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DE10081456T1 - Vefahren und Vorrichtung zum doppelseitigen Polieren - Google Patents

Vefahren und Vorrichtung zum doppelseitigen Polieren

Info

Publication number
DE10081456T1
DE10081456T1 DE10081456T DE10081456T DE10081456T1 DE 10081456 T1 DE10081456 T1 DE 10081456T1 DE 10081456 T DE10081456 T DE 10081456T DE 10081456 T DE10081456 T DE 10081456T DE 10081456 T1 DE10081456 T1 DE 10081456T1
Authority
DE
Germany
Prior art keywords
double
sided polishing
sided
polishing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE10081456T
Other languages
English (en)
Other versions
DE10081456B9 (de
DE10081456B3 (de
Inventor
Akira Horiguchi
Ken Isobe
Tsuneo Takeda
Tomio Fukushima
Kiyohide Murata
Yoshiaki Uzu
Hiroshi Matsumoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kashiwara Machine Manufacturing Co Ltd Kashiwara Osaka
Sumco Corp
Original Assignee
Sumitomo Metal Industries Ltd
Kashiwara Machine Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP13563799A external-priority patent/JP2000326213A/ja
Priority claimed from JP13565299A external-priority patent/JP4294162B2/ja
Priority claimed from JP13563199A external-priority patent/JP4235313B2/ja
Application filed by Sumitomo Metal Industries Ltd, Kashiwara Machine Manufacturing Co Ltd filed Critical Sumitomo Metal Industries Ltd
Publication of DE10081456T1 publication Critical patent/DE10081456T1/de
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/005—Feeding or manipulating devices specially adapted to grinding machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/10—Single-purpose machines or devices
    • B24B7/16—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings
    • B24B7/17—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings for simultaneously grinding opposite and parallel end faces, e.g. double disc grinders

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
DE10081456T 1999-05-17 2000-05-17 Vefahren und Vorrichtung zum doppelseitigen Polieren Granted DE10081456T1 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP13563799A JP2000326213A (ja) 1999-05-17 1999-05-17 両面研摩方法及び装置
JP13565299A JP4294162B2 (ja) 1999-05-17 1999-05-17 両面研摩装置
JP13563199A JP4235313B2 (ja) 1999-05-17 1999-05-17 両面研摩装置
PCT/JP2000/003159 WO2000069597A1 (en) 1999-05-17 2000-05-17 Method and device for polishing double sides

Publications (1)

Publication Number Publication Date
DE10081456T1 true DE10081456T1 (de) 2001-09-27

Family

ID=27317117

Family Applications (2)

Application Number Title Priority Date Filing Date
DE10081456.5A Expired - Lifetime DE10081456B9 (de) 1999-05-17 2000-05-17 Vorrichtung zum doppelseitigen Polieren
DE10081456T Granted DE10081456T1 (de) 1999-05-17 2000-05-17 Vefahren und Vorrichtung zum doppelseitigen Polieren

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE10081456.5A Expired - Lifetime DE10081456B9 (de) 1999-05-17 2000-05-17 Vorrichtung zum doppelseitigen Polieren

Country Status (3)

Country Link
US (2) US7648409B1 (de)
DE (2) DE10081456B9 (de)
WO (1) WO2000069597A1 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE112010003696B4 (de) 2009-09-18 2023-03-23 Sumco Corp. Polierverfahren und Poliervorrichtung

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US7648409B1 (en) * 1999-05-17 2010-01-19 Sumitomo Mitsubishi Silicon Corporation Double side polishing method and apparatus
US6620257B1 (en) * 1999-06-30 2003-09-16 Hoya Corporation Scrub cleaning method for substrate and manufacturing method for information recording medium
US8602842B2 (en) 2010-03-12 2013-12-10 Wayne O. Duescher Three-point fixed-spindle floating-platen abrasive system
US8740668B2 (en) 2010-03-12 2014-06-03 Wayne O. Duescher Three-point spindle-supported floating abrasive platen
US8500515B2 (en) 2010-03-12 2013-08-06 Wayne O. Duescher Fixed-spindle and floating-platen abrasive system using spherical mounts
US8647171B2 (en) 2010-03-12 2014-02-11 Wayne O. Duescher Fixed-spindle floating-platen workpiece loader apparatus
DE102010043627A1 (de) 2010-11-09 2012-05-10 Siltronic Ag Verfahren und Vorrichtung zum Reinigen von Poliertüchern
JP5671735B2 (ja) * 2011-01-18 2015-02-18 不二越機械工業株式会社 両面研磨装置
DE102011080323A1 (de) * 2011-08-03 2013-02-07 Siltronic Ag Verfahren zum Einebnen einer Halbleiterscheibe mit verbesserter Kantenschonung
US8807318B2 (en) * 2011-09-20 2014-08-19 International Business Machines Corporation Multi-generational carrier platform
US9499921B2 (en) 2012-07-30 2016-11-22 Rayton Solar Inc. Float zone silicon wafer manufacturing system and related process
KR101438971B1 (ko) * 2012-12-27 2014-09-15 현대자동차주식회사 로봇그리퍼 및 그 제어방법
JP6113624B2 (ja) * 2013-10-11 2017-04-12 株式会社荏原製作所 基板処理装置および基板処理方法
US9138914B1 (en) * 2014-01-09 2015-09-22 Joshua Higgins Masonry veneer machine
DE102015220090B4 (de) * 2015-01-14 2021-02-18 Siltronic Ag Verfahren zum Abrichten von Poliertüchern
JP6491024B2 (ja) * 2015-04-20 2019-03-27 不二越機械工業株式会社 両面研磨装置および研磨方法
CN106926133B (zh) * 2017-04-19 2019-02-01 深圳市长盈精密技术股份有限公司 陶瓷工件的抛光方法
CN108453598B (zh) * 2018-03-02 2020-12-22 泰州永林机械有限公司 一种机械铁质板材表面双层同步抛光设备
CN112658833A (zh) * 2021-01-04 2021-04-16 张友 一种整体式轴瓦内圈全自动研磨设备
CN113894635B (zh) * 2021-11-03 2022-06-21 安徽格楠机械有限公司 基于自学习的智能硅基晶圆超精密研磨抛光机
CN115157088B (zh) * 2022-07-25 2024-07-02 佛山市精研方硕模具有限公司 一种太阳能电板模具生产用加工系统及加工方法
CN115533739A (zh) * 2022-09-21 2022-12-30 中国电子科技集团公司第二十九研究所 一种热沉载板表面超薄镀层均匀研磨抛光用组合工装
CN116494028B (zh) * 2023-06-29 2023-09-22 苏州磐宇科技发展有限公司 一种冶金零件磁力抛光机
WO2025058320A1 (ko) * 2023-09-12 2025-03-20 정인권 반도체 기판 연마 장치
CN117428580B (zh) * 2023-12-15 2024-03-19 成都市凯林机械贸易有限责任公司 一种阀门加工用抛光装置
CN119609941A (zh) * 2024-12-09 2025-03-14 西安奕斯伟材料科技股份有限公司 一种抛光垫修整设备、方法及控制装置

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE112010003696B4 (de) 2009-09-18 2023-03-23 Sumco Corp. Polierverfahren und Poliervorrichtung

Also Published As

Publication number Publication date
US8002610B2 (en) 2011-08-23
US7648409B1 (en) 2010-01-19
DE10081456B9 (de) 2016-11-03
WO2000069597A1 (en) 2000-11-23
DE10081456B3 (de) 2016-09-15
US20100130111A1 (en) 2010-05-27

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Legal Events

Date Code Title Description
8110 Request for examination paragraph 44
8607 Notification of search results after publication
8127 New person/name/address of the applicant

Owner name: KASHIWARA MACHINE MFG. CO., LTD., KASHIWARA, OSAKA

Owner name: SUMITOMO MITSUBISHI SILICON CORP., TOKIO/TOYKO, JP

R016 Response to examination communication
R018 Grant decision by examination section/examining division
R083 Amendment of/additions to inventor(s)
R020 Patent grant now final
R071 Expiry of right