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CU22592A3 - MODULE WITH A BOX AND A BASE PLATE - Google Patents

MODULE WITH A BOX AND A BASE PLATE

Info

Publication number
CU22592A3
CU22592A3 CU1997116A CU1997116A CU22592A3 CU 22592 A3 CU22592 A3 CU 22592A3 CU 1997116 A CU1997116 A CU 1997116A CU 1997116 A CU1997116 A CU 1997116A CU 22592 A3 CU22592 A3 CU 22592A3
Authority
CU
Cuba
Prior art keywords
box
conductive plate
force
module
fittings
Prior art date
Application number
CU1997116A
Other languages
Spanish (es)
Inventor
Thomas Lade
Carsten Storbeck
Ralf-Dieter Busse
Original Assignee
Krone Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Krone Gmbh filed Critical Krone Gmbh
Publication of CU22592A3 publication Critical patent/CU22592A3/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0091—Housing specially adapted for small components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09427—Special relation between the location or dimension of a pad or land and the location or dimension of a terminal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10583—Cylindrically shaped component; Fixing means therefore
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10727—Leadless chip carrier [LCC], e.g. chip-modules for cards

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Casings For Electric Apparatus (AREA)
  • Connection Or Junction Boxes (AREA)

Abstract

El módulo de acuerdo con la invención dispone de una caja (1) para cubrir la placa conductora (3), que está equipada con los elementos de construcción electrónicos (10, 11, 12) como módulo de protección contra sobretensiones. Varios, pero por lo menos dos aditamentos bovedados (2) están dispuestos en la caja que están compuestos por un material por lo menos parcialmente conformable. Estos aditamentos resaltan dentro de la caja hacia la placa conductora a empalmar y es donde enganchan en las escotaduras allí practicadas. El tamano de los aditamentos bovedados es tal que se pueden meter, sin problema alguno, en las escotaduras durante el montaje y se conforman bajo el efecto de energía y/o fuerza, de manera que se produce una unión contundente de forma y/o fuerza entre la caja y la placa conductora. Además, estos aditamentos han de dimensionarse de tal modo que después de su conformación conseguida mediante la influencia de energía y/o fuerza, no sobresalgan del nivel predeterminado por el lado inferior de la placa conductora y que garanticen por lo tanto una facilidad de conexión como se requiere para esta clase de módulos.The module according to the invention has a box (1) to cover the conductive plate (3), which is equipped with the electronic construction elements (10, 11, 12) as a surge protection module. Several, but at least two domed attachments (2) are arranged in the box that are composed of at least partially conformable material. These attachments protrude inside the box towards the conductive plate to be spliced and it is where they engage in the recesses made there. The size of the vaulted fittings is such that they can be inserted, without any problem, into the recesses during assembly and are formed under the effect of energy and / or force, so that a forceful union of shape and / or force is produced between the box and the conductive plate. Furthermore, these fittings must be dimensioned in such a way that after their conformation achieved through the influence of energy and / or force, they do not protrude from the predetermined level on the underside of the conductive plate and therefore guarantee ease of connection such as is required for this class of modules.

CU1997116A 1996-03-25 1997-10-15 MODULE WITH A BOX AND A BASE PLATE CU22592A3 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE1996111631 DE19611631C1 (en) 1996-03-25 1996-03-25 Plug-in electronic overvoltage protection module with base-plate

Publications (1)

Publication Number Publication Date
CU22592A3 true CU22592A3 (en) 2000-02-10

Family

ID=7789277

Family Applications (1)

Application Number Title Priority Date Filing Date
CU1997116A CU22592A3 (en) 1996-03-25 1997-10-15 MODULE WITH A BOX AND A BASE PLATE

Country Status (2)

Country Link
CU (1) CU22592A3 (en)
DE (1) DE19611631C1 (en)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1844657U (en) * 1961-10-12 1962-01-11 Sihn Kg Wilhelm Jun PLASTIC COMPONENT FOR THE HOUSING OF ELECTRICAL DEVICES.
DE2713650C2 (en) * 1977-03-28 1986-10-16 Siemens AG, 1000 Berlin und 8000 München Joint connection of two plastic parts
DE4215041C3 (en) * 1991-05-22 1997-09-25 Siemens Ag Electronic control unit

Also Published As

Publication number Publication date
DE19611631C1 (en) 1997-08-21

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