CN2772173Y - Thin Film Heating Components - Google Patents
Thin Film Heating Components Download PDFInfo
- Publication number
- CN2772173Y CN2772173Y CN 200520001321 CN200520001321U CN2772173Y CN 2772173 Y CN2772173 Y CN 2772173Y CN 200520001321 CN200520001321 CN 200520001321 CN 200520001321 U CN200520001321 U CN 200520001321U CN 2772173 Y CN2772173 Y CN 2772173Y
- Authority
- CN
- China
- Prior art keywords
- heating
- electric
- heat generating
- generating component
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000010409 thin film Substances 0.000 title claims description 12
- 238000010438 heat treatment Methods 0.000 title abstract description 21
- 238000005485 electric heating Methods 0.000 claims abstract description 22
- 239000000758 substrate Substances 0.000 claims abstract description 18
- 229910052751 metal Inorganic materials 0.000 claims abstract description 15
- 239000002184 metal Substances 0.000 claims abstract description 13
- 239000010408 film Substances 0.000 claims description 25
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 9
- 239000004411 aluminium Substances 0.000 claims description 6
- 229910052782 aluminium Inorganic materials 0.000 claims description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- 239000011777 magnesium Substances 0.000 claims description 6
- 239000010936 titanium Substances 0.000 claims description 6
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 5
- 239000000956 alloy Substances 0.000 claims description 5
- 230000004888 barrier function Effects 0.000 claims description 5
- 239000007769 metal material Substances 0.000 claims description 4
- 150000002894 organic compounds Chemical class 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 claims description 3
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 3
- 229910045601 alloy Inorganic materials 0.000 claims description 3
- 229910052790 beryllium Inorganic materials 0.000 claims description 3
- ATBAMAFKBVZNFJ-UHFFFAOYSA-N beryllium atom Chemical compound [Be] ATBAMAFKBVZNFJ-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000011521 glass Substances 0.000 claims description 3
- 229910052744 lithium Inorganic materials 0.000 claims description 3
- 229910052749 magnesium Inorganic materials 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 229910052710 silicon Inorganic materials 0.000 claims description 3
- 239000010703 silicon Substances 0.000 claims description 3
- 229910052719 titanium Inorganic materials 0.000 claims description 3
- 239000000919 ceramic Substances 0.000 claims description 2
- 239000004020 conductor Substances 0.000 abstract description 2
- 239000000463 material Substances 0.000 description 16
- 238000000034 method Methods 0.000 description 8
- 239000004065 semiconductor Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000008034 disappearance Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 150000007522 mineralic acids Chemical class 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 229910021332 silicide Inorganic materials 0.000 description 1
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- GPPXJZIENCGNKB-UHFFFAOYSA-N vanadium Chemical compound [V]#[V] GPPXJZIENCGNKB-UHFFFAOYSA-N 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
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- Resistance Heating (AREA)
Abstract
The utility model discloses a film heating component, which is a heating component taking an electric heating film as a heating medium and mainly comprises a metal substrate, wherein an insulating layer is coated on the metal substrate, and the insulating layer is coated with an electric heating film layer for heating when being electrified; the electric heating film layer can be heated after the electric conductor is electrified, and the metal substrate has better structural strength, so that the heating assembly can be prevented from being broken.
Description
Technical field
The utility model relates to a kind of heat generating component, and particularly a kind of is the film heat generating component of heating medium with the electric-heating thin film.
Background technology
As everyone knows, so far still at the existing electric-heating assembly that uses, substantially shown in Fig. 1, Figure 1B, Fig. 1 C and Fig. 1 D, be a wire with suitable resistance, metal bar, metallic plate or in the tubulose heater of heating wire is arranged.
No matter be heating wire, electrical bar, electric hot plate or electrothermal tube, all have following problem:
1,, all utilizes the resistance coefficient of electric conducting material itself, so after the energising, material itself generates heat because of resistance produces heat energy, uses for people because of heating wire, electrical bar, electric hot plate or electrothermal tube.If will obtain accurate heat, must calculate this properties of materials very accurately, and according to result calculated, accurately produce the heating wire or the electrical bar of certain material, certain-length, certain sectional area, but, because the factor of material itself is difficult to really produce and can accurately sends the fixedly electric-heating assembly of heat.
2, the electric-heating assembly of heat is difficult to make owing to can accurately send fixedly, so up to now, on the high-tech electronic industry of the more accurate thermal source of needs, the needs that existing electric-heating assembly can't be realistic, the electric heating field that causes the high-tech electronic industry still can't obtain to break through.
Because have heating wire, electrical bar, electrothermal tube etc. now above-mentioned disappearance is arranged, the inventor has begun to lack the road of studying improvement at those in many years ago, there are many achievements to produce through long-time research, and it is on record to this country's application invention or novel patent, for example, Electric radiant Heating Film and method for making thereof (application case number be No. 93114226), device for heating electric heating membrane (application case number be No. 93214315), samming heat conduction panel (application case number be No. 93215909) or the like.
In the above-mentioned electric calorifie installation, Electric radiant Heating Film is made with semi-conducting material, and can utilize the manufacture of semiconductor subassembly to make electric-heating assembly, but conductive exothermal efficient is not high for fear of taking place, even causes the situation of electric shock, the applicant is in above-mentioned invention or utility model, all use ceramic material as base material, still, the major defect of easy breakage is arranged but in the use.
The utility model content
It is a kind of with film be used as the generating heat film heat generating component of medium that the purpose of this utility model is to provide, this kind film heat generating component of the present utility model, its heating component in order to the evolution of heat is one can be made into electrons heat film as thin as a wafer, the heat that it sent is promptly not only very even, and control easily.
This kind film heat generating component of the present utility model, the heat that it sent, owing to can very accurately and accurately adjust because of the resistance value of conductive layer, so applicable to high-precision product, and the size of its volume more can be very accurate, beyond so fine even product is also applicable, because the material that its base material is a metal material etc. to be difficult for breaking is made, so its fraction defective in manufacture process can greatly reduce, cost can reduce virtually, cracky not when simultaneously it uses more improves the value that it utilizes, and this is a purpose more of the present utility model.
The utility model is to adopt following technological means to realize:
A kind of film heat generating component mainly includes a substrate, and is located at the electric-heating thin film layer on the substrate, and substrate is constituted by the metal or alloy material, and between metal substrate and the electric-heating thin film layer layer insulating is arranged.
Aforesaid substrate is the glass of process intensive treatment, the film heat generating component of the ceramic naked layer that is constituted.
Aforesaid metal can be aluminium (Al), iron (Fe), copper (Cu), nickel (Ni), beryllium (Be), titanium (Ti) ... Deng metal or its alloy.
Aforesaid insulating barrier can be oxide (oxide), carbide (carbide) or other organic compound of aluminium (Al), silicon (Si), magnesium (Mg), lithium (Li).
A kind of labor-saving stapler of the utility model compared with prior art has remarkable advantages and beneficial effect:
From the above as can be known, all can damaged effect when this kind film heat generating component of the present utility model has when making with operation really, and this itself has the drawback that the higher effect of heating efficiency also can be improved existing heating wire, electrical bar, electric hot plate and electrothermal tube really.
Description of drawings
The schematic diagram of the existing heating wire of Figure 1A;
Figure 1B is the schematic diagram of existing electrical bar;
Fig. 1 C is the schematic diagram of existing electric hot plate;
Fig. 1 D is the schematic diagram of existing electrothermal tube;
Fig. 2 is a schematic perspective view of the present utility model;
Fig. 3 is a schematic cross-section of the present utility model;
Fig. 4 is of the present utility model one stereogram when implementing.
Embodiment
The technology that relevant the utility model adopted, means and effect thereof, lift a preferred embodiment now and cooperate graphic detailed description as after.
See also shown in Figure 1A to Fig. 1 D, be existing electric-heating assembly, its disappearance described in detail as before, no longer be described in detail herein.
As Fig. 2 and shown in Figure 3, this kind film heat generating component of the present utility model, it mainly is by a substrate 1,2 formation of one electric-heating thin film layer, wherein, substrate 1 is constituted by the material of cracky not, therefore, can be through strengthening and insulation processing glass, pottery even be coated with the metal material of insulating barrier 5 through insulation processing made the occasion of the visual application of its thickness and making.Electric-heating thin film layer 2 is the electric-heating thin film of semi-conducting material, embodiment is a material of main part with the chloride or the silicide of tin, vanadium, thereafter, adds the compound of iron, antimony, indium etc. as dopant in the process of modulation, above-mentioned material is evenly mixed, and according to special ratios and solvent; Above-mentioned raw materials is mixed the back inorganic acid that adds a little work as blending agents, make itself and material of main part produce oxidation reaction, and semiconductor heating film material, semiconductor heating film material with gained sprays on substrate 1 with special nozzle at last, become the high temperature atomizing and be deposited on the substrate for vaporific charged particle, the thickness of its electric-heating thin film layer 2 can be 0.5～5 μ m.
Above-mentioned metal substrate, can be aluminium (Al), iron (Fe), copper (Cu), nickel (Ni), beryllium (Be), titanium (Ti) ... Deng metal or its alloy, and be coated on insulating barrier on the metal base, preferable is oxide (oxide), carbide (carbide) and other organic compound (organic compounds) of aluminium (Al), silicon (Si), magnesium (Mg), lithium (Li) etc.And insulating barrier is coated on the method on the base material, can be vacuum splashing and plating method (vacuumsputtering), printing cladding process (printing ﹠amp; Method such as coating).
The film heat generating component of the utility model such as above-mentioned gained, it in use, preferable enforcement situation is as shown in Figure 4, can on electric-heating thin film layer 2, form or set firmly the conductive film 31,32 of pair of separated, respectively conductive film 31,32 is connected power line 41,42 again, after the energising, can be from 2 evolution of heat of electric-heating thin film layer.Herein, need Chen Ming, conductive film 31,32 can have multiple different shape, even configuration, and this kind film heat generating component of the present utility model, because its base material is the material of not cracky and constitutes that the yield during its manufacturing can greatly improve, damaged chance during use more can reduce, and is more suitable for the use of various occasions.
It should be noted that at last: above embodiment only in order to the explanation the utility model and and the described technical scheme of unrestricted the utility model; Therefore, although this specification has been described in detail the utility model with reference to each above-mentioned embodiment,, those of ordinary skill in the art should be appreciated that still and can make amendment or be equal to replacement the utility model; And all do not break away from the technical scheme and the improvement thereof of the spirit and scope of utility model, and it all should be encompassed in the middle of the claim scope of the present utility model.
Claims (4)
1, a kind of film heat generating component mainly includes a substrate, and is located at the electric-heating thin film layer on the substrate, and it is characterized in that: substrate is constituted by the metal or alloy material, and between metal substrate and the electric-heating thin film layer layer insulating is arranged.
2, film heat generating component according to claim 1 is characterized in that substrate is the glass through intensive treatment, the film heat generating component of the ceramic naked layer that is constituted.
3, film heat generating component according to claim 1 is characterized in that metal can be aluminium (Al), iron (Fe), copper (Cu), nickel (Ni), beryllium (Be), titanium (Ti) metal or its alloy.
4, film heat generating component according to claim 1 is characterized in that insulating barrier can be the oxide (oxide) of aluminium (Al), silicon (Si), magnesium (Mg), lithium (Li), carbide (carbide) or other organic compound.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200520001321 CN2772173Y (en) | 2005-01-21 | 2005-01-21 | Thin Film Heating Components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200520001321 CN2772173Y (en) | 2005-01-21 | 2005-01-21 | Thin Film Heating Components |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2772173Y true CN2772173Y (en) | 2006-04-12 |
Family
ID=36705955
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200520001321 Expired - Fee Related CN2772173Y (en) | 2005-01-21 | 2005-01-21 | Thin Film Heating Components |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2772173Y (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008101405A1 (en) * | 2007-02-13 | 2008-08-28 | Advanced Materials Enterprises Co., Ltd | Heating apparatus and method for making the same |
| WO2010006535A1 (en) * | 2008-07-18 | 2010-01-21 | Advanced Materials Enterprises Company Limited | Nano thickness heating material coated food warmer devices |
| WO2010009669A1 (en) * | 2008-07-23 | 2010-01-28 | Advanced Materials Enterprises Co., Ltd | Medical warming system with nano-thickness heating element |
| CN101765252A (en) * | 2009-09-10 | 2010-06-30 | 董晓波 | Electrothermal film heater based on metal substrate |
| CN102068207B (en) * | 2009-11-20 | 2015-05-20 | 财团法人工业技术研究院 | Heating and heat-insulating carrier |
-
2005
- 2005-01-21 CN CN 200520001321 patent/CN2772173Y/en not_active Expired - Fee Related
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008101405A1 (en) * | 2007-02-13 | 2008-08-28 | Advanced Materials Enterprises Co., Ltd | Heating apparatus and method for making the same |
| WO2010006535A1 (en) * | 2008-07-18 | 2010-01-21 | Advanced Materials Enterprises Company Limited | Nano thickness heating material coated food warmer devices |
| WO2010009669A1 (en) * | 2008-07-23 | 2010-01-28 | Advanced Materials Enterprises Co., Ltd | Medical warming system with nano-thickness heating element |
| CN102105120B (en) * | 2008-07-23 | 2012-11-28 | 高新材料企业有限公司 | Medical heating system with nanometer-thick heating elements |
| CN101765252A (en) * | 2009-09-10 | 2010-06-30 | 董晓波 | Electrothermal film heater based on metal substrate |
| CN101765252B (en) * | 2009-09-10 | 2013-09-25 | 董晓波 | Electrothermal film heater based on metal substrate |
| CN102068207B (en) * | 2009-11-20 | 2015-05-20 | 财团法人工业技术研究院 | Heating and heat-insulating carrier |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20060412 Termination date: 20100221 |