CN2909758Y - condenser microphone - Google Patents

Abstract

The utility model discloses a capacitive microphone. The capacitive microphone mainly independently takes out a wiring substrate originally contained and covered by a shell, so that the shell covered with a plate, a vibration membrane, a vibration membrane ring, a gasket and a cover plate can be electrically plugged and connected with the independent wiring substrate. Since the wiring substrate is taken out and placed outside the shell, an IC component can also be plugged into the wiring substrate outside the shell, so that the back chamber space surrounded by the shell vibration membrane, the vibration membrane ring and the cover plate is greatly reduced, and the goal of miniaturization of the capacitive microphone can be naturally achieved, and the sensitivity of the microphone can be increased to obtain a better sound quality.

Description

condenser microphone

technical field

The utility model relates to a capacitive microphone, in particular, a miniature capacitive microphone which can greatly reduce the volume.

Background technique

According to the known capacitive microphones, the capacitive changes are mainly caused by sound waves, which are converted into electrical signals, and then the sound is amplified and sent out. For example, the microphones of mobile phones often use capacitive microphones.

With reference to shown in Fig. 4, traditional capacitive microphone is to be formed with several sound holes 31 on the front panel on the aluminum shell 30, is provided with vibrating membrane ring 32 in the front panel inner side, and this vibrating membrane ring upper layer is provided with a vibration Membrane 33, the vibrating membrane 33 is in contact with the vibrating membrane ring 32; a gasket 34 is arranged on the upper side of the vibrating membrane, and a pole plate 35 is formed on the other side of the gasket 34, and the surface of the pole plate is evaporated There is metal to form a polymer film, which is polarized, and the film and the vibrating film 33 are in a state of facing each other, and in the back chamber 38 formed by the vibrating mode ring 32, there is an amplification conversion Use the IC assembly 39, and set the cover plate 40 on the bottom of the wiring substrate 37; finally, bend the rear end 301 of the housing 30 and fix the aforementioned components.

However, it can be seen clearly from the above and with reference to FIG. In the back chamber 38 of 30, there are basically three kinds of deficiencies in this design:

First, the size reduction space is limited: It can be clearly seen from Figure 4 that the IC components with a preset height are accommodated in the back room, and the space reduction in the back room is quite limited. The space in the back room cannot be effectively reduced, which will affect the micro-sound The size miniaturization of devices suffers from a bottleneck, especially in the 21st century when technology is in command. The basic needs of consumers for electronic products are light, thin, short, and small. Therefore, it is known that capacitive microphones cannot be miniaturized. It is the trend of the times that devices are gradually eliminated by the industry.

Second, the sound quality is not good: when the sound wave enters the impact diaphragm from the sound hole of the casing and then enters the back room, because a high IC component is set in the center of the back room to block, and then the frequency of the sound wave encounters the block of the IC component, it will be It directly affects the sound quality of the microphone output.

Third, there is insufficient space for flexible changes: due to the large number of manufacturers manufacturing microphones and the complexity of specifications and sizes, it is conceivable. However, as far as we know, manufacturers with small production scales mostly need to match the high share of microphones. The specifications produced by major manufacturers; the matching method is nothing more than connecting a "board body" to the bottom of the microphone to match the appearance of the microphone from a major manufacturer. This kind of addition of a board at the bottom of the microphone will undoubtedly increase the material The cost, and the thickness of the microphone not only cannot be reduced but also thickened.

Fourth, the design flexibility of the IC component circuit is insufficient: because the microphone is limited by the miniaturization of its size, if it is necessary to add an amplifier to the IC component, it is often impossible to add it due to the size limitation of the microphone, and the overall flexibility The degree of design is obviously insufficient.

Utility model content

Aiming at the technical problems existing in the structure design of the known capacitive microphones, the creator finally developed a miniature capacitor that can overcome the known technical problems based on his rich experience in R&D and manufacturing in related industries, and after many trials. Microphone.

In order to achieve the above object, the utility model mainly provides a miniature capacitive microphone which can reduce the space of the back room.

Another object of the present invention is to provide a capacitive microphone with better output sound quality.

Another object of the present invention is to provide a capacitive microphone that can improve the flexibility of circuit design of IC components.

Still another object of the present invention is to provide a capacitive microphone that does not need to add a board and meets the assembly specifications of a large microphone manufacturer.

In order to achieve the above purpose, a capacitive microphone of the present invention is mainly composed of a vibration module and a wiring board electrically connected, wherein:

The vibration module has a ㄇ-shaped metal shell with a sound hole in its cross section, and a pole plate coated with a polymer film on the surface, a gasket, a vibrating body and a cover plate are sequentially accommodated inside;

At least one IC component is inserted in the preset position of the wiring substrate, and the wiring substrate is electrically connected with the vibration module in a movable plug-in manner to form a capacitive microphone.

Therefore, in order to overcome the deficiencies of the known items and achieve the above-mentioned expected structural effects, the technical means adopted by the utility model is to independently take out the wiring board originally covered by the housing, so that the covered pole plate, vibration The casing of the diaphragm, vibrating membrane ring, gasket, and cover plate can be electrically plugged and connected with an independent wiring substrate. Since the wiring substrate is taken out and placed outside the casing, IC components can also be plugged into the wiring substrate located outside the casing. , so that the back room space enclosed by the shell diaphragm, diaphragm ring and cover plate is greatly reduced, and the goal of miniaturization of the capacitive microphone can be achieved naturally.

Description of drawings

Fig. 1 is an exploded schematic diagram of the structure of the capacitive microphone of the present invention.

Fig. 2 is a three-dimensional appearance diagram of the capacitive microphone of the present invention.

Fig. 3 is a sectional view of the capacitive microphone of the present invention.

Fig. 4 is a sectional view of a known capacitive microphone.

[Description of main component symbols]

10-----Shell 101----Positioning Department

11-----Front panel 12-----Sound hole

13-----polar plate 131-----perforation 14-----diaphragm 141----diaphragm ring 142----skirt 15-----gasket 16--- --Cover Plate 161--Connection Part 17-----Back Room 18-----Wiring Substrate 19-----IC Components 30-----Shell 301----Rear End Part 31-----sound hole 32-----diaphragm ring 33-----diaphragm 34-----gasket 35-----plate 36-----skirt 37-----Wiring substrate 38-----Back room 39-----IC components 40-----Cover plate

Detailed ways

The utility model relates to a capacitive microphone, please refer to Figures 1 to 3, the capacitive microphone is mainly composed of a vibration module and a wiring board electrically plugged together, the vibration module is further It includes a shell, a pole plate, a vibrating body and a cover plate; where:

The shell 10 is a metal cylinder with a ㄇ-shaped cross section, and the front panel 11 of the shell is provided with several sound holes 12 for easy penetration of sound waves;

A pole plate 13, one surface of which is vapor-deposited with a polymer film, the polymer film is polarized, and several perforations 131 are also provided on the pole plate 13, so that the sound wave can pass through when it is introduced through the sound hole 12 The hole 131 hits the vibrating membrane 14;

A vibrating body refers to a vibrating film and a vibrating film ring electrically connected, and the vibrating film 14 is a conductive vibrating film, and nickel (Ni), aluminum (Al) etc. are evaporated on a surface of the film to form a conductive layer, and A spacer 15 is provided between the vibrating membrane 14 and the pole plate 13 to form a state close to each other; and the vibrating membrane ring 141 is made of metal and butted on the vibrating membrane 14, and is electrically connected to each other at the same time. And the vibrating membrane ring 141 is slightly smaller than the vibrating membrane 14, so that between the vibrating membrane ring 141 and the outer end surface of the vibrating membrane 14, a skirt 142 insulated from the housing can be formed when the housing 10 is inserted; in addition, the vibrating membrane ring 141, the vibrating membrane 14 and the cover plate 16 at the bottom of the shell 10 jointly enclose a back chamber 17;

A wiring substrate 18 is an independent PC circuit board that can be made into any shape according to the specifications of the microphone manufacturer. Make the shell 10 and the externally connected wiring substrate 18 in an electrically conductive connection relationship;

An IC component 19 is integrated with a miniature capacitor and an integrated IC component that can be equipped with an amplifier. It is mainly electrically plugged into the wiring substrate 18, and the input terminal of the IC component 19 is connected to the diaphragm ring 142. In order to provide the audio conversion generated by impacting the vibrating membrane 14, and amplify and send out the sound wave through the output terminal.

When the capacitive microphone of the present utility model is assembled, the pole plate 13, the gasket 15, the vibrating membrane 14, the vibrating membrane ring 141 and the cover plate 16 are put into the housing 10 in sequence, and then the bottom of the housing 10 is facing inward. Bending and pressing to form a positioning part 101 that firmly covers the above-mentioned components, and then inserting the IC component 19 into the predetermined position of the wiring substrate 18, and finally inserting the integrated cover plate of the housing 10 into the wiring substrate 18. connected, and electrically connected to the wiring substrate 18 through the connecting portion 161 on the lower end surface of the cover plate 16, thus forming a capacitive microphone as shown in FIG. 2 .

Therefore, the utility model takes out the known wiring board 18 arranged in the casing 10 and independently arranges it outside the casing 10. The expected structural effects include:

The internal space is greatly reduced: since the wiring substrate 18 is located outside the casing 10, the IC component 19 can also be connected to the outside of the wiring substrate 18, so the back chamber 17 of the capacitive microphone lacks the IC component 19 with a preset height, which can naturally The space of the back room 17 is greatly reduced, and the capacitive microphone is flatter and miniaturized to meet the design requirements of light, thin, short and small electronic products.

Better sound quality: Since the wiring board 18 and IC components 19 are located outside the casing 10, the back chamber 17 formed by the vibrating membrane 14, the vibrating membrane ring 141 and the cover plate 16 forms an internal space without any obstacles, so , the audio frequency produced by the sound hole 12 entering the impacting diaphragm 14 remains consistent, improving the sensitivity of the microphone, so that the output sound quality can naturally be optimized, and each component of the capacitive microphone of the present invention has a heat-resistant effect , for automatic production under high temperature environment, there is no need to worry about damaging components.

Flexibility in assembly and operation: Since the wiring substrate 18 is independently located outside the housing 10, as long as the base distribution substrate 18 that conforms to the specifications and shapes of the microphone manufacturer is replaced, it can be applied to various electronic products, and there is no need to add additional components that meet the requirements of micro-phone manufacturers. The "board body" with the standard shape of a large speaker manufacturer is used; the capacitive microphone of the present invention omits the use of the board connected to the electronic product, which will not increase the cost of the capacitive microphone, and will not cause capacitance The thickness of the type microphone is increased.

Good flexibility in IC component design: Since the wiring board 18 is independently located outside the casing 10, the design of the IC component 19 does not need to worry about whether the volume is limited in the back room. If an amplifier needs to be added, it can be added to improve the microphone. The overall design flexibility is high, and because the wiring substrate 18 is independently located outside the casing 10, the specifications of the IC components are greatly reduced. If the specification is required, an amplifier can be added, which can greatly reduce the production cost.

On the whole, the capacitive microphone of the present utility model only takes out the wiring substrate 18 originally covered in the casing, and then independently integrates the pole plate 13, the gasket 15, the vibrating membrane 14, the vibrating membrane ring 141 and the cover plate The shell 10 of 16 is electrically plugged and connected without increasing the cost, which can effectively overcome the above-mentioned many shortcomings of the known capacitive microphone, and achieve the aforementioned various progressive effects. It can be described as a novel and progressive new type. utility model.

Claims (7)

1, a kind of capacitor microphone mainly is to be formed by a vibration module and a wiring substrate electrically connect, it is characterized in that, wherein:

The metal shell that the cross section of this vibration module is ㄇ shape is provided with sound hole, and inside is installed with pole plate, pad, vibrating body and the cover plate that a surface is coated with macromolecule membrane in regular turn;

The default place of this wiring substrate plugs an IC assembly at least, and wiring substrate also supplies vibration module with movable inserting mode electrically connect, to constitute a capacitor microphone.

2, capacitor microphone as claimed in claim 1 is characterized in that, described vibrating body comprises that the vibrating membrane and of a conductivity is slightly less than the metal vibration zona of vibrating membrane.

3, capacitor microphone as claimed in claim 1 is characterized in that, described pole plate offers several perforation.

4, capacitor microphone as claimed in claim 1 or 2 is characterized in that, described pad is that the boundary is between the vibrating membrane of pole plate and vibrating body.

5, capacitor microphone as claimed in claim 1 is characterized in that, the described connecting portion that is provided with in the cover plate bottom surface of shell lowermost end with the wiring substrate electrically connect that is installed with.

6, capacitor microphone as claimed in claim 2 is characterized in that, described vibration zona is an insulating material, imposes metal plating on insulating material, becomes conductivity.

7, capacitor microphone as claimed in claim 2 is characterized in that, can be the down stubborn skirt section that fold with casing insulation, outside when described vibrating membrane is inserted shell.

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