CN2610390Y - Air deflector for computer motherboard radiator - Google Patents
Air deflector for computer motherboard radiator Download PDFInfo
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- CN2610390Y CN2610390Y CN 03243586 CN03243586U CN2610390Y CN 2610390 Y CN2610390 Y CN 2610390Y CN 03243586 CN03243586 CN 03243586 CN 03243586 U CN03243586 U CN 03243586U CN 2610390 Y CN2610390 Y CN 2610390Y
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- computer motherboard
- top board
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- air
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- 238000009423 ventilation Methods 0.000 claims description 10
- 238000012545 processing Methods 0.000 description 12
- 238000001816 cooling Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 241000579895 Chlorostilbon Species 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 229910052876 emerald Inorganic materials 0.000 description 1
- 239000010976 emerald Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
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Abstract
Description
技术领域technical field
本实用新型是有关电脑(个人电脑)主机的散热装置,尤其是有关连接电脑散热风扇与中央处理单元(CPU)散热片的导流罩。The utility model relates to a cooling device of a computer (personal computer) mainframe, in particular to a flow guiding cover connected with a cooling fan of a computer and a cooling fin of a central processing unit (CPU).
背景技术Background technique
申请人获准的台湾专利公告第511872号,揭示一种电脑散热的导风罩结构。该导风罩是一中空罩体的一端结合一风扇,另一端结合另一罩体。该另一罩体的L型板体开口,恰可将中央处理单元模组一侧的散热片部分包覆住,以便使该导风罩内部的空气可流经上、下风道,以进行该中央处理单元模组及周遭的电子元件的散热作用。The applicant's approved Taiwan patent announcement No. 511872 discloses an air guide cover structure for computer heat dissipation. The wind guide cover is a hollow cover body, one end of which is combined with a fan, and the other end is combined with another cover body. The L-shaped plate body opening of this other cover body just can cover the cooling fin part on one side of the central processing unit module, so that the air inside the air guide cover can flow through the upper and lower air ducts to carry out this process. The heat dissipation effect of the central processing unit module and the surrounding electronic components.
一般中央处理单元模组的侧边,装设有支援中央处理单元的电子零件。该等支援中央处理单元的电子零件,所产生的热量约占中央处理单元所产生热量的四分之一,也是一个重要的发热源。The side of the general central processing unit module is equipped with electronic components supporting the central processing unit. The heat generated by these electronic components supporting the central processing unit accounts for about a quarter of the heat generated by the central processing unit and is also an important heat source.
上述专利案的导风罩采用上、下风道的设计,虽能对中央处理单元及周遭的电子元件进行散热。但其上风道设于中央处理单元的上方,并不能直接对置于中央处理单元侧边,支援中央处理单元的电子零件进行散热。The wind guide cover of the above-mentioned patent case adopts the design of the upper and lower air ducts, although it can dissipate heat to the central processing unit and the surrounding electronic components. However, the upper air duct is arranged above the central processing unit, and cannot be directly opposite to the side of the central processing unit, so as to support the heat dissipation of the electronic components of the central processing unit.
且现有导风罩皆由下方固定于主机板上,需于主机板上钻孔,用螺丝锁固导风罩下端,会占据主机板的配置电路空间,影响电路的布置。Moreover, the existing air guides are all fixed on the motherboard from the bottom, and holes need to be drilled on the motherboard, and the lower ends of the air guides are locked with screws, which will occupy the configuration circuit space of the motherboard and affect the layout of the circuits.
实用新型内容Utility model content
本实用新型的主要目的,在提供一种电脑主机板散热器的导流罩,能有效的对支援中央处理单元的电子零件进行散热。The main purpose of the present utility model is to provide a shroud for a heat sink of a computer motherboard, which can effectively dissipate heat to the electronic parts supporting the central processing unit.
本实用新型的另一目的,在提供一种电脑主机板散热器的导流罩,能由上端固定导流罩,使主机板具有更大的电路布置空间。Another object of the present utility model is to provide a shroud for a heat sink of a computer motherboard, which can be fixed by the upper end, so that the motherboard has a larger space for circuit layout.
本实用新型一种电脑主机板散热器的导流罩,其特征在于,包括一罩体具有一上板、右侧板及左侧板;该上板下方及该右侧板的内侧边,具有一可罩于CPU散热器外围的第一通气孔;该上板下方及该左侧板的内侧边,具有一可罩于支援CPU的电子零件外围的第二通气孔。The utility model is a kind of air deflector of computer motherboard radiator, it is characterized in that, comprises a cover body to have an upper board, right side board and left side board; There is a first ventilation hole which can be covered on the periphery of the CPU radiator; the bottom of the upper plate and the inner side of the left side plate have a second ventilation hole which can be covered on the periphery of the electronic parts supporting the CPU.
其中该上板包括一平板的一侧边延伸一扩张板;该扩张板的另一侧边延伸第一顶板及第二顶板;该第一顶板及第二顶板的另一端分别向下方延伸该右侧板及该左侧板。Wherein the upper plate includes an expansion plate extending from one side of a flat plate; the other side of the expansion plate extends the first top plate and the second top plate; side panels and the left panel.
其中该第二顶板的端部向下方倾斜,与该第一顶板的端部形成一高度差;一上侧板连接该第一顶板及该第二顶板具高度差的相邻边。Wherein the end of the second top board is inclined downward to form a height difference with the end of the first top board; an upper side board connects the first top board and the adjacent side of the second top board with height difference.
其中该第一通气孔位于该右侧板及该上侧板之间。Wherein the first ventilation hole is located between the right side plate and the upper side plate.
其中该第二通气孔位于该左侧板及该上侧板下方之间。Wherein the second ventilation hole is located between the left side plate and the bottom of the upper side plate.
其中该第一顶板上方具有扣件。Wherein the first top board is provided with fasteners.
其中该扣件上端套接于一固定构件相对应的孔内。Wherein the upper end of the fastener is sleeved in a corresponding hole of a fixing member.
其中该扣件具肋片,被压制于固定构件的下端。Wherein the fastener has ribs and is pressed on the lower end of the fixing member.
附图说明Description of drawings
为进一步说明本实用新型的其他目的、功效,请参阅附图及实施例,详细说明如下,其中:In order to further illustrate other purposes and effects of the present utility model, please refer to the accompanying drawings and embodiments, and the detailed description is as follows, wherein:
图1为本实用新型导流罩的立体示意图。Fig. 1 is a three-dimensional schematic diagram of a shroud of the present invention.
图2为本实用新型导流罩与电脑主机的立体示意图。Fig. 2 is a three-dimensional schematic diagram of the shroud and the host computer of the present invention.
图3为本实用新型导流罩结合电脑主机的立体示意图。Fig. 3 is a three-dimensional schematic diagram of the combination of the air deflector of the present invention and the host computer.
具体实施方式Detailed ways
请参阅图1所示,本实用新型电脑主机板散热器的导流罩,是一罩体10具有一上板11、右侧板12及左侧板13所组成。上板包括一平板111的一侧边延伸一扩张板112。扩张板112的另一侧边延伸第一顶板113及第二顶板114。第二顶板114的端部115向下方倾斜,与第一顶板113的端部形成一高度差。一上侧板116连接第一顶板113及第二顶板114具高度差的相邻边。第一顶板113及第二顶板114的另一端分别向下方延伸右侧板12及左侧板13。第一顶板113上方具有两扣件117,供结合其他固定构件以固定罩体10。第一顶板113下方、右侧板12内侧边及上侧板116之间形成第一通气孔14。第二顶板114下方、左侧板13内侧边及上侧板116下方形成第二通气孔15。Please refer to shown in Fig. 1, the air deflector of the radiator of computer motherboard of the present utility model is that a cover body 10 has an
请参阅图2所示,一般电脑主机20的CPU结合散热器21,以散发CPU产生的热量。CPU的侧边设有支援CPU的电子零件22,以提供CPU所需电力。经测试显示该支援CPU的电子零件22,工作时发出的热量约为CPU本身发热量的四分之一。一般现有的导流罩及上述专利的导风罩,只罩于CPU散热器21的外围,并不能直接对支援CPU的电子零件22进行散热,故仍无法对电脑主机20内部进行有效的散热。Please refer to FIG. 2 , the CPU of a
本实用新型的特点,是使罩体10的第一通气孔14罩于CPU散热器21的外围;而第二通气孔15罩于支援CPU的电子零件22的外围。罩体10另一端的平板111结合于散热风扇30的后侧。风扇30结合于电源供应器40的后侧,如图3所示。The feature of the present utility model is that the
当风扇30转动时,同时可排除电源供应器40、CPU的散热器21及支援CPU的电子零件22所产生的热量。使风扇30能对电脑主机20内部,主要的发热元件进行最有效率的散热。When the fan 30 rotates, the heat generated by the
本实用新型第二顶板114呈向下倾斜的设计,使第二通气孔15的开口具有较小面积的进气口,具有较强的吸力,兼可吸收电脑主机20内部,其他区域的电子零件所产生的热气。The second
请参阅图3所示,本实用新型罩体10的两扣件上端118分别套接于一固定构件50的板片相对应的孔内。而扣件向后延伸的肋片119被压制于固定构件50的下端。固定构件50的两端,分别被用螺丝60锁固于电脑主机20机壳,使罩体10可被更稳固的被固定于电脑主机20内。不需在主机板开设孔洞,及组装导流翠固定构造,使主机板具有更大的电路布置空间。Please refer to FIG. 3 , the
以上所记载,仅为利用本实用新型技术内容的实施例,任何熟悉本项技艺者运用本实用新型所为的修饰、变化,皆属本实用新型主张的专利范围,而不限于实施例所揭示的。The above records are only the embodiments of utilizing the technical content of the present utility model. Any modifications and changes made by those skilled in the art using the present utility model all belong to the patent scope claimed by the utility model, and are not limited to the disclosed embodiments. of.
综上所述,本实用新型电脑主机板散热器的导流罩有所创新,且较现有导流罩具有功效增进,合于专利条件,故依法申请专利。To sum up, the utility model of the cooling shroud of the computer mainboard radiator is innovative, and has improved efficacy compared with the existing shroud, which is in line with the patent requirements, so the patent is applied for according to the law.
Claims (8)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 03243586 CN2610390Y (en) | 2003-04-02 | 2003-04-02 | Air deflector for computer motherboard radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 03243586 CN2610390Y (en) | 2003-04-02 | 2003-04-02 | Air deflector for computer motherboard radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2610390Y true CN2610390Y (en) | 2004-04-07 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 03243586 Expired - Fee Related CN2610390Y (en) | 2003-04-02 | 2003-04-02 | Air deflector for computer motherboard radiator |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100543639C (en) * | 2005-11-01 | 2009-09-23 | 鸿富锦精密工业(深圳)有限公司 | cooling system |
| CN101644946B (en) * | 2008-08-08 | 2012-10-31 | 英业达股份有限公司 | Wind shield |
| CN103901988A (en) * | 2014-04-23 | 2014-07-02 | 合肥恒研智能科技有限公司 | 1U vehicle-mounted ruggedized computer |
| CN105792599A (en) * | 2014-12-25 | 2016-07-20 | 鸿富锦精密工业(武汉)有限公司 | heat sink |
| CN108089678A (en) * | 2017-12-25 | 2018-05-29 | 曙光信息产业(北京)有限公司 | A kind of server air guiding cover heat radiation module |
| CN111240449A (en) * | 2020-02-25 | 2020-06-05 | 浙江广厦建设职业技术学院 | Portable computer heat dissipation module and computer heat dissipation device |
-
2003
- 2003-04-02 CN CN 03243586 patent/CN2610390Y/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100543639C (en) * | 2005-11-01 | 2009-09-23 | 鸿富锦精密工业(深圳)有限公司 | cooling system |
| CN101644946B (en) * | 2008-08-08 | 2012-10-31 | 英业达股份有限公司 | Wind shield |
| CN103901988A (en) * | 2014-04-23 | 2014-07-02 | 合肥恒研智能科技有限公司 | 1U vehicle-mounted ruggedized computer |
| CN105792599A (en) * | 2014-12-25 | 2016-07-20 | 鸿富锦精密工业(武汉)有限公司 | heat sink |
| CN108089678A (en) * | 2017-12-25 | 2018-05-29 | 曙光信息产业(北京)有限公司 | A kind of server air guiding cover heat radiation module |
| CN111240449A (en) * | 2020-02-25 | 2020-06-05 | 浙江广厦建设职业技术学院 | Portable computer heat dissipation module and computer heat dissipation device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20040407 |