[go: up one dir, main page]

CN2612180Y - electronic camera module - Google Patents

electronic camera module Download PDF

Info

Publication number
CN2612180Y
CN2612180Y CN 03225230 CN03225230U CN2612180Y CN 2612180 Y CN2612180 Y CN 2612180Y CN 03225230 CN03225230 CN 03225230 CN 03225230 U CN03225230 U CN 03225230U CN 2612180 Y CN2612180 Y CN 2612180Y
Authority
CN
China
Prior art keywords
circuit board
printed circuit
image sensor
flexible printed
electro
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN 03225230
Other languages
Chinese (zh)
Inventor
王木荣
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Foxlink Electronics Dongguan Co Ltd
Cheng Uei Precision Industry Co Ltd
Original Assignee
Foxlink Electronics Dongguan Co Ltd
Cheng Uei Precision Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Foxlink Electronics Dongguan Co Ltd, Cheng Uei Precision Industry Co Ltd filed Critical Foxlink Electronics Dongguan Co Ltd
Priority to CN 03225230 priority Critical patent/CN2612180Y/en
Application granted granted Critical
Publication of CN2612180Y publication Critical patent/CN2612180Y/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Landscapes

  • Camera Bodies And Camera Details Or Accessories (AREA)

Abstract

The utility model discloses an electronic camera module, which comprises a flexible printed circuit board with an assembly part and a wire arranging part, wherein the wire arranging part is formed by extending the assembly part integrally, and both sides of the wire arranging part are coated with metal layers to prevent the electronic electromagnetic interference between signals; an image sensor disposed on one side of the assembly portion of the flexible printed circuit board; a lens mounted above the image sensor and aligned with the image sensor; an image processing chip is arranged on the other side of the assembling part of the flexible printed circuit board, so that the volume of the module is effectively reduced; a connector arranged at the end of the flexible printed circuit board, the connector is used for connecting with the printed circuit board of the electronic equipment to be applied, and the flexibility of design and use is increased; a serial flash memory, which is installed on the assembly portion of the printed circuit board and connected with the image sensor, and can record the dead pixel and the color deviation of the image sensor, so as to provide accurate image for the electronic device to correct and compensate.

Description

电子摄像模块electronic camera module

所属技术领域Technical field

本实用新型涉及一种电子摄像模块,尤指一种可应用于数码像机及摄像手机等电子设备且短小轻薄、组装简易并具应用灵活性的电子摄像模块。The utility model relates to an electronic camera module, in particular to an electronic camera module which can be applied to electronic equipment such as a digital camera and a camera phone, and is short, thin, easy to assemble and flexible in application.

背景技术Background technique

电子摄像模块应用范围愈来愈广泛,从结合在个人电脑,到数码相机,更可应用到手表或手机上,以增设摄像功能。图五及图六是显示传统的数字电子摄像模块。为达短小轻薄之目的,一般影像处理的电路已经利用影像处理芯片来执行,以减少模块的体积,所以图五及图六所示之电子摄像模块200主要包含一镜头201,一用以接受镜头撷取之影像的影像传感器(ImageSensor)202,及一影像处理芯片203以处理影像传感器202所显示的影像,最后电子摄像模块200连接至所应用的电子设备的印刷电路板(PrintedCircuit Board)204,例如数码相机,以执行影像编辑及储存等功能。从传统的电子摄像模块的结构来看,首先,电子摄像模块200中具有影像传感器202及影像处理芯片203,二者结合在一起进行封装,由于此二者均属较精密的组件,所以价值较高,而且多芯片组装(Multi-Chip Package,MCP)结合在一起及封装技术较复杂,技术要求甚高,导致制造上良率甚低,自然而然使成本高涨。The application range of electronic camera module is more and more extensive, from being combined in personal computer, to digital camera, and can be applied to watch or mobile phone to add camera function. Figures 5 and 6 show traditional digital electronic camera modules. In order to achieve the purpose of being short and thin, the general image processing circuit has been implemented by using an image processing chip to reduce the size of the module. Therefore, the electronic camera module 200 shown in Fig. 5 and Fig. 6 mainly includes a lens 201, and a lens 201 for receiving the lens An image sensor (ImageSensor) 202 of the captured image, and an image processing chip 203 to process the image displayed by the image sensor 202, and finally the electronic camera module 200 is connected to the printed circuit board (Printed Circuit Board) 204 of the applied electronic equipment, Such as a digital camera to perform functions such as image editing and storage. From the perspective of the structure of the traditional electronic camera module, firstly, the electronic camera module 200 has an image sensor 202 and an image processing chip 203, and the two are packaged together. High, and the multi-chip assembly (Multi-Chip Package, MCP) is combined and the packaging technology is more complicated, and the technical requirements are very high, resulting in a very low manufacturing yield, which naturally increases the cost.

当电子摄像模块制造完成后,组装至电子设备的印刷电路板时,则依印刷电路板预留的插孔供电子摄像模块的插脚置入,再进行焊接。应用上,如果插孔为贯穿孔,则以自动表面焊接技术(Surface Mounting Technology,SMT)为之,但是由于芯片所设计的插孔及插脚均十分精细,在制造时,产生不良品的机率比一般制造高,而不良品造成整个模块报废,其损失甚大;更严重的是,如果印刷电路板为多层板,则插孔属非贯穿孔,则利用球状格栅阵列(Ball Grid Array,BGA)技术焊着,此加工技术更因为非贯穿孔及利用红外线等热源来熔化焊料,所以良率会更差,而且不良品非目视可检出。整体而言,因设计上的不良,造成不符合工业上的生产效益。When the electronic camera module is manufactured and assembled to the printed circuit board of the electronic device, the pins of the electronic camera module are placed in the reserved sockets of the printed circuit board, and then soldered. In terms of application, if the jack is a through hole, automatic surface mounting technology (Surface Mounting Technology, SMT) is used. However, since the jack and pins designed by the chip are very fine, the probability of defective products is lower than Generally, the manufacturing cost is high, and defective products cause the entire module to be scrapped, and the loss is very large; more seriously, if the printed circuit board is a multilayer board, the jack is a non-through hole, and the Ball Grid Array (BGA) is used to ) technology welding, because this processing technology does not have through-holes and uses heat sources such as infrared rays to melt the solder, so the yield rate will be worse, and defective products cannot be detected visually. On the whole, due to poor design, it does not conform to industrial production efficiency.

实用新型内容Utility model content

为了改进上述现有技术于工业生产上存在制造不易及良率偏低而最终导致浪费多、成本高的缺失,本实用新型提供一种电子摄像模块,其在软性印刷电路板两侧分别装设摄像模块之影像显示传感器及影像处理芯片,使电子摄像模块短小轻薄、组装简易并具有应用灵活性。In order to improve the problems of difficult manufacturing and low yield in industrial production of the above-mentioned prior art, which eventually lead to a lot of waste and high cost, the utility model provides an electronic camera module, which is installed on both sides of the flexible printed circuit board. The image display sensor and image processing chip of the camera module make the electronic camera module short, thin, easy to assemble and flexible in application.

为达到上述目的,本实用新型提供一种电子摄像模块,它具有一软性印刷电路板,影像传感器及影像处理芯片分别结合在软性印刷电路板的两侧,镜头则装设在影像传感器上,软性印刷电路板延伸一排线部以装设连接器,排线部两侧均涂布有金属层,使排线部中的讯号传输具有抗电子电磁干扰(Electric and Magnetic Interference,EMI)之功能,连接器连接至电子设备的电路板上,可以依产品设计需求灵活调配,例如电子设备预留的连结位置与电子摄像模块的位置可以错开,二者的高度也可以不同,一般而言,软性印刷电路板的可上下挠曲角度约50度,同时在软性印刷电路板的组装部装设一串行闪存(Serial Flash RAM,SFR),由于影像传感器常有坏点,例如白点或黑点,以及频色偏差等问题,所以在电子摄像模块完成后,在检测时,会将影像传感器的坏点记录在串行闪存中,供电子设备在使用时,由电子设备比对影像传感器的坏点记录并提供摄取影像的校正及补偿,使所摄取的影像得到更高的品质。In order to achieve the above object, the utility model provides an electronic camera module, which has a flexible printed circuit board, the image sensor and the image processing chip are respectively combined on both sides of the flexible printed circuit board, and the lens is installed on the image sensor , the flexible printed circuit board extends a line part to install the connector, and the metal layer is coated on both sides of the line part, so that the signal transmission in the line part has anti-electromagnetic interference (Electric and Magnetic Interference, EMI) The function, the connector is connected to the circuit board of the electronic device, and can be flexibly deployed according to the product design requirements. For example, the reserved connection position of the electronic device and the position of the electronic camera module can be staggered, and the heights of the two can also be different. Generally speaking The flex angle of the flexible printed circuit board is about 50 degrees up and down. At the same time, a serial flash memory (Serial Flash RAM, SFR) is installed in the assembly part of the flexible printed circuit board. Because the image sensor often has dead pixels, such as white Dots or black spots, as well as frequency and color deviation, etc., so after the electronic camera module is completed, the dead pixels of the image sensor will be recorded in the serial flash memory during detection, and the electronic equipment will be compared by the electronic equipment when it is in use. The dead pixels of the image sensor record and provide correction and compensation for captured images, so that the captured images can be of higher quality.

通过本实用新型的实施,可使电子摄像模块易于安装使用于各种便携式电子设备上,降低故障与损坏率,并且能有效增进所摄取影像之品质。Through the implementation of the utility model, the electronic camera module can be easily installed and used on various portable electronic devices, the rate of failure and damage can be reduced, and the quality of captured images can be effectively improved.

附图说明Description of drawings

下面结合附图和实施例对本实用新型作进一步详细的描述。Below in conjunction with accompanying drawing and embodiment the utility model is described in further detail.

图1为本实用新型电子摄像模块的俯视图。Fig. 1 is a top view of the electronic camera module of the present invention.

图2为本实用新型电子摄像模块的剖视图。Fig. 2 is a cross-sectional view of the electronic camera module of the present invention.

图3为本实用新型电子摄像模块的仰视图。Fig. 3 is a bottom view of the electronic camera module of the present invention.

图4为本实用新型电子摄像模块的排线部的局部放大剖面图。Fig. 4 is a partially enlarged cross-sectional view of the cable arrangement part of the electronic camera module of the present invention.

图5为现有电子摄像模块第一实施例的剖视图。FIG. 5 is a cross-sectional view of a first embodiment of a conventional electronic camera module.

图6为现有电子摄像模块第二实施例的剖视图。FIG. 6 is a cross-sectional view of a second embodiment of a conventional electronic camera module.

图中,10.软性印刷电路板,11.组装部,12.排线部,20.影像传感器,30.镜头,40.影像处理芯片,50.连接器,60.串行闪存,100.电子摄像模块,121.金属层。In the figure, 10. Flexible printed circuit board, 11. Assembly part, 12. Wiring part, 20. Image sensor, 30. Lens, 40. Image processing chip, 50. Connector, 60. Serial flash memory, 100. Electronic camera module, 121. Metal layer.

具体实施方式Detailed ways

请参阅图1至图3所示,本实用新型之电子摄像模块100包含一软性印刷电路板10,软性印刷电路板10具有一组装部11及一排线部12,排线部12是由组装部11一体延伸而成。Please refer to Fig. 1 to Fig. 3, the electronic camera module 100 of the present utility model comprises a flexible printed circuit board 10, and the flexible printed circuit board 10 has an assembly part 11 and a cable arrangement part 12, and the cable arrangement part 12 is It is integrally extended from the assembly part 11 .

一影像传感器20设置在软性印刷电路板10之组装部11的第一侧(如图1及图2),一镜头30装设在影像传感器20上方,并对准影像传感器20。为使模块体积得以缩小,镜头30以非球面镜头为之,而得到仅约5mm厚度的镜头。一般而言,影像传感器20是焊接至软性印刷电路板10,而镜头30是套在影像传感器20上,再以黏着剂予以结合。An image sensor 20 is disposed on the first side of the assembly portion 11 of the flexible printed circuit board 10 (as shown in FIGS. 1 and 2 ), and a lens 30 is disposed above the image sensor 20 and aimed at the image sensor 20 . In order to reduce the volume of the module, the lens 30 is made of an aspheric lens, and the thickness of the lens is only about 5 mm. Generally speaking, the image sensor 20 is soldered to the flexible printed circuit board 10 , and the lens 30 is set on the image sensor 20 and combined with an adhesive.

一影像处理芯片40设置在软性印刷电路板10之组装部11的第二侧(如图2及图3),基于影像传感器20及影像处理芯片40是分别结合在组装部11的不同侧,所以彼此不会互相牵制,制造上简易,良率得以提升,而且一旦前一制程有误,得立即停止,不会造成损失扩大。An image processing chip 40 is arranged on the second side of the assembly portion 11 of the flexible printed circuit board 10 (as shown in FIGS. 2 and 3 ). Based on the fact that the image sensor 20 and the image processing chip 40 are respectively combined on different sides of the assembly portion 11, Therefore, they will not be restrained by each other, the manufacturing is simple, the yield rate can be improved, and if there is an error in the previous process, it must be stopped immediately, and the loss will not be expanded.

一连接器50设置在软性印刷电路板10之排线部12末端,连接器50用以连接至所欲应用的电子设备的印刷电路板上,而将电子摄像模块100所取得的影像讯号传输至电子设备中。连接器50与软性印刷电路板100之结合属甚常用的简单技术,而且软性印刷电路板10的排线部12可以依实际需求设计不同的长度及弯曲延伸角度,再加上软性印刷电路板10的排线部12可以向上或向下挠曲,一般而言,可以挠曲50度,所以提供设计及使用上甚大的灵活度。A connector 50 is arranged at the end of the wiring part 12 of the flexible printed circuit board 10, and the connector 50 is used to connect to the printed circuit board of the electronic device to be applied, and transmit the image signal obtained by the electronic camera module 100 into electronic equipment. The combination of the connector 50 and the flexible printed circuit board 100 is a very common and simple technology, and the cable section 12 of the flexible printed circuit board 10 can be designed with different lengths and bending extension angles according to actual needs. The cable portion 12 of the circuit board 10 can be flexed upwards or downwards, generally speaking, it can be flexed by 50 degrees, thus providing great flexibility in design and use.

所以,影像经由镜头30撷取至影像传感器20,然后经影像处理芯片40形成数字讯号,再经排线部12及连接器50将讯号传输至电子设备中,以达数字电子摄像之目的。Therefore, the image is captured by the lens 30 to the image sensor 20, and then the digital signal is formed by the image processing chip 40, and then the signal is transmitted to the electronic device through the cable part 12 and the connector 50, so as to achieve the purpose of digital electronic photography.

再者,本实用新型之电子摄像模块100具软性印刷电路板10及排线部12,排线部12负有传输讯号的功能,而应用在电子设备中,有时会有电子及/或电磁干扰的情况,所以本实用新型在排线部12的两侧涂布金属层121(如图4),以防止电子设备中的各电子零组件产生电子电磁干扰(Electric &Magnetic Interference,EMI)。Furthermore, the electronic camera module 100 of the present utility model has a flexible printed circuit board 10 and a cable section 12. The cable section 12 is responsible for the function of transmitting signals, and when used in electronic equipment, sometimes there will be electronic and/or electromagnetic In the case of interference, the utility model coats the metal layer 121 on both sides of the cable portion 12 (as shown in Figure 4) to prevent the electronic components in the electronic equipment from generating electronic electromagnetic interference (Electric & Magnetic Interference, EMI).

请再参阅图1所示,本实用新型之电子摄像模块100进一步包含一闪存,例如串行闪存(Serial Flash RAM)60,设置在印刷电路板10的组装部11上并连接影像传感器20。串行闪存60是在电子摄像模块100检测时,检测仪器将影像传感器20所产生的讯号与正常的影像讯号比对,来找出影像传感器20是否存在坏点,例如白点或黑点等,以及频色的偏差,再将此数值储存在串行闪存60中。除非影像传感器20确属重大瑕疵,才予以报废,否则,少量瑕疵可经由此数值储存在串行闪存60中,然后在使用时,由电子设备中的处理器提供需要的校正及补偿,一则可以增加可用范围,二则可以在实际使用上,提供正准确的影像,以提升实用价值。1, the electronic camera module 100 of the present invention further includes a flash memory, such as serial flash memory (Serial Flash RAM) 60, which is arranged on the assembly part 11 of the printed circuit board 10 and connected to the image sensor 20. The serial flash memory 60 is when the electronic camera module 100 is tested, the detection instrument compares the signal generated by the image sensor 20 with the normal image signal to find out whether the image sensor 20 has dead pixels, such as white dots or black dots, etc. And frequency deviation, then this value is stored in the serial flash memory 60. Unless the image sensor 20 is indeed a major defect, it will be discarded. Otherwise, a small amount of defects can be stored in the serial flash memory 60 through this value, and then when used, the processor in the electronic device provides the required correction and compensation. It can increase the usable range, and secondly, it can provide accurate images in actual use to enhance the practical value.

由于本实用新型之电子摄像模块100体积甚小,如果排线部12不计(因排线部12在不同需求下可以加长或缩短),本实用新型整体之体积可达9×12×7mm。而且本实用新型之制造简易,组装要求技术不强,应用灵活度甚高,所以可以适用的电子设备甚广,例如个人电脑、数码相机、手表、手机、掌上型电脑(Palm PC)、个人数字助理(PDA)等等,均可以增设摄像功能,而此功能可由本实用新型之电子摄像模块100提供。Because the volume of the electronic camera module 100 of the present invention is very small, if the wiring part 12 is not counted (because the wiring part 12 can be lengthened or shortened under different requirements), the overall volume of the present invention can reach 9 * 12 * 7mm. Moreover, the utility model is easy to manufacture, the assembling technology is not strong, and the application flexibility is very high, so the applicable electronic equipment is very wide, such as personal computer, digital camera, wrist watch, mobile phone, palm PC (Palm PC), personal digital Assistant (PDA) etc., all can add camera function, and this function can be provided by electronic camera module 100 of the present utility model.

Claims (5)

1. electro-photographic module, it comprises a printed circuit board (PCB), one is positioned at the image sensor on the printed circuit board (PCB), one is installed in image sensor top and aims at the camera lens of image sensor, one is positioned at the image processing chip on the printed circuit board (PCB), it is characterized in that: described printed circuit board (PCB) is a flexible printed wiring board, this flexible printed wiring board has the winding displacement part that an assembled portion and is extended from assembled portion, described image sensor is arranged on first side of the assembled portion of flexible printed wiring board, described image processing chip then is arranged on second side of the assembled portion of flexible printed wiring board, the winding displacement part of flexible printed wiring board and a connector electrically connect, and transmit the signal between the electronic equipment of this electro-photographic module and institute's desire application.
2. electro-photographic module as claimed in claim 1 is characterized in that: the both sides of described winding displacement part are coated with metal level.
3. electro-photographic module as claimed in claim 2 is characterized in that: described metal level is a copper foil layer.
4. electro-photographic module as claimed in claim 1 is characterized in that: described camera lens is an aspheric lens.
5. electro-photographic module as claimed in claim 1 is characterized in that: this electro-photographic module further comprises a flash memory and is connected to image sensor, and the bad point of this flash memory recording image transducer and the deviation of frequency look are for the correction and the compensation of picked-up image.
CN 03225230 2003-04-14 2003-04-14 electronic camera module Expired - Fee Related CN2612180Y (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 03225230 CN2612180Y (en) 2003-04-14 2003-04-14 electronic camera module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 03225230 CN2612180Y (en) 2003-04-14 2003-04-14 electronic camera module

Publications (1)

Publication Number Publication Date
CN2612180Y true CN2612180Y (en) 2004-04-14

Family

ID=34163641

Family Applications (1)

Application Number Title Priority Date Filing Date
CN 03225230 Expired - Fee Related CN2612180Y (en) 2003-04-14 2003-04-14 electronic camera module

Country Status (1)

Country Link
CN (1) CN2612180Y (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103582286A (en) * 2012-08-02 2014-02-12 鸿富锦精密工业(深圳)有限公司 Circuit board assembly and camera module

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103582286A (en) * 2012-08-02 2014-02-12 鸿富锦精密工业(深圳)有限公司 Circuit board assembly and camera module

Similar Documents

Publication Publication Date Title
EP1774453B1 (en) System and method for mounting an image capture device on a flexible substrate
US7473585B2 (en) Technique for manufacturing an overmolded electronic assembly
CA2675179C (en) Folded package camera module and method of manufacture
CN101543145B (en) Wiring board module and method for manufacturing the wiring board module
US20200194951A1 (en) Endoscope device and cable assembly thereof
JP4947054B2 (en) Socket and module board and inspection system using the same
US7075176B2 (en) Chip package substrate having soft circuit board and method for fabricating the same
CN110099509A (en) Circuit board and electronic equipment
CN2612180Y (en) electronic camera module
CN222638783U (en) Flexible circuit board, flexible circuit board assembly and display device
KR20090046293A (en) Assembly structure and assembly method of camera module to shield electromagnetic interference
US9510462B2 (en) Method for fabricating circuit board structure
US20040212726A1 (en) Electronic image-capture module
CN1694601A (en) Electronic component assembly device inside electronic equipment
CN102111955B (en) Connecting structure and connecting method for PCB
CN2768375Y (en) Installing structure of flexible printed circuit plate
KR20050117371A (en) Image sensor module and the product method thereof
CN100350312C (en) Flat panel display and its backlight module
CN113747660A (en) Image pickup apparatus and method for connecting the same
CN116320703A (en) Camera module and electronic device
CN223829386U (en) Novel ultra-thin camera structure
KR100947967B1 (en) Camera module and its manufacturing method
KR101393925B1 (en) Camera Module
CN220570009U (en) An adapter board, connecting cable and electronic equipment
CN218888763U (en) Circuit board, circuit board assembly, camera module and electronic equipment

Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
C19 Lapse of patent right due to non-payment of the annual fee
CF01 Termination of patent right due to non-payment of annual fee