CN2929733Y - test board - Google Patents

Abstract

The utility model relates to a survey test panel for the connection situation of the pin of the slot of test mainboard or connector. The utility model discloses a survey test panel includes a plurality of MOSFET components and a plurality of electrical property contact, wherein utilizes a plurality of electrical property contacts to be connected with the slot or the connector of survey test panel and mainboard to test the connection situation of the pin of slot or connector with a plurality of MOSFET components.

Description

test board

technical field

The utility model relates to a test board for a socket or a connector of a main board, in particular to a test board using a plurality of MOSFET elements as test elements.

Background technique

During the manufacturing process of the mainboard, each part of the mainboard needs to be tested to see if it is normal in advance, so as to avoid problems occurring after shipment and cause heavy losses to the manufacturer.

In the prior art, when it is necessary to test whether the slot (or connector) of the mainboard can operate normally, for example, to test whether there is empty soldering, cold soldering, open circuit, short circuit or other similar abnormal conditions, it is usually with the help of a test tool (test jet) is tested by capacitive sensing. However, this test method can only test the signal pin of the slot, and the power pin and ground pin are connected in parallel due to the circuit design, so unless all If the power pin or all the ground pins are abnormal, otherwise it cannot be correctly tested by capacitive sensing.

Since the number of power pins and ground pins usually accounts for about half of all the pins of the motherboard slot, only about half of the pins can be tested with the prior art. Similarly, in the prior art, high-impedance resistors or diodes are also used instead of capacitive sensing methods for testing. However, this test method also cannot correctly test the power pins and ground pins due to the problem of parallel connection of circuits. .

In the prior art, there is also a method of testing the slot of the mainboard, which is to plug in a memory module or a PCI interface card, etc., which will actually operate in the slot, to actually test the slot. But this test mode needs to use actual memory module or PCI interface card, so required cost is higher, and memory module or PCI interface card also have the problem of service life, so this test mode will have many problems for manufacturer. the inconvenience.

Therefore, it is really necessary to provide a novel test tool to solve the problems in the prior art.

Utility model content

The purpose of the utility model is to provide a test board, which can test the slots of the motherboard or all pins of the connector.

In order to achieve the above object, the utility model provides a test board for testing the connection status of a slot of a motherboard or a plurality of pins of a connector, wherein the plurality of pins include at least one power pin , at least one ground pin, at least one signal pin and at least one unconnected pin, the test board includes: a circuit board; a plurality of metal oxide semiconductor field effect transistor (MOSFET) elements, arranged on the circuit board, wherein Each MOSFET element includes a gate, a drain, and a source; and a plurality of electrical contacts arranged on the circuit board for when the test board is inserted into the slot or the connector, The plurality of MOSFET elements are electrically connected to the plurality of pins for testing the connection status of the plurality of pins.

For example, the gate of the MOSFET element can be electrically connected to an unconnected pin as a control pin; the drain is electrically connected to a power pin; and the source is electrically connected to a signal pin. Alternatively, the gate of the MOSFET element is electrically connected to the control pin; the drain is electrically connected to the signal pin; and the source is electrically connected to the ground pin. Alternatively, the gate of the MOSFET element is electrically connected to the control pin; the drain is electrically connected to the higher potential signal pin; and the source is electrically connected to the lower potential signal pin.

In addition, the test board of the present invention may further include at least one diode element to test the connection status of multiple pins of the slot or connector, wherein one end of each diode element is electrically connected to the control pin, and the other end is electrically connected to the control pin. Electrically connected with the signal pin.

The test board of the utility model utilizes a plurality of MOSFET elements as test elements. The utility model makes use of the characteristics of the MOSFET components to electrically connect each MOSFET component with the power supply pins, signal pins, unconnected pins or grounding pins in the multiple pins of the slot through circuit design, which can be convenient Ground implements all pins of the test socket.

Description of drawings

FIG. 1 is a schematic structural view of a test board according to an embodiment of the present invention.

Fig. 2 is a schematic structural view of a test board according to another embodiment of the present invention.

FIG. 3 is a schematic diagram of the configuration of the test board and an external test machine of the present invention.

FIG. 4 is a schematic diagram of pin types of multiple pins of a slot.

Fig. 5 is a schematic diagram of the MOSFET element of the present invention.

FIG. 6 is a schematic diagram of a circuit connection of the MOSFET element of the present invention.

FIG. 7 is a schematic diagram of another circuit connection of the MOSFET element of the present invention.

FIG. 8 is a schematic diagram of a circuit connection of the diode element of the present invention.

Detailed ways

In order to make the above and other purposes, features and advantages of the present invention more obvious and understandable, the embodiments utilizing the technical contents of the present invention are specifically cited and described in detail as follows in conjunction with the accompanying drawings.

Please refer to FIG. 1 for a schematic structural diagram of a test board according to an embodiment of the present invention. As shown in FIG. 1 , in an embodiment of the present invention, the test board 10 of the present invention includes a circuit board 20 . The circuit board 20 is provided with a plurality of Metal Oxide Semiconductor Field Effect Transistor (MOSFET) elements 21 , a plurality of electrical contacts 23 and a planned connection circuit of the plurality of MOSFET elements 21 .

Next, please refer to FIG. 2 for a schematic structural diagram of a test board according to another embodiment of the present invention. As shown in Fig. 2, the utility model further provides a test board 10' as an alternative embodiment of the test board 10. In addition to the circuit board 10', a plurality of MOSFET elements 21' and a plurality of electrical contacts 23', the test board 10' also has a plurality of diode elements 22 as test elements.

Next, please refer to FIG. 3 for a schematic configuration diagram of the test board 10 (or test board 10') and an external test machine. As shown in FIG. 3 , a connection device is provided on the motherboard 31 , which can be a slot or a connector for connecting with a memory module (not shown) or other similar interface cards. In this embodiment, the connecting device is the slot 311 as an example, but the present invention is not limited thereto. Meanwhile, in an embodiment of the present invention, the circuit board 20 of the test board 10 is made to match the size of the slot 311 . The plurality of MOSFET elements 21 can be used to test the connection status of the plurality of pins 312 of the socket 311 of the motherboard 31 , for example, to test whether there is no solder joint, cold solder joint, open circuit, short circuit or other similar abnormal conditions. The test board 10 has a plurality of electrical contacts 23, which are used to connect with the slots 311 or connectors of the motherboard 31, so that a plurality of MOSFET elements 21 can be electrically connected to a plurality of pins 312 for testing a plurality of The connection status of pin 312. After the socket 311 is connected to the test board 10, the testing machine 32 can use the probes 321 to test the sockets of the plurality of pins 312 of the socket 311, so that each pin 312 of the socket 311 can be tested. connection status. However, the test function or method of the test machine 32 using the probe 321 is not the key point of the present invention, so it will not be repeated here.

As shown in FIG. 3 , the socket 311 includes a plurality of pins 312 . However, it should be noted that the number and purpose of the plurality of pins 312 may vary in different slots 311 . For example, in one embodiment of the present invention, as shown in the schematic diagram of pin categories in FIG. 4 , the multiple pins 312 may include at least one signal pin (signal pin) 41, at least one power pin pin) 42, at least one ground pin (ground pin) 43 and at least one non-connected pin (non-connected pin) 44. Wherein, the unconnected pins 44 may include at least one control pin 441 for transmitting control signals. The control signal is a signal sent by the test machine 32 to control the MOSFET element 21 to be turned on or off.

Next, please refer to FIG. 5 , which is a schematic diagram of each MOSFET element 21 of the present invention. As shown in FIG. 5 , the MOSFET element 21 has three pins, namely a gate 211 , a source 212 and a drain 213 .

In order to allow the MOSFET element 21 to be a test element for testing the multiple pins 312 of the socket 311 , the connection circuit of each MOSFET element 21 disposed on the circuit board 20 needs to be designed. That is, the gate 211 of each MOSFET element 21 is electrically connected to the control pin 441 for receiving the control signal. The control pin 441 utilizes the unconnected pin 44 among the plurality of pins 312 of the socket 311 as a connection pin to the gate 211 . The source 212 and the drain 213 of each MOSFET element 21 are respectively electrically connected to the power pin 42 , the ground pin 43 or the signal pin 41 among the plurality of pins 312 of the socket 311 . In this embodiment, as long as the test machine 32 sends a control signal to turn on or turn off the MOSFET element 21 respectively during the test, and then uses the probe 321 to measure the sockets of the plurality of pins 312, the slot 311 can be known. Whether the signal pin 41, the power pin 42 or the ground pin 43 is connected properly.

It should be noted that, in the MOSFET device 21 , if the potential of the source 212 is higher than that of the drain 213 , when the gate 211 is turned off, the source 212 and the drain 213 may also be turned on. If the above conditions exist during the measurement, accurate test results cannot be achieved, so the potential of the drain 213 must be higher than the potential of the source 212 . Generally speaking, the potential relationship among the signal pin 41 , the power pin 42 or the ground pin 43 in the slot 311 is that the potential of the power pin 42 is higher than that of the signal pin 41 ; the signal pin 41 The potential of the ground pin 43 is higher than the potential of the ground pin 43 .

Therefore, as shown in a schematic diagram of a circuit connection between the MOSFET element 21 and multiple pins 312 in FIG. 6 , when the drain 213 is electrically connected to the power pin 42 , the source 212 must be electrically connected to the signal pin 41 . Alternatively, as shown in another circuit connection diagram of the MOSFET element 21 and multiple pins 312 in FIG. 7 , if the drain 213 is electrically connected to the signal pin 41 , the source 212 must be electrically connected to the ground pin 43 .

It should be noted that if the drain 213 is electrically connected to the power pin 42 and the source 212 is electrically connected to the ground pin 43, it may be because the circuits of the power pin 42 and the ground pin 43 are initially designed, respectively. There is a parallel problem and cannot be tested accurately.

On the other hand, if the potential level between the two signal pins 41 is determined, the drain 213 of the MOSFET element 21 can be electrically connected to the higher potential signal pin 41; the source 212 can be connected to the higher potential The low potential signal pin 41 is electrically connected. If the potential level between the two signal pins 41 cannot be determined, the drain 213 and the source 212 cannot be electrically connected to the two signal pins 41 at the same time, because the potential of the source 212 may be higher than the drain. 213 potential situation.

In addition, when using the test board 10' as shown in FIG. The plurality of grounding pins 43 are electrically connected in pairs according to the above-mentioned method. If there are still remaining signal pins 41 not connected after the paired electrical connection, then the remaining signal pins 41 are electrically connected to the plurality of diode elements 22 for testing. That is, as shown in the circuit connection schematic diagram of the diode element and multiple pins in FIG. 8 , both ends of the diode element 22 are electrically connected to the control pin 441 and the signal pin 41 of the socket 311 respectively. Then, test in the same way with the testing machine 32 to know whether the signal pin 41 connected to the diode element 22 is normally conducted.

Therefore, with the help of the test board 10 or the test board 10' of the present utility model and utilizing the above-mentioned circuit connection method, the connection status of the plurality of pins 312 of the slot 311 can be fully tested by cooperating with the test machine 32, so as to solve the previous problems. problems encountered by technology.

To sum up, the utility model shows its characteristics that are very different from the prior art in terms of purpose, means and efficacy. However, it should be noted that the above-mentioned embodiments are only examples for the convenience of description, and the scope of rights claimed by the utility model should be based on the scope of the claims of this application, rather than being limited to the above-mentioned embodiments.

Claims (9)

1. A test board, used to test a socket of a motherboard or a connection condition of a plurality of pins of a connector, wherein the plurality of pins include at least one power pin, at least one ground pin, at least A signal pin and at least one unconnected pin, characterized in that the test board includes: a circuit board; a plurality of metal-oxide-semiconductor field-effect transistor (MOSFET) elements disposed on the circuit board, wherein each MOSFET element includes a gate, a drain, and a source; and A plurality of electrical contacts are arranged on the circuit board, so that when the test board is inserted into the slot or the connector, the plurality of MOSFET elements are electrically connected to the plurality of pins for Test the connection status of the plurality of pins. 2. The test board according to claim 1, wherein the at least one unconnected pin comprises at least one control pin, and the gate of each MOSFET element of the plurality of MOSFET elements is connected to the control pin electrical connection. 3. The test board according to claim 2, wherein the drain of at least one MOSFET element is electrically connected to the at least one power pin, and the source is electrically connected to the at least one signal pin . 4. The test board according to claim 2, wherein the drain of at least one MOSFET element is electrically connected to the at least one signal pin, and the source is electrically connected to the at least one ground pin . 5. The test board according to claim 2, wherein the drain of at least one MOSFET element is electrically connected to a part of the at least one signal pin, and the source is connected to the at least one signal pin. Another part of the pins is electrically connected to the signal pin, and the potential of the signal pin electrically connected to the drain is greater than the potential of the signal pin electrically connected to the source. 6. The test board according to claim 1, wherein the at least one unconnected pin comprises at least one control pin, and the test board further comprises at least one diode element disposed on the circuit board, wherein each diode One end of the component is electrically connected to the control pin, and the other end is electrically connected to one of the at least one signal pin. 7. The test board as claimed in claim 2, wherein the at least one control pin transmits a control signal to control the turn-on or turn-off of the plurality of MOSFET elements. 8. The test board as claimed in claim 6, wherein the at least one control pin transmits a control signal to control the at least one diode element to be turned on or off. 9. The test board according to claim 7 or 8, wherein the control signal is controlled by an external test machine.

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