kurzschlüsse hervorrufen und zum anderen durch Einwirkung von Feuchtigkeit zu Korrosionserscheinungen führen. To produce flawless soft solder connections and to avoid Soldering defects are required, both from the solder powder particles and from the to connecting surfaces the disruptive metal oxide layers in the course of Remove the soldering process and avoid reoxidation. This is done in a known manner solved by the use of so-called activators, which in the metal oxides Transfer metal connections. Usually organic acids or Bases used. The disadvantage of this way of working is that after Soldering process both residues of the activators as well as those created during activation Metal connections are present. These ionic residues can be found once in Result of the lowering of the surface resistance cause short circuits and to lead to corrosion by exposure to moisture.
Folgende Varianten zur Lösung des Problems sind bekannt gemacht worden:
- - Anwendung von speziellen Bindersystemen, die zur Einkapselung der ionogenen Rückstände führen, z. B. Lotpasten auf Basis Epoxiharze (siehe M. Läntzsch: Elektronikforum 04/1998). Nachteilig ist der aufwendige Lötprozeß und daß das Rückständeproblem nicht grundsätzlich gelöst ist.
- - Verzicht auf den Aktivatoreinsatz durch den Einsatz extrem oxidfreier Lotpulver und vorher gereinigter Oberflächen. Hierfür ist eine aufwendige Vorbehandlung erforderlich; die Gefahr der Reoxydation beim Löten an Luft bleibt jedoch bestehen.
- - Verwendung von Lotpasten mit mehreren Komponenten, die im Lötprozeß durch ihre Wirkungen miteinander die Reinigung der verwendeten Komponenten ermöglichen. In DE 42 17 445 wird ein aus zwei Komponenten bestehendes Flußmittel und seine Verwendung für eine Lotpaste beschrieben, in dem u. a. auch Ameisensäure enthalten ist. Diese und auch andere der verwendeten Bestandteile haben jedoch auf Grund der relativ hohen Dampfdrücke die nachteilige Eigenschaft, bereits vor dem Lötprozeß aus der Lotpaste auszudampfen und daher ohne Wirkung im Lötprozeß zu sein.
- - Löten unter solch einer reduzierenden Atmosphäre, die die Oxide in Metalle überführt, z. B. durch Löten in H2- oder CO-Atmosphäre. Beschrieben ist ein derartiger komplizierter und daher kostenaufwendiger Lötprozeß in US 4919729.
- - Kombination des Einsatzes oxidarmen Lotpulvers mit flüchtigen bzw. zersetzlichen Bindemitteln und Vornahme des Lötens unter Wechselwirkung mit einer reduzierende Aktivatoren enthaltenen Umgebung. Ein derartiges Lötverfahren und die dazu verwendete Lotpaste beschreibt DE 198 02 401 A1. Insbesondere die gewollte Wechselwirkung zwischen der Lotpaste und den Verfahrensparametern gestaltet den Lötprozeß sehr aufwendig. Ein Beispiel dieser Erfindung sieht die Verwendung von Ameisensäure als dampfförmigen Aktivator in einem Azeotrop vor. Für dessen Einsatz sind besondere Vorrichtungen erforderlich, wie sie z. B. in DE 38 13 931 dargestellt ist. Die Verwendung an offener Atmosphäre ist ausgeschlossen.
- - Anwendung von reaktiven Atmosphären, die zu flüchtigen oder leicht
zersetzlichen Endprodukten führen. Ein sogenanntes Schutzgaslötverfahren nach diesem
Prinzip ist dargestellt in DE 38 13 931. Der Nachteil dieses aufwendigen
Lötverfahrens besteht darin, daß die gesamte Baugruppe der Einwirkung der aggressiven
Säuredämpfe ausgesetzt ist. Dies führt u. a. dazu, daß die aufgebrachten
Lötstopplacke, die zur Einhaltung der Lötgeometrien benötigt werden, angegriffen
werden und es dadurch zu nicht tolerierbaren Lötfehlern kommt.
Die Anwendung des Verfahren an offener Atmosphäre ist ebenfalls ausgeschlossen.
- - Application of special binder systems that lead to the encapsulation of the ionogenic residues, e.g. B. solder pastes based on epoxy resins (see M. Läntzsch: Electronics Forum 04/1998). The disadvantage is the complex soldering process and that the residue problem is not fundamentally solved.
- - The activator is not used due to the use of extremely oxide-free solder powder and previously cleaned surfaces. This requires extensive pretreatment; however, the risk of reoxidation when soldering in air remains.
- - Use of solder pastes with several components, the effects of which enable the cleaning of the components used in the soldering process. DE 42 17 445 describes a flux consisting of two components and its use for a solder paste, which also contains formic acid. However, due to the relatively high vapor pressures, these and also other of the components used have the disadvantageous property that they evaporate out of the solder paste before the soldering process and therefore have no effect in the soldering process.
- - Soldering under such a reducing atmosphere that converts the oxides into metals, e.g. B. by soldering in H 2 or CO atmosphere. Such a complicated and therefore costly soldering process is described in US 4919729.
- - Combination of the use of low-oxide solder powder with volatile or decomposable binders and carrying out the soldering in interaction with an environment containing reducing activators. Such a soldering process and the solder paste used for this purpose are described in DE 198 02 401 A1. In particular, the intended interaction between the solder paste and the process parameters makes the soldering process very complex. An example of this invention provides the use of formic acid as a vapor activator in an azeotrope. For its use special devices are required, such as. B. is shown in DE 38 13 931. Use in an open atmosphere is excluded.
- - Use of reactive atmospheres that lead to volatile or easily decomposable end products. A so-called protective gas soldering process according to this principle is shown in DE 38 13 931. The disadvantage of this complex soldering process is that the entire assembly is exposed to the action of the aggressive acid vapors. This leads, among other things, to the fact that the applied solder resists, which are required to maintain the soldering geometries, are attacked and this leads to intolerable soldering errors.
The use of the process in an open atmosphere is also excluded.
Die vorliegende Erfindung hat das Ziel, eine Lotpaste bereitzustellen, bei der im Flußmittel enthaltene Aktivatoren dafür sorgen, daß nach dem Lötprozeß auf den gelöteten elektrischen und/oder elektronischen Bauteilen keine ionogenen Rückstände verbleiben. The present invention aims to provide a solder paste in which Activators containing flux ensure that after the soldering process on the soldered electrical and / or electronic components no ionogenic Residues remain.
Aufgabe der Erfindung ist es, eine Lotpaste zur Verfügung zustellen, mit der im Lötprozeß durch autogene Abläufe Oxidschichten sowohl vom Lotpulver als auch von den Oberflächen der zu verbindenden Bauteile beseitigt werden können. Das soll geschehen durch den Einsatz solcher Aktivatoren, die zum einen die störenden Metalloxide entweder zu Metall reduzieren oder in Verbindungen überführen, die unterhalb der Löttemperatur flüchtig oder zersetzlich sind unter Bildung nichtionogener Rückstände und die zum anderen beim Erreichen der Löttemperatur selbst rückstandslos flüchtig sind, wodurch überschüssige Mengen an Aktivatoren beseitigt werden. The object of the invention is to provide a solder paste with which Soldering process through oxyfuel processes Oxide layers of both the solder powder and the surfaces of the components to be connected can be eliminated. It has to be happen through the use of such activators, on the one hand the disruptive Metal oxides either reduce to metal or convert them into compounds that below the soldering temperature are volatile or decomposable to form nonionic Residues and the other when reaching the soldering temperature itself are completely volatile, which eliminates excess amounts of activators become.
Die Aufgabe wird dadurch gelöst, das aus für das Weichlöten geeigneten Lotpulvern Lotpasten hergestellt werden, bei denen das verwendete Flußmittel feste Aktivatoren in Form von festen chemischen Verbindungen der Ameisensäure enthält. Derartige Verbindungen können Ammoniumformiat oder Formylhydrazin sein. Sie reduzieren die Metalloxide oder überführen diese in zersetzliche oder flüchtige Spezies. Ihre Überschußanteile zerfallen rückstandslos bereits unterhalb der Löttemperatur. Diese Aktivatoren sind für alle Werkstoffe geeignet, die selbst für das Weichlöten geeignet sind. Ihre Verwendung ermöglicht das Löten an Luft ohne Schutzgas oder Fremdaktivierung, benötigt keine Vorbehandlung der zu verbindenden Teile und führt zu Lötverbindungen, die frei von ionogenen Rückständen sind. Ferner sind keine speziellen Flußmittelsysteme erforderlich. Die Flußmittel können je nach gewünschter Verarbeitungsweise und verlangtem Anwendungszweck aus einem Gemisch von Binder, Lösungsmitteln und Zusätzen (z. B. Thixotropiermittel) bestehen, um die erforderlichen Eigenschaften der herzustellenden Lotpasten, wie Druckbarkeit, Naßklebekraft und Lagerbeständigkeit zu gewährleisten. Diese Eigenschaften werden in keiner Weise durch den Zusatz der erfindungsgemäßen Aktivatoren nachteilig beeinflußt. Der Gehalt der erfindungsgemäßen Aktivatoren in den Flußmitteln kann in einem weiten Bereich schwanken. Vorzugsweise wird mit Gehalten von 1-5 Ma-% gearbeitet. The object is achieved by using solder powders suitable for soft soldering Solder pastes are made in which the flux used is solid activators contains in the form of solid chemical compounds of formic acid. such Compounds can be ammonium formate or formyl hydrazine. You reduce the metal oxides or convert them into decomposable or volatile species. Your Excess parts disintegrate without residue even below the soldering temperature. This Activators are suitable for all materials, even suitable for soft soldering are. Their use enables soldering in air without protective gas or External activation, does not require any pretreatment of the parts to be connected and leads to Solder connections that are free of ionic residues. Furthermore, there are no special ones Flux systems required. The flux can vary depending on the desired Processing method and required application from a mixture of binder, Solvents and additives (e.g. thixotropic agents) exist to make the required properties of the solder pastes to be produced, such as printability, wet adhesive strength and to ensure shelf life. These properties are in none Way adversely affected by the addition of the activators of the invention. The content of the activators according to the invention in the flux can be in one fluctuate wide range. Preferably with levels of 1-5% by mass worked.
Zur Herstellung von 120 g eines Flußmittels wurde der Binder Foral AX-E (Handelsname der Fa. Hercules) in einem Gemisch von 2-Methyl-2,4-Pentandiol und Triethylenglykol gelöst. Nach Zusatz von 3 g Ammoniumformiat und entsprechender Einarbeitung wurde soviel amidmodifiziertes, hydriertes Rizinusöl-Thixotropiermittel zugefügt, daß die Viskosität des Flußmittels nach einer Reifezeit von 14 d im Bereich 100-130 [Pas] lag (gemessen mit dem Brookfield-Viskosimeter). For the preparation of 120 g of a flux, the binder Foral AX-E (Trade name of Hercules) in a mixture of 2-methyl-2,4-pentanediol and Triethylene glycol dissolved. After adding 3 g of ammonium formate and the like So much amide-modified, hydrogenated castor oil thixotropic agent was incorporated added that the viscosity of the flux after a ripening time of 14 d in the range 100-130 [Pas] was (measured with the Brookfield viscometer).
Zur Herstellung von 1 kg einer bleifreien Lotpaste wurden 100 g des Flußmittels vorgelegt und ca. 900 g eines SnAg3,5-Lotpulvers (3-Korn) eingerührt. Die Viskosität der Paste wurde im Bereich von 500-550 [Pas] eingestellt. 100 g of the flux was used to produce 1 kg of a lead-free solder paste submitted and stirred in about 900 g of a SnAg3.5 solder powder (3-grain). The viscosity the paste was set in the range of 500-550 [Pas].
Nach einer Standzeit von 8 d ließ sich diese Paste einwandfrei verarbeiten. Zum Test wurden Leiterplatten bedruckt und anschließend in einem Reflow-Ofen bei 250°C gelötet. Man erhielt einwandfreie Lötstellen. Der Test auf ionogene Rückstände (Elutionstest gemäß MIL-P-28809) ergab Werte weit unter dem Grenzwert von 1,3 µg NaCl/cm2. After a standing time of 8 d, this paste could be processed perfectly. For the test, printed circuit boards were printed and then soldered in a reflow oven at 250 ° C. Flawless solder joints were obtained. The test for ionic residues (elution test according to MIL-P-28809) showed values well below the limit of 1.3 µg NaCl / cm 2 .
Claims (6)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE2001140670 DE10140670A1 (en) | 2001-08-18 | 2001-08-18 | Solder paste, used for soft soldering electrical and/or electronic components, comprises a mixture of solder powder and a fluxing agent with a formic acid derivative as activator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE2001140670 DE10140670A1 (en) | 2001-08-18 | 2001-08-18 | Solder paste, used for soft soldering electrical and/or electronic components, comprises a mixture of solder powder and a fluxing agent with a formic acid derivative as activator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE10140670A1 true DE10140670A1 (en) | 2003-03-13 |
Family
ID=7695950
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE2001140670 Ceased DE10140670A1 (en) | 2001-08-18 | 2001-08-18 | Solder paste, used for soft soldering electrical and/or electronic components, comprises a mixture of solder powder and a fluxing agent with a formic acid derivative as activator |
Country Status (1)
| Country | Link |
|---|---|
| DE (1) | DE10140670A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20170033068A1 (en) * | 2014-12-23 | 2017-02-02 | Intel Corporation | Formation of solder and copper interconnect structures and associated techniques and configurations |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3813931A1 (en) * | 1988-04-25 | 1989-11-02 | Heino Pachschwoell | Inert-gas soldering method and device for carrying out this method |
| US4919729A (en) * | 1988-06-08 | 1990-04-24 | International Business Machines Corporation | Solder paste for use in a reducing atmosphere |
| EP0510539A1 (en) * | 1991-04-17 | 1992-10-28 | Yuho Chemicals Inc. | Additive for fluxes and soldering pastes |
| DE4217445A1 (en) * | 1991-05-27 | 1992-12-03 | Mec Co | LOET FLUX AND LOET PASTE COMPOSITION |
-
2001
- 2001-08-18 DE DE2001140670 patent/DE10140670A1/en not_active Ceased
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3813931A1 (en) * | 1988-04-25 | 1989-11-02 | Heino Pachschwoell | Inert-gas soldering method and device for carrying out this method |
| US4919729A (en) * | 1988-06-08 | 1990-04-24 | International Business Machines Corporation | Solder paste for use in a reducing atmosphere |
| EP0510539A1 (en) * | 1991-04-17 | 1992-10-28 | Yuho Chemicals Inc. | Additive for fluxes and soldering pastes |
| DE4217445A1 (en) * | 1991-05-27 | 1992-12-03 | Mec Co | LOET FLUX AND LOET PASTE COMPOSITION |
Non-Patent Citations (2)
| Title |
|---|
| JP 02175094 A in Derwent Abstr. Nr. 90-25087133 * |
| SU 625 878 in Derwent Abstr. Nr. 1979-5411B/29 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20170033068A1 (en) * | 2014-12-23 | 2017-02-02 | Intel Corporation | Formation of solder and copper interconnect structures and associated techniques and configurations |
| US10068863B2 (en) * | 2014-12-23 | 2018-09-04 | Intel Corporation | Formation of solder and copper interconnect structures and associated techniques and configurations |
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