CN2612075Y - LED package structure - Google Patents

Abstract

The utility model relates to a LED packaging structure, including a support radiating block, two at least wafers and a colloid. A concave part is formed on the bracket radiating block, two bending brackets extend from two sides of the bracket radiating block respectively, and the thickness of the bracket radiating block is thicker than that of the bending brackets extending from two sides; each wafer is arranged in the concave part of the heat dissipation block of the bracket and is respectively matched and connected with each power pin by a lead; the colloid is sealed and combined with the bracket radiating block and each chip, the bottom surface of the bracket radiating block is exposed out of the colloid, and the bent brackets and each power pin which extend from both sides of the bracket radiating block also extend out of the colloid; therefore, the LED packaging structure overcomes the defects of the prior art, has excellent heat dissipation effect, simplifies the manufacturing process, reduces the manufacturing cost, has adjustable color and can be provided with a plurality of chips, and the light sources of the chips with various colors can be continuously lightened for a long time at the same time to form a high-power LED packaging structure.

Description

LED package structure

technical field

The utility model relates to an LED packaging structure, in particular to such an LED packaging structure, a concave part can be formed on the heat dissipation block of the support, a bent support is extended on both sides of the heat dissipation block of the support, and the thickness of the heat dissipation block of the support is It is thicker than the bent bracket extending on both sides, and each chip is set in the concave part of the heat sink of the bracket, respectively connected to each power supply pin with a wire, and the heat sink of the bracket and each chip are sealed by colloid, and the bracket dissipates heat. The bottom surface of the block is exposed outside the gel, and the extended bending brackets and power pins on both sides of the heat dissipation block of the bracket are also extended and exposed outside the gel, so that it has an excellent heat dissipation effect, which can simplify the production process and reduce production costs. , can adjust the color and set multiple chips, for the light sources of various color chips to be continuously lit for a long time at the same time, suitable for large display boards, stores, display lighting, various advertising boards and lighting fixtures, etc. or similar items.

Background technique

The known LED packaging structure is to form a bowl on a bracket 2 (as shown in Figure 1), a chip 1 is arranged in the bowl, and two power pins are extended from the bracket 2, and the two power pins are soldered to the circuit board On the solder joint 3 of 4, although the bowl of this known vertical light-emitting diode is deep and can improve the luminous efficiency, but because it only uses one power supply pin to dissipate heat, the heat dissipation efficiency is poor, and the heat dissipation effect is excellent. The degree of inferiority is directly proportional to the luminous efficiency, so the worse the heat dissipation effect is, the worse the luminous effect will be. Therefore, the heat dissipation effect of the vertical light-emitting diode is poor and needs to be improved. In addition, there is another kind of LED packaging structure, which uses the principle of light mixing to package light-emitting diodes of various color chips on the bracket or circuit board. Due to the poor heat dissipation effect of the overall structure, the various color chips cannot be lit for a long time at the same time when used. , but it needs to light up in a blinking manner, which is still difficult to meet the needs of users in actual use.

Contents of the invention

The technical problem to be solved by the utility model is to provide an LED packaging structure, the thickness of the heat dissipation block of the bracket holding each chip is thicker than that of the bent brackets extending on both sides, and the heat dissipation block of the bracket and the heat dissipation block of the bracket are two The extended bending brackets on each side and the power supply pins are joined to a circuit board, which greatly increases the contact area between the cooling block of the bracket and the circuit board, and has an excellent heat dissipation effect. There are multiple wafers, and the light sources of each wafer can be continuously lit for a long time at the same time, which increases its practicability.

Another technical problem to be solved by the utility model is to provide an LED packaging structure, the heat dissipation block of the bracket, the bent brackets extending on both sides of the heat dissipation block of the bracket and the power supply pins are integrally formed, and then sealed with glue, Cutting the legs can simplify the production process, greatly reduce the overall production cost, and increase the overall practicability.

Another technical problem to be solved by the utility model is to provide an LED packaging structure, which uses different brightness ratios for chips of various colors, so that color adjustment can be performed, and the required color of the light source can be achieved by using the principle of color mixing.

Another technical problem to be solved by the utility model is to provide an LED packaging structure. With the overall excellent heat dissipation effect, multiple chips can be installed, and the light sources of each chip can be continuously lit for a long time at the same time, so that the Each chip in the concave part of the cooling block of the bracket can be arranged with each power supply pin in various parallel or series configurations.

The technical solution of the utility model is: an LED packaging structure, the LED packaging structure includes,

A heat dissipation block of a bracket, a concave part is formed on the heat dissipation block of the support, a bent bracket is extended on both sides of the heat dissipation block of the bracket, and the thickness of the heat dissipation block of the bracket is thicker than the bent brackets extending on both sides;

At least two chips, each chip is arranged in the recessed part of the heat dissipation block of the support, and each chip is respectively connected to each power supply pin by a wire; and

A colloid, the colloid seals and combines the heat dissipation block of the support and the chips. The extension is exposed outside the colloid.

According to the LED package structure described above, the outer peripheral edge of the heat dissipation block of the bracket forms a curved portion that can be firmly combined with the above-mentioned glue.

According to the LED package structure described above, each chip and each power supply pin disposed in the concave portion of the heat dissipation block of the bracket are arranged in series.

According to the LED package structure described above, each chip and each power supply pin disposed in the concave portion of the heat dissipation block of the bracket are disposed in parallel.

According to the above LED packaging structure, the bottom surface of the heat dissipation block of the bracket is provided with heat dissipation glue, and the bottom surface of the heat dissipation glue is bonded to a circuit board.

In the LED package structure described above, the heat dissipation block of the support, the bent supports extending from both sides of the heat dissipation block of the support, and the power supply pins are bonded to a circuit board.

The features and advantages of the present utility model are: the thickness of the heat dissipation block of the support for holding each chip is thicker than the bent support extended on both sides, and the heat dissipation block of the support and the bent support extended on both sides of the heat dissipation block of the support and each power supply pin is joined to a circuit board, so that the contact area between the heat dissipation block of the support and the circuit board is greatly increased, thereby having an excellent heat dissipation effect; a plurality of chips can be arranged in the concave part of the heat dissipation block of the support, and each chip The light source can be continuously lit at the same time; by using different brightness ratios of chips of various colors, the color can be adjusted, and the color of the required light source can be achieved by using the principle of color mixing; The extended bending bracket and each power supply pin are integrally formed, and then sealed and cut, so the production process can be simplified and the overall production cost can be greatly reduced; in addition, it is installed in the concave part of the heat dissipation block of the bracket Each chip and each power supply pin can be arranged in multiple parallel configurations or in series configuration, which is flexible and convenient in use, increases its practicability, and forms a high-power LED packaging structure.

Description of drawings

Fig. 1 is the use schematic diagram of a known embodiment;

Fig. 2 is a perspective view of the first embodiment of the utility model;

Fig. 3 is a schematic plan view of the first embodiment of the utility model;

Fig. 4 is a schematic cross-sectional view of the use state of the first embodiment of the utility model;

5A and 5B are schematic views of the use state of the second embodiment of the present invention;

6A and 6B are schematic diagrams of the usage state of the third embodiment of the present invention;

7A and 7B are schematic diagrams of the usage state of the fourth embodiment of the present invention;

8A and 8B are schematic diagrams of the usage status of the fifth embodiment of the present invention;

9A and 9B are schematic diagrams of the usage state of the sixth embodiment of the present invention;

Explanation of reference numbers:

1. Chip 2. Bracket 3. Solder joints 4. Circuit board

5. Wafer 6. Bracket cooling block 61. Recessed part 62. Curved part

63. Bracket 7. Power pin 8. Colloid 9. Wire

10. Thermal glue 11. Circuit board

Detailed ways

In order to make the technical scheme, structure and effect of the utility model clearer, the LED packaging structure proposed by the utility model is described in detail as follows with specific embodiments and accompanying drawings:

As shown in Figure 2 to Figure 4, it is a kind of LED packaging structure proposed by the utility model, the LED packaging structure includes:

A bracket cooling block 6, a concave portion 61 is formed on the bracket cooling block 6, a bent bracket 63 extends on both sides of the bracket cooling block 6, the thickness of the bracket cooling block 6 is thicker than the bent brackets 63 extending on both sides, In addition, an arc portion 62 is formed on the outer peripheral edge of the heat dissipation block 6 of the support to facilitate a firm combination with the gel 8 and to eliminate the structural stress between the gel 8 and the heat dissipation block 6 of the support.

Three chips 5 (at least two chips 5 ), each chip 5 is disposed in the recessed portion 61 of the heat sink block 6 of the support, and respectively connected to each power pin 7 by wires 9 .

A colloid 8, the colloid 8 is sealed and combined with the heat dissipation block 6 of the bracket and each chip 5, the bottom surface of the heat dissipation block 6 of the bracket is exposed outside the colloid 8, and the bending brackets 63 extending on both sides of the heat dissipation block 6 of the bracket are connected with each power supply The pins 7 are also extended and exposed outside the colloid 8; thereby, a high-power LED packaging structure is formed for the light sources of the chips 5 of various colors to be continuously lit at the same time.

The heat dissipation block 6 of the support, the bent brackets 63 extending on both sides of the heat dissipation block 6 of the support and the power supply pins 7 are joined on a circuit board 11 to facilitate heat dissipation. Adhesive 10, the bottom surface of the heat dissipation adhesive 10 is bonded to a circuit board 11 to facilitate rapid heat dissipation.

A kind of LED packaging structure is constituted by the above-mentioned structure, please refer to Fig. 2 to Fig. 4, the characteristic of the present utility model is that the thickness of the support cooling block 6 that holds each chip 5 can be compared with the bending support 63 extending on both sides thick, and the heat dissipation block 6 of the bracket, the bent brackets 63 extending on both sides of the heat dissipation block 6 of the bracket and the power supply pins 7 are joined on a circuit board 11, so that the contact area between the heat dissipation block 6 of the bracket and the circuit board 11 A large increase, with an excellent heat dissipation effect, a plurality of chips 5 can be arranged in the recessed portion 61 of the cooling block 6 of the bracket, and the light sources of each chip 5 can be continuously lit at the same time (when a 14mil chip is packaged, a current of 50mA can be operated , and can be continuously lit for a long time in three colors at the same time).

The chips 5 of various colors can adopt different brightness ratios, and the color can be adjusted, and the required color of the light source can be achieved by using the principle of color mixing.

The bracket cooling block 6 of the utility model, the bent brackets 63 extending on both sides of the bracket cooling block 6 and the power supply pins 7 are integrally formed, and then sealed and cut, so the production process can be simplified. The overall production cost is greatly reduced.

In addition, each chip 5 disposed in the recessed portion 61 of the heat dissipation block 6 of the bracket can be arranged in various parallel configurations with each power pin 7 (as shown in FIGS. 5A to 6B , FIGS. 8A to 9B ), or arranged into a series pattern (see Figure 7A, 7B).

The LED packaging structure proposed by the utility model has an excellent heat dissipation effect, and at the same time can simplify the production process, reduce the production cost, adjust the color and set multiple chips, and the light source of each chip can be continuously lit for a long time at the same time, which is practical. It has good performance and is a high-power LED packaging structure.

Although the utility model has been disclosed with specific embodiments, it is not intended to limit the utility model, and there may be differences in some parts or the arrangement of the parts, and any person skilled in the art will not depart from the utility model Various changes and modifications can also be made under the premise of the concept and scope of the present utility model, so the protection scope of the present utility model should be based on the scope defined by the claims.

Claims (6)

1. LED encapsulating structure is characterized in that: this LED encapsulating structure comprises,

One support radiating block forms a depressed part on the described support radiating block, these support radiating block both sides respectively are extended with a bending support, and the bending support that the thickness of described support radiating block extends than both sides is thick;

At least two wafers, described each wafer is arranged in the depressed part of described support radiating block, and each wafer is coupled to each power pin with lead respectively; And

Colloid, this colloid envelope is established in conjunction with described support radiating block and described each wafer, and described support radiating block bottom surface exposes to outside this colloid, and each bending support that extends of described support radiating block both sides and each power pin also extend and expose to outside the described colloid.

2. LED encapsulating structure as claimed in claim 1 is characterized in that: the outboard peripheries of described support radiating block constitute can with the firm arc-curved part that combines of above-mentioned colloid.

3. LED encapsulating structure as claimed in claim 1 is characterized in that: described each interior wafer of depressed part that is arranged at this support radiating block is the setting of connecting with each power pin.

4. LED encapsulating structure as claimed in claim 1 is characterized in that: each wafer in the described depressed part that is arranged at this support radiating block and each power pin are for being arranged in parallel.

5. LED encapsulating structure as claimed in claim 1 is characterized in that: described support radiating block bottom surface is provided with thermal paste, and this thermal paste bottom surface is engaged on the circuit board.

6. LED encapsulating structure as claimed in claim 1 is characterized in that: described support radiating block, each bending support and each power pin that extends of described support radiating block both sides are engaged on the circuit board.

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