CN2899116Y

CN2899116Y - Die-bonded conduction and thermal conduction packaging structure of light-emitting diodes

Info

Publication number: CN2899116Y
Application number: CNU2005200528663U
Authority: CN
Inventors: 陈聪欣
Original assignee: 陈劲豪
Priority date: 2005-12-23
Filing date: 2005-12-23
Publication date: 2007-05-09
Anticipated expiration: 2015-12-23

Abstract

The utility model discloses a solid crystal electricity conduction and heat conduction packaging structure of a light-emitting diode, which comprises a circuit board with heat conduction material performance, wherein the circuit board can be in a shape of at least a convex block or a multi-step layer besides a flat plate, the circuit board is provided with at least one bearing area for bearing a chip, and at least one group of electrode pairs which can directly transmit the heat conduction of the heat conduction material is arranged at the edge, the plate surface, the groove, the interlayer or the bottom of the circuit board to ensure that the chip can generate circuit connection; in essence, the supporting region has at least one cavity for accommodating the adhesive to adhere one or more chips, and the region between the supporting region and the chip not in contact with the adhesive is used as a heat conduction path.

Description

The solid-crystal conductive and heat-conductive packing structure of light-emitting diode

Technical field:

The utility model relates to a kind of solid-crystal conductive and heat-conductive packing structure of light-emitting diode.

Background technology:

Light-emitting diode (LED) has been applied in every electronic product system aspect widely, from the more weak indicator light of luminous efficiency, to illuminance light fixtures such as the information products of high strength and outdoor billboard, traffic lights.Basically, it is the PN interface that operates in forward bias with a kind of, when forward bias, inject a large amount of holes at p type island region, then inject a large amount of electronics in N type district, these holes and electronics can be in exhaustion regions, each carries out the injection of minority carrier to another district, so in the moment that combines with a large amount of carriers at this place, the photon that is equivalent to the energy gap energy is emitted in radiation, and produce illumination effect.Known light-emitting diode is the sheet metal carrier unit that is suitable for conducting electricity that several equidistantly link via punching press; Rack surface is electroplated silver layer; Semiconductor chip is bonded to support, as the light source of light-emitting diode; Lead two ends are connected on support and the chip, to form the cathode and anode pin respectively; And with poured with epoxy resin on support top, make it to form light penetrating object and sealing chip, lead supervisor are made.

Have the knack of this skill personage just as those and know, most of energy of light-emitting diode all is converted into heat, if described heat is not eliminated, then can make chip overheating and damages.Accumulate in this light penetrating object as for these heat parts, fraction distributes through tiny lead first, second pin by support.But because of light penetrating object is with epoxy resin machine-shaping, heat conduction rate variance, so the hot major part that chip produces accumulates in the light penetrating object, effectively distribute heat, can only pass through the support heat loss through conduction by above-mentioned through tiny lead by fraction, and have the lower problem of radiating efficiency.

Particularly, all be packaged with a transparent body in all known traditional LED LAMP support upper ends, and the glue that sticks together that is covered with about thick about 20 μ m～100 μ m in cup all areal extents of the end of negative electrode bowl cup (divides elargol again, white glues, insulating cement) comes then led chip, but also thereby counteract the main cause of luminous waste heat heat loss through conduction, because it is no matter big, low power led chip, in lighting, conducting all generates different direct ratio thermals source at different levels because of power is different, and whether can be to influence the main cause that this light-emitting diode can produce illumination effect or illumination efficiency and life-span rapidly with this thermal source heat loss through conduction.

If this light emitting diode construction is considered in redesign, it is known that its structure is different from, and can change its function of use, kenel, and be different from old law; In fact, also can obviously increase its radiating efficiency; And these problems all are not prompted or advise in above-mentioned case.

The utility model content:

Technical problem to be solved in the utility model is: at the above-mentioned deficiency of prior art, a kind of solid-crystal conductive and heat-conductive packing structure of light-emitting diode is provided, bearing district at circuit board has a hole at least, come in conjunction with one or more chips, with so that the zone that this bearing district and chip chamber do not contact with sizing material as the path of heat conduction.

In order to solve the problems of the technologies described above, the technical scheme that the utility model adopted is: a kind of solid-crystal conductive and heat-conductive packing structure of light-emitting diode, it includes the circuit board of a tool heat-conducting performance, it is characterized in that: described circuit board can be tabular, at least one projection shape or multistage stratiform, and on the plate face and be provided with the bearing district of at least one bearing chip, and at the edge of circuit board, the plate face, groove, interlayer or bottom dispose at least one group that can be directly see through heat-conducting heat conduction and make described chip can produce the electrode pair that circuit connects, at least has a hole in this bearing district, this hole can hold a sizing material, this sizing material can cemented one or more chips, and the zone that this bearing district and chip chamber do not contact with sizing material is as the path of heat conduction.

All bulk area edges of described circuit board are provided with several pyramidal sawtooth tissues.

More can cover in the zone in described bearing district and close at least one light shield body or optical screen curtain, described chip is covered by in this light shield body or the optical screen curtain.Can form the groove of two-phase friendship at least on described bearing district one desired location, and on described intersection location, form a hole.The bottom in described hole comprises the post hole of an axis direction.Described light shield body or optical screen curtain encapsulate several continuously arranged bearing districts.

Described circuit board plate face is chimeric or in conjunction with at least one heat sink, this heat sink top end face has at least one hole.Described heat sink is formed with the heating column of a convex shape at least, and the upper top of the heating column of this convex shape is provided with the reflecting condensation effect of an increase light-emitting diode and the reflecting surface of increase heat extraction or heat transfer efficiency.The heating column of described convex shape can be inserted in the post hole, and with the chip thermal contact conductance.The last top ends of described heating column is provided with at least one hole.

On the surperficial reference direction of described heat sink, form the sawtooth profile tissue of configuration kenel continuously respectively, to form surperficial heat conduction ditch or concavo-convex configuration, to increase area of dissipation, and the surface attachment intensity of encapsulation light shield body, optical screen curtain, or conveniently embed, lock, the intensity and the operation of injection moulding light shield body, optical screen curtain.The top of described heat sink or bottom are provided with one or several makes the multistage heat sink can be through covering groove and the hole that gluing closes.

Described circuit board is provided with groove, with printing, deposition, coating, embedding, bonding, interlayer mode, on groove, form the positive and negative electrode of relative direction along described groove, and on the groove of the positive and negative electrode of this relative direction, define a hole, to apply sizing material, come cemented chip.Form two grooves arranged side by side that are parallel to each other on the described circuit board, on circuit board, form the positive and negative electrode of relative direction along described groove with printing, deposition, coating, bonding, embedding, interlayer mode; The positive and negative electrode of this relative direction defines a hole on groove, to apply sizing material, chip is cemented at becomes kenel in parallel on this position, hole.Form two grooves arranged side by side that are parallel to each other on the described circuit board, on circuit board, form the positive and negative electrode of relative direction along described groove with printing, deposition, coating, bonding, embedding, interlayer mode; The positive and negative electrode of this relative direction defines a hole on groove, and allow the coating sizing material, the link of two adjacent chips is cemented on the hole of described groove with opposite polarity respectively, the mode that makes each interior chip of groove adopt series connection links, and each chip on adjacent grooves is linked respectively in parallel.

At least an electric-insulation heat-conduction material protective layer is covered on described circuit board or the positive and negative electrode.

Described positive and negative electrode can be arranged between the last flaggy and following flaggy of a circuit board, and one connect face, pin, projection, contact and can form with the positive and negative electrode arranged between flaggy and be connected along disposing a channel on the axis reference direction, make the chip that is configured on the upper plate laminate face in last flaggy.

Described circuit board can be the single order stratiform at least and one deck or at least one heat sink are formed with a thickness of setting at least.

Described circuit board bottom is provided with that several are rectangular, the concavo-convex arrangement tissue of the recess of taper or protuberance.

Compared with prior art, the utility model has the advantages that: the bearing district at circuit board is provided with at least one hole, come in conjunction with one or more chips, with so that the zone that this bearing district and chip chamber do not contact with sizing material as thermally conductive pathways, and all circuit are because of being configured on the tool heat conduction materials with function, can significantly reduce resistance, increase electrical power, also effect that just can voluminous third contact of a total solar or lunar eclipse; Be provided with several pyramidal sawtooth tissues at the edge of circuit board, this helps to increase the physics ground state of the area of dissipation and the heat sink material of circuit board, and can strengthen, insert, embed, lock, the intensity of injection moulding formula encapsulation; Sizing material be coated with stick at chip the gluing area less than chip area, help significantly to reduce the contact area of the sizing material and the chip chamber of significant impact heat conduction, and relatively significantly increased the effective area of conduction heat energy.

As for novelty of the present utility model, characteristics, and other purpose and effect, will cooperate appended graphic explanation in detail hereinafter, and be tending towards understanding.

Description of drawings:

Fig. 1 is a schematic perspective view of the present utility model.

Fig. 2 is the cutaway view of Fig. 1.

Fig. 3 is the generalized section of another embodiment of the utility model.

Fig. 4 is the generalized section of binder removal among Fig. 3.

Fig. 5 is the generalized section of heat dissipation direction among Fig. 3.

Fig. 6 is the utility model circuit board and the schematic diagram that engages of fastener.

Fig. 7 is the utility model embodiment schematic diagram again.

Fig. 8 is the another embodiment generalized section of the utility model.

Fig. 9 is the possible embodiments schematic diagram of the utility model electrode configuration mode.

Figure 10 is the utility model one embodiment schematic diagram of deriving; Disclosed the situation that the heat sink surface is formed with sawtooth profile tissue.

Figure 11 is the rough schematic of the utility model one electrode pair, chip attach.

Figure 12 rough schematic that to be the utility model bipolar electrode pair be connected in parallel with chip.

Figure 13 is the utility model multi-electrode pair rough schematic that is connected with each chip.

Figure 14 is the schematic diagram that the utility model multicore sheet and electrode are connected in series.

Figure 15 is the utility model is covered with a protective layer on the electrode of a circuit board a generalized section.

Figure 16 is the schematic perspective view of another possible embodiments of the utility model.

Figure 17 is the generalized section of encapsulation aspect embodiment illustrated in fig. 16.

Figure 18 is the generalized section of another encapsulation aspect embodiment illustrated in fig. 16.

Figure 19 is the generalized section of an encapsulation aspect more embodiment illustrated in fig. 16.

Figure 20 is the generalized section of the another embodiment of deriving of the utility model.

Figure 21 is the schematic diagram that engages of tool conductive force circuit board bottom and multistage layer of heat sink among the another embodiment of deriving of the utility model.

Figure 22 is that another of tool conductive force circuit board bottom and multistage layer of heat sink engages schematic diagram among the another embodiment of deriving of the utility model.

Figure 23 be among the another embodiment of deriving of the utility model tool conductive force circuit board bottom and multistage layer of heat sink one engage schematic diagram again.

Figure 24 is the schematic diagram of the juncture of deriving of the multistage layer heat sink of Figure 21 tool conductive force circuit board bottom or heat sink.

Figure 25 is the schematic diagram of another juncture of deriving of the multistage layer heat sink of Figure 21 tool conductive force circuit board bottom or heat sink.

Figure 26 is that the utility model is arranged on the recess of tool conductive force circuit board bottom or heat sink and the schematic diagram that engages of protuberance.

To be the utility model recess of being arranged on tool conductive force circuit board bottom or heat sink engage schematic diagram with another of protuberance to Figure 27.

Figure 28 is the schematic perspective view of the utility model tool conductive force circuit board bottom or heat sink top ends.

Figure 29 is another schematic perspective view of the utility model tool conductive force circuit board bottom or heat sink top ends heat sink.

Label declaration:

1........... circuit board 10............ sizing material

11.......... electrode pair 12............ positive electrode

13.......... negative electrode 14............ bottom

15.......... pyramidal sawtooth is organized the 16............ protective layer

17.......... flaggy under the last flaggy 18............

19.......... passage 2,2 ' ... .. bearing district

20.......... light shield body or optical screen curtain 21,21 ' ... hole

23.......... post hole 26,26 ' ... groove

3........... chip 5,5 ' ... .. heat sink

51.......... top end face 53............ heating column

54.......... reflecting surface 55............ recess

56.......... protuberance 6,6 ' ... .. radiating subassembly

Embodiment:

See also Figure 1 and Figure 2, the solid crystalline substance of the utility model light-emitting diode, first embodiment that conductive and heat-conductive packing structure is adopted, it includes the circuit board 1 of one one-tenth geometry tool heat-conducting function, this circuit board 1 allows all be configured in the edge, the plate face, groove, interlayer, the circuit of bottom, because of the thermal energy that electric energy produced, can directly see through the Heat Conduction Material performance, with heat conduction outward from all quarter, can cause reduction resistance, the effect of thermal resistance, improving electricity leads, the efficient of thermal conductance, also just improve the ratio that electric energy is converted to luminous energy, and cause the generation high-energy photon, the function of efficient electric energy.Be provided with several pyramidal sawtooth tissues 15 at the edge of described circuit board 1, this helps to increase the physics ground state of the area of dissipation and the heat sink material of circuit board 1, and can strengthen insertion, embed, lock, the intensity of injection moulding formula encapsulation.Dispose a bearing district 2 on the plate face, described bearing district 2 optionally is provided with one or several holes 21, the edge of this circuit board 1 or plate face or groove or interlayer or bottom dispose one group of electrode pair 11 at least, make the feeder ear of 11 of described chip 3 and electrode pairs or link produce the circuit connection after being connected; In fact, being configured in the hole 21 in the bearing district 2, is in order to hold sizing material 10 cemented one or more chips 3 and to provide an encapsulating or device or injection moulding mode encapsulate, to form light shield body or optical screen curtain 20, as shown in Figure 2.

Therefore, in embodiment of the present utility model, this binds the zone that the chip 3 on circuit board 1 does not contact with sizing material 10, is to be connected with the top layer of the circuit board 1 of tool heat-conducting, forms large-area heat dissipation path and zone.Adopting in the preferable consideration at present embodiment, is to make the area that sizing material 10 and chip 3 stick together be reduced to minimum, and for example: chip 3 areas of 200mil are made as 3mm * 3mm, and its chip 3 gluing areas are 0.1～0.15mm approximately only ², account for chip 3 areas 1/150～70/100.Scrutablely be, so design mainly makes the gluing area less than chip 3 areas, help significantly to reduce the contact area of 3 of the sizing material 10 of significant impact heat conduction and chips, and relatively significantly increased the effective area of conduction heat energy, can conduct fast looses removes the heat that about 5W left and right sides electric energy is produced, and also relatively increases its service efficiency and life-span certainly.

One is arranged on the side top layer of the taper sawtooth tissue 15 at circuit board 1 edge, has strengthened light shield body, optical screen curtain package strength, need only partly cover to be combined on circuit board 1 surface area; And chip 3 can not be subjected to the zone of sizing material 10 contacts do contact thermal energy dissipation or conduction via its chip 3 at the heat energy that work the time is produced, as the situation as shown in Fig. 2 arrow.

Fig. 3-Fig. 6 has shown the embodiment that the utility model one is feasible, and 21 bottom comprises the post hole 23 of an axis direction in the hole, allows low-melting sizing material 10 between the long baking journey of processing, must fuse liquid and 23 discharges from the post hole.So, post hole 23 forms hollow state, when chip 3 conductions are lighted, see through this post hole 23 and can form the convection type heat radiation, and form the effect of thermal energy exchange with the Cryogenic air of external environment, or cooperate the second heavy heat sink 5, allow the heating column 53 of all convex shapes directly inject post holes 23 and with chip 3 direct contact heat transfers, and if top ends is as being provided with reflecting surface 54 on the heating column 53 that protrudes, more can further promote the reflecting condensation effect of LED illuminating part, also significantly increase heat extraction or heat transfer efficiency simultaneously.

Fig. 7 is the feasible embodiment schematic diagram of deriving of the utility model one, in the present embodiment, can form the groove 26 that two-phase is at least handed on bearing district 2 one predeterminated positions, in order to filler gum, fixes chip 3; Area accounts between the 2%-70%, makes chip 3 and bearing district 2 cemented mutually and reach as the conductive force in the foregoing description.

Fig. 8 has shown: under the consideration that increases area of dissipation, circuit board 1 plate face is chimeric or be combined with a minimum heat sink 5, and heat sink 5 is chosen a column or block configuration in this embodiment, include minimum one in the hole 21 of top end face 51, in order to be covered with sizing material 10 cemented chips 3.In the present embodiment, the thermal power that chip 3 is produced can be from the zone that sizing material 10 does not contact with chip 3, and conducting heat to heat sink 5 derives.Apprehensible is that for making the area of dissipation increase, this heat sink 5 more can link minimum another layer radiating subassembly 6, as shown in Fig. 8 dotted portion; The effect that increases it and lead/dispel the heat.

Fig. 9 is the utility model embodiment that derives again, and this positive and negative electrode (12,13) is arranged between the last flaggy 17 and following flaggy 18 in the circuit board 1 in the present embodiment; On this, on an axis reference direction, dispose a passage 19 in the flaggy 17, make the chip 3 that is configured on the flaggy 17 plate faces connect face, pin (or claiming projection, salient point) and can form by the positive and negative electrode of being arranged between passage 19 and flaggy (12,13) and link, or use lead, guide pillar passes this passage 19 and connects these positive and negative electrodes (12,13).

Certainly, this positive and negative electrode (12,13) also can be arranged in the bottom 14 of circuit board 1 or following flaggy 18, and make this passage 19 pass this circuit board 1 or upper and lower flaggy (17,18), with so that this chip 3 connects face, pin (or claiming projection, salient point) or lead, guide pillar can be connected with positive and negative electrode (12,13).

Figure 10 is the embodiment that derives of Fig. 8, comprise that a minimum heat sink 5 ' is under the notion condition that increases heat sink 5 ' cooling surface area, at least on the surperficial reference direction of heat sink 5 ' and radiating subassembly 6 ', form the sawtooth profile tissue of configuration kenel continuously respectively, to form surperficial heat conduction ditch or concavo-convex configuration, increase cooling surface area and package surface adhesive strength or conveniently insert, embed, bind, lock, the intensity when injection moulding light shield body, optical screen curtain 20, so need only the packed part volume, abdicate more cooling surface areas.

Seeing also shown in Figure 11ly, is to be provided with groove 26 ' on a circuit board 1, in modes such as printing, deposition, coating, embedding, bonding, interlayers, forms the positive and negative electrode (12,13) of relative direction along described groove 26 ' on circuit board 1.In the present embodiment, the positive and negative electrode of this relative direction (12,13) defines a hole 21 ' on groove 26 '; This hole 21 ' is allowed and is applied sizing material 10, comes cemented chip 3, uses the zone that chip 3 is not contacted with sizing material 10, is used as loosing/path of heat conduction.

See also shown in Figure 12, be on a circuit board 1, to form the groove 26 ' arranged side by side that is parallel to each other, in modes such as printing, deposition, coating, embedding, bonding, interlayers, on circuit board 1, form the positive and negative electrode (12,13) of relative direction along described groove 26 '.In the present embodiment, the positive and negative electrode of this relative direction (12,13) defines a hole 21 ' on groove 26 '; Coating sizing material 10 is allowed in this hole 21 ', chip 3 is cemented at this hole 21 ' goes up and form kenel in parallel, and the heat energy that makes chip 3 be produced, the zone that can not contact with sizing material 10 by each chip 3 respectively reaches the effect of heat loss through conduction.

Figure 13 has shown that then tool is provided with the groove 26 ' that several are arranged side by side on the plate face of a circuit board 1, in modes such as printing, deposition, coating, embedding, bonding, interlayers, on circuit board 1, form the positive and negative electrode (12,13) of relative direction along described groove 26 '.In the present embodiment, the positive and negative electrode of this relative direction (12,13) defines a hole 21 ' on groove 26 '; Behind a coating sizing material 10, the link of two adjacent chips 3 is cemented on the hole 21 ' of described groove 26 ' with opposite polarity respectively, the mode that makes each groove 26 ' each interior chip 3 adopt series connection links, and each adjacent grooves 26 ' is arranged respectively in parallel, to form an embodiment of multicore sheet 3 and a plurality of positive and negative electrodes (12,13) configuration.

Figure 14 has then shown another embodiment that derives of the utility model, be formed with groove 26 ' layout at a circuit board 1, in modes such as printing, deposition, coating, embedding, bonding, interlayers, on circuit board 1, form positive and negative electrode (12,13) along described groove 26 '.In the present embodiment, this positive and negative electrode (12,13) defines a hole 21 ' on groove 26 '; In the present embodiment, its several chips 3 are separately positioned on the hole 21 ' that groove 26 ' defines in the mode of series connection, link application with the circuit of setting up between a multicore sheet 3 and positive and negative electrode (12,13).

Such design, except can reaching above-mentioned radiating effect, further directly chip 3 is connected with positive and negative electrode (12,13) on the circuit board 1 plate face, when imposing an external power source, can allow chip 3 enter operating state, and need not allow chip 3 connect up in addition again or the overlap joint call wire.

Figure 15 has shown in a preferable consideration; for avoiding being arranged in the conducting metal in this groove 26 '; after using for a long time; can produce the situation of burning; and the protective layer 16 of one deck tool heat-conducting that is covered at positive and negative electrode (12,13) or on circuit board 1 at least; for example: be covered with the heat conduction glue-line that one deck has the electric insulation effect of suitable thickness, as the usefulness of circuit board 1 or positive and negative electrode (12,13) and air obstruct.

Figure 16 has then shown another feasible embodiment of the utility model, this circuit board 1 optionally forms the design of single-order or multistage laminar, below described circuit board 1, a heat sink 5 ' is set, wherein, this circuit board 1 has one respectively with heat sink 5 ' and sets thickness, increasing the area of dissipation of circuit board 1 and heat sink 5 ', and tool is provided with the sawtooth profile tissue of continuous configuration kenel on the end face of described thickness, to form surperficial heat conduction ditch or concavo-convex configuration; Adopt under the preferable consideration at present embodiment, be disposed at the bearing district 2 ' in the circuit board 1, form a design of protruding circuit board 1, and at least one hole 21 ' that in this bearing district 2 ', is pivoted, and allow that this hole 21 ' is through covering glue, and chip 3 is cemented on the hole 21 ', encapsulate through an encapsulating or device or injection moulding mode, to form light shield body or optical screen curtain 20.

Referring to Figure 17 to Figure 19, the generalized section that has then shown this embodiment, by finding out among the figure, several protrude from the bearing district 2 ' of circuit board 1, after above-mentioned encapsulation process, can form light shield body or the optical screen curtain 20 1 local organizational patterns that encapsulate bearing districts 2 ' or all encapsulate or will encapsulate comprehensively several continuously arranged bearing districts 2 '.

Please continue to consult Figure 17 to Figure 19, in the another possible embodiments of deriving of the utility model, this circuit board 1 is provided with several bearing districts 2 ' of protruding circuit board 1, and this circuit board 1 can form the design of single-order or multistage binding heat sink 5 '; In the present embodiment, this circuit board 1 and the heat sink 5 ' that is configured in the circuit board lower end are for can be integrally formed or the kenel that engages of multi-disc, piece, part; In addition, each positive and negative electrode be configured in the material of circuit board 1 or also configurable with heat sink 5 ' the formed interlayer that engages in (not shown).

See also Figure 20, and in described circuit board 1, dispose a passage 19 along an axis reference direction, make each chip 3 that is configured on the circuit board 1 connect face, pin (or claiming projection, salient point) and can form by the positive and negative electrode (12,13) that passage 19 and interlayer are arranged and link, or use lead, guide pillar passes this passage 19 and connects these positive and negative electrodes (12,13).

In addition, in the present embodiment, the mode of encapsulation light shield body or optical screen curtain 20 among the more extensible last embodiment, cemented behind set hole 21 ', bearing district 2 ' at chip 3, do the chip 3 in each bearing district 2 ' local or whole or encapsulate the organizational patterns in several continuously arranged bearing districts 2 ' comprehensively; The shown situation of Figure 20 for example.

To shown in Figure 23, in the another embodiment that derives of the utility model, be formed with a bearing district 2 that protrudes from circuit board 1 on the plate face of this circuit board 1 as Figure 21, this bearing district 2 is provided with a hole 21 at least, in order to hold the cemented chip 3 of sizing material; The bottom of described circuit board 1 can engage the circuit board 1 or the heat sink 5 ' of single order (layer) at least or multistage (layer), in the present embodiment, optionally at circuit board 1 and 5 of heat sinks or the heat sink 5 ' of two rank (layer) or two rank (layer) circuit board 1, appoint select joint wherein one connect face, one or several holes 21 are set, apply sizing material, the effect that produces cemented joint through one; In addition, in Figure 22 to Figure 23, further point out to be configured in two rank heat sinks, the 5 ' composition surface below circuit board 1 or the described circuit board 1, being respectively arranged with several recesses 55 reaches in order to articulate the protuberance 56 on another composition surface, to form a concavo-convex arrangement tissue, wherein, this recess 55 and protuberance 56 can be rectangle, taper as situation or other geometry as shown in Figure 26 to Figure 27; Adopt in the preferable consideration at present embodiment, the surperficial visual demand of its recess 55 or protuberance 56 is provided with one or several holes 21, and on hole 21 coated with sizing material, connect the abutting end of another heat sink 5 ' or another rank (layer) circuit board 1.

Referring to Figure 24 to Figure 27, the design of deriving for this embodiment, described protuberance 56 is arranged between two heat sinks 5 ' that engage in large-area mode respectively with

recess

55 or 5 of circuit board 1 and heat sinks, and in two heat sinks 5 ' or heat sink 5 and circuit board 1 engaging zones, one or several holes 21 are set hold sizing material, multistage layer heat sink 5 ' or heat sink 5 and circuit board 1 or other inter-module can be bonded with each other by this, in order to do to reach the effect that increases area of dissipation.

Referring to Figure 28 to Figure 29, then shown the bottom of this embodiment tool thermolysis circuit board 1 and the schematic perspective view of heat sink 5 top ends, this circuit board 1 is provided with several pyramidal sawtooth tissues 15 with the edge of heat sink 5; This helps to increase the physics ground state of the area of dissipation and the heat sink material of circuit board 1, be respectively equipped with groove 26 on the surface of the heat sink 5 of this single-order or multistage (layer) or the bottom, and several are configured in the hole 21 on the set groove 26 of circuit board 1 or plate face, in the present embodiment, this hole 21 is in order to hold sizing material, make chip 3, heat sink 5 or other assembly, can be after described sizing material applies bonding, can combine closely mutually or bind between generation component, except having good heat radiation or conductive force, and reach the effect that multistage heat sink or multistage assembly engage.

Claims

1. the solid-crystal conductive and heat-conductive packing structure of a light-emitting diode, it includes the circuit board of a tool heat-conducting performance, it is characterized in that: described circuit board can be tabular, at least one projection shape or multistage stratiform, and the plate face is provided with the bearing district of at least one bearing chip, and at the edge of circuit board, the plate face, groove, interlayer or bottom dispose at least one group that can be directly see through heat-conducting heat conduction and make described chip can produce the electrode pair that circuit connects, at least has a hole in this bearing district, this hole can hold a sizing material, this sizing material can cemented one or more chips, and the zone that this bearing district and chip chamber do not contact with sizing material is as the path of heat conduction.

2. the solid-crystal conductive and heat-conductive packing structure of light-emitting diode according to claim 1, it is characterized in that: all bulk area edges of described circuit board are provided with several pyramidal sawtooth tissues.

3. the solid-crystal conductive and heat-conductive packing structure of light-emitting diode according to claim 1, it is characterized in that: more can cover in the zone in described bearing district and close at least one light shield body or optical screen curtain, described chip is covered by in this light shield body or the optical screen curtain.

4. the solid-crystal conductive and heat-conductive packing structure of light-emitting diode according to claim 1, it is characterized in that: the bottom in described hole comprises the post hole of an axis direction.

5. the solid-crystal conductive and heat-conductive packing structure of light-emitting diode according to claim 1 is characterized in that: can form the groove of two-phase friendship at least on described bearing district one desired location, and form a hole on described intersection location.

6. the solid-crystal conductive and heat-conductive packing structure of light-emitting diode according to claim 1, it is characterized in that: described circuit board plate face is chimeric or in conjunction with at least one heat sink, this heat sink top end face has at least one hole.

7. the solid-crystal conductive and heat-conductive packing structure of light-emitting diode according to claim 6, it is characterized in that: described heat sink is formed with the heating column of a convex shape at least, and the upper top of the heating column of this convex shape is provided with the reflecting condensation effect of an increase light-emitting diode and the reflecting surface of increase heat extraction or heat transfer efficiency.

8. the solid-crystal conductive and heat-conductive packing structure of light-emitting diode according to claim 7, it is characterized in that: the heating column of described convex shape can be inserted in the post hole, and with the chip thermal contact conductance.

9. the solid-crystal conductive and heat-conductive packing structure of light-emitting diode according to claim 7, it is characterized in that: the last top ends of described heating column is provided with at least one hole.

10. the solid-crystal conductive and heat-conductive packing structure of light-emitting diode according to claim 6, it is characterized in that: on the surperficial reference direction of described heat sink, form the sawtooth profile tissue of configuration kenel continuously respectively, to form surperficial heat conduction ditch or concavo-convex configuration, to increase area of dissipation, and the surface attachment intensity of encapsulation light shield body, optical screen curtain, or conveniently embed, lock, the intensity and the operation of injection moulding light shield body, optical screen curtain.

11. the solid-crystal conductive and heat-conductive packing structure of light-emitting diode according to claim 1, it is characterized in that: described circuit board is provided with groove, along described groove with printing, deposition, coating, embedding, bonding, interlayer mode, on groove, form the positive and negative electrode of relative direction, and on the groove of the positive and negative electrode of this relative direction, define a hole, to apply sizing material, come cemented chip.

12. the solid-crystal conductive and heat-conductive packing structure of light-emitting diode according to claim 1, it is characterized in that: form two grooves arranged side by side that are parallel to each other on the described circuit board, on circuit board, form the positive and negative electrode of relative direction along described groove with printing, deposition, coating, bonding, embedding, interlayer mode; The positive and negative electrode of this relative direction defines a hole on groove, to apply sizing material, chip is cemented at becomes kenel in parallel on this position, hole.

13. the solid-crystal conductive and heat-conductive packing structure of light-emitting diode according to claim 1, it is characterized in that: form two grooves arranged side by side that are parallel to each other on the described circuit board, on circuit board, form the positive and negative electrode of relative direction along described groove with printing, deposition, coating, bonding, embedding, interlayer mode; The positive and negative electrode of this relative direction defines a hole on groove, and allow the coating sizing material, the link of two adjacent chips is cemented on the hole of described groove with opposite polarity respectively, the mode that makes each interior chip of groove adopt series connection links, and each chip on adjacent grooves is linked respectively in parallel.

14. the solid-crystal conductive and heat-conductive packing structure according to claim 1 or 11 or 12 or 13 described light-emitting diodes is characterized in that: an electric-insulation heat-conduction material protective layer at least is covered on described circuit board or the positive and negative electrode.

15. solid-crystal conductive and heat-conductive packing structure according to claim 11 or 12 or 13 described light-emitting diodes, it is characterized in that: described positive and negative electrode can be arranged between the last flaggy and following flaggy of a circuit board, and one connect face, pin, projection, contact and can form with the positive and negative electrode arranged between flaggy and be connected along disposing a passage on the axis reference direction, make the chip that is configured on the upper plate laminate face in last flaggy.

16. the solid-crystal conductive and heat-conductive packing structure of light-emitting diode according to claim 1 is characterized in that: described circuit board can be the single order stratiform at least and one deck or at least one heat sink are formed with a thickness of setting at least.

17. the solid-crystal conductive and heat-conductive packing structure of light-emitting diode according to claim 3 is characterized in that: described light shield body or optical screen curtain encapsulate several continuously arranged bearing districts.

18. the solid-crystal conductive and heat-conductive packing structure according to claim 1 or 2 or 11 or 12 or 16 described light-emitting diodes is characterized in that: described circuit board bottom is provided with that several are rectangular, the concavo-convex arrangement tissue of the recess of taper or protuberance.

19. the solid-crystal conductive and heat-conductive packing structure according to claim 6 or 7 described light-emitting diodes is characterized in that: the top of described heat sink or bottom are provided with one or several makes the multistage heat sink can be through covering groove and the hole that gluing closes.