CN2612180Y - electronic camera module - Google Patents
electronic camera module Download PDFInfo
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- CN2612180Y CN2612180Y CN 03225230 CN03225230U CN2612180Y CN 2612180 Y CN2612180 Y CN 2612180Y CN 03225230 CN03225230 CN 03225230 CN 03225230 U CN03225230 U CN 03225230U CN 2612180 Y CN2612180 Y CN 2612180Y
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- circuit board
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Abstract
Description
所属技术领域Technical field
本实用新型涉及一种电子摄像模块,尤指一种可应用于数码像机及摄像手机等电子设备且短小轻薄、组装简易并具应用灵活性的电子摄像模块。The utility model relates to an electronic camera module, in particular to an electronic camera module which can be applied to electronic equipment such as a digital camera and a camera phone, and is short, thin, easy to assemble and flexible in application.
背景技术Background technique
电子摄像模块应用范围愈来愈广泛,从结合在个人电脑,到数码相机,更可应用到手表或手机上,以增设摄像功能。图五及图六是显示传统的数字电子摄像模块。为达短小轻薄之目的,一般影像处理的电路已经利用影像处理芯片来执行,以减少模块的体积,所以图五及图六所示之电子摄像模块200主要包含一镜头201,一用以接受镜头撷取之影像的影像传感器(ImageSensor)202,及一影像处理芯片203以处理影像传感器202所显示的影像,最后电子摄像模块200连接至所应用的电子设备的印刷电路板(PrintedCircuit Board)204,例如数码相机,以执行影像编辑及储存等功能。从传统的电子摄像模块的结构来看,首先,电子摄像模块200中具有影像传感器202及影像处理芯片203,二者结合在一起进行封装,由于此二者均属较精密的组件,所以价值较高,而且多芯片组装(Multi-Chip Package,MCP)结合在一起及封装技术较复杂,技术要求甚高,导致制造上良率甚低,自然而然使成本高涨。The application range of electronic camera module is more and more extensive, from being combined in personal computer, to digital camera, and can be applied to watch or mobile phone to add camera function. Figures 5 and 6 show traditional digital electronic camera modules. In order to achieve the purpose of being short and thin, the general image processing circuit has been implemented by using an image processing chip to reduce the size of the module. Therefore, the
当电子摄像模块制造完成后,组装至电子设备的印刷电路板时,则依印刷电路板预留的插孔供电子摄像模块的插脚置入,再进行焊接。应用上,如果插孔为贯穿孔,则以自动表面焊接技术(Surface Mounting Technology,SMT)为之,但是由于芯片所设计的插孔及插脚均十分精细,在制造时,产生不良品的机率比一般制造高,而不良品造成整个模块报废,其损失甚大;更严重的是,如果印刷电路板为多层板,则插孔属非贯穿孔,则利用球状格栅阵列(Ball Grid Array,BGA)技术焊着,此加工技术更因为非贯穿孔及利用红外线等热源来熔化焊料,所以良率会更差,而且不良品非目视可检出。整体而言,因设计上的不良,造成不符合工业上的生产效益。When the electronic camera module is manufactured and assembled to the printed circuit board of the electronic device, the pins of the electronic camera module are placed in the reserved sockets of the printed circuit board, and then soldered. In terms of application, if the jack is a through hole, automatic surface mounting technology (Surface Mounting Technology, SMT) is used. However, since the jack and pins designed by the chip are very fine, the probability of defective products is lower than Generally, the manufacturing cost is high, and defective products cause the entire module to be scrapped, and the loss is very large; more seriously, if the printed circuit board is a multilayer board, the jack is a non-through hole, and the Ball Grid Array (BGA) is used to ) technology welding, because this processing technology does not have through-holes and uses heat sources such as infrared rays to melt the solder, so the yield rate will be worse, and defective products cannot be detected visually. On the whole, due to poor design, it does not conform to industrial production efficiency.
实用新型内容Utility model content
为了改进上述现有技术于工业生产上存在制造不易及良率偏低而最终导致浪费多、成本高的缺失,本实用新型提供一种电子摄像模块,其在软性印刷电路板两侧分别装设摄像模块之影像显示传感器及影像处理芯片,使电子摄像模块短小轻薄、组装简易并具有应用灵活性。In order to improve the problems of difficult manufacturing and low yield in industrial production of the above-mentioned prior art, which eventually lead to a lot of waste and high cost, the utility model provides an electronic camera module, which is installed on both sides of the flexible printed circuit board. The image display sensor and image processing chip of the camera module make the electronic camera module short, thin, easy to assemble and flexible in application.
为达到上述目的,本实用新型提供一种电子摄像模块,它具有一软性印刷电路板,影像传感器及影像处理芯片分别结合在软性印刷电路板的两侧,镜头则装设在影像传感器上,软性印刷电路板延伸一排线部以装设连接器,排线部两侧均涂布有金属层,使排线部中的讯号传输具有抗电子电磁干扰(Electric and Magnetic Interference,EMI)之功能,连接器连接至电子设备的电路板上,可以依产品设计需求灵活调配,例如电子设备预留的连结位置与电子摄像模块的位置可以错开,二者的高度也可以不同,一般而言,软性印刷电路板的可上下挠曲角度约50度,同时在软性印刷电路板的组装部装设一串行闪存(Serial Flash RAM,SFR),由于影像传感器常有坏点,例如白点或黑点,以及频色偏差等问题,所以在电子摄像模块完成后,在检测时,会将影像传感器的坏点记录在串行闪存中,供电子设备在使用时,由电子设备比对影像传感器的坏点记录并提供摄取影像的校正及补偿,使所摄取的影像得到更高的品质。In order to achieve the above object, the utility model provides an electronic camera module, which has a flexible printed circuit board, the image sensor and the image processing chip are respectively combined on both sides of the flexible printed circuit board, and the lens is installed on the image sensor , the flexible printed circuit board extends a line part to install the connector, and the metal layer is coated on both sides of the line part, so that the signal transmission in the line part has anti-electromagnetic interference (Electric and Magnetic Interference, EMI) The function, the connector is connected to the circuit board of the electronic device, and can be flexibly deployed according to the product design requirements. For example, the reserved connection position of the electronic device and the position of the electronic camera module can be staggered, and the heights of the two can also be different. Generally speaking The flex angle of the flexible printed circuit board is about 50 degrees up and down. At the same time, a serial flash memory (Serial Flash RAM, SFR) is installed in the assembly part of the flexible printed circuit board. Because the image sensor often has dead pixels, such as white Dots or black spots, as well as frequency and color deviation, etc., so after the electronic camera module is completed, the dead pixels of the image sensor will be recorded in the serial flash memory during detection, and the electronic equipment will be compared by the electronic equipment when it is in use. The dead pixels of the image sensor record and provide correction and compensation for captured images, so that the captured images can be of higher quality.
通过本实用新型的实施,可使电子摄像模块易于安装使用于各种便携式电子设备上,降低故障与损坏率,并且能有效增进所摄取影像之品质。Through the implementation of the utility model, the electronic camera module can be easily installed and used on various portable electronic devices, the rate of failure and damage can be reduced, and the quality of captured images can be effectively improved.
附图说明Description of drawings
下面结合附图和实施例对本实用新型作进一步详细的描述。Below in conjunction with accompanying drawing and embodiment the utility model is described in further detail.
图1为本实用新型电子摄像模块的俯视图。Fig. 1 is a top view of the electronic camera module of the present invention.
图2为本实用新型电子摄像模块的剖视图。Fig. 2 is a cross-sectional view of the electronic camera module of the present invention.
图3为本实用新型电子摄像模块的仰视图。Fig. 3 is a bottom view of the electronic camera module of the present invention.
图4为本实用新型电子摄像模块的排线部的局部放大剖面图。Fig. 4 is a partially enlarged cross-sectional view of the cable arrangement part of the electronic camera module of the present invention.
图5为现有电子摄像模块第一实施例的剖视图。FIG. 5 is a cross-sectional view of a first embodiment of a conventional electronic camera module.
图6为现有电子摄像模块第二实施例的剖视图。FIG. 6 is a cross-sectional view of a second embodiment of a conventional electronic camera module.
图中,10.软性印刷电路板,11.组装部,12.排线部,20.影像传感器,30.镜头,40.影像处理芯片,50.连接器,60.串行闪存,100.电子摄像模块,121.金属层。In the figure, 10. Flexible printed circuit board, 11. Assembly part, 12. Wiring part, 20. Image sensor, 30. Lens, 40. Image processing chip, 50. Connector, 60. Serial flash memory, 100. Electronic camera module, 121. Metal layer.
具体实施方式Detailed ways
请参阅图1至图3所示,本实用新型之电子摄像模块100包含一软性印刷电路板10,软性印刷电路板10具有一组装部11及一排线部12,排线部12是由组装部11一体延伸而成。Please refer to Fig. 1 to Fig. 3, the
一影像传感器20设置在软性印刷电路板10之组装部11的第一侧(如图1及图2),一镜头30装设在影像传感器20上方,并对准影像传感器20。为使模块体积得以缩小,镜头30以非球面镜头为之,而得到仅约5mm厚度的镜头。一般而言,影像传感器20是焊接至软性印刷电路板10,而镜头30是套在影像传感器20上,再以黏着剂予以结合。An
一影像处理芯片40设置在软性印刷电路板10之组装部11的第二侧(如图2及图3),基于影像传感器20及影像处理芯片40是分别结合在组装部11的不同侧,所以彼此不会互相牵制,制造上简易,良率得以提升,而且一旦前一制程有误,得立即停止,不会造成损失扩大。An
一连接器50设置在软性印刷电路板10之排线部12末端,连接器50用以连接至所欲应用的电子设备的印刷电路板上,而将电子摄像模块100所取得的影像讯号传输至电子设备中。连接器50与软性印刷电路板100之结合属甚常用的简单技术,而且软性印刷电路板10的排线部12可以依实际需求设计不同的长度及弯曲延伸角度,再加上软性印刷电路板10的排线部12可以向上或向下挠曲,一般而言,可以挠曲50度,所以提供设计及使用上甚大的灵活度。A
所以,影像经由镜头30撷取至影像传感器20,然后经影像处理芯片40形成数字讯号,再经排线部12及连接器50将讯号传输至电子设备中,以达数字电子摄像之目的。Therefore, the image is captured by the
再者,本实用新型之电子摄像模块100具软性印刷电路板10及排线部12,排线部12负有传输讯号的功能,而应用在电子设备中,有时会有电子及/或电磁干扰的情况,所以本实用新型在排线部12的两侧涂布金属层121(如图4),以防止电子设备中的各电子零组件产生电子电磁干扰(Electric &Magnetic Interference,EMI)。Furthermore, the
请再参阅图1所示,本实用新型之电子摄像模块100进一步包含一闪存,例如串行闪存(Serial Flash RAM)60,设置在印刷电路板10的组装部11上并连接影像传感器20。串行闪存60是在电子摄像模块100检测时,检测仪器将影像传感器20所产生的讯号与正常的影像讯号比对,来找出影像传感器20是否存在坏点,例如白点或黑点等,以及频色的偏差,再将此数值储存在串行闪存60中。除非影像传感器20确属重大瑕疵,才予以报废,否则,少量瑕疵可经由此数值储存在串行闪存60中,然后在使用时,由电子设备中的处理器提供需要的校正及补偿,一则可以增加可用范围,二则可以在实际使用上,提供正准确的影像,以提升实用价值。1, the
由于本实用新型之电子摄像模块100体积甚小,如果排线部12不计(因排线部12在不同需求下可以加长或缩短),本实用新型整体之体积可达9×12×7mm。而且本实用新型之制造简易,组装要求技术不强,应用灵活度甚高,所以可以适用的电子设备甚广,例如个人电脑、数码相机、手表、手机、掌上型电脑(Palm PC)、个人数字助理(PDA)等等,均可以增设摄像功能,而此功能可由本实用新型之电子摄像模块100提供。Because the volume of the
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| Application Number | Priority Date | Filing Date | Title |
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| CN 03225230 CN2612180Y (en) | 2003-04-14 | 2003-04-14 | electronic camera module |
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| CN 03225230 CN2612180Y (en) | 2003-04-14 | 2003-04-14 | electronic camera module |
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| CN2612180Y true CN2612180Y (en) | 2004-04-14 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103582286A (en) * | 2012-08-02 | 2014-02-12 | 鸿富锦精密工业(深圳)有限公司 | Circuit board assembly and camera module |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103582286A (en) * | 2012-08-02 | 2014-02-12 | 鸿富锦精密工业(深圳)有限公司 | Circuit board assembly and camera module |
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