CN2805090Y - Liquid-cooled heat sink - Google Patents
Liquid-cooled heat sink Download PDFInfo
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- CN2805090Y CN2805090Y CN200520018479.8U CN200520018479U CN2805090Y CN 2805090 Y CN2805090 Y CN 2805090Y CN 200520018479 U CN200520018479 U CN 200520018479U CN 2805090 Y CN2805090 Y CN 2805090Y
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
Description
技术领域technical field
本实用新型涉及一种散热装置,尤其涉及一种组装便利的液冷式散热装置。The utility model relates to a heat dissipation device, in particular to a liquid-cooled heat dissipation device with convenient assembly.
背景技术Background technique
目前所应用的电脑,由于电路板上的芯片,在启动一段时间后,会因高频震汤而产生高温,因此需要适当的散热元件,提供适时的散热,以维持电脑的正常运作。The computers currently used, because the chips on the circuit board will generate high temperature due to high-frequency vibration after a period of time, so appropriate heat dissipation elements are needed to provide timely heat dissipation to maintain the normal operation of the computer.
目前的散热方式,有以散热鳍片直接贴接于芯片〔如中央处理器〕上,使芯片所产生的热能可以经由传递作用,直接传递至散热鳍片上,进行散热,然而这种以散热鳍片所进行的散热效率,已经无法适用于新一代的芯片上。The current heat dissipation method is to directly attach the heat dissipation fins to the chip (such as the central processing unit), so that the heat energy generated by the chip can be directly transferred to the heat dissipation fins for heat dissipation, but this heat dissipation fin The heat dissipation efficiency of the chip is no longer applicable to the new generation of chips.
因此,目前尚有一种液冷式的散热系统,应用于电脑芯片的散热上,该液冷式散热系统的元件,包含液冷盒、散热排、水箱、液压泵及风扇,其中该液冷盒是紧贴于芯片上,并以输液管串联液冷盒、散热排、水箱及液压泵,使冷却液可以循环流动于上述的元件间,如此使冷却液在流经液冷盒时,可与芯片进行热交换,以将热能带至散热排,进行散热,除提供较旧式散热鳍片更佳的散热效果外,也可将芯片所产生的热能带至远处散热,以降低电脑中的热能。但,现有液冷式散热系统,其中散热排、水箱、液压泵及风扇,都是呈一独立、分离的元件,在安装或拆卸上都必须逐一进行,因此对于组装或拆卸作业十分不便。Therefore, at present there is still a liquid-cooled heat dissipation system, which is applied to the heat dissipation of computer chips. The components of the liquid-cooled heat dissipation system include a liquid cooling box, a radiator, a water tank, a hydraulic pump, and a fan. The liquid cooling box It is closely attached to the chip, and the liquid cooling box, radiator, water tank and hydraulic pump are connected in series with the infusion tube, so that the cooling liquid can circulate among the above-mentioned components, so that when the cooling liquid flows through the liquid cooling box, it can be connected with the The chip performs heat exchange to bring the heat energy to the radiator for heat dissipation. In addition to providing better heat dissipation effect than the old cooling fins, it can also take the heat energy generated by the chip to a distant place for heat dissipation to reduce the heat energy in the computer. . However, in the existing liquid-cooled heat dissipation system, the heat sink, water tank, hydraulic pump and fan are all independent and separated components, which must be installed or disassembled one by one, so it is very inconvenient to assemble or disassemble.
实用新型内容Utility model content
本实用新型所要解决的主要技术问题在于,克服现有技术存在的缺陷,而提供一种液冷式散热装置,其具有组装便利的优点。The main technical problem to be solved by the utility model is to overcome the defects of the prior art, and provide a liquid-cooled heat dissipation device, which has the advantage of convenient assembly.
本实用新型解决其技术问题所采用的技术方案是:The technical scheme that the utility model solves its technical problem adopts is:
一种液冷式散热装置,其特征在于:包括:框体,含有容置室,并于其一侧的侧板上,穿设有通风口,以连通该容置室;散热排,装置于该框体的容置室中,该散热排含有热交换管,该热交换管上嵌套多个鳍片;风扇,锁固于该框体上,且对正于该通风口的外侧;液压泵,其外壳体是锁接固定舌板,并穿设有穿孔,以借由螺丝穿经后,锁接于该框体上;水箱,其外壳体是锁接有舌板部,该舌板部上穿设有多个穿孔,以借由螺丝穿经后,锁接于该框体上;液冷盒,紧贴于热源上,该液冷盒内设有水道;该液压泵的出口端,以输液管衔接至液冷盒的水道进口,而液冷盒的水道出口,以输液管衔接至散热排的热交换管的入口,并使热交换管的出口以输液管衔接至水箱的进水口,而水箱的出水口,以输液管衔接至液压泵的吸水口。A liquid-cooled heat dissipation device is characterized in that it includes: a frame body containing a storage chamber, and a vent hole is pierced on one side of the side plate to communicate with the storage chamber; In the accommodating chamber of the frame, the radiator contains a heat exchange tube, and a plurality of fins are nested on the heat exchange tube; the fan is locked on the frame and aligned to the outside of the vent; the hydraulic pressure The outer shell of the pump is locked and fixed with a tongue plate, and is perforated with a perforation, so that it can be locked to the frame after being passed through by a screw; the outer shell of the water tank is locked with a tongue plate, and the tongue plate A plurality of perforations are pierced on the upper part, so as to be locked on the frame body after being passed through by screws; the liquid cooling box is closely attached to the heat source, and a water channel is provided in the liquid cooling box; the outlet end of the hydraulic pump , connect the waterway inlet of the liquid cooling box with the infusion tube, and connect the waterway outlet of the liquid cooling box to the inlet of the heat exchange tube of the radiator with the infusion tube, and connect the outlet of the heat exchange tube to the inlet of the water tank with the infusion tube The water port, and the water outlet of the water tank is connected to the water suction port of the hydraulic pump with the infusion tube.
前述的液冷式散热装置,其中框体含有:本体,在其第一侧面凹设有凹部,以形成该容置室,该容置室的相对两侧,分别相对地穿设有多个固定孔,以锁接散热排,并于该本体的第二侧面,即第一侧面的相对面穿设有通风口,以连通该容置室,且于该本体位于该通风口的外围,穿设有多个风扇固定孔,以对应地锁接风扇,另于该本体上穿设有水箱固定孔及液压泵固定孔,以分别对应地锁接水箱及液压泵;盖板,锁接于该本体的第一侧面,该盖板上设有通口,以连通该容置室,并于该盖板上设有多个固定孔,以借由螺丝锁接于电脑主机箱中。The aforementioned liquid-cooled heat dissipation device, wherein the frame body includes: a main body, a recess is provided on its first side to form the accommodating chamber, and the opposite sides of the accommodating chamber are respectively provided with a plurality of fixed The hole is used to lock the heat sink, and a vent is pierced on the second side of the body, that is, the opposite side of the first side, to communicate with the accommodating chamber, and the body is located on the periphery of the vent, pierced There are multiple fan fixing holes for correspondingly locking the fans, and the body is pierced with water tank fixing holes and hydraulic pump fixing holes for correspondingly locking the water tank and hydraulic pump respectively; the cover plate is locked to the body On the first side of the cover, a port is provided on the cover to communicate with the accommodating chamber, and a plurality of fixing holes are provided on the cover to be locked in the main computer case by screws.
前述的液冷式散热装置,其中盖板的各固定孔的间距,是吻合、对应电脑主机箱所预设用以锁接一般散热风扇的孔距。In the aforementioned liquid-cooled heat dissipation device, the spacing between the fixing holes of the cover plate is consistent with, and corresponds to, the spacing between holes preset by the main computer case for locking with a general cooling fan.
本实用新型具有以下的结构特征及优点:The utility model has the following structural features and advantages:
1.在框体上预设有用以锁接风扇、散热排、水箱及液压泵的固定孔,使上述元件可以一并锁接于该框体上,而随该框体紧附于电脑主机箱上。1. There are fixed holes for locking fans, radiators, water tanks and hydraulic pumps on the frame body, so that the above components can be locked together on the frame body, and then attached to the main computer case with the frame body superior.
2.风扇、散热排、水箱及液压泵,由于一并锁接于框体上,而成一完整的个体,组装者可以一并自电脑主机箱中移除,或安装于电脑主机箱中,以增加组装的便利性。2. The fan, radiator, water tank and hydraulic pump are locked together on the frame to form a complete unit. The assembler can remove them from the main computer case or install them in the main computer case to Increase the convenience of assembly.
附图说明Description of drawings
下面结合附图和实施例对本实用新型进一步说明。Below in conjunction with accompanying drawing and embodiment the utility model is further described.
图1是本实用新型的分解结构示意图。Fig. 1 is a schematic diagram of an exploded structure of the utility model.
图2是本实用新型另一角度的分解结构示意图。Fig. 2 is a schematic diagram of an exploded structure of the utility model from another angle.
图3是本实用新型的组合状态示意图。Fig. 3 is a schematic diagram of the assembled state of the present utility model.
图4是图3所示的4-4方向局部剖面图。Fig. 4 is a partial sectional view taken along the direction 4-4 shown in Fig. 3 .
图5是本实用新型应用于电脑主机箱中的示意图。Fig. 5 is the schematic diagram that the utility model is applied in the computer main frame.
图6是本实用新型应用于电脑主机箱中的另一组装方式示意图。Fig. 6 is a schematic diagram of another assembly method of the utility model applied in a computer main box.
图中标号说明:Explanation of symbols in the figure:
20框体 210容置室 21本体20
211固定孔 212通风口 213风扇固定孔211 Fixing
214水箱固定孔 215液压泵固定孔214 Water
22盖板 221通口 222固定孔22
30散热排 31热交换管 311入口30
312出口 32鳍片 40风扇312
50液压泵 51出口端 52吸水口50
53固定舌板 531穿孔 60水箱53
61进水口 62出水口 63舌板部61 Water inlet 62
631穿孔 70液冷盒 71热源631
72水道 721水道进口 722水道出口72
80电脑主机箱80 computer main box
具体实施方式Detailed ways
请参阅图1至图5所示,本实用新型是有关于一种液冷式散热装置,包括:一框体20,含有一容置室210,并于其一侧的侧板上,穿设有通风口212,以连通该容置室210;一散热排30,装置于该框体20的容置室210中,该散热排30含有一热交换管31,并于该热交换管31上,嵌套多个鳍片32;一风扇40,锁固于该框体20上,且对正于该通风口212的外侧;一液压泵50锁固于该框体20上;一水箱60,锁固于该框体20上;以及一液冷盒70,紧贴于一热源71上,该液冷盒70内设有一水道72;其中令该液压泵50的出口端51,以输液管衔接至液冷盒70的水道进口721,而液冷盒70的水道出口722,以输液管衔接至散热排30的热交换管的入口311,并使热交换管31的出口312以输液管衔接至水箱60的进水口61,而水箱60的出水口62,以输液管衔接至液压泵50的吸水口52,以构成一散热循环。Please refer to Fig. 1 to Fig. 5, the utility model relates to a liquid-cooled heat dissipation device, comprising: a
如图1、图2所示,本实用新型的液冷式散热装置,其中该框体20,含有:一本体21,在其第一侧面,凹设一凹部,以形成该容置室210,该容置室210的相对两侧,分别相对地穿设有多个固定孔211,以锁接散热排30,并于该本体21的第二侧面,即第一侧面的相对面,穿设有通风口212,以连通该容置室210,且在该本体21位于该通风口212的外围,穿设有多个风扇固定孔213,以对应地锁接一风扇40。另于该本体21上穿设有水箱固定孔214及液压泵固定孔215,以分别对应地锁接一水箱60及液压泵50;一盖板22,锁接于该本体21的第一侧面,该盖板22上,是设有通口221,以连通该容置室210,并于该盖板22上,设有多个固定孔222,以借助螺丝锁接于电脑主机箱80中,其中各固定孔222的间距,是吻合、对应电脑主机箱80所预设用以锁接一般散热风扇的孔距,使本实用新型的框体20,可以直接锁固于电脑主机箱80上,而可以将散热排30、风扇40、液压泵50及水箱60一并紧附于电脑主机箱80中。As shown in Fig. 1 and Fig. 2, in the liquid-cooled heat dissipation device of the present invention, the
本实用新型的液压泵50,在其外壳体,是锁接或突设有固定舌板53,并穿设有穿孔531,以对应该框体20的液压泵固定孔215,借助螺丝将该液压泵50紧锁于该框体20的本体21上。The
本实用新型的水箱60,在其外壳体是锁接或突设有舌板部63,并于该舌板部63上穿设有多个穿孔631,以对应框体20的水箱固定孔214,借助螺丝将该水箱60锁固于框体20上。In the
本实用新型的散热排30、风扇40、液压泵50、水箱60及液冷盒70等元件,其内部结构,是属于现有技术,且已被普遍应用于一般的液冷式散热装置中,由于各元件的内部结构特征,并非本实用新型专利申请标的,故不予赘述。The internal structure of the
本实用新型的液冷式散热装置,其中该框体20,可采用金属板材以扳金方式成型,或以塑胶材料射出成型,本实用新型并不予以限制。In the liquid-cooled heat dissipation device of the present invention, the
如图3、图4、图5所示,本实用新型的液冷式散热装置,在应用上,可将框体20固装于如电脑主机箱80的箱体上,使固装于框体20上的风扇40,在启动后所产生的冷空气流,可以吹向位于框体20容置室210中的散热排30,而将散热排30上的热能,循框体20第二侧的通口221,经电脑主机箱80的通气孔〔图中未示〕,向外吹出电脑主机箱体80外,即将电脑主机箱体80中的热能,强制地排出电脑主机箱80外,以提高其散热效率。As shown in Fig. 3, Fig. 4, and Fig. 5, the liquid-cooled heat dissipation device of the present utility model, in application, the
如图3、图4、图5所示,本实用新型的液冷式散热装置,在组装上是可使该风扇40锁接在该框体20的本体21的外侧,使该风扇40在启动后,其出风方向是吹向置于框体20中的散热排30;或者如图6所示,但该风扇40锁接于该框体20的盖板22一侧,以置于该框体20与电脑主机箱80之间,在启动该风扇40后,以抽风的方式,如箭头引线所示,将电脑主机箱80内的空气,吸进框体20内,并窜入散热排30,而后由风扇40吹向电脑主机箱80外;本实用新型并不限制该风扇40装置于框体20的位置。As shown in Fig. 3, Fig. 4, and Fig. 5, the liquid-cooled heat dissipation device of the present invention can be assembled so that the
本实用新型所揭示的液冷式散热装置,由于该散热排30、风扇40、液压泵50及水箱60等元件,是一并锁固于框体20上,因此,使用者在安装上,可以一并安装或移除上述各元件,因此可以使组装或拆卸操作更加便利快速。The liquid-cooled heat dissipation device disclosed in the utility model, since the components such as the
以上所述,仅是本实用新型的较佳实施例而已,并非对本实用新型作任何形式上的限制,凡是依据本实用新型的技术实质对以上实施例所作的任何简单修改、等同变化与修饰,均仍属于本实用新型技术方案的范围内。The above is only a preferred embodiment of the utility model, and does not limit the utility model in any form. Any simple modification, equivalent change and modification made to the above embodiments according to the technical essence of the utility model, All still belong to within the scope of the technical solution of the utility model.
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| CN200520018479.8U CN2805090Y (en) | 2005-05-12 | 2005-05-12 | Liquid-cooled heat sink |
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| CN200520018479.8U CN2805090Y (en) | 2005-05-12 | 2005-05-12 | Liquid-cooled heat sink |
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| CN2805090Y true CN2805090Y (en) | 2006-08-09 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103209567A (en) * | 2012-01-13 | 2013-07-17 | 鸿富锦精密工业(深圳)有限公司 | Closed type control device |
| CN105549704A (en) * | 2016-01-28 | 2016-05-04 | 武汉攀升兄弟科技有限公司 | Liquid-cooled case structure |
| CN113126721A (en) * | 2019-12-31 | 2021-07-16 | 鸿富锦精密工业(武汉)有限公司 | Electronic device and heat dissipation mechanism thereof |
-
2005
- 2005-05-12 CN CN200520018479.8U patent/CN2805090Y/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103209567A (en) * | 2012-01-13 | 2013-07-17 | 鸿富锦精密工业(深圳)有限公司 | Closed type control device |
| CN105549704A (en) * | 2016-01-28 | 2016-05-04 | 武汉攀升兄弟科技有限公司 | Liquid-cooled case structure |
| CN113126721A (en) * | 2019-12-31 | 2021-07-16 | 鸿富锦精密工业(武汉)有限公司 | Electronic device and heat dissipation mechanism thereof |
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Expiration termination date: 20150512 Granted publication date: 20060809 |