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CZ21995A3 - Chip module - Google Patents

Chip module

Info

Publication number
CZ21995A3
CZ21995A3 CZ95219A CZ21995A CZ21995A3 CZ 21995 A3 CZ21995 A3 CZ 21995A3 CZ 95219 A CZ95219 A CZ 95219A CZ 21995 A CZ21995 A CZ 21995A CZ 21995 A3 CZ21995 A3 CZ 21995A3
Authority
CZ
Czechia
Prior art keywords
chip module
chip
module
Prior art date
Application number
CZ95219A
Other languages
Czech (cs)
Inventor
Wolfgang Knoblauch
Gisela Jahn
Roland Sander
Roland Klemm
Dieter Albin
Siegfried Pahl
Dieter Baake
Stephan Perschke
Original Assignee
Meyerhoff Dieter
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Meyerhoff Dieter filed Critical Meyerhoff Dieter
Publication of CZ21995A3 publication Critical patent/CZ21995A3/en

Links

Classifications

    • H10W70/68—
    • H10W90/00—
    • H10W70/682—
    • H10W72/075—
    • H10W72/5524—
    • H10W90/754—
CZ95219A 1992-07-30 1993-01-29 Chip module CZ21995A3 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE4225154A DE4225154A1 (en) 1992-07-30 1992-07-30 Chip module

Publications (1)

Publication Number Publication Date
CZ21995A3 true CZ21995A3 (en) 1995-06-14

Family

ID=6464438

Family Applications (1)

Application Number Title Priority Date Filing Date
CZ95219A CZ21995A3 (en) 1992-07-30 1993-01-29 Chip module

Country Status (7)

Country Link
EP (1) EP0653104A1 (en)
JP (1) JPH08501413A (en)
CA (1) CA2141458A1 (en)
CZ (1) CZ21995A3 (en)
DE (1) DE4225154A1 (en)
SK (1) SK18195A3 (en)
WO (1) WO1994003924A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE29515521U1 (en) * 1995-09-28 1996-01-18 TELBUS Gesellschaft für elektronische Kommunikations-Systeme mbH, 85391 Allershausen Multi-chip module
JP2013172572A (en) * 2012-02-21 2013-09-02 Nissan Motor Co Ltd Semiconductor device
FI130401B (en) * 2020-03-09 2023-08-14 Infinited Fiber Company Oy Separation of polycotton blends

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE8203300U1 (en) * 1982-06-24 Siemens AG, 1000 Berlin und 8000 München Semiconductor component with ceramic substrate
DE1616249A1 (en) * 1968-01-31 1971-05-06 Itt Ind Gmbh Deutsche Integrated differential amplifier
CH526203A (en) * 1968-11-06 1972-07-31 Olivetti & Co Spa Method of assembling one or more electronic circuits integrated in a container
EP0051165A1 (en) * 1980-11-03 1982-05-12 BURROUGHS CORPORATION (a Michigan corporation) Repairable IC package with thermoplastic chip attach
US4378902A (en) * 1981-02-17 1983-04-05 The Jade Corporation Apparatus for preventing wire sag in the wire bonding process for producing semiconductor devices
JPS57207356A (en) * 1981-06-15 1982-12-20 Fujitsu Ltd Semiconductor device
US4729061A (en) * 1985-04-29 1988-03-01 Advanced Micro Devices, Inc. Chip on board package for integrated circuit devices using printed circuit boards and means for conveying the heat to the opposite side of the package from the chip mounting side to permit the heat to dissipate therefrom
GB2189084B (en) * 1986-04-10 1989-11-22 Stc Plc Integrated circuit package
DE3911711A1 (en) * 1989-04-10 1990-10-11 Ibm MODULE STRUCTURE WITH INTEGRATED SEMICONDUCTOR CHIP AND CHIP CARRIER

Also Published As

Publication number Publication date
JPH08501413A (en) 1996-02-13
CA2141458A1 (en) 1994-02-17
DE4225154A1 (en) 1994-02-03
EP0653104A1 (en) 1995-05-17
SK18195A3 (en) 1995-06-07
WO1994003924A1 (en) 1994-02-17

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