CN2899049Y - Laser seamless welded chip resistor structure - Google Patents

Abstract

The utility model relates to a laser seamless welding chip resistor structure, which selects required alloy plates according to different resistance values, uses a laser welding machine to implement seamless welding of the alloy plates and copper plates, detects and adjusts the resistance value after the alloy plates and the copper plates are formed into a preset shape by stamping, and uses a laser cutting mode to carry out fine adjustment; because the utility model discloses with the accurate combination of laser welding integrated structure with the copper on the alloy board, it can grasp the accuracy in the aspect of the resistance in making really, and implements the resistance after whole piece stamping forming and repairs, can reach required resistance range in the reservation.

Description

Laser seamless welded chip resistor structure

technical field

The utility model relates to a laser seamless welding chip resistance structure, in particular refers to the seamless welding of an alloy plate and a copper plate by a laser, so that the resistance value can be controlled in a stable range, and the resistance value can be fine-tuned. technology, so that the accuracy of each resistor is adjusted to the required range.

Background technique

The manufacturing process of the known surface mount chip resistors is mainly to plate copper metal on the alloy plate to combine the alloy plate with the copper plate. form the desired resistor. However, when the general chip resistor is electroplated to attach copper metal to the alloy plate, the thickness of the copper metal in the plating process is not easy to control, which causes the resistance to become unstable. When the probe used for detection is in contact with the resistor body When contacting, it is very difficult to adjust the resistance value due to the large change rate of the resistance value. Since the resistance value adjustment is not easy, the proportion of eliminated resistors is high, and the relative manufacturing cost is often high because of this.

Contents of the invention

In order to overcome the deficiencies in the prior art, the purpose of the utility model is to provide a chip resistor suitable for mass production and stable in quality. To replace the problem of unstable resistance value and poor precision in the traditional manufacturing structure.

The technical solution adopted by the utility model is: a chip resistance structure of laser seamless welding,

The alloy plate is in the shape of a strip, and the two sides of the alloy plate are seamlessly welded and combined with copper plates.

Description of drawings

Fig. 1 is the appearance perspective view of composite board of the present utility model;

Fig. 2 is the perspective view of the appearance of the utility model that the copper plate is welded on both sides of the composite plate;

Fig. 3 is a perspective view of the utility model die punching;

Fig. 4 is a perspective view of the appearance of the utility model to adjust the resistance value by laser cutting;

Fig. 5 is that the utility model is coated with protective adhesive layer on both sides of the alloy plate;

Fig. 6 The utility model has a welding layer attached to the electrode plating at both ends of the copper plate.

Description of reference signs: 1 alloy plate; 2 copper plate; 3 laser welding; 4 laser cutting; 5 resin mold; 6 electrode terminal; A-alloy resistor.

Detailed ways

Please refer to Fig. 1 and Fig. 2, the chip resistance structure of the laser seamless welding of the present invention is mainly to select the required alloy plate material according to the required resistance, wherein the alloy plate 1 is strip-shaped, according to The copper plate 2 (or copper alloy) selected for the resistance value is laser welded on both sides of the alloy plate 1 to form the electrode end. Taking the diagram as an example, the diameter is welded on both sides of the alloy plate 1. Because the laser welding 3 The copper plate 2 is welded to the alloy plate 1 to form a seamless weld, so the combination of the copper plate 2 and the alloy plate 1 is precise and reliable, and the welding process is extremely simple. When two metal plates of different materials are combined, the predetermined set resistance value is almost to zero difference.

Please refer to Figures 3 to 4 again. After the alloy plate 1 is combined with the copper plate 2 with high thermal conductivity, the entire die can be further implemented to punch out its shape according to the original preset resistance value, and then The alloy plate 1 on one side is cut to facilitate resistance measurement. Due to the fact that there will be some errors when the die is implemented, a special laser machine can be used to do laser cutting 4 on the resistor body with a die on each alloy plate 1 to achieve the effect of fine-tuning and trimming the resistance value, and each resistor after trimming can be improved. Its accuracy value is within 1%, so the elimination of its defective products is relatively very low.

As shown in Figure 5, the above-mentioned resistors are coated on both sides of the alloy resistors of the alloy plate 1 with epoxy resin after passing through the punching die and adjusting the resistance value (in the drawing, to realize the covered plastic resin Protective mold 5 part), as plastic grease protective mold 5 to protect resistor body and reach insulation effect, but in order to maintain electrical conduction between the circuit substrate, the copper plate 2 welded at both ends of the alloy plate 1 must be partially exposed.

Please refer to Figure 6. After the resistor body is protected by the plastic resin protective mold, it can be punched as a single body, and the entire resistor is punched into individual units. Finally, the protrusion is exposed on the plastic resin protective mold. The copper plates at both ends of the mold 5 are barrel-plated with the electrode terminal 6, and the electrode 6 is plated with nickel (Ni) and tin (Sn), and the surface of the copper plate is covered by nickel (Ni) and tin (Sn), which can improve the tin property of the copper metal. bad situation.

The chip resistance structure of the laser seamless welding of the utility model adopts a simple welding combination structure, which can simplify the manufacturing procedure, and at the same time ensure the accuracy of the resistance value of the chip resistor; therefore, the laser provided by the utility model has no The seam-welded chip resistance structure is not only novel and pioneered by the inventor, but also can achieve the expected practical value and effect. Compared with the conventional electroplating form, the utility model has greater advantages and improved effects.

To sum up, these are only preferred embodiments of the present invention, and should not limit the implementation scope of the present invention. That is to say, all equivalent changes and modifications made according to the patent scope of the utility model should still belong to the scope covered by the patent of the present invention.

Claims (1)

1. A chip resistance structure of laser seamless welding, characterized in that: The alloy plate is in the shape of a strip, and the two sides of the alloy plate are seamlessly welded and combined with copper plates.

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