DD268804A1 - DEVICE FOR THE ASSEMBLY OF ELECTRONIC COMPONENTS IN THE STRUCTURE ASSEMBLY - Google Patents

Abstract

The invention relates to a device for separating electronic components in Traeger strip association. The invention is applicable in microelectronics in the manufacture of electronic components. According to the invention, the singulation is carried out in individual components from the strip of dressers by means of a device comprising a roller transport system and two laser heads. The laser beams cut the components out of the strip of haulers. The inventive solution during the separation no mechanical stress on the components.

Description

Field of application of the invention

The invention is applicable in microelectronics in the manufacture of electronic components.

Cha.-akteristik of the known technical solutions

Modern technologies for the production of electronic components assume that semiconductor chips are mounted on metallic carriers. The metallic carriers are in the form of carrier strips or bands. Parts of the carrier strip enter the finished component as chip carriers and connections. During Mondays, these connections are connected by transverse and intermediate webs. After sealing, the carrier strip is separated into components by trimming. The separation takes place in tools that intermittently by the stroke of a press that punches the components of the carrier strip. The T rägerstreifen be promoted by a feed device in the tool and mechanically ejected the isolated components and the remains of the carrier strips. The separation works intermittently, purely mechanically and hard. Especially the plastic or plastic closures are exposed to great stress. Damage to the plastic housings and to the component connections can occur.

Furthermore, the service life of the separating tool is limited by the cyclic loading of the cutting edges.

Another way of separating components from the carrier strip association is described in WP 232140. Here, the separation takes place by means of rollers. There are also considerable mechanical stresses.

Object of the invention

The object of the invention is to develop a device with which components can be separated from a carrier strip continuously without mechanical stress.

Disclosure of the essence of the invention

From this, taking into account the disadvantages of the known devices, the task to be solved is derived from designing the device so that the trimming process takes into account the shape of the closed component and the carrier so that a continuous and harmless to the device and the tool-friendly Editing is possible. According to the invention, this object is achieved in that the device is composed of a transport system and two laser heads. By means of a roller transport system, the carrier strips are continuously arranged and guided in the correct position through the two laser strips. The two laser beams cut out the components from the carrier tape. The roll transport system transports the waste out of the device.

The solution according to the invention does not cause mechanical stress on the components during singulation.

The device can be used by adjusting the laser heads and switching the roller transport system for separating different electronic components.

embodiment

The invention will be explained in more detail below using an exemplary embodiment. The principle solution illustrated in FIG. 1 serves this purpose. The embodiment includes singulating transistors from a carrier strip assembly.

The carrier strips 1 are fed to the transport rollers 2 via a rail or a roller belt. The guide rollers 3 position the carrier strip 1 and thus the einzzelnan components in the correct position to the two laser beams 5. The two laser beams 5 cut you, components from the carrier strip association. The waste is transported out of the device by the transport roller 4. D jrch a continuously variable motor 6 are driven by toothed belt 7, the individual roles.

Claims (1)

Device for separating electronic components in the carrier strip association, characterized in that the verplasteten carrier strips or carrier tapes via an adjustable roller transport system continuously ordered and in the correct position by two laser beams, which are generated by two adjustable Laserköpfan performed and separated into electronic components. For this 1 page drawing Field of application of the invention The invention is applicable in microelectronics in the manufacture of electronic components. Characteristic of the known technical solutions Modern technologies for the production of electronic components assume that semiconductor chips are mounted on metallic carriers. The metallic carriers are in the form of carrier strips or bands. Parts of the carrier strip enter the finished component as chip carriers and connections. During the Monday? these connections are connected by transverse and intermediate webs. After sealing, the carrier strip is separated into components by trimming. The separation takes place in tools that intermittently by the stroke of a press that punches the components of the carrier strip. The carrier strips are conveyed by a feed device into the tool and mechanically ejected the separated components and the remainders of the carrier strips. The separation works intermittently, purely mechanically and hard. Especially the plastic or plastic closures are exposed to great stress. Damage to the plastic housings and to the component connections can occur. Furthermore, the service life of the separating tool is limited by the cyclic loading of the cutting edges. Another way of separating components from the carrier strip association is described in WP 232140. Here, the separation takes place by means of rollers. There are also considerable mechanical stresses. Object of the invention The object of the invention is to develop a device with which components can be separated from a carrier strip continuously without mechanical stress. Explanation of the essence of the invention Lead it! Taking into account the disadvantages of the known devices, the task to be solved so from the device to be designed so that the trimming the form of the closed component and the carrier considered so that a continuous and harmless for the component and the tool-friendly machining possible is. According to the invention, this object is achieved in that the device is composed of a transport system and two laser heads. By means of a roller transport system, the carrier strips are continuously arranged and guided in the correct position through the two laser strips. The two laser beams cut out the components bus from the carrier tape. The roll transport system transports the waste out of the device. The solution according to the invention does not cause mechanical stress on the components during singulation. The device can be used by adjusting the laser heads and switching the roller transport system for separating different electronic components. exemplary The invention will be explained in more detail below on a Ausführungsbeiäpiel. The principle solution illustrated in FIG. 1 serves this purpose. The embodiment involves the isolation of transistors from a carrier strip assembly. The carrier strips 1 are fed to the transport rollers 2 via a rail or a roller belt. The guide rollers 3 position the carrier strip 1 and thus the einzzelnsn components in the correct position to the two laser beams 5. The two laser beams 5 cut di> v components from the carrier strip association. The waste is transported out of the device by the transport roller 4. D jrch a continuously variable motor 6 are driven by toothed belt 7, the individual roles.