CN2830990Y - Refrigerator - Google Patents

Abstract

The utility model provides a refrigeration device, which includes a semiconductor refrigeration element, the semiconductor refrigeration element includes a hot end and a cold end, the hot end of the semiconductor refrigeration element is provided with a heat dissipation device, and the hot end of the semiconductor refrigeration device is attached to a liquid storage box. The liquid storage box is communicated with the heat dissipation pipe, the liquid storage box and the heat dissipation pipe are filled with cooling medium, and part of the wall of the liquid storage box that is not attached to the hot end of the semiconductor refrigeration device is recessed toward the inside of the liquid storage box; The part of the liquid storage box is trapezoidal; the small end surface of the trapezoidal part of the liquid storage box is attached to the hot end of the semiconductor refrigeration device; the side of the liquid storage box opposite to the small end surface of the trapezoid is recessed into the liquid storage box; The rear upper part of the liquid storage box is provided with a box body part protruding from the liquid storage box; the heat dissipation pipes are in multiple groups, and are respectively communicated with the liquid storage box. In the refrigerating device, the gravity heat pipe type radiator has a reasonable structure, the radiating pipe has high heat dissipation efficiency, and the refrigerating device has high cooling efficiency.

Description

refrigeration unit

technical field

The utility model relates to a refrigeration device, in particular to a refrigeration device provided with a gravity heat pipe type radiator.

Background technique

Semiconductor refrigeration technology has the characteristics of small size, no pollution, no noise, and simple structure, so it can be applied to many occasions. The principle of semiconductor refrigeration technology is to generate heat absorption and heat release through the potential energy changes of electrons and holes in the energized circuit. The semiconductor refrigeration components generate cold ends and hot ends, and then realize the functions of cooling and heating. When the semiconductor refrigeration element is in thermal balance, to improve the cooling capacity of the cooling end, the main link is to improve the heat dissipation efficiency of the hot end, reduce the heat accumulation at the hot end, and minimize the temperature difference between the two ends to obtain more cooling capacity at the cold end. The heat dissipation method of the hot end of the earliest semiconductor refrigeration components usually adopts metal fins and fans to force heat dissipation, or internal circulation natural water cooling and external circulation forced water cooling, etc., but the above heat dissipation efficiency is low, which leads to a decrease in cooling efficiency. In order to improve the heat dissipation efficiency of semiconductor radiators, Chinese patent CN2124438 discloses a semiconductor gravity heat pipe radiator, which can be used for heat dissipation of semiconductor air conditioners and semiconductor refrigerators. It includes a gravity heat pipe and an energy transmission sheet. It is characterized in that the top of the gravity heat pipe is hemispherical or arc-shaped, an acceleration pump is installed inside the pipe, parallel fins and flanges are installed outside the pipe, and the bottom of the pipe is connected to a semiconductor cold-heat reactor. The technical solution provided by the above patent can improve the heat dissipation efficiency of the hot end of the semiconductor refrigeration element to a certain extent, but the heat absorption efficiency of the cooling medium in the heat dissipation system is still relatively low, and the heat dissipation efficiency is limited to a certain extent. Can not be fully utilized, resulting in a waste of energy.

Utility model content

The utility model provides a refrigeration device. The refrigeration device is provided with a gravity heat pipe type radiator. In the refrigeration device, the gravity heat pipe type radiator has fast heat dissipation speed and high heat dissipation efficiency.

The utility model further provides a refrigerating device, which is provided with a gravity heat pipe radiator, which can improve the refrigerating efficiency of the refrigerating device and make full use of the energy generated by the semiconductor refrigerating element.

In order to realize the above-mentioned purpose of the invention of the utility model, the utility model adopts the following technical solutions.

The utility model discloses a refrigeration device, which comprises a semiconductor refrigeration element. The semiconductor refrigeration element includes a hot end and a cold end. The hot end of the semiconductor refrigeration element is provided with a heat dissipation device. The liquid storage box with the hot end attached, the liquid storage box communicates with the heat dissipation pipe, the liquid storage box and the heat dissipation pipe are filled with cooling medium, and the part of the wall surface of the liquid storage box that is not attached to the hot end of the semiconductor refrigeration device Recessed towards the inside of the reservoir.

In the above technical solution, the liquid storage box is attached to the hot end of the semiconductor refrigeration element, and the cooling medium in the liquid storage box absorbs the heat of the semiconductor refrigeration element and vaporizes, and then enters the heat dissipation pipe, and the cooling medium in the heat dissipation pipe passes through the pipe wall and air After heat exchange, it condenses again into a liquid and flows back to the liquid storage box under the action of gravity to absorb the heat from the hot end of the semiconductor refrigeration element and cool it down. The liquid storage box is attached to the hot end of the semiconductor refrigeration element. The liquid storage box can accommodate a large amount of cooling medium. The cooling medium contacts the hot end of the semiconductor refrigeration element through the wall of the liquid storage box to transfer heat and absorb the heat of the hot end of the semiconductor refrigeration element. , and the absorbed heat enters the heat dissipation pipe through the vaporized refrigerant medium and conducts heat exchange and cooling with the air through a large area, so the heat dissipation speed is fast and the heat dissipation efficiency is improved.

The liquid storage box adopts a further preferred structure: part of the wall of the liquid storage box that is not attached to the hot end of the semiconductor refrigeration element is recessed toward the inside of the liquid storage box.

In the heat dissipation structure where the liquid storage box is bonded to the hot end of the semiconductor refrigeration element, since the surface area of the hot end and the cold end of the semiconductor refrigeration device is limited to a certain extent, there is a certain limit to the bonding surface of the liquid storage box that is attached to the hot end. However, in the entire cooling system, that is, in the entire circulation system connecting the liquid storage box and the heat dissipation pipe, due to the mutual conversion of liquid and gas, a certain amount of gas space should be reserved in the circulation system, and only when the liquid and gas space is properly adjusted , in order to achieve the best match of gas and liquid conversion, and then achieve better heat dissipation efficiency. In the above-mentioned heat dissipation method of the semiconductor refrigeration element through the liquid storage box and the heat dissipation pipe, in order to realize the pressure matching in the thermal cycle system and the bonding between the liquid storage box and the hot end of the semiconductor refrigeration element, the liquid level of the liquid in the liquid storage box Relatively low, that is, the contact between the cooling medium in the liquid storage box and the hot end of the semiconductor refrigeration element is small, so the cooling medium cannot fully absorb the heat generated by the hot end of the refrigeration element, and the heat dissipation efficiency is low, thereby reducing the cooling efficiency of the semiconductor element. In the utility model, on the basis of the above-mentioned liquid storage box, the structure of the above-mentioned liquid storage box is changed, so that the part of the wall of the liquid storage box that is not attached to the hot end of the semiconductor refrigeration element is recessed toward the inside of the liquid storage box, so the relative improvement The liquid level of the cooling medium in contact with the hot end of the semiconductor refrigeration element is increased, thereby increasing the contact area between the cooling medium and the hot end of the semiconductor refrigeration element, the heat absorption of the cooling medium is increased, and the heat dissipation efficiency is improved. Under the same conditions, the temperature of the hot end is relatively According to the principle of heat balance, the cooling efficiency of semiconductor refrigeration elements is correspondingly improved.

In order to simplify the structure of the liquid storage box, facilitate processing and fix the liquid storage box in the refrigerator, the part of the liquid storage box is trapezoidal, and the small end face of the trapezoidal part of the liquid storage box is attached to the hot end of the semiconductor refrigeration device. The side of the liquid storage box opposite to the small end face of the trapezoid is recessed toward the interior of the liquid storage box.

In order to adjust the bonding between the liquid storage box and the hot end of the semiconductor refrigeration element and the matching of the pressure in the heat dissipation circulation system, the rear upper part of the trapezoidal liquid storage box is provided with a box body part protruding from the liquid storage box.

In the gravity heat pipe type radiator, the heat mainly releases the heat absorbed by the cooling medium in the heat pipe to the surrounding air through the contact between the heat pipe and the air, and then converts the gas cooling medium in the heat pipe into liquid and returns it to the liquid storage box for reabsorption. The heat generated by the hot end of the semiconductor refrigeration element is used to improve the heat dissipation efficiency of the heat dissipation pipe, and the heat dissipation pipe is a coil pipe, and the coil pipe is arranged obliquely.

The radiating pipe is formed into a coil, which can increase the radiating area of the radiating pipe in a limited area. The coils of the cooling pipes are usually set on the same plane, so the coils are arranged at an inclination to make the coils misaligned with each other in the longitudinal direction, and the heat released by the lower coils will not or reduce the rising heat of the lower coils to contact the upper coils , so the heat dissipation efficiency of the coil can be improved.

After the cooling medium in the liquid storage box absorbs the heat from the hot end of the semiconductor refrigeration element and vaporizes part of the liquid cooling medium, the faster it rises into the heat dissipation pipe, the faster the circulation and the higher the heat dissipation efficiency. The faster the liquid medium flows back into the liquid storage box, the faster the heat dissipation efficiency can also be improved. Therefore, in the utility model, the heat dissipation pipes are used in multiple groups, which are individually connected to the liquid storage box. Moreover, multiple groups of cooling pipes can increase the heat transfer area and reduce the temperature of the return liquid.

In order to further facilitate the connection of multiple heat dissipation pipes on the liquid storage box, the heat dissipation pipes are connected by fins or fins.

After the cooling pipe enters the coil from the outlet end, it will immediately cool down the cooling medium. Therefore, if the outlet end of the coil contacts the cooled coil, it will release heat to the cooled coil and reduce the heat dissipation efficiency of the coil. The outlet ends of the coil pipes are led out in different directions to contact the cooled coil pipes, and the outlet ends of the cooling pipes are arranged side by side in the same direction.

In order to facilitate the setting of the coil, the heat dissipation pipe is a coil, and the coil is bent into a U shape. Since the semi-conductor refrigeration element usually cools a small refrigeration device, in order to reduce the plane area occupied by the coil, the coil can be bent into a U shape. This design is especially suitable for the structure where multiple coils are arranged side by side.

Also in order to arrange a coil with a larger area in a limited area and improve the heat dissipation efficiency, the heat dissipation pipes are arranged side by side or front to back.

And in order to further improve the heat dissipation efficiency of the gravity heat pipe type radiator, heat dissipation fins or fins can be arranged on the heat dissipation pipe.

The utility model adopts the heat dissipation principle of the gravity heat pipe, and the gas-liquid conversion is carried out between the cooling medium, and the cooling medium converted into liquid flows back into the liquid storage box through gravity, so in order to make the cooling medium return smoothly, the pipeline of the coil is Up and down tilt steering coils.

The circulation mode of the circulation loop formed by the cooling medium between the liquid storage box and the heat dissipation pipe is: the cooling medium absorbs the heat generated by the hot end of the semiconductor refrigeration element in the liquid storage box, then vaporizes and rises to the upper space of the liquid storage box and enters the heat dissipation pipe , the absorbed heat is exchanged with the surrounding air in the heat dissipation pipe, and then cooled and converted into liquid again. Under the action of gravity, the cooled liquid enters the liquid storage box through the entrance of the heat dissipation pipe, so in order to facilitate the liquefied cooling medium to enter The liquid storage box and the liquid cooling medium for preventing backflow prevent the vaporized cooling medium from rising after being heated, and the inlet end of the heat dissipation pipe communicates with the lower part of the liquid storage box.

As mentioned above, the cooling medium in the liquid storage box rises into the heat dissipation pipe after being cooled. Therefore, in order to facilitate the cooling medium to enter the heat dissipation pipe to form a smooth heat dissipation cycle, the outlet end of the heat dissipation pipe communicates with the upper part of the liquid storage box.

The gravity heat pipe radiator of the utility model can be applied to various refrigeration devices, such as refrigerators, air conditioners or freezers.

In the utility model, the heat dissipation method combining the liquid storage box and the heat dissipation pipe is adopted. Compared with the heat dissipation structure of the existing semiconductor refrigeration element, the heat dissipation efficiency has been significantly improved, and the structure of the liquid storage box is further improved so that it does not Part of the wall of the liquid storage box attached to the hot end of the semiconductor refrigeration element is recessed toward the inside of the liquid storage box, which relatively increases the liquid level of the cooling medium in contact with the hot end of the semiconductor refrigeration element, thereby increasing the contact between the cooling medium and the hot end of the semiconductor refrigeration element. The contact area and the heat absorption efficiency of the cooling medium are improved. According to the principle of heat balance, the cooling efficiency of the semiconductor refrigeration element is correspondingly improved.

And the coil tube is arranged obliquely; the coil tube pipeline is coiled along the inclined direction from top to bottom; the heat dissipation pipes are in multiple groups, which are separately connected with the liquid storage box, which can improve the heat dissipation efficiency of the heat dissipation pipes in the radiator. The refrigeration efficiency of the semiconductor refrigeration element is also improved.

Description of drawings

Fig. 1 is a side view of the structure of a specific embodiment of a liquid storage box of a refrigeration device provided with a gravity heat pipe type radiator.

Fig. 2 is a sectional view along A-A in Fig. 1 .

Fig. 3 is a right view of the liquid storage box in Fig. 1 .

Fig. 4 is a top view of the liquid storage box in Fig. 1 .

Fig. 5 is a front view of the structure of the specific embodiment 1 of the gravity heat pipe radiator.

FIG. 6 is a schematic diagram of the expanded structure of the radiator in FIG. 5 .

Fig. 7 is a front view of the structure of the specific embodiment 2 of the gravity heat pipe type radiator

FIG. 8 is a top view of FIG. 7 .

Fig. 9 is a structural schematic diagram of a refrigerator or freezer provided with a gravity heat pipe type radiator.

Fig. 10 is a cross-sectional view along B-B in Fig. 9 .

Detailed ways

A kind of refrigerator or electric freezer 6 that is provided with gravity heat pipe type radiator as shown in Fig. 9, Fig. 10, this refrigerator or electric freezer is a single box structure, for illustrating the semiconductor refrigeration element and gravity heat pipe type radiator Structure, the refrigerator or freezer can adopt other structural forms, in Fig. 9, Fig. 10 is convenient for explaining the problem, has omitted the door body of refrigerator or freezer in the illustration;

The refrigerator or freezer 6 includes a casing 61, and a hole 7 is opened on the rear wall 62 of the casing 61. The inside of the hole 7 corresponds to a semiconductor refrigeration element 4, and the semiconductor refrigeration element 4 faces the inner side of the refrigerator casing. It is the cold end, and the side facing the outside of the refrigerator box is the hot end. The liquid storage box 1 of the gravity heat pipe type heat sink is attached to the hot end of the semiconductor refrigeration element, and the liquid storage box 1 is fixed in the opening 7. The hole A sealing and heat-insulating material 8 is arranged between 7 and the liquid storage box 1 .

As shown in Figure 5, Figure 7, and Figure 8, the gravity heat pipe type radiator includes a liquid storage box 1 attached to the hot end of the semiconductor refrigeration element, the liquid storage box 1 communicates with the heat dissipation pipe 2, and the liquid storage box 1 And the cooling medium 3 is filled in the cooling pipe 2 .

As shown in Fig. 1, Fig. 2, Fig. 3, Fig. 4, and Fig. 10, the front part 31 of the liquid storage box 3 is trapezoidal, and the small end surface 32 of the trapezoidal part of the liquid storage box is attached to the hot end of the semiconductor refrigeration element 4, and the storage The rear wall 33 of the liquid box opposite to the small end face of the trapezoid is recessed into the liquid storage box. Of course, the liquid storage box 1 can be made into a simple box body, which is directly connected to the heat dissipation pipe, and can also achieve the function of improving heat dissipation efficiency, and the box body can be arranged in a trapezoidal shape. The rear wall 33 of the liquid storage box opposite to the trapezoidal small end face is recessed toward the inside of the liquid storage box. Compared with the simple liquid storage box body, the height of the liquid level of the cooling medium in the liquid storage box can be increased, and the cooling medium in the liquid storage box can be increased. The junction with the contact surface of the hot end of the semiconductor further improves the heat dissipation efficiency of the hot end of the semiconductor.

The rear upper part of the trapezoidal liquid storage box part is provided with a box body part 34 protruding from the liquid storage box.

As shown in Fig. 5, Fig. 6, Fig. 7 and Fig. 8, the cooling pipe 2 is a coil pipe;

As shown in Figure 9, the coiled pipe 2 is divided into two parts 21 and 22, the coiled pipe 21 is arranged vertically, and the coiled pipe 22 is arranged obliquely, and the coiled pipe part 22 is arranged obliquely, so that the coiled pipes can be misaligned with each other in the longitudinal direction, reducing Or prevent the rising heat of the lower coil from contacting the upper coil, thus improving the heat dissipation efficiency of the coil.

The outlet end 23 of the heat pipe communicates with the upper protruding box body portion 34 of the liquid storage box.

The inlet end 24 of the heat pipe communicates with the lower part of the liquid storage box 1 .

After the gas-liquid conversion between the cooling media, in order to make the converted cooling media return to the liquid storage box through gravity and return smoothly, the pipeline 25 of the coil 2 is coiled along an inclined direction from top to bottom.

The cooling medium in the liquid storage box 1 absorbs the heat of the hot end of the semiconductor refrigeration element and vaporizes, and the faster the circulation, the higher the heat dissipation efficiency. Therefore, the heat dissipation pipes 2 used in the present invention are in two groups, which communicate with the liquid storage box 1 separately.

In order to further improve the heat dissipation efficiency of the heat dissipation pipe, heat dissipation fins 5 are arranged on the heat dissipation pipe 2 .

As shown in Fig. 7 and Fig. 8, two groups of gravity-type heat dissipation pipe coils are connected to the liquid storage box 1 before and after 2 points. Connected via fins 5.

After the cooling pipe enters the coil 2 from the outlet end 23, it will immediately cool down the cooling medium. Therefore, if the outlet end of the coil contacts the cooled coil, it will release heat to the cooled coil, reducing the heat dissipation efficiency of the coil. To prevent multiple outlets of the coils from being drawn out in different directions and contacting the cooled coils, as shown in FIG. 7 , the outlets 23 of the cooling pipes are arranged in parallel and in the same direction.

As shown in Fig. 5 and Fig. 6, when the two coils are arranged side by side and connected with the liquid storage box 1 respectively, in order to facilitate the installation of the coils, the coils are bent into a U-shape through the pipeline 26.

In the above specific embodiment, the circulation mode of the circulation loop formed by the cooling medium 3 between the liquid storage box 1 and the radiating pipe 2 is: the cooling medium 3 absorbs the heat generated by the hot end of the semiconductor refrigeration element 4 in the liquid storage box and then vaporizes and rises to The upper space of the liquid storage box enters the heat dissipation pipe 2. In the heat dissipation pipe 2, the absorbed heat is exchanged with the surrounding air and then cooled and converted into liquid again. Under the action of gravity, the cooled liquid enters through the entrance of the heat dissipation pipe. The liquid storage box 1 repeatedly circulates in this way to cool down the temperature of the hot end of the semiconductor refrigeration element.

In the above specific embodiment, by recessing the rear wall of the liquid storage box into the interior of the liquid storage box 1, the liquid level of the cooling medium in the liquid storage box in contact with the hot end of the semiconductor refrigeration element is relatively increased, and the contact between the cooling medium and the hot end of the semiconductor refrigeration element is further improved. The contact area of the hot end of the semiconductor refrigeration element improves the heat absorption efficiency of the cooling medium. According to the principle of heat balance, the cooling efficiency of the semiconductor refrigeration element is correspondingly improved.

And two groups of cooling pipes 2 are arranged, respectively communicated with the described liquid storage box separately; Coil pipe 2 is arranged obliquely; , which also improves the refrigeration efficiency of the semiconductor refrigeration element.

In the utility model, it is easy to understand that the gravity heat pipe radiator can be applied to the heat dissipation of various semiconductor refrigeration elements. As long as the gravity heat pipe radiator is attached to the hot end of the semiconductor refrigeration element, the heat dissipation efficiency can be improved. Function, correspondingly improve the refrigeration efficiency of the semiconductor refrigeration element.

Claims (10)

1. A refrigeration device, comprising a semiconductor refrigeration element, the semiconductor refrigeration element includes a hot end and a cold end, the hot end of the semiconductor refrigeration element is provided with a heat sink, it is characterized in that the heat dissipation device includes a heat sink attached to the hot end of the semiconductor refrigeration element A combined liquid storage box, the liquid storage box communicates with the heat dissipation pipe, the liquid storage box and the heat dissipation pipe are filled with cooling medium, and the part of the wall of the liquid storage box that is not attached to the hot end of the semiconductor refrigeration element faces the liquid storage The inside of the box is recessed. 2. The refrigeration device according to claim 1, wherein the part of the liquid storage box is trapezoidal, the small end surface of the trapezoidal part of the liquid storage box is attached to the hot end of the semiconductor refrigeration element, and the liquid storage box The side opposite to the small end face of the trapezoid is recessed toward the interior of the liquid storage box. 3. The refrigerating device according to claim 1, wherein a box body protruding from the liquid storage box is provided at the upper rear part of the liquid storage box. 4. The refrigeration device according to claim 1, wherein the heat dissipation pipe is a coiled tube, and the coiled tube is arranged obliquely. 5. The refrigerating device according to claim 1 or 4, characterized in that there are multiple groups of the heat dissipation pipes, each of which communicates with the liquid storage box independently. 6. The refrigerating device according to claim 5, wherein the outlet ends of the heat dissipation pipes are arranged side by side in the same direction. 7. The refrigerating device according to claim 5, wherein the heat dissipation pipes are arranged side by side or front to back. 8. The refrigerating device according to claim 5, wherein the heat dissipation pipe is a coiled tube, and the coiled tube is bent into a U shape. 9. The refrigerating device according to claim 5, wherein the heat dissipation pipes are connected by fins or fins. 10. The refrigerating device according to any one of claims 1 to 9, characterized in that the refrigerating device is a refrigerator, an air conditioner or a freezer.

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