DE1063228B - Process for the production of electrical and electronic devices with printed circuits - Google Patents
Process for the production of electrical and electronic devices with printed circuitsInfo
- Publication number
- DE1063228B DE1063228B DEJ12815A DEJ0012815A DE1063228B DE 1063228 B DE1063228 B DE 1063228B DE J12815 A DEJ12815 A DE J12815A DE J0012815 A DEJ0012815 A DE J0012815A DE 1063228 B DE1063228 B DE 1063228B
- Authority
- DE
- Germany
- Prior art keywords
- electronic devices
- electrical
- production
- printed circuits
- german patent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims description 5
- 238000004519 manufacturing process Methods 0.000 title claims description 4
- 239000000853 adhesive Substances 0.000 claims description 6
- 230000001070 adhesive effect Effects 0.000 claims description 6
- 239000012790 adhesive layer Substances 0.000 claims description 3
- 229920001296 polysiloxane Polymers 0.000 claims description 3
- 235000013870 dimethyl polysiloxane Nutrition 0.000 claims description 2
- 239000004205 dimethyl polysiloxane Substances 0.000 claims description 2
- 229920001971 elastomer Polymers 0.000 claims description 2
- 239000000945 filler Substances 0.000 claims description 2
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims description 2
- 239000004848 polyfunctional curative Substances 0.000 claims description 2
- 238000003825 pressing Methods 0.000 description 2
- 229920002379 silicone rubber Polymers 0.000 description 2
- 239000004945 silicone rubber Substances 0.000 description 2
- 239000004568 cement Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 235000011837 pasties Nutrition 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
- H05K3/305—Affixing by adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0133—Elastomeric or compliant polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Adhesives Or Adhesive Processes (AREA)
Description
Verfahren zur Herstellung elektrischer und elektronischer Geräte mit gedruckten Schaltungen Die Hauptpatentanmeldung beschreibt ein Verfahren zur Herstellung elektrischer und elektronischer Geräte mit gedruckten Schaltungen unter Verwendung von Druckplatten, die mit einem auf Druck klebenden Silikonkitt beschichtet sind und bei denen die Bauelemente durch Aufdrücken auf diese Klebschicht befestigt werden. Als Klebmittel ist insbesondere der unter der Bezeichnung »bouncing putty« bekanntgewordene elastische Silikonkitt mit Rückprallelastizität vorgeschlagen, der gegebenenfalls, wie in der deutschen Patentschrift 957 156 beschrieben, einen erheblichen Anteil Polyvinylchlorid enthalten kann.Process for the production of electrical and electronic devices with printed circuits The main patent application describes a method of manufacture electric and electronic devices with printed circuit boards using of printing plates that are coated with a silicone cement that adheres to the pressure and in which the components are attached by pressing onto this adhesive layer. The adhesive that has become known as “bouncing putty” is particularly known as an adhesive elastic silicone putty with rebound resilience proposed, which, if necessary, as described in German patent specification 957 156, a considerable proportion May contain polyvinyl chloride.
Es wurde nun weiterhin gefunden, daß das an sich bereits als Klebmittel vorgeschlagene füllstoff-, härte-und vulkanisationsmittelfreie Dimethylpolysiloxankautschuk-Gel, einfach als angefüllter Silikonkautschuk zu bezeichnen, sich mit Vorteil zur Beschichtung der Druckplatten eignet. Dieses hochviskose, pastenförmige und klebrige Produkt kann leicht in dünner Schicht aufgetragen werden, wozu es z. B. aufgepreßt bzw. aufgewalzt, oder auch aus einer Lösung oder Dispersion aufgebracht wird.It has now also been found that this in itself is already used as an adhesive proposed filler, hardener and vulcanizing agent-free dimethylpolysiloxane rubber gel, easy to describe as filled silicone rubber, with advantage for coating of the printing plates. This highly viscous, pasty and sticky product can easily be applied in a thin layer. B. pressed on or rolled on, or applied from a solution or dispersion.
Das Klebmittel, das seine Eigenschaften und seine Konsistenz in einem weiten Temperaturbereich, etwa -60 bis -f-250° C, und in längeren Zeiträumen nicht ändert, zeigt darüber hinaus besonders auch bei dynamischen Beanspruchungen überraschende Bindefestigkeiten. Die nach der Hauptpatentanmeldung nur durch Aufdrücken auf die Klebschicht der Druckplatten befestigten Bauelemente werden somit auch nach dem Herstellen der Verbindungen zwischen den Leitungszügen und den Anschlüssen der Bauelemente, z. B. durch Tauchlöten, mittels des hier vorgeschlagenen Klebmittels zusätzlich unveränderlich gehalten. Weitere, besondere Befestigungsmittel erübrigen sich.The adhesive that combines its properties and consistency in one wide temperature range, around -60 to -f-250 ° C, and not for longer periods of time changes, shows also surprising especially with dynamic loads Bond strengths. The after the main patent application only by pressing on the Adhesive layer of the printing plates attached components are thus also after Establishing the connections between the cable runs and the connections of the components, z. B. by dip soldering, additionally by means of the adhesive proposed here held immutable. Further, special fasteners are unnecessary.
Der angefüllte Silikonkautschuk besitzt einen ausgeprägten kalten Fluß, so daß die aufgeklebten Teile trotz der hohen Bindefestigkeit des Produktes an sich, mit der Zeit einfach wegschwimmen können. Bei der erfindungsgemäßen Verwendung genügen jedoch die die Druckplatten durchragenden Anschlüsse der Bauelemente zur Festhaltung. Bei Bedarf können zusätzliche einfachste Befestigungsmittel, wie z. B. Stifte, Laschen od. dgl., Verwendung finden.The filled silicone rubber has a pronounced cold Flow, so that the glued parts in spite of the high bond strength of the product in itself, being able to simply swim away over time. When used according to the invention however, the connections of the components protruding through the pressure plates are sufficient Detention. If necessary, additional simple fastening means, such as. B. pins, tabs or the like., Use.
Claims (2)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DEJ12815A DE1063228B (en) | 1957-02-11 | 1957-02-11 | Process for the production of electrical and electronic devices with printed circuits |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DEJ12815A DE1063228B (en) | 1957-02-11 | 1957-02-11 | Process for the production of electrical and electronic devices with printed circuits |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE1063228B true DE1063228B (en) | 1959-08-13 |
Family
ID=7199162
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DEJ12815A Pending DE1063228B (en) | 1957-02-11 | 1957-02-11 | Process for the production of electrical and electronic devices with printed circuits |
Country Status (1)
| Country | Link |
|---|---|
| DE (1) | DE1063228B (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE941090C (en) * | 1952-07-02 | 1956-04-05 | Dow Corning | Adhesives, including in the form of adhesive strips |
| DE1016391B (en) | 1957-01-18 | 1957-09-26 | Helmut Jedlicka | Method of joining any materials with the simultaneous use of adhesives and mechanical means |
-
1957
- 1957-02-11 DE DEJ12815A patent/DE1063228B/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE941090C (en) * | 1952-07-02 | 1956-04-05 | Dow Corning | Adhesives, including in the form of adhesive strips |
| DE1016391B (en) | 1957-01-18 | 1957-09-26 | Helmut Jedlicka | Method of joining any materials with the simultaneous use of adhesives and mechanical means |
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