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DD99599A1 - Composition for polishing the surfaces of solid bodies - Google Patents

Composition for polishing the surfaces of solid bodies

Info

Publication number
DD99599A1
DD99599A1 DD16642672A DD16642672A DD99599A1 DD 99599 A1 DD99599 A1 DD 99599A1 DD 16642672 A DD16642672 A DD 16642672A DD 16642672 A DD16642672 A DD 16642672A DD 99599 A1 DD99599 A1 DD 99599A1
Authority
DD
German Democratic Republic
Prior art keywords
polishing
composition
solid bodies
bodies
solid
Prior art date
Application number
DD16642672A
Other languages
German (de)
Inventor
Alexandr Serafimovich Artemov
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to DD16642672A priority Critical patent/DD99599A1/en
Publication of DD99599A1 publication Critical patent/DD99599A1/en

Links

DD16642672A 1972-10-23 1972-10-23 Composition for polishing the surfaces of solid bodies DD99599A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DD16642672A DD99599A1 (en) 1972-10-23 1972-10-23 Composition for polishing the surfaces of solid bodies

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DD16642672A DD99599A1 (en) 1972-10-23 1972-10-23 Composition for polishing the surfaces of solid bodies

Publications (1)

Publication Number Publication Date
DD99599A1 true DD99599A1 (en) 1973-08-12

Family

ID=5488651

Family Applications (1)

Application Number Title Priority Date Filing Date
DD16642672A DD99599A1 (en) 1972-10-23 1972-10-23 Composition for polishing the surfaces of solid bodies

Country Status (1)

Country Link
DD (1) DD99599A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2722780A1 (en) * 1977-05-20 1978-11-23 Wacker Chemitronic LAEP RELEASE AGENT
EP2075106A4 (en) * 2006-10-20 2012-04-11 Mitsubishi Electric Corp THICK SUSPENSION FOR SILICON INGOT CUTTING AND METHOD OF CUTTING SILICON INGOTS WITH THE SAME

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2722780A1 (en) * 1977-05-20 1978-11-23 Wacker Chemitronic LAEP RELEASE AGENT
EP2075106A4 (en) * 2006-10-20 2012-04-11 Mitsubishi Electric Corp THICK SUSPENSION FOR SILICON INGOT CUTTING AND METHOD OF CUTTING SILICON INGOTS WITH THE SAME

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